10AX090U2F45E2SG - Arria 10 GX FPGA 900K LE 1932-FCBGA | Intel
Teilenummer: 10AX090U2F45E2SG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7610.3 | $7.610,30 |
| 10 | $7230 | $72.300,00 |
| 100 | $6850 | $685.000,00 |
| 500 | $6420 | $3.210.000,00 |
| 1.000 | $5995 | $5.995.000,00 |
10AX090U2F45E2SG Übersicht
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O cells can be configured after manufacture to implement arbitrary digital circuits, DSP pipelines, memory controllers, and high-speed serial interfaces. Within Intel's product hierarchy, the Arria 10 family sits in the mid-range transceiver-rich segment, between the lower-power Cyclone series and the high-end Stratix family, targeting applications that combine DSP throughput, high-speed transceivers, and moderate power budgets.
Key features of the 10AX090U2F45E2SG include the Arria 10 adaptive logic module (ALM) fabric, on-chip variable-precision DSP blocks, embedded 20nm SRAM blocks supporting single-port, dual-port, and FIFO configurations, and dedicated high-speed serial transceivers. The 1932-ball FC-FBGA package provides a high pin-count matrix suitable for high-bandwidth memory interfaces and multi-gigabit transceiver I/O, while the 0.9V core voltage aligns with the Arria 10 family's power architecture.
Architecturally, the Arria 10 device integrates hard IP for PCI Express Gen3, 10GbE and 40GbE MACs, external memory interfaces (DDR4, DDR3, QDR II+, RLDRAM III), and a high-performance core fabric with redundant logic for SEU mitigation. The E2 speed grade offers a balance between timing margin and power consumption suitable for production deployments.
Typical applications include wireless baseband processing, radar signal processing, military and aerospace secure communications, medical imaging accelerators, broadcast video processing, high-performance computing (HPC) coprocessors, and test-and-measurement ASIC prototyping where the high logic density and integrated transceivers reduce external component count.
When designing with the 10AX090U2F45E2SG, careful attention must be paid to PCB stack-up, power-rail sequencing, and thermal management. The FC-FBGA package requires microvia stack-up, and the high-density transceiver count demands controlled impedance routing. Use Intel Quartus Prime for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in Arria 10 family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für 10AX090U2F45E2SG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10AX090U2F45E2SG (gleiche Bauform und Footprint) – abweichend in Speed Grade, Logic Elements, Package, Operating Temperature Grade, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10AX090U2F45E2LG
✅ Drop-In✓ Auf Lager
$3647.5 / Stück
Datenblatt ansehen →10AX090U2F45E1SG
✅ Drop-In✓ Auf Lager
$5895 / Stück
Datenblatt ansehen →10AX090U2F45E1LG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10AX090U1F45E1SG
✅ Drop-In✓ Auf Lager
$8750 / Stück
Datenblatt ansehen →10AX090U1F45I1SG
✅ Drop-In✓ Auf Lager
$9750 / Stück
Datenblatt ansehen →10AX090U2F45E2SG Grenzwerte & elektrische Eigenschaften
| Family | Arria 10 GX |
| Logic Elements | 900000 |
| Embedded Memory (bits) | 59234304 |
| User I/O Count | 480 |
| Gehäuse | 1932-BBGA, FCBGA |
| Package Type | FC-FBGA (F45) |
| Speed Grade | -E2 |
| Temperature Grade | Industrial (S) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Device Family Variant | 10AX090 |
| Ordering Code Suffix | U2F45E2SG |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Montageart | Surface Mount |
10AX090U2F45E2SG Pin-Konfiguration
| Pin 1 | VCC — Core/auxiliary supply (refer to F45 ballout for exact rail assignment) |
| Pin 2 | GND — Common ground return |
| Pin 3 | IO_BANK_1A — User I/O bank 1A (LVDS/CMOS programmable) |
| Pin 4 | GXB_TX — Transceiver transmit differential pair |
| Pin 5 | GXB_RX — Transceiver receive differential pair |
| Pin 6 | REFCLK — Reference clock input for transceiver/PLL |
| Pin 7 | CONFIG_DONE — Configuration complete status output |
| Pin 8 | nSTATUS — Configuration status flag (active low) |
| Pin 9 | nCONFIG — Configuration initiate (active low) |
| Pin 10 | MSEL — Configuration mode select |
Typische Anwendungen
10AX090U2F45E2SG ist geeignet für 7 Anwendungs: Wireless Baseband Processing, Radar Signal Processing, Medical Imaging Acceleration, Broadcast Video Processing, High-Performance Computing (HPC) Coprocessor, ASIC Prototyping, Test & Measurement Instrumentation.
Wireless Baseband Processing
The 10AX090U2F45E2SG's 900K logic elements, integrated DSP blocks, and high-speed transceivers up to 28 Gbps make it well-suited for 4G/5G baseband digital up/down-conversion, CFR/DPD signal processing, and multi-antenna MIMO pipelines. The 59.2 Mbits embedded SRAM buffers FFT working sets without external memory stalls, while the 480 user I/O interfaces to analog RF front-ends and external DDR4 buffers.
Empfohlen
Radar Signal Processing
Military and weather radar systems rely on the 10AX090U2F45E2SG's 20nm process for high MTBF and its industrial temperature grade for field deployment. The variable-precision DSP blocks accelerate pulse-compression, MTI filtering, and CFAR detection pipelines, while the transceiver count handles multi-channel ADC data ingest up to 6.144 Gbps per lane. The 1932-ball FC-FBGA's thermal performance is critical for sustained compute loads in airborne platforms.
Empfohlen
Medical Imaging Acceleration
CT, MRI, and ultrasound imaging systems use the 10AX090U2F45E2SG to accelerate back-projection, beamforming, and image-reconstruction algorithms. The 900K logic elements and 59.2 Mbits embedded SRAM allow real-time 3D rendering, while the PCI Express Gen3 hard IP connects to host CPUs over standard PCIe backplanes. The industrial temperature range supports operating-room and mobile-clinic deployment without thermal derating.
Empfohlen
Broadcast Video Processing
The 10AX090U2F45E2SG supports 4K/UHD video processing including scaling, deinterlacing, color-space conversion, and HDR tone mapping in broadcast infrastructure. Its transceiver count handles 12G-SDI ingest at 11.88 Gbps per link, and the M20K memory blocks implement line buffers and motion-estimation windows. The 480 user I/O interfaces to HDMI 2.0, SDI, and DisplayPort 1.4 conversion ASICs.
Empfohlen
High-Performance Computing (HPC) Coprocessor
HPC clusters use the 10AX090U2F45E2SG as a co-processor for FPGA-accelerated genomics, financial Monte Carlo, and machine-learning inference. PCI Express Gen3 x8 hard IP enables host coupling at 8 GB/s, and the DSP fabric implements custom-precision floating-point operators. The 900K logic elements allow whole genomes or risk models to be staged on-chip, eliminating DRAM round-trips.
Empfohlen
ASIC Prototyping
Pre-silicon ASIC validation teams use the 10AX090U2F45E2SG to prototype designs approaching 900K ASIC gates on a reprogrammable platform, catching logic bugs before mask-set commitment. The F45 1932-ball FC-FBGA footprint, abundant transceivers, and Quartus Prime prototyping flow shorten bring-up cycles. Multiple Arria 10 boards can be ganged for multi-FPGA ASIC prototypes exceeding 5M gates.
Empfohlen
Test & Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators integrate the 10AX090U2F45E2SG for real-time signal acquisition, triggering, and DSP. The transceiver count handles 25+ Gbps protocol decoding for PCIe 4.0 and USB 3.1 Gen2 analysis. Industrial temperature screening supports bench-to-rack test equipment operating in uncontrolled environments, while Quartus Prime enables rapid protocol firmware updates.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10AX090U2F45E2SG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10AX090U2F45E2LG | 10AX090U2F45E1SG | 10AX090U2F45E1LG | 10AX090U1F45E1SG | 10AX090U1F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 900000 | 900000 | 900000 | 900000 | 900000 | 900000 |
| Embedded Memory (Mbits) | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Speed Grade | -E2 | -E2 | -E1 (faster) | -E1 (faster) | -E1 (faster) | -I1 (industrial) |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Wichtigste Unterscheidungsmerkmale
- Identical silicon to 10AX090U2F45E1SG with E2 speed bin selection (vs. 10AX090U2F45E1SG)
- Same package as 10AX090U2F45E2LG with SG terminal finish (vs. 10AX090U2F45E2LG)
- Industrial-grade screening over U1F45 commercial variant (vs. 10AX090U1F45E1SG)
- Mid-range Arria 10 density tier with balanced DSP and transceiver mix (vs. 10AX115 (higher density tier))
Designhinweise
The 1932-ball FC-FBGA package with 1.0mm ball pitch requires an 8-12 layer PCB stack-up with stacked microvias (laser-drilled) for inner ball connections. Use low-loss (Df < 0.005) high-Tg FR-4 or mid-loss Nelco N4000-13EP for the core. Maintain a 50Ω single-ended and 100Ω differential controlled impedance for transceiver channels. Place 0402 or 0201 decoupling capacitors on every VCC ball within 1mm trace length.
Estimate: the 10AX090U2F45E2SG core rail draws approximately 3-8A at 0.9V under typical utilization. Total device power can exceed 25W when transceivers are fully active. Use a multi-phase buck regulator (e.g., 4-phase ISL8225M) feeding the core rail, and route analog/digital supplies separately. Enable Intel's SmartVoltage ID and power-management features in Quartus to reduce dynamic power by 30-50% on lightly-loaded regions.
Estimated: at 25W total power dissipation and 31.4 C/W theta_JA for the F45 FC-FBGA, the junction rises 785C above ambient - exceeding silicon limits. A heatsink with thermal resistance under 1 C/W, plus 200 LFM forced airflow, is required for production deployment. The exposed-die FC-FBGA attaches directly to a heat spreader via thermal interface material (TIM). Use Intel's Arria 10 thermal estimator spreadsheet for board-level simulation before tape-out.
Route GXB (transceiver) channels first with length matching to within 0.127mm (5 mils) for lanes within a quad, and reference over a continuous ground plane. Use stitched ground vias every 2mm along the channel to suppress common-mode resonance. Separate analog PLL supplies from digital supplies with their own ferrite-bead-filtered rails. Avoid routing any signal traces under BGA balls on internal layers.
Common pitfalls include: (1) using Quartus II instead of Quartus Prime Pro - the older software cannot synthesize Arria 10 silicon; (2) omitting the .qsf pin assignments file before compilation; (3) underestimating configuration time for 20nm SRAM configuration bitstream > 100 Mbit; (4) failing to instantiate the Altera PHYLite or External Memory Interface IP for DDR4 - free IP is required for legal PHY; (5) ignoring SDC timing constraints for inter-clock-domain paths leads to silent functional failures.
Compliance-Informationen
RoHS and REACH compliant per Intel Arria 10 product family declaration. AEC-Q100 is not applicable - this is an FPGA, not an automotive-qualified IC; AEC-Q100 qualification must be done at the system level for the OEM. Lead-free ball finish standard on SG/LG suffixes.