10AS057H1F34E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
MPN: 10AS057H1F34E1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3999.59 | $3,999.59 |
| 10 | $3850 | $38,500.00 |
| 50 | $3650 | $182,500.00 |
| 100 | $3500 | $350,000.00 |
| 500 | $3300 | $1,650,000.00 |
Drop-in alternatives for 10AS057H1F34E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057H2F34E1HG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3050 / Unit
View Datasheet →10AS057H1F34E2SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS048H2F34E1HG
✅ Drop-In✓ In Stock
$3650 / Unit
View Datasheet →10AS048K2F35E1HG
✅ Drop-In✓ In Stock
$2650 / Unit
View Datasheet →10AS032H2F34E1HG
✅ Drop-In✓ In Stock
$1227.9 / Unit
View Datasheet →10AS057H1F34E1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Series | 10AS057 |
| Logic Elements | 570 K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Core Frequency | 1.5 GHz |
| Package | 1152-FBGA, FC (35x35 mm) |
| Pin/Ball Count | 1152 |
| I/O Count | 492 user I/O |
| Process Technology | 20 nm |
| Transceiver Data Rate (max) | 17.7 Gbps |
| Memory Controller | Hard DDR3/DDR4 controller in HPS and FPGA fabric |
| PCIe Hard IP | PCIe Gen2/Gen3 x1/x2/x4 |
| Operating Temperature | -40C to +100C (industrial) |
| Mounting Type | Surface Mount (FCBGA) |
| RoHS Status | Compliant |
10AS057H1F34E1HG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS057H1F34E1HG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H1F34E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H1F34E1HG is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, Industrial Machine Vision Pipelines, Broadcast and Pro AV Video Processing, Military Radar Signal Processing, 5G Baseband Preprocessing, High-Performance Embedded Computing.
Software-Defined Radio (SDR) Baseband
The 10AS057H1F34E1HG fits SDR baseband designs because its 570K logic elements, hard DSP blocks, and 17.7 Gbps transceivers deliver the parallel compute density and I/O bandwidth needed for wideband digital down-conversion and channelization. The dual-core ARM Cortex-A9 HPS runs a real-time Linux control stack to manage PHY state machines, RF front-end calibration, and host-side TCP/IP, while the FPGA fabric accelerates FFTs, FIR filtering, and modulation/demodulation at line rate. Compared with discrete processor + FPGA boards, the integrated HPS eliminates a chip-to-chip interconnect, reducing latency between the MAC layer and the FPGA accelerator. Estimated DSP utilization for a typical 4-antenna LTE-style receiver remains below 70 percent of the device's hard DSP blocks, leaving room for protocol customization.
Recommended
Industrial Machine Vision Pipelines
For machine vision pipelines, the 10AS057H1F34E1HG provides the 570K logic elements and DDR4 memory bandwidth needed to process multi-stream 1080p/4K sensor data in real time. The dual-core ARM Cortex-A9 HPS can host a Linux-based camera stack, trigger I/O, and GigE Vision / USB3 Vision protocols while the FPGA fabric handles Bayer demosaic, gamma correction, and edge detection. Compared with CPU-only vision systems, the SoC FPGA delivers deterministic frame-to-frame latency below 5 ms at 4K resolution. The 1152-FBGA F34 package is suitable for conduction-cooled industrial PCs where the SoC is bonded to a thermal spreader. Estimated: at 4K@60 fps dual-stream ingest, the design consumes roughly 35-45 percent of available DSP blocks, leaving headroom for AI pre-processing.
Recommended
Broadcast and Pro AV Video Processing
The 10AS057H1F34E1HG is well matched to broadcast video processing because its 570K logic elements and 17.7 Gbps transceivers support uncompressed SDI (3G-SDI, 12G-SDI) and HDMI 2.0 multi-stream ingest. The FPGA fabric handles color-space conversion, scaling, deinterlacing, and overlay composition at 60 fps, while the ARM Cortex-A9 HPS runs a Linux control plane for IP-based streaming (SMPTE 2022, NDI). Compared with ASSP video SoCs, the SoC FPGA enables custom overlay and watermarking logic without external glue chips. The PCIe Gen2/Gen3 hard IP block provides a direct path to a host CPU for broadcast playout servers. Estimated: a four-channel 3G-SDI processor typically fits within 60 percent of available logic elements, leaving margin for downstream IP conversion.
Recommended
Military Radar Signal Processing
For military radar signal processing, the 10AS057H1F34E1HG offers the logic density, 20 ns low-latency fabric, and DSP blocks needed for pulse-Doppler, SAR, and phased-array beamforming workloads. The dual-core ARM Cortex-A9 HPS executes the tracking and classification software stack under a real-time OS, while the FPGA fabric performs the pulse compression, MTI, and CFAR detection at line rate. Compared with ASIC implementations, the SoC FPGA allows rapid algorithm updates across fielded hardware without re-spinning silicon. The 1152-FBGA F34 package supports the ruggedized thermal envelopes typical of ground-mobile and airborne platforms. Estimated: a 16-channel phased-array radar front-end typically consumes 40-55 percent of the available DSP blocks per processing frame.
Recommended
5G Baseband Preprocessing
The 10AS057H1F34E1HG suits 5G baseband preprocessing thanks to its 570K logic elements and high-speed transceivers that deliver the CPRI/JESD204B fronthaul bandwidth required for massive-MIMO and millimeter-wave base stations. The ARM Cortex-A9 HPS runs the L2/L3 protocol stack and OAM management under Linux, while the FPGA fabric accelerates channel coding, FFT/iFFT, and beamforming weight calculation. Compared with CPU-based baseband pools, the SoC FPGA reduces per-bit compute power by roughly 40 percent. The 1152-FBGA package dissipates higher power than smaller BGA options, so thermal design must allocate a thermal spreader. Estimated: a 64-antenna massive-MIMO fronthaul card uses about 60 percent of the FPGA's logic and DSP capacity.
Recommended
High-Performance Embedded Computing
The 10AS057H1F34E1HG fits high-performance embedded computing (HPEC) chassis that combine sensor ingest, DSP, and decision logic on a single board. The dual-core ARM Cortex-A9 HPS exposes gigabit Ethernet and USB 2.0 for host connectivity and runs a Linux control plane, while the FPGA fabric implements custom co-processors for image, radar, or SIGINT workloads. Compared with separate processor + FPGA modules, the integrated SoC reduces board area by roughly 30 percent and eliminates external chip-to-chip bridges. The 1152-FBGA F34 package and PCIe Gen3 hard IP enable 3U VPX or COM Express module form factors. Estimated: a typical HPEC payload (4-channel ADC ingest + tracker) utilizes about 50 percent of available logic elements.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H1F34E1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H2F34E1HG | 10AS057H1F34E2SG | 10AS048H2F34E1HG | 10AS048K2F35E1HG | 10AS032H2F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F35, 35x35 mm) - same ball count, same package family | 1152-FBGA (F34, 35x35 mm) - same |
| Logic Elements | 570 K | 570 K | 570 K | 480 K (-16%) | 480 K (-16%) | 320 K (-44%) |
| HPS Core Frequency (max) | 1.5 GHz | 1.5 GHz (higher speed grade) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Transceiver Data Rate (max) | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps | 17.7 Gbps |
| Hard Processor System | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 | Dual-core ARM Cortex-A9 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Indicative Unit Price (qty 1, USD) | $3,999.59 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Mid-range Arria 10 SX density with proven HPS subsystem (vs 10AS032H2F34E1HG)
- Direct HPS access to FPGA fabric without external bridges (vs 10AS048K2F35E1HG (lower-density alternative))
- Higher speed grade available in the same package for design uplift (vs 10AS057H2F34E1HG)
Design Notes
The 1152-FBGA F34 package demands a high-layer-count PCB (typically 12 to 16 layers) to fan out the 1.0 mm pitch BGA. Follow Intel's Arria 10 SX pin connection guidelines for power pin decoupling and use microvia-in-pad or stacked-via structures for the inner-row balls. Place 0.1 uF and 10 uF decoupling capacitors as close as possible to each power pin, with dedicated ground pours beneath the SoC to provide a low-impedance return path for the 17.7 Gbps transceivers.
Estimated: at full utilization (570K LE @ 80 percent toggle rate + 1.5 GHz HPS + active transceivers), the 10AS057H1F34E1HG can dissipate 15 to 25 W. Use a thermal spreader bonded to the package lid and at least 200 LFM airflow, or attach a heatsink with thermal interface material rated for 20 nm device junction temperatures. Industrial-temperature designs must hold the junction below 100 C in the worst-case ambient.
Common pitfalls include forgetting to instantiate the HPS-to-FPGA bridge in Platform Designer (which leaves peripherals inaccessible to the fabric), powering the HPS before the FPGA fabric is configured (causing HPS boot failure), and under-budgeting the high-speed transceiver reference clocks. Verify all transceiver reference clock frequencies against the selected PCS protocol configuration before PCB fab.
The 17.7 Gbps transceivers require controlled-impedance differential routing (100 ohm differential) with length matching within 0.127 mm. Use a SerDes channel simulator such as Intel's Transceiver Toolkit to validate channel loss and crosstalk budgets. Reference clocks must use a low-jitter oscillator (less than 100 fs RMS) and be AC-coupled if routed to the SoC.
Compliance Information
RoHS and lead-free status confirmed per Intel/Altera product page. Halogen-free status not explicitly listed in the provided data. AEC-Q100 not applicable - this is an industrial FPGA, not an automotive-qualified IC.
