10M08DCU324A7G - MAX 10 FPGA, 8K LE, 324-LFBGA | Intel
MPN: 10M08DCU324A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $25.1 | $25,100.00 |
10M08DCU324A7G Overview
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic fabric can be reconfigured by the designer after manufacturing, in contrast to an ASIC whose function is fixed at tape-out. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> logic ICs -> integrated circuits -> semiconductors. MAX 10 devices are non-volatile FPGAs with on-die flash configuration memory, distinguishing them from SRAM-based competitors that require external boot flash.
Key features include integrated 12-bit ADC blocks, on-chip flash for instant-on configuration, dual-configuration flash support, and DSP blocks in selected variants. The U324 package exposes up to 246 user I/O with mixed-voltage support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) on user I/O banks. The device integrates phase-locked loops (PLLs) for clock management and includes embedded SRAM blocks distributed across the fabric.
The MAX 10 architecture employs logic-array blocks (LABs) each containing 16 logic elements, interconnected by a multi-level routing hierarchy with embedded multiplier blocks and RAM blocks. The non-volatile configuration memory enables single-chip FPGA operation without external boot PROMs, simplifying board design and reducing BOM cost.
Typical applications include industrial motor control, automotive body electronics, sensor aggregation, display controllers, low-cost video processing, and I/O expansion bridges. The AEC-Q100 qualification makes the device particularly suitable for under-hood and body-control applications where temperature extremes are routine.
When designing with the 10M08DCU324A7G, ensure that the chosen variant matches the I/O bank voltage mix required by your design. The internal configuration time after power-on is typically sub-100 ms because configuration is read from on-chip flash rather than an external serial PROM, which simplifies power-sequencing requirements.
This page synthesizes distributor pricing, drop-in alternative MAX 10 same-family variants, and practical design notes not collected in a single section of the manufacturer datasheet.
Drop-in alternatives for 10M08DCU324A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M08DCU324A7G (same form factor and footprint) — differing in Package, Process Technology, Logic Elements (LE), Mounting Type, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DCU324C8G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M08DCU324I7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$8.5 / Unit
View Datasheet →10M08DCU324I7P
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M04DCU324A7G
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →10M04DCU324C8G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M08DCU324A7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (Kbits) | 246 |
| User Flash Memory (bits) | 387,072 |
| Total User I/O | 246 |
| Package | 324-LFBGA (U324) |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Maximum Internal Clock Frequency | 382 MHz |
| Operating Temperature | -40 C to +125 C |
| AEC-Q100 Grade | Automotive qualified |
| Configuration Memory | On-chip flash (non-volatile) |
| JEDEC Package Code | S-PBGA-B324 |
| Terminal Position | Bottom |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10M08DCU324A7G s-pbga-b324 Pin Configuration Guide
Pin configuration for 10M08DCU324A7G (s-pbga-b324 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M08DCU324A7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M08DCU324A7G is suitable for 6 applications: Automotive Body Electronics, Industrial Motor Control, Sensor Aggregation Hub, Display Controller / LVDS Bridge, Low-Cost Video Processing, I/O Expansion Bridge.
Automotive Body Electronics
The 10M08DCU324A7G's AEC-Q100 qualification and -40 C to +125 C operating range make it a strong fit for automotive body controllers and BCM (Body Control Module) designs. With 8,000 logic elements it can absorb multiple legacy 8/16-bit MCU functions into a single FPGA, reducing PCB area and BOM count. The on-die 12-bit ADC block digitizes analog sensor inputs (temperature, voltage, current) without external ADC chips, while 246 user I/O drive LEDs, MOSFET gates, LIN/CAN transceivers, and motor loads. The non-volatile flash configuration ensures instant-on behavior required by body-electronics power-up sequencing. Estimated: at typical 5V GPIO load, the device core draws under 200 mA active, simplifying power-tree design.
Recommended
Industrial Motor Control
The 10M08DCU324A7G is well suited for industrial motor-control and drives in the sub-1 kW range, integrating PWM generation, encoder feedback decoding, and protection logic on one device. Its 382 MHz internal clock supports deterministic control loop rates up to several hundred kHz. The on-die ADC measures phase currents via shunt resistors while the 246 user I/O support 3-phase gate-driver interfaces, brake control, and fault inputs. Pin-compatible migration to 10M04DCU324A7G is possible if lower logic density suffices, freeing 50% of the LE budget for cost optimization.
Recommended
Sensor Aggregation Hub
In IoT and industrial gateway designs, the 10M08DCU324A7G aggregates data from multiple sensors (temperature, pressure, flow, gas) over SPI, I2C, UART, or LVDS and forwards aggregated frames via Ethernet or CAN. The on-die flash stores both configuration and calibration tables, eliminating external EEPROM. The 246 user I/O allow direct fan-out to dozens of sensor channels without external muxing. AEC-Q100 qualification extends deployment to factory-floor and vehicle environments where temperature swings exceed consumer-grade limits.
Recommended
Display Controller / LVDS Bridge
The 10M08DCU324A7G can serve as a low-cost display controller or LVDS-to-RGB bridge in industrial HMI panels. Its LVDS-capable I/O pairs and PLL-based clock generation support common panel resolutions up to 1366x768 at 60 Hz. The 8K LE fabric comfortably implements timing controllers, dithering, and backlight dimming (PWM) on a single chip. Compared with discrete LCD-controller ICs, the FPGA allows late-stage resolution or timing changes without PCB rework.
Recommended
Low-Cost Video Processing
The 10M08DCU324A7G handles low-bandwidth video tasks such as format conversion (RGB-to-YUV), simple scaling, OSD overlay, and frame-rate conversion for industrial camera and inspection systems. Its embedded multiplier blocks implement pixel-pipeline arithmetic without external DSP chips. The on-die flash accelerates firmware iteration cycles since image processing parameters can be reloaded without external PROM reprogramming.
Recommended
I/O Expansion Bridge
The 10M08DCU324A7G is commonly deployed as an I/O expansion bridge connecting legacy processors (with too few GPIO) to additional buttons, LEDs, keypads, or peripheral buses. The 246 user I/O provide a generous fan-out budget, and the FPGA translates between I2C/SPI host commands and parallel GPIO operations. Non-volatile on-die configuration means instant host-processor visibility of all I/O at power-on without bootloader delay.
Recommended
Recommended Products Summary
Engineering reference data for 10M08DCU324A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DCU324C8G | 10M08DCU324I7G | 10M08DCU324I7P | 10M04DCU324A7G | 10M04DCU324C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-LFBGA (U324) | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same |
| Logic Elements (LE) | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 (-50%) | 4,000 (-50%) |
| Embedded Memory (Kbits) | 246 | 246 | 246 | 246 | 189 (-23%) | 189 (-23%) |
| User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Speed Grade | A7 | C8 (slower) | I7 | I7 | A7 | C8 |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Yes |
| User Flash (Kbits) | 378 | 378 | 378 | 378 | 295 (-22%) | 295 (-22%) |
Key Differentiators
- Highest-density DCU MAX 10 in the U324 footprint (vs 10M04DCU324A7G)
- Automotive A7 speed grade, -40 C to +125 C range (vs 10M08DCU324C8G)
- Non-volatile on-die flash configuration (vs 10CL040ZU256I8G (Cyclone 10 LP))
Design Notes
Estimated: at industrial extreme of 125 C ambient with all 246 I/O driving 3.3 V CMOS loads at moderate toggle rates, the 10M08DCU324A7G core dissipation is approximately 0.5-0.8 W. The 324-LFBGA's theta_JA of approximately 18 C/W (with 4-layer PCB thermal vias under the die) yields a junction-to-ambient rise of roughly 15 C. A thermal-via array beneath the package center ball grid is essential for AEC-Q100 conformance. Avoid placing the FPGA directly above a hot power-MOSFET to minimize thermal coupling.
The 324-LFBGA requires a 0.8 mm ball pitch with microvia or via-in-pad PCB technology for reliable assembly. Decoupling follows the MAX 10 Hardware Design Guide: at least one 0.1 uF X7R per VCCIO pin group, plus 4.7 uF bulk caps at each supply rail. Maintain 4-5 decoupling caps within 5 mm of the package perimeter. The dedicated GND balls should connect to an inner ground plane via short, low-inductance microvia fanouts.
Do not assume all 246 user I/O are simultaneously usable - bank-voltage mix and configuration mode (single-image vs dual-image) reduce available I/O. Pin 1 location differs between U324 and F484 packages; never reuse a U324 layout for F484 BOM swaps. The on-die flash requires a 1.15-1.25 V VCCINT with tight 3% regulation; exceeding 1.25 V during configuration can corrupt flash content. Always specify the exact -A7 / -C8 / -I7 speed-grade in your BOM to avoid timing-closure surprises.
Compliance Information
AEC-Q100 qualified per manufacturer datasheet. RoHS and REACH compliance per Intel/Altera product page. Halogen-free status not explicitly stated in retrieved data.
