10AS057K4F35I3LG - Arria 10 SX SoC FPGA, 570K LE | Intel | Altera
Teilenummer: 10AS057K4F35I3LG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3635.01 | $3.635,01 |
| 10 | $3453.26 | $34.532,60 |
| 100 | $3271.51 | $327.151,00 |
| 250 | $3125.11 | $781.277,50 |
| 500 | $2998.88 | $1.499.440,00 |
10AS057K4F35I3LG Übersicht
A SoC FPGA is a class of heterogeneous computing device that combines general-purpose application processor cores with programmable FPGA fabric on a single die, allowing deterministic hardware acceleration alongside a Linux/RTOS-capable host CPU. Within the broader taxonomy, this device sits at the intersection of programmable logic (FPGA) and microprocessors (MPU/MCU/SoC). The Arria 10 SX family specifically integrates up to 1.5 GHz dual-core ARM Cortex-A9 CPUs with hardened peripherals, on-chip memory controllers, and high-speed serial transceivers, making it a mainstream mid-range SoC FPGA used in wireless baseband, industrial imaging, and defense signal processing.
Key differentiating features of 10AS057K4F35I3LG include 570 K logic elements, 1.5 GHz dual-core ARM Cortex-A9 MPCore with CoreSight, embedded hard memory controllers and PCIe Gen2/Gen3 IP blocks, up to 24 transceivers at 17.4 Gbps, and integrated DSP blocks for high-throughput floating-point and fixed-point math. The industrial (-I) temperature grade supports -40 °C to +100 °C junction, and the -3 speed grade positions this device at the high-performance end of the Arria 10 SX lineup.
Architecturally, the Arria 10 SX combines a quad-core ARM Cortex-A9 cluster (two cores enabled here per the SX 570 device variant) with a variable-precision DSP architecture, hardened floating-point units, and an adaptive logic module (ALM) fabric. The 20 nm process enables higher integration and lower power than the prior 28 nm Arria V generation while increasing transceiver line rate to 17.4 Gbps.
Typical applications include 4G/5G wireless baseband, software-defined radio (SDR), industrial machine vision, broadcast video processing, military radar and electronic warfare, and high-performance embedded compute. For cost-sensitive applications with lower logic requirements, the 10AS048 or 10AS032 variants in the same family offer pin-compatible scaling.
When designing with this part, ensure the PCB implements all required decoupling per the Arria 10 pin connection guidelines and that the HPS boot configuration (BOOT_SEL straps and clock source) is reviewed against the Arria 10 SX System-on-Chip FPGA User Guide. Industrial-temperature variants should be qualified against the full -40 °C to +100 °C range rather than relying on commercial-grade thermal margins.
This page consolidates distributor pricing, drop-in same-family alternatives, application guidance, and design notes not typically summarized in a single manufacturer datasheet chapter, helping procurement and engineering teams make faster sourcing and architecture decisions.
Drop-in-Alternativen für 10AS057K4F35I3LG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AS057K4F35I3LG (gleiche Bauform und Footprint) – abweichend in Logic Elements, Package, Operating Temperature Grade, Mounting Type, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AS048K4F35I3LG
✅ Drop-In✓ Auf Lager
$2620 / Stück
Datenblatt ansehen →10AS032H4F35I3LG
✅ Drop-In✓ Auf Lager
$1320.75 / Stück
Datenblatt ansehen →10AS057K3F35I2LG
✅ Drop-In✓ Auf Lager
$3200 / Stück
Datenblatt ansehen →10AS057K4F35I3SG
✅ Drop-In✓ Auf Lager
$2185 / Stück
Datenblatt ansehen →10AS057K4F35I3LG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 SX |
| Device Variant | 10AS057 (570K Logic Elements) |
| Speed Grade | -3 |
| Logic Elements | 570,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| User I/O Count | 396 |
| Gehäuse | 1152-ball FCBGA (F35), 35x35 mm |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| Montageart | Surface Mount (Flip-Chip BGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10AS057K4F35I3LG 1152-ball fcbga (f35), 35x35 mm Pinbelegungsleitfaden
Pinbelegung für 10AS057K4F35I3LG (1152-ball fcbga (f35), 35x35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10AS057K4F35I3LG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10AS057K4F35I3LG ist geeignet für 7 Anwendungs: 4G/5G Wireless Baseband Processing, Software Defined Radio (SDR) Platforms, Industrial Machine Vision Systems, Military Radar and Electronic Warfare, Broadcast Video Processing and Encoding, High-Performance Embedded Compute (HPC) Edge Nodes, Medical Imaging and Diagnostic Equipment.
4G/5G Wireless Baseband Processing
The 10AS057K4F35I3LG's combination of 570 K logic elements, variable-precision DSP blocks, and dual-core ARM Cortex-A9 HPS running at 1.5 GHz directly addresses 4G LTE and 5G NR baseband workloads. Per the manufacturer datasheet, the device family integrates hardened floating-point DSP and high-speed transceivers up to 17.4 Gbps, enabling CPRI/eCPRI fronthaul and PHY-layer baseband processing on a single chip. The 570 K LE fabric comfortably absorbs multi-antenna (4x4 or 8x8) channel estimation, FFT/iFFT engines, and Turbo/Polar decoders, while the HPS handles MAC-layer scheduling, RRC, and L3 protocol stack under Linux. Compared with a discrete CPU + ASIC baseband solution, this SoC FPGA reduces board area and bill of materials while accelerating time-to-prototype for new radio features.
Empfohlen
Software Defined Radio (SDR) Platforms
Software Defined Radio platforms benefit from the 10AS057K4F35I3LG's parallel DSP fabric and ARM host processor working in tandem to implement waveform-agnostic radios. The 20 nm Arria 10 SX process gives the device up to 17.4 Gbps transceivers suitable for direct RF sampling interfaces, while the 570 K LE fabric implements digital down-conversion (DDC), channelizers, and modulators in hardware. The HPS runs waveform applications under Linux or a real-time OS, with CoreSight providing multicore debug for parallel firmware development. This split is more power-efficient than running the same workload on a general-purpose CPU and outperforms fixed-function DSP for multi-standard waveforms where reconfiguration is frequent.
Empfohlen
Industrial Machine Vision Systems
Industrial machine vision requires deterministic, high-throughput image processing combined with on-board decision logic and connectivity. The 10AS057K4F35I3LG provides 570 K logic elements and embedded DSP that can ingest multiple camera streams via LVDS or MIPI soft IP, perform real-time image enhancement, defect detection, and barcode/OCR classification, while the dual-core ARM Cortex-A9 HPS handles camera control, industrial protocols (EtherCAT, PROFINET), and HMI rendering. The industrial -40 °C to +100 °C temperature grade supports factory-floor deployment without thermal screening. Compared with a CPU + GPU solution, the SoC FPGA offers lower latency for line-scan inspection because processing is parallelized in hardware rather than queued through a graphics driver.
Empfohlen
Military Radar and Electronic Warfare
Defense radar and electronic warfare systems use the 10AS057K4F35I3LG to implement phased-array beamforming, pulse compression, and adaptive jamming at the edge. The Arria 10 SX device family is qualified to industrial temperature and offers hardened floating-point DSP blocks that accelerate FFT-based Doppler processing and STAP (Space-Time Adaptive Processing). Transceiver rates up to 17.4 Gbps interface directly to high-speed ADCs and DACs at the antenna array, and the HPS runs situational-awareness software. Compared with discrete FPGA + processor modules, this single-chip integration reduces SWaP-C for airborne and naval platforms where size, weight, and power are constrained.
Empfohlen
Broadcast Video Processing and Encoding
Broadcast studios deploy the 10AS057K4F35I3LG for real-time HEVC/H.264 encoding, multi-stream transcoding, and SDI/HDMI bridging. The 570 K LE fabric implements motion estimation and CABAC encoding pipelines in hardware, while the HPS manages codec containerization, watermarking, and network streaming. Transceiver channels support 12G-SDI and SMPTE 2110 IP-based broadcast workflows. The -3 speed grade positions this device at the high-performance end of the Arria 10 SX line, reducing required logic for a given throughput and lowering per-stream power. Engineers often pair this SoC FPGA with external DDR4 ECC memory to support 4K UHD processing at 60 fps.
Empfohlen
High-Performance Embedded Compute (HPC) Edge Nodes
Edge compute nodes use the 10AS057K4F35I3LG to accelerate AI inference, signal preprocessing, and data reduction before sending summaries to the cloud. The 570 K LE fabric implements custom CNN/RNN accelerators in programmable logic that outperform general-purpose GPUs per watt for fixed-precision inference, while the dual-core ARM Cortex-A9 HPS handles Linux, networking, and orchestration. The industrial temperature grade and surface-mount FCBGA package support deployment in ruggedized enclosures. Compared with a discrete accelerator card, this SoC FPGA consolidates compute, I/O, and control into a single BGA, reducing BOM and reliability risk for long-life industrial deployments.
Empfohlen
Medical Imaging and Diagnostic Equipment
Medical imaging modalities including ultrasound, CT, and MRI back-end processing use the 10AS057K4F35I3LG to implement beamforming, image reconstruction, and DICOM pipeline acceleration. The Arria 10 SX family provides the floating-point DSP throughput required for filtered back-projection and iterative reconstruction while the HPS runs the user interface, database, and network stacks. Industrial temperature operation supports integration into diagnostic carts and stationary imaging cabinets. Unlike general-purpose CPUs, the parallel DSP fabric performs reconstruction at deterministic latency, which is critical for real-time ultrasound and intra-operative imaging applications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AS057K4F35I3LG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AS048K4F35I3LG | 10AS032H4F35I3LG | 10AS057K3F35I2LG | 10AS057K4F35I3SG |
|---|---|---|---|---|---|
| Package | 1152-ball FCBGA (F35), 35x35 mm | 1152-ball FCBGA (F35), 35x35 mm - same | 1152-ball FCBGA (F35), 35x35 mm - same | 1152-ball FCBGA (F35), 35x35 mm - same | 1152-ball FCBGA (F35), 35x35 mm - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 | 480,000 | 320,000 | 570,000 | 570,000 |
| Speed Grade | -3 | -3 | -3 | -2 (slower) | -3 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Industrial | Industrial |
| HPS Cores | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
Wichtigste Unterscheidungsmerkmale
- Highest logic-element density in the F35-footprint Arria 10 SX family (vs. 10AS048K4F35I3LG)
- Industrial temperature grade at -3 speed grade (vs. 10AS057K3F35I2LG)
- Integrated dual-core ARM Cortex-A9 hard processor system (vs. 10AX570 non-SoC variant)
Designhinweise
Estimated: At typical SoC FPGA utilization (~70% logic + HPS active + transceivers at line rate), the 10AS057K4F35I3LG dissipates 15-25 W. The F35 35x35 mm FCBGA has a typical theta_JA of 8-12 C/W with a properly designed thermal via array and heatsink. Designers should run the Intel Arria 10 PowerPlay Early Power Estimator for board-accurate budgeting and add at least 0.5 m/s airflow if the junction-to-ambient thermal margin is below 25 C. Industrial temperature SKUs must keep junction below 100 C at worst-case ambient (commonly +85 C inside sealed enclosures).
Per the Arria 10 SX Device Family Pin Connection Guidelines, the 1152-ball F35 FCBGA requires a fully-populated via-in-pad array for the central transceiver and ground balls, with 1-oz copper on outer layers and 0.5-oz on inner layers. All VCC core and VCC_HPS rails must have decoupling per the Quartus Prime early board design checklist. HPS reference clock jitter must stay below the datasheet spec or Ethernet and DDR subsystems will fail link training. JTAG, BOOT_SEL, and MSEL straps should be pulled to their default positions through 4.7 kohm resistors with a single test-point for factory reconfiguration.
Estimated: A typical 10AS057K4F35I3LG design draws peak transient current in excess of 20 A on the 0.9 V core rail during configuration and clock-startup events. The Intel PowerPlay board design guidelines specify a minimum of 6 bulk ceramic capacitors (100 uF X7R) plus 240+ small-geometry decoupling (0.1 uF and 1 uF) near the device. Designers should sequence the HPS and FPGA rails using the recommended Intel power controller (e.g., LTC or EM22xx partner parts) to avoid latch-up during hot-plug or inrush events. Always verify the actual inrush profile with a current probe before finalizing the regulator selection.
Differential pairs to DDR4, transceivers, and high-speed LVDS must be length-matched within the tolerances stated in the Intel Arria 10 SX External Memory Interface Handbook. Reference plane continuity must be maintained across all high-speed lanes; do not route a high-speed signal over a plane split. For the 17.4 Gbps transceivers, target 85-ohm differential impedance with continuous reference plane on layer 2 or layer N-1. Use Intel's PCB design files (available under NDA) as a starting reference rather than designing from scratch.
Two common mistakes: (1) Using the wrong MSEL/BSEL strap configuration, which causes the HPS to fail to boot - always double-check the Arria 10 SX SoC FPGA User Guide boot table before tape-out; (2) Neglecting the transceer's reference clock slew-rate requirement, which produces intermittent link failures at high line rates. Always validate end-to-end with Quartus Prime Signal Tap and Transceiver Toolkit before shipping. Industrial-temperature variants should be subjected to thermal-screening at -40 C and +100 C; commercial-grade SKUs will fail early in the field.
Compliance-Informationen
RoHS compliant and lead-free per Intel Arria 10 product family documentation. AEC-Q100 not applicable for FPGAs - this part targets industrial, not automotive. Halogen-free status not explicitly stated in the verified web data - marked unknown per Data Authenticity Rules. Reach compliance per Intel product environmental specifications.
