10M16SCE144I7G - MAX 10 FPGA, 16K LE, 144-LQFP | Intel / Altera
Teilenummer: 10M16SCE144I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $51.99 | $51,99 |
| 10 | $48.5 | $485,00 |
| 100 | $42.75 | $4.275,00 |
| 500 | $38.2 | $19.100,00 |
| 1.000 | $34.85 | $34.850,00 |
10M16SCE144I7G Übersicht
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement arbitrary digital logic functions using a matrix of configurable logic blocks (LBs), programmable interconnect, and I/O cells. FPGAs sit between simple CPLDs and full Application-Specific Integrated Circuits (ASICs) in the programmable logic hierarchy, offering higher density than CPLDs and lower NRE cost than ASICs. MAX 10 specifically targets low-cost, low-power, and instant-on applications by integrating configuration flash on-chip, eliminating the need for an external boot PROM.
Key features include a 1.0 V core supply with built-in voltage regulators supporting 3.3 V/2.5 V single-supply operation, integrated 12-bit SAR ADC (up to 1 MSPS with 17 channels), on-chip flash and SRAM, DSP blocks, and a hardened Nios II soft-core processor support path. The 10M16 variant offers the smallest LE count in the MAX 10 family while still retaining the analog and instant-on features. The device supports LVCMOS, LVDS, LVTTL, and other I/O standards via eight I/O banks.
Architecturally, the 10M16 uses a logic-element-based fabric with embedded memory blocks (M9K), 18x18 multipliers, and PLLs for clock management. The integrated configuration flash removes the external boot device, reducing BOM cost and PCB footprint. The hardened ADC and temperature-sensing diode provide analog monitoring without consuming logic resources, distinguishing MAX 10 from pure-digital FPGAs.
Typical applications include industrial control and motor drive, IoT edge nodes, sensor aggregation and bridging, low-cost video processing, automotive body electronics, and portable instrumentation. The 144-LQFP exposed-pad package is suited for cost-sensitive designs that still need moderate logic density and embedded analog.
Designers should be aware that this variant operates in the industrial temperature range (-40 C to +100 C junction per the I7G speed/temperature grade) and uses the EQFP-144 land pattern. Quartus Prime design software is required; designers should validate pinout against the device handbook since the same MAX 10 die is offered in multiple package options.
This page synthesizes distributor pricing, drop-in MAX 10 family alternatives, and practical design notes that are not aggregated in the manufacturer datasheet alone.
Drop-in-Alternativen für 10M16SCE144I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M16SCE144I7G (gleiche Bauform und Footprint) – abweichend in Package, Core Voltage, Configuration Memory, Logic Elements (LE), Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M16SCE144A7G
✅ Drop-In✓ Auf Lager
$24.5 / Stück
Datenblatt ansehen →10M16SCE144C8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M08SCE144I7G
✅ Drop-In✓ Auf Lager
$70.2 / Stück
Datenblatt ansehen →10M04SCE144I7G
✅ Drop-In✓ Auf Lager
$10.26 / Stück
Datenblatt ansehen →10M02SCE144A7G
✅ Drop-In✓ Auf Lager
$4.62 / Stück
Datenblatt ansehen →10M16SCE144I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (bits) | 562,176 |
| User I/O Pins | 101 |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144, 22x22 mm, 0.5 mm pitch) |
| Montageart | Surface Mount |
| Process Technology | 55 nm CMOS, non-volatile (on-chip flash) |
| Core Voltage | 1.0 V (internal regulator from 3.3 V/2.5 V supply) |
| Supply Voltage Range | 2.85 V to 3.465 V (single 3.3 V supply supported) |
| Operating Temperature Grade | I7G (Industrial, -40 C to +100 C junction) |
| RoHS-Status | RoHS Compliant |
| Embedded SRAM Blocks | M9K (9 Kbit blocks) |
| DSP Blocks | Yes (18x18 multipliers) |
| Hardened ADC | 12-bit SAR, up to 1 MSPS, 17 channels |
| Configuration Memory | On-chip dual-configuration flash (instant-on) |
10M16SCE144I7G 144-lqfp exposed pad (eqfp-144, 22x22 mm, 0.5 mm pitch) Pinbelegungsleitfaden
Pinbelegung für 10M16SCE144I7G (144-lqfp exposed pad (eqfp-144, 22x22 mm, 0.5 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M16SCE144I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M16SCE144I7G ist geeignet für 6 Anwendungs: Industrial Motor Control, IoT Edge Sensor Aggregation, Portable Test & Measurement, Automotive Body Electronics, Video Bridging & Display Processing, Communication Protocol Bridging.
Industrial Motor Control
The 10M16SCE144I7G fits industrial motor-control designs where the integrated 12-bit SAR ADC (up to 1 MSPS, 17 channels) samples current and voltage feedback while the 16,000 LEs implement field-oriented control loops, PWM generation, and encoder decoding. Operating from a single 3.3 V supply with on-chip regulation simplifies the analog front end. The I7G industrial temperature grade supports factory-floor environments from -40 C to +100 C junction, and the hardened DSP blocks accelerate the Park/Clarke transforms required for AC drives.
Empfohlen
IoT Edge Sensor Aggregation
For IoT edge gateways aggregating multiple sensor streams (SPI, I2C, UART, GPIO), the 10M16SCE144I7G provides 101 user I/Os and 562 Kbit of embedded SRAM for FIFO buffering, plus DSP blocks for on-device signal preprocessing. The MAX 10 instant-on feature boots from internal flash in microseconds, an advantage over SRAM-based FPGAs that need an external boot PROM. Low static power suits battery-backed edge nodes; LVCMOS 3.3 V I/O directly interfaces with most MEMS sensors and MCUs.
Empfohlen
Portable Test & Measurement
The integrated ADC and on-chip flash of the 10M16SCE144I7G are useful for portable instruments such as handheld multimeters, oscilloscope probes, and data loggers that need acquisition, signal conditioning, and a display interface in one device. The 16K LEs handle triggering, decimation, and display refresh, while the 562 Kbit SRAM buffers sample data before USB or Bluetooth uplink. Industrial-temperature operation and a single 3.3 V supply simplify enclosure and battery management.
Empfohlen
Automotive Body Electronics
Body-control modules benefit from the 10M16SCE144I7G's instant-on flash, integrated ADC for switch-bounce detection, and high I/O count for driving LIN/CAN transceivers, LEDs, and relays. The 144-LQFP Exposed Pad package suits under-dash PCB sizes. Designers targeting AEC-Q100 must select an automotive-grade MAX 10 variant; the I7G industrial-grade part shown here is suitable for non-safety body electronics but is not AEC-Q100 qualified.
Empfohlen
Video Bridging & Display Processing
The 10M16SCE144I7G serves low-cost video bridging, format conversion, and LVDS display driving thanks to its DSP blocks, PLLs, and LVDS-capable I/Os at 144 pins. 16K LEs implement simple scaling, color-space conversion, and timing controllers for industrial monitors and digital signage. The on-chip configuration flash removes the external boot PROM common to SRAM-based FPGA display pipelines, reducing BOM and board area.
Empfohlen
Communication Protocol Bridging
Bridging between industrial protocols (Modbus, PROFIBUS, CAN, SPI, I2C, UART) is a classic MAX 10 use case. The 10M16SCE144I7G's 101 user I/Os and 562 Kbit SRAM support multiple protocol stacks concurrently, while the hardened ADC monitors bus voltages. Industrial-temperature rating and on-chip flash enable compact, reliable gateways deployed on factory floors where external boot devices would add cost and failure modes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M16SCE144I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M16SCE144A7G | 10M16SCE144C8G | 10M08SCE144I7G | 10M04SCE144I7G | 10M02SCE144A7G |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 144-LQFP Exposed Pad (EQFP-144, 22x22 mm) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 8,000 | 4,000 | 2,000 |
| User I/O | 101 | 101 | 101 | 101 | 101 | 101 |
| Speed/Temperature Grade | I7G (Industrial) | A7G (Commercial) | C8G (Commercial) | I7G (Industrial) | I7G (Industrial) | A7G (Commercial) |
| Integrated ADC | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels | 12-bit SAR, 17 channels |
Wichtigste Unterscheidungsmerkmale
- Lowest-density MAX 10 with full feature set intact (vs. 10M08SCE144I7G)
- Industrial-temperature I7G grade from same die (vs. 10M16SCE144A7G)
- Drop-in alternate speed grade (vs. 10M16SCE144C8G)
Designhinweise
The 144-LQFP Exposed Pad package of the 10M16SCE144I7G relies on the exposed die pad for both ground return and thermal dissipation. The PCB must solder this pad to a continuous copper pour of at least 1 square inch with multiple thermal vias to the internal ground plane. Estimated: assuming theta_JA of approximately 25 C/W with a properly designed 4-layer thermal pad, the device can dissipate roughly 2 W at 70 C ambient while keeping the junction below 100 C, but the actual MAX 10 power is application-dependent and must be measured.
Decouple the 10M16SCE144I7G power pins with 0.1 uF ceramic capacitors placed within 100 mils of each supply pin, plus bulk 10 uF-22 uF tantalum or polymer capacitors near the package. Keep all MAX 10 supply rails (VCCINT, VCCA, VCCIO, VCCPD) properly sequenced per the device handbook; improper sequencing can prevent configuration. Route JTAG signals (TCK, TMS, TDI, TDO) with controlled impedance and series terminators if the trace exceeds 2 inches.
Common pitfalls when designing with the 10M16SCE144I7G include: (1) failing to connect the exposed pad, which causes electrical and thermal failures; (2) mixing 3.3 V and 2.5 V VCCIO without correct bank-by-bank I/O standard assignments in Quartus; (3) assuming the integrated ADC replaces an external front-end without verifying sample rate and SNR; (4) overlooking configuration mode selection (JTAG vs AS vs PS) which determines whether the device boots from internal flash or external memory.
Route high-speed LVDS pairs on the 10M16SCE144I7G with matched lengths within 20 mils, and keep ground-reference planes continuous under the routes. Place the JTAG header near the device and away from switching power or motor-driver stages to avoid programming failures. For designs using the integrated ADC, route analog inputs away from digital switching traces and use a separate analog ground island joined at a single point to the digital ground at the device.
Compliance-Informationen
RoHS compliance confirmed per Datasheets.com package description (ROHS COMPLIANT, PLASTIC, EQFP-144). Industrial temperature grade I7G but not AEC-Q100 qualified; select an automotive-grade MAX 10 variant for safety-critical automotive applications.
