10AX115H2F34E2LG - Arria 10 GX FPGA 1.15M LE 1152-FCBGA | Intel / Altera
MPN: 10AX115H2F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8250 | $8,250.00 |
| 10 | $7800 | $78,000.00 |
| 100 | $7100 | $710,000.00 |
| 500 | $6500 | $3,250,000.00 |
| 1,000 | $5950 | $5,950,000.00 |
Drop-in alternatives for 10AX115H2F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115H2F34E1SG
✅ Drop-In✓ In Stock
$3300 / Unit
View Datasheet →10AX115H1F34E1SG
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$2895 / Unit
View Datasheet →10AX115H1F34I1SG
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$6500 / Unit
View Datasheet →10AX115H2F34E2LG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Family | Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/O Count | 504 |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| Package | 1152-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Number of Terminals | 1152 |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Operating Temperature Grade | Industrial (E2 = -40C to +100C) |
| RoHS Status | Compliant |
10AX115H2F34E2LG square Pin Configuration Guide
Complete pinout information for 10AX115H2F34E2LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115H2F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115H2F34E2LG is suitable for 6 applications: 100G Ethernet Line Card, FPGA-Based ASIC Prototyping, Radar and Signal-Intelligence Preprocessing, 4K/8K Broadcast Video Processing, High-Speed Data Acquisition System, PCIe Gen3 Accelerator Card.
100G Ethernet Line Card
The 10AX115H2F34E2LG is well suited for 100G Ethernet line cards because its hardened 100G Ethernet MAC block and 14.1 Gbps transceivers (28.05 Gbps backplane) handle four 25G CAUI-4 lanes directly. Designers route two SFP28 cages or one QSFP28 to the FPGA fabric with minimal glue logic, while the 1.15M LE budget supports packet parsing, classification, and traffic management. The 504 user I/Os are sufficient for fabric back-pressure and DMA paths to a host CPU. Compared to a discrete PHY-plus-ASIC approach, this FPGA integration reduces BOM cost and board area by approximately 30 percent while preserving reprogrammability for evolving protocols.
Recommended
FPGA-Based ASIC Prototyping
Engineers building ASIC prototypes use the 10AX115H2F34E2LG because its 1.15M LE capacity plus 8.4 MB of embedded M20K memory mirrors mid-range SoC designs. The variable-precision DSP blocks support IEEE 754 single-precision floating point, allowing direct emulation of DSP accelerators. Time-division multiplexing of one ASIC clock across multiple FPGA clock domains is simplified by the abundant PLLs and 28 global clock networks. According to Intel's ASIC prototyping reference designs, one Arria 10 GX 115 can absorb roughly 10-15 million gates of equivalent ASIC logic, which is enough for early firmware bring-up and software regression testing before tape-out.
Recommended
Radar and Signal-Intelligence Preprocessing
The 10AX115H2F34E2LG fits radar front-end preprocessing because its variable-precision DSP blocks deliver up to 1.5 TFLOPs of single-precision compute, sufficient for FFT-based pulse-Doppler processing on multiple simultaneous receive channels. The 504 user I/Os interface to JESD204B/C ADCs from Analog Devices at 12.5 Gbps lane rates, while the 14.1 Gbps transceivers backhaul processed tracks to a host CPU. Industrial temperature grade (-40C to +100C) allows deployment on outdoor military and aerospace platforms. Reference Intel's Radar Signal Processing reference design for FFT pipeline and channelizer implementations.
Recommended
4K/8K Broadcast Video Processing
Broadcast video infrastructure uses the 10AX115H2F34E2LG because the 1.15M LE budget and 8.4 MB of M20K memory hold two full 4K60 frames (3840 x 2160, 10-bit) for cross-conversion and color grading. Hardened DisplayPort 1.4 and HDMI 2.0b output controllers drive up to two 4K monitors at 60 Hz. The PCIe Gen3 x8 hard IP connects to a host media server for uncompressed stream ingest. Designers typically pair this FPGA with DDR4 SODIMMs at 2666 Mbps for frame-rate conversion buffers, and the industrial temperature grade supports 24/7 broadcast facility operation.
Recommended
High-Speed Data Acquisition System
The 10AX115H2F34E2LG serves as the core of high-speed data acquisition systems because its 14.1 Gbps transceivers pair directly with JESD204B/C ADCs at lane rates up to 12.5 Gbps, capturing RF, ultrasonic, or medical-imaging signals in real time. The 8.4 MB of embedded memory functions as a deep FIFO, smoothing bursts before DMA transfer to the host over PCIe Gen3 x8. Designers use the 504 user I/Os for GPIO, trigger inputs, and clock distribution. Industrial temperature grade and -40C to +100C operation make the FPGA suitable for factory-floor test equipment and outdoor instrumentation. Reference Intel's data-acquisition reference design for JESD204B link bring-up.
Recommended
PCIe Gen3 Accelerator Card
Hyperscale accelerator cards integrate the 10AX115H2F34E2LG because its hardened PCIe Gen3 x8 endpoint supports 8 GB/s host transfers without consuming fabric resources. The 1.15M LE budget hosts custom compute pipelines - for example, database query acceleration, GZIP/Zstandard compression, or machine-learning inference engines. The 14.1 Gbps transceivers expose additional external ports for NVMe-over-Fabric or 25G Ethernet co-processing. Compared to a discrete PCIe switch plus accelerator ASIC solution, the Arria 10 integration reduces the typical half-height half-length card to a single FPGA, simplifying thermal design. Source: Intel's PCIe-based accelerator reference platform.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115H2F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115H2F34E1SG | 10AX115H1F34E1SG | 10AX115H1F34I1SG | 10AX115N3F40E2SG |
|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1932-BBGA, FCBGA |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O | 504 | 504 | 504 | 504 | 768 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Operating Temperature | -40C to +100C (E2) | 0C to +100C (E1) | 0C to +100C (E1) | -40C to +125C (I) | -40C to +100C (E2) |
| RoHS / Ball Finish | LG (lead-free, RoHS) | SG (lead-free, RoHS) | SG (lead-free, RoHS) | SG (lead-free, RoHS) | SG (lead-free, RoHS) |
Key Differentiators
- Highest transceiver lane count in the 1152-FCBGA H2 family (vs 10AX115H1F34E1SG)
- Industrial temperature grade with lead-free ball finish (vs 10AX115H2F34E1SG)
- Mid-bandwidth positioning vs Stratix 10 and Cyclone V (vs 10AX090S4F45E3LG)
Design Notes
The 1152-ball FCBGA requires a high-density-interconnect (HDI) PCB stack-up with laser-drilled microvias, sequential lamination, and matched-length routing on the transceiver lanes. Reference Intel's Arria 10 GX Transceiver PHY User Guide for channel-loss budgets and PCB stack-up recommendations; inadequate stack-up planning is the most common cause of 14.1 Gbps link-up failures. Estimated: typical build is a 12-layer 1+N+1 stack-up with Megtron-6 or equivalent low-loss dielectric, target insertion loss under 10 dB at 7 GHz.
Estimated: a fully populated 10AX115H2F34E2LG design can draw 20-30 W from the 0.9 V core plus 1.5-2.0 W per 14.1 Gbps transceiver channel. Use at least a 6-layer power plane stack with 1-oz copper on the 0.9 V plane and a dedicated return-path via stitching every 200 mil. Decouple each transceiver power pin with 0.1 uF + 10 uF + 220 uF bulk, and place them within 100 mil of the BGA pad. Source: Intel Arria 10 GX Power Distribution Network design guidelines.
Estimated: junction-to-ambient thermal resistance (theta_JA) for the 1152-FCBGA at 1 m/s airflow is approximately 8-12 C/W depending on PCB copper area. At 25 W dissipation, junction temperature rises 200-300 C above ambient without airflow or heatsink. Industrial-grade (-40C to +100C) operation requires at minimum a 1 m/s forced-air stream or a custom heatsink that contacts the FCBGA top via a thermal-interface material. Source: Intel Arria 10 Thermal Management User Guide.
For 14.1 Gbps transceiver channels, route diff pairs with 100 ohm differential impedance, intra-pair skew below 1 ps per inch, and inter-pair skew below 5 mil. Use a continuous reference plane on layer 2 and stitch vias every lambda/10 to suppress ground-bounce resonance. Run post-route SI simulations in HyperLynx, Ansys SIwave, or Intel's Quartus Prime Signal Tap to verify eye margins of at least 50 percent at the receiver. Source: Intel Arria 10 Transceiver Signal Integrity guidelines.
Do not confuse H2 (high-density transceiver, 24 lanes) with H1 (standard transceiver, 12 lanes) when sourcing alternates - both share the 1152-FCBGA but have different transceiver pin maps. Always consult the Quartus Prime pin-out file before laying out a board. Also note that LG vs SG ball finish is not a pin-level difference; only the solder-ball alloy changes (lead-free vs leaded for SG). Source: Intel Arria 10 datasheet, 'Package Information' chapter.
Compliance Information
RoHS compliant per LG suffix and Intel Arria 10 datasheet package information. AEC-Q100 not applicable (industrial-grade FPGA, not automotive qualified). Conflict-mineral declaration is available through Intel's corporate responsibility report.
