10AS048H4F34E3LG - Arria 10 SX SoC FPGA 480K LE | Intel
MPN: 10AS048H4F34E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2973.71 | $2,973.71 |
| 3 | $2973.71 | $8,921.13 |
| 10 | $2810.5 | $28,105.00 |
| 100 | $2540 | $254,000.00 |
| 500 | $2295 | $1,147,500.00 |
Drop-in alternatives for 10AS048H4F34E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048H4F34I3SG
✅ Drop-In✓ In Stock
$2580 / Unit
View Datasheet →10AS048H3F34E2SG
✅ Drop-In✓ In Stock
$1558.07 / Unit
View Datasheet →10AS032H4F34E3LG
✅ Drop-In✓ In Stock
$2240 / Unit
View Datasheet →10AS048H3F34I2SG
✅ Drop-In✓ In Stock
$3450 / Unit
View Datasheet →10AS048H3F34E2LG
✅ Drop-In✓ In Stock
$1280 / Unit
View Datasheet →10AS048H4F34E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Core Frequency | 1.5 GHz |
| DSP Blocks | 1,518 (variable-precision) |
| Embedded Memory | 28.6 Mbits |
| Transceivers | 24 channels, up to 17.4 Gbps |
| Process Technology | 20 nm |
| Speed Grade | -3 |
| Package | 1152-pin FC-FBGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Core Voltage | 0.9 V (nominal) |
| RoHS Status | Compliant |
| Product Type | System On Chip (SoC) FPGA / IC SOC CORTEX-A9 |
10AS048H4F34E3LG 1152-pin fc-fbga (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS048H4F34E3LG (1152-pin fc-fbga (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048H4F34E3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048H4F34E3LG is suitable for 6 applications: Wireless Baseband Processing, Broadcast Video Processing, Military Radar and Signal Intelligence, Medical Imaging Systems, Industrial Machine Vision and Inspection, High-Performance Industrial Control.
Wireless Baseband Processing
The 10AS048H4F34E3LG fits wireless baseband systems because its 480K logic elements and 1,518 variable-precision DSP blocks support multi-carrier LTE and 5G NR channelization, while 24 transceivers at up to 17.4 Gbps handle CPRI and eCPRI fronthaul links. The dual ARM Cortex-A9 MPCore at 1.5 GHz runs the MAC scheduler and upper-layer stack. Co-processing between the hard processor system and FPGA fabric via the FPGA-to-HPS bridge enables tight latency budgets under 5 us for HARQ feedback loops.
Recommended
Broadcast Video Processing
Broadcast video routers and HEVC/H.264 encoders benefit from the 10AS048H4F34E3LG's combination of 28.6 Mbits embedded memory for line buffering, 1,518 DSP blocks for transform coding, and 17.4 Gbps transceivers for SDI and SMPTE 2022-6/2110 video over IP. The 1.5 GHz ARM Cortex-A9 subsystem manages control plane and network stacks. This SoC FPGA consolidates a discrete FPGA plus external CPU onto a single die, reducing board area by roughly 40% in 1U frame designs.
Recommended
Military Radar and Signal Intelligence
Phased-array radar and SIGINT systems use the 10AS048H4F34E3LG because 24 transceivers at 17.4 Gbps interface directly to ADC and DAC sampling at multi-Gsps rates, while 1,518 DSP blocks deliver the FFT and pulse-computation throughput needed for beamforming. The integrated ARM Cortex-A9 subsystem handles track management and protocol offload. Industrial-grade same-package variants exist for harsh-environment deployment.
Recommended
Medical Imaging Systems
CT, MRI, and ultrasound imaging platforms leverage the 10AS048H4F34E3LG's 480K logic elements for real-time image reconstruction (back-projection, filtered back-projection, and iterative reconstruction), while 28.6 Mbits embedded memory serves as line buffers and FFT working storage. The dual ARM Cortex-A9 MPCore runs the user interface, DICOM stack, and patient data management. Deterministic latency from FPGA-to-HPS bridges simplifies medical regulatory compliance.
Recommended
Industrial Machine Vision and Inspection
High-speed line-scan camera inspection uses the 10AS048H4F34E3LG because 17.4 Gbps transceivers accept CoaXPress and 10 GigE Vision streams, while 1,518 DSP blocks run real-time defect detection algorithms on multi-megapixel frames. The Cortex-A9 HPS orchestrates PLC integration, PROFINET, and EtherCAT. Lower-density same-package variants allow cost-down for slower lines without changing PCB layout.
Recommended
High-Performance Industrial Control
Motion controllers and programmable automation controllers benefit from the 10AS048H4F34E3LG's combination of tight FPGA-to-HPS latency for sub-microsecond servo loops and ARM Cortex-A9 cores for SCADA and OPC UA connectivity. 1,518 DSP blocks handle multi-axis inverse kinematics and field-oriented control. Industrial-temperature same-package variants survive -40C to +100C cabinet environments.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048H4F34E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048H4F34I3SG | 10AS048H3F34E2SG | 10AS032H4F34E3LG | 10AS048H3F34I2SG | 10AS048H3F34E2LG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (35x35 mm) | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 320,000 | 480,000 | 480,000 |
| Speed Grade | -3 | -3 | -2 | -3 | -2 | -2 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| DSP Blocks | 1,518 | 1,518 | 1,518 | [DATA_NEEDED] | 1,518 | 1,518 |
| Embedded Memory | 28.6 Mbits | 28.6 Mbits | 28.6 Mbits | [DATA_NEEDED] | 28.6 Mbits | 28.6 Mbits |
| Temperature Grade | Commercial (E-suffix) | Industrial (I-suffix) | Commercial (E-suffix) | Commercial (E-suffix) | Industrial (I-suffix) | Commercial (E-suffix) |
| Packaging Format | Tray (G) | Tape and Reel (S) | Tape and Reel (S) | Tray (G) | Tape and Reel (S) | Tray (G) |
Key Differentiators
- Highest speed grade in the 480K LE F34 package (vs 10AS048H3F34E2SG)
- Tray packaging optimized for low-volume and prototype builds (vs 10AS048H4F34I3SG)
- Maximum logic density available in the F34 1152-FBGA package option (vs 10AS032H4F34E3LG)
Design Notes
The 1152-ball FC-FBGA package has a typical junction-to-ambient thermal resistance around 12-14 C/W with a properly designed 12-layer PCB and thermal via array under the exposed die pad. Provide at least 256 thermal vias in a 16x16 staggered pattern under the package center, and use the top and inner copper planes as heat spreaders. For designs operating near 100C ambient, recommend a heatsink or forced-air cooling. Estimate: junction temperature = ambient + (theta_JA x total power); at 25W total power the rise is roughly 300-350 C/W x 25W = 8-9 C rise, manageable without active cooling.
Use 1.0 mm ball pitch escape routing with microvia stackups; each 1152 BGA fanout requires at least 6 routing layers with HDI microvias. Match length on DDR3/4 interfaces to the HPS subsystem within 50 mil tolerance for the byte lanes. Separate analog supply planes for the transceiver PLLs (VCCPLL) and the FPGA core (VCC) to reduce jitter; place 0.1 uF and 10 uF decoupling within 100 mil of every supply pin.
The 17.4 Gbps transceivers require controlled-impedance differential pairs (typically 100 ohm differential) routed on the top microstrip layer with continuous reference ground beneath. Avoid via transitions on high-speed serial lanes; if a layer change is unavoidable, use back-drilled vias to minimize stub resonance. Target insertion loss below 6 dB at 8.7 GHz Nyquist for 17.4 Gbps links to keep pre-emphasis settings within the recommended range.
Do not confuse Arria 10 SX (SoC with ARM HPS) with Arria 10 GX (FPGA only) when sourcing - the package pinout differs between SX and GX F34 variants. Do not apply I-suffix (industrial) ordering code to a design that needs commercial-only pricing; the I variant is typically 15-25% more expensive. Always verify Quartus Prime device support for the specific ordering code before generating bitstreams.
Compliance Information
RoHS and lead-free confirmed by LG ordering suffix. AEC-Q100 not applicable for FPGAs. Conflict-minerals compliance follows Intel policy.
