10M08DCU324I7G - MAX 10 FPGA, 8K LE, U324 BGA | Intel
MPN: 10M08DCU324I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.5 | $16.50 |
| 10 | $14.85 | $148.50 |
| 100 | $12.95 | $1,295.00 |
| 500 | $11.2 | $5,600.00 |
| 1,000 | $9.85 | $9,850.00 |
| 3,000 | $8.5 | $25,500.00 |
Drop-in alternatives for 10M08DCU324I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DCU324A7G
✅ Drop-In✓ In Stock
$25.1 / Unit
View Datasheet →10M08DAU324I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$22.1 / Unit
View Datasheet →10M16DCU324I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$40.1 / Unit
View Datasheet →10M25DCU324I7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M04DCU324I7G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M08DCU324C8G
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10M08DCU324I7G Maximum Ratings & Electrical Characteristics
| Product Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (M9K blocks / bits) | 246 Kbits |
| User Flash Memory | 387,072 bits |
| Maximum User I/O Pins | 246 |
| Package | 324-pin UFBGA (U324) |
| Ball Pitch | 0.8 mm |
| Process Technology | 55 nm NOR flash CMOS |
| Integrated ADC | 12-bit SAR, up to 18 channels |
| ADC Sampling Rate | 1 MSa/s (single-ended) |
| Configuration Modes | JTAG, internal flash, external host |
| Core Voltage | 3.3 V |
| Operating Temperature | -40C to +100C (industrial, I7) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Mounting Type | Surface Mount (BGA) |
10M08DCU324I7G 324-pin ufbga (u324) Pin Configuration Guide
Complete pinout information for 10M08DCU324I7G (324-pin ufbga (u324) package) with 246 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DCU324I7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 246 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M08DCU324I7G is suitable for 6 applications: Industrial Motor Control and Drive I/O Expansion, Board Management Controller / System Management, Video Bridging and Image Aggregation, Low-Cost PCIe Endpoint Prototyping, Legacy CPLD Replacement with ADC Integration, Automotive Body Electronics and Driver Assistance.
Industrial Motor Control and Drive I/O Expansion
The 10M08DCU324I7G fits industrial motor-control and I/O-expansion designs where deterministic low-latency logic is required alongside non-volatile instant-on configuration. The 8,000 logic elements provide ample headroom for custom PWM modulators, encoder decoding, and fieldbus glue logic such as EtherCAT or PROFIBUS side-channels. The on-die 12-bit ADC samples up to 1 MSa/s, enabling current-sense and back-EMF monitoring without a separate ADC chip. Compared with a discrete MCU plus CPLD solution, integrating both into a single MAX 10 device reduces board area by roughly 30 to 40 percent and eliminates configuration-PROM complexity. Quartus Prime Lite supports the typical IP cores needed for industrial motor-control reference designs.
Recommended
Board Management Controller / System Management
The MAX 10 architecture is purpose-built for board-management-controller (BMC) and system-management roles in telecom, server, and networking hardware. The on-die NOR flash enables CPLD-style instant-on within milliseconds of power-up, which is critical for sequencing power rails, monitoring fans, and asserting resets before a baseboard management controller boots. The integrated 12-bit ADC aggregates rail voltages, temperatures, and fan tachometer inputs, removing a dedicated ADC IC from the BOM. The U324 package supports the 246 I/O count needed for mid-complexity backplane management, and vertical migration to 10M16 or 10M25 in the same U324 footprint lets designers reuse the PCB across product variants.
Recommended
Video Bridging and Image Aggregation
The 10M08DCU324I7G serves as a cost-effective bridge between image sensors, parallel RGB/CMOS interfaces, and downstream processors in industrial camera, kiosk, and machine-vision applications. The 8K LE fabric and embedded multipliers handle pixel-rate color-space conversion, gamma correction, and limited compression at resolutions up to 1080p60. LVDS I/O support allows direct connection to flat-panel displays or serializer/deserializer (FPD-Link) channels. Because the part is non-volatile, the bridging logic comes up immediately at power-on, eliminating display-mux glitches during system boot. The U324 footprint provides enough I/O for dual-channel LVDS input and output plus control GPIOs.
Recommended
Low-Cost PCIe Endpoint Prototyping
The MAX 10 supports PCIe hard IP in higher-density device variants, and the 10M08DCU324I7G can implement Gen1/Gen2 endpoint prototyping for low-bandwidth add-in cards, IO modules, and industrial PCs. The integrated transceivers (where present in the family) plus the soft PCI Express IP core support x1 lane operation at 2.5 GT/s or 5 GT/s. The 8K LE fabric is sufficient for low-density endpoint functions such as GPIO expansion, I2C/SPI bridging, or basic data acquisition. Designers evaluating PCIe validation can use the same U324 footprint across 10M08, 10M16, and 10M25 to scale logic density without re-spinning the board.
Recommended
Legacy CPLD Replacement with ADC Integration
The 10M08DCU324I7G is an ideal modernization path for designs that currently use a CPLD (such as MAX II or MAX V) plus a separate external ADC. The on-die 12-bit ADC replaces the standalone ADC, and the 8K logic fabric replaces the CPLD logic in a single package. Designers benefit from a smaller BOM, lower quiescent current, and the option to add soft-processor cores such as Nios II for housekeeping tasks. The U324 footprint is pin-compatible with other MAX 10 density options, enabling a clean migration path from the legacy CPLD design to a higher-density MAX 10 if feature growth demands it.
Recommended
Automotive Body Electronics and Driver Assistance
For automotive applications such as body-control modules, lighting controllers, and sensor aggregation, the 10M08DCU324I7G (industrial grade) is a stepping stone to the AEC-Q100-qualified 10M08DCU324A7G variant in the identical U324 package. The non-volatile configuration supports the instant-on behavior needed for body-electronics wake-up, while the embedded ADC handles sensor inputs such as temperature, lighting, and battery monitoring. Designers can prototype on industrial-grade parts and migrate to automotive-grade silicon for production without changing the PCB layout. The MAX 10 AEC-Q100 qualification covers the operating temperature range from -40C to +125C required for under-hood and cabin deployments.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DCU324I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DCU324A7G | 10M08DAU324I7G | 10M16DCU324I7G | 10M25DCU324I7G | 10M04DCU324I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin UFBGA (U324) | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same |
| Logic Elements | 8,000 LE | 8,000 LE | 8,000 LE | 16,000 LE | 25,000 LE | 4,000 LE |
| Temperature Grade | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory | 246 Kbits | 246 Kbits | 246 Kbits | 504 Kbits | 675 Kbits | 189 Kbits |
| User Flash | 387 Kbits | 387 Kbits | 387 Kbits | 585 Kbits | 788 Kbits | 295 Kbits |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Integrated ADC | 12-bit SAR, 18 channels | 12-bit SAR, 18 channels | 12-bit SAR, 18 channels | 12-bit SAR, 22 channels | 12-bit SAR, 26 channels | 12-bit SAR, 14 channels |
| AEC-Q100 Qualified | No (industrial grade) | Yes | No | No | No | No |
Key Differentiators
- On-die NOR flash configuration eliminates external boot PROM (vs SRAM-based competitors (Xilinx XC7A35T, Lattice ECP5))
- Integrated 12-bit SAR ADC with up to 18 analog inputs (vs Xilinx XC7A35T (no on-die ADC))
- Pin-to-pin vertical migration across the MAX 10 family (vs Lattice MachXO2-1200 (separate package per density))
Design Notes
The U324 package uses a 0.8 mm ball pitch and a 15x15 ball array with depopulated outer rows. Microvia or via-in-pad technology is recommended for the breakout, and at least four PCB routing layers are needed to escape BGA balls cleanly. A continuous ground reference plane directly under the BGA is critical for LVDS and DDR signal-integrity margins; a split or discontinuous plane under the device can cause impedance discontinuities greater than 15 percent. Estimated: the PCB stackup should target a 50 ohm single-ended / 100 ohm differential impedance for LVDS pairs, with via stubs kept below 0.3 mm for signal rise times under 200 ps.
MAX 10 devices require multiple supply rails: a 3.3 V core/analog supply, a separate 2.5 V or 1.2 V auxiliary supply depending on the variant, and per-bank VCCIO supplies. Decoupling follows the standard Intel FPGA guideline: at least one 100 uF bulk capacitor per supply rail near the device, plus 0.1 uF and 1 nF ceramic capacitors distributed around the BGA periphery with one pair per eight balls. Power-up sequencing requirements are relaxed compared with SRAM-based FPGAs because configuration is stored in flash, but ramp rates should still meet the 0.5 to 100 ms VCCIO specification to avoid POR glitches.
Differential-pair routing for LVDS must maintain less than 10 mil length mismatch within each pair and less than 50 mil mismatch between pairs to meet the MAX 10 LVDS skew budget. The Quartus Prime Fitter reports timing margin after place-and-route; designers should target at least 200 ps of setup margin on all source-synchronous interfaces to absorb PCB tolerances across temperature. The on-die temperature-sensing diode should be routed to dedicated JTAG pins (TDI/TDO) with no series resistance, enabling thermal profiling via Quartus during board bring-up.
A frequent pitfall when migrating from MAX II/V CPLDs to MAX 10 is omitting the JTAG chain pull-up on TCK and TMS. MAX 10 expects an external 1 to 4.7 kohm pull-up on TMS to keep the TAP controller in a defined state during power-up; without it, configuration can fail intermittently. Another common mistake is using single-ended clocking on LVDS receiver inputs - MAX 10 LVDS receivers require the complementary input to be AC-coupled or properly biased. Finally, the user flash memory (UFM) has a 100,000-erase-cycle endurance rating; using it as general-purpose storage in high-write-rate applications will shorten device lifetime.
Compliance Information
Standard industrial MAX 10 OPN. For AEC-Q100 automotive qualification in the same U324 footprint, choose 10M08DCU324A7G. Lead-free matte-tin balls; tray packing per JEDEC tray standard.
