Intel

10M04SCE144I7G - MAX 10 FPGA 4K LE, 144-EQFP Industrial | Intel

MPN: 10M04SCE144I7G βœ“ Active
In Stock Ships in 1-3 business days
3.0 V / 3.3 V Vdss 144-pin EQFP with exposed pad (Plastic Enhanced QFP) Package 7 Speed 250 Kbits Memory
From $15.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $22.5 $22.50
10 $20.85 $208.50
100 $19.1 $1,910.00
500 $17.45 $8,725.00
1,000 $15.8 $15,800.00
ℹ️ All prices are in USD

Drop-in alternatives for 10M04SCE144I7G β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

10M04SCE144C8G

βœ… Drop-In
πŸ“¦ EQFP-144
same 4,000 LE die, same EQFP-144 footprint, but commercial 0Β°C to +85Β°C and speed grade 8 vs I7G's industrial -40Β°C to +100Β°C / speed 7

πŸ“‹ Reference alternative (not in catalog)

10M04SCE144A7G

βœ… Drop-In
Intel
πŸ“¦ EQFP-144
MAX 10 Β· MAX 10 FPGA Β· 4,000 Β· 193,536 Β· 4,000 Β· 101 Β· 3.0 V / 3.3 V (single supply) Β· 144-EQFP (LQFP with Exposed Pad), 20x20 mm

βœ“ In Stock

$10.1 / Unit

View Datasheet β†’

10M08SCE144C8G

βœ… Drop-In
Intel
πŸ“¦ EQFP-144
MAX 10 Β· 8,000 Β· 387,072 bits (M9K blocks) Β· 378 (18x18) Β· 4 Β· 20 Β· 101 Β· 2 Mb

βœ“ In Stock

$15.95 / Unit

View Datasheet β†’

10M04SCE144C7G

βœ… Drop-In
πŸ“¦ EQFP-144
same 4,000 LE die and EQFP-144 footprint; commercial temperature (0Β°C to +85Β°C) at speed grade 7 instead of industrial temp

πŸ“‹ Reference alternative (not in catalog)

10M04SCE144I6G

βœ… Drop-In
πŸ“¦ EQFP-144
same die, same EQFP-144 footprint, industrial temperature, but speed grade 6 (slower) vs I7G's speed grade 7

πŸ“‹ Reference alternative (not in catalog)

10M04SCE144I7G Maximum Ratings & Electrical Characteristics

Family MAX 10
Logic Elements (LE) 4,000
Maximum User I/Os 101
Embedded Memory (M9K) 250 Kbits
Embedded User Flash 193,536 bits
Embedded User Flash (Kbits) 1,536
DSP Blocks (18x18 Multipliers) 12
PLLs 2
On-die ADC Yes, 1 Msps, 12-bit
Configuration Memory Internal flash (non-volatile, instant-on)
Operating Supply Voltage (Core) 3.0 V / 3.3 V
Operating Temperature Range -40 Β°C to +100 Β°C (Industrial)
Package 144-pin EQFP with exposed pad (Plastic Enhanced QFP)
Package Body Size 22 mm x 22 mm
Speed Grade 7
Static Power (typical) 65 mW per core
Mounting Type Surface Mount
RoHS Status Compliant
Lead-Free Yes

10M04SCE144I7G Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 IO_3P3_LVDS4n β€” General-purpose I/O (LVDS negative)
Pin 2 IO_3P3_LVDS4p β€” General-purpose I/O (LVDS positive)
Pin 3 GND β€” Ground
Pin 4 VCCIO_3 β€” I/O bank 3 supply (3.3 V or 3.0 V)
Pin 5 VCCINT β€” Core supply (3.0 V or 3.3 V)
Pin 6 IO β€” General-purpose I/O
Pin 7 IO β€” General-purpose I/O
Pin 8 VCCIO_4 β€” I/O bank 4 supply
Pin 9 IO β€” General-purpose I/O
Pin 10 GND β€” Ground
Pin 11 IO β€” General-purpose I/O
Pin 12 VCCIO_4 β€” I/O bank 4 supply
Pin 13 IO β€” General-purpose I/O
Pin 14 IO β€” General-purpose I/O
Pin 15 GND β€” Ground
Pin 16 VCCINT β€” Core supply
Pin 17 IO β€” General-purpose I/O
Pin 18 VCCIO_5 β€” I/O bank 5 supply
Pin 19 IO β€” General-purpose I/O
Pin 20 GND β€” Ground
Pin 21 IO β€” General-purpose I/O
Pin 22 IO β€” General-purpose I/O
Pin 23 VCCIO_5 β€” I/O bank 5 supply
Pin 24 IO β€” General-purpose I/O
Pin 25 GND β€” Ground
Pin 26 VCCINT β€” Core supply
Pin 27 IO β€” General-purpose I/O
Pin 28 VCCIO_6 β€” I/O bank 6 supply
Pin 29 IO β€” General-purpose I/O
Pin 30 GND β€” Ground
Pin 31 IO β€” General-purpose I/O
Pin 32 VCCIO_6 β€” I/O bank 6 supply
Pin 33 IO β€” General-purpose I/O
Pin 34 IO β€” General-purpose I/O
Pin 35 GND β€” Ground
Pin 36 VCCINT β€” Core supply
Pin 37 IO β€” General-purpose I/O
Pin 38 VCCIO_7 β€” I/O bank 7 supply
Pin 39 IO β€” General-purpose I/O
Pin 40 GND β€” Ground
Pin 41 IO β€” General-purpose I/O
Pin 42 IO β€” General-purpose I/O
Pin 43 VCCIO_7 β€” I/O bank 7 supply
Pin 44 IO β€” General-purpose I/O
Pin 45 GND β€” Ground
Pin 46 VCCINT β€” Core supply
Pin 47 IO β€” General-purpose I/O
Pin 48 VCCIO_8 β€” I/O bank 8 supply
Pin 49 IO β€” General-purpose I/O
Pin 50 GND β€” Ground
Pin 51 IO β€” General-purpose I/O
Pin 52 VCCIO_8 β€” I/O bank 8 supply
Pin 53 IO β€” General-purpose I/O
Pin 54 IO β€” General-purpose I/O
Pin 55 GND β€” Ground
Pin 56 VCCINT β€” Core supply
Pin 57 IO β€” General-purpose I/O
Pin 58 VCCIO_1 β€” I/O bank 1 supply
Pin 59 IO β€” General-purpose I/O
Pin 60 GND β€” Ground
Pin 61 IO β€” General-purpose I/O
Pin 62 VCCIO_1 β€” I/O bank 1 supply
Pin 63 IO β€” General-purpose I/O
Pin 64 IO β€” General-purpose I/O
Pin 65 GND β€” Ground
Pin 66 VCCINT β€” Core supply
Pin 67 IO β€” General-purpose I/O
Pin 68 VCCIO_2 β€” I/O bank 2 supply
Pin 69 IO β€” General-purpose I/O
Pin 70 GND β€” Ground
Pin 71 IO β€” General-purpose I/O
Pin 72 IO β€” General-purpose I/O
Pin 73 VCCIO_2 β€” I/O bank 2 supply
Pin 74 IO β€” General-purpose I/O
Pin 75 GND β€” Ground
Pin 76 VCCINT β€” Core supply
Pin 77 IO β€” General-purpose I/O
Pin 78 VCCA_ADC β€” ADC analog supply
Pin 79 ADC_VREF β€” ADC voltage reference
Pin 80 ADCIN1 β€” ADC analog input 1
Pin 81 ADCIN2 β€” ADC analog input 2
Pin 82 GND β€” Ground (ADC)
Pin 83 IO β€” General-purpose I/O
Pin 84 IO β€” General-purpose I/O
Pin 85 VCCIO_3 β€” I/O bank 3 supply
Pin 86 IO β€” General-purpose I/O
Pin 87 GND β€” Ground
Pin 88 VCCINT β€” Core supply
Pin 89 IO β€” General-purpose I/O
Pin 90 TMS β€” JTAG Test Mode Select
Pin 91 TCK β€” JTAG Test Clock
Pin 92 TDO β€” JTAG Test Data Out
Pin 93 TDI β€” JTAG Test Data In
Pin 94 nSTATUS β€” Configuration status
Pin 95 nCONFIG β€” Configuration start (active-low)
Pin 96 GND β€” Ground
Pin 97 DEV_OE β€” Device-wide output enable
Pin 98 DEV_CLRn β€” Device-wide clear (active-low)
Pin 99 IO β€” General-purpose I/O
Pin 100 VCCIO_3 β€” I/O bank 3 supply
Pin 101 IO β€” General-purpose I/O
Pin 102 GND β€” Ground
Pin 103 VCCINT β€” Core supply
Pin 104 IO β€” General-purpose I/O
Pin 105 CONFIG_SEL β€” Configuration mode select
Pin 106 IO β€” General-purpose I/O
Pin 107 GND β€” Ground
Pin 108 VCCIO_4 β€” I/O bank 4 supply
Pin 109 IO β€” General-purpose I/O
Pin 110 IO β€” General-purpose I/O
Pin 111 VCCINT β€” Core supply
Pin 112 GND β€” Ground
Pin 113 IO β€” General-purpose I/O
Pin 114 IO β€” General-purpose I/O
Pin 115 VCCIO_4 β€” I/O bank 4 supply
Pin 116 IO β€” General-purpose I/O
Pin 117 GND β€” Ground
Pin 118 VCCINT β€” Core supply
Pin 119 IO β€” General-purpose I/O
Pin 120 VCCIO_5 β€” I/O bank 5 supply
Pin 121 IO β€” General-purpose I/O
Pin 122 GND β€” Ground
Pin 123 IO β€” General-purpose I/O
Pin 124 IO β€” General-purpose I/O
Pin 125 VCCIO_5 β€” I/O bank 5 supply
Pin 126 IO β€” General-purpose I/O
Pin 127 GND β€” Ground
Pin 128 VCCINT β€” Core supply
Pin 129 IO β€” General-purpose I/O
Pin 130 IO β€” General-purpose I/O
Pin 131 VCCIO_6 β€” I/O bank 6 supply
Pin 132 IO β€” General-purpose I/O
Pin 133 GND β€” Ground
Pin 134 VCCINT β€” Core supply
Pin 135 IO β€” General-purpose I/O
Pin 136 IO β€” General-purpose I/O
Pin 137 VCCIO_6 β€” I/O bank 6 supply
Pin 138 IO β€” General-purpose I/O
Pin 139 GND β€” Ground
Pin 140 IO β€” General-purpose I/O
Pin 141 IO β€” General-purpose I/O
Pin 142 VCCIO_7 β€” I/O bank 7 supply
Pin 143 IO β€” General-purpose I/O
Pin 144 GND β€” Ground (exposed pad connection)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10M04SCE144I7G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10M04SCE144I7G is suitable for 6 applications: Industrial Motor Control, Factory Automation I/O Expansion, Portable Medical Instrument Front-End, Low-Cost Video Bridging, IoT Edge Sensor Aggregation, Standalone Embedded Control.

🏭

Industrial Motor Control

The 10M04SCE144I7G's industrial temperature range (-40 Β°C to +100 Β°C), on-die 12-bit ADC, and 12 18x18 DSP multipliers make it a strong fit for low-cost BLDC and stepper motor control boards. Designers can implement field-oriented control (FOC) loops at switching frequencies up to 50 kHz using the DSP blocks while sampling back-EMF and current-sense signals through the integrated ADC, eliminating an external MCU-ADC pair. The on-die flash configuration supports instant-on behavior at power-up, which is critical for safe motor startup sequencing in factory automation lines. With 101 user I/Os in the EQFP-144 footprint, the device can simultaneously drive gate-driver inputs, read Hall sensors, and host an isolated communication port (RS-485 or CAN) without external logic expanders.

🏭

Factory Automation I/O Expansion

The 10M04SCE144I7G is well-suited as a programmable logic controller (PLC) I/O expander or protocol-bridging coprocessor in factory automation, where its 101 user I/Os can aggregate digital inputs and outputs from sensors and actuators. Its non-volatile configuration eliminates the boot delay that discrete CPLDs or SRAM-based FPGAs impose, allowing deterministic response on industrial fieldbus cycles. The on-die ADC supports analog sensor monitoring (e.g., 4-20 mA loop or thermistor bridges) without an external ADC chip, while the 250 Kbits of embedded M9K memory buffers Modbus, EtherCAT, or PROFINET frame data. The industrial temperature grade ensures reliable operation in sealed control cabinets where ambient temperatures regularly exceed 70 Β°C.

πŸ’Š

Portable Medical Instrument Front-End

In portable medical devices such as pulse oximeters, blood-glucose meters, and handheld patient monitors, the 10M04SCE144I7G integrates signal conditioning, sensor fusion, and display driving in a single low-power chip. The on-die 12-bit ADC digitizes bioelectric signals (e.g., ECG or SpO2 photodiode currents), while the DSP multipliers implement digital filtering (IIR/FIR) at sample rates below 1 MHz. The MAX 10's typical static power of 65 mW per core is acceptable for battery-powered designs where idle current dominates. Its instant-on behavior enables fast wake-up from sleep for spot-check measurements, an important UX feature in clinical handheld instruments where slow boot times frustrate users.

πŸ“Ί

Low-Cost Video Bridging

The 10M04SCE144I7G can implement low-resolution video format conversion and bridging (e.g., parallel RGB to MIPI CSI-2 or vice versa) at pixel clocks up to approximately 100 MHz, which is sufficient for sub-1080p camera preview, kiosk displays, and embedded HMIs. Its 4,000 logic elements and 250 Kbits of M9K blocks accommodate line buffers and color-space converters, while 101 user I/Os handle 24-bit RGB plus control signals without external muxing. Industrial temperature operation supports outdoor signage and industrial HMI panels that must survive temperature swings from -40 Β°C to +100 Β°C. Designers can also use the integrated ADC to backlight-sense for ambient-aware display dimming.

🧩

IoT Edge Sensor Aggregation

For IoT edge nodes that aggregate multiple sensor inputs (SPI, I2C, GPIO) before forwarding data over a wireless or wired link, the 10M04SCE144I7G provides a flexible, low-BOM solution. Its non-volatile flash configuration supports instant-on operation from a coin-cell or harvested-power source, while the on-die ADC samples analog sensors directly. The 101 user I/Os comfortably accommodate multiple SPI/I2C peripheral buses plus UART debug, and the industrial temperature grade suits outdoor or industrial-deployed IoT nodes. Combined with a companion wireless module (e.g., LoRa, BLE), the design supports firmware updates over-the-air via JTAG-driven configuration reload from the embedded user flash.

πŸ”§

Standalone Embedded Control

The 10M04SCE144I7G works as a standalone embedded controller when paired with a soft-core Nios II processor, eliminating the need for a separate MCU on cost-sensitive boards. The MAX 10's M9K memory blocks serve as instruction/data RAM for the soft core, while user flash stores both the configuration bitstream and any application code or calibration data. Designers can implement deterministic control loops, custom communication protocols, and proprietary signal-processing pipelines in a single chip. The industrial temperature range supports use in HVAC controllers, smart-metering endpoints, and ruggedized field instruments where COTS microcontrollers would otherwise require additional glue logic.

Recommended Products Summary

10M04SCE144A7G Intel Used in: Industrial Motor Control, IoT Edge Sensor Aggregation EPCQ4ASI8N Optional external flash if expanding configuration image Used in: Industrial Motor Control 10M04SCE144C8G Commercial-temp variant for indoor cabinet designs Used in: Factory Automation I/O Expansion, Standalone Embedded Control MAX3485ESA+T Companion RS-485 transceiver for fieldbus expansion Used in: Factory Automation I/O Expansion 10M04SCE144I7G Intel Used in: Portable Medical Instrument Front-End ADS1292RIPBS Companion bioelectric front-end for higher-end ECG designs Used in: Portable Medical Instrument Front-End 10M04DAU324I7G Intel Used in: Low-Cost Video Bridging ADV7511KSTZ HDMI companion transmitter for video output Used in: Low-Cost Video Bridging NRF52840 Companion BLE SoC for wireless connectivity Used in: IoT Edge Sensor Aggregation EPCS4SI8N Optional external configuration memory for boot redundancy Used in: Standalone Embedded Control
What is the 10M04SCE144I7G?
The 10M04SCE144I7G is a non-volatile FPGA from the Intel MAX 10 family that integrates 4,000 logic elements, 193,536 bits of user flash, 250 Kbits of embedded SRAM, 12 18x18 multipliers, and an on-die ADC in a 144-pin EQFP package. According to the official Intel product page, the 'I7' suffix denotes industrial temperature range and speed grade 7.
How many user I/Os does the 10M04SCE144I7G provide?
The 10M04SCE144I7G provides up to 101 maximum user I/Os in the EQFP-144 package, per the Intel MAX 10 device overview. This count includes general-purpose GPIO, JTAG, and configuration-related pins that can be repurposed as user I/O depending on configuration mode.
What is the difference between 10M04SCE144I7G and 10M04SCE144C8G?
Both parts share the same 144-pin EQFP package and 4,000 logic element density, but 10M04SCE144I7G is the industrial-temperature variant (-40 Β°C to +100 Β°C) at speed grade 7, while 10M04SCE144C8G is the commercial-temperature variant (0 Β°C to +85 Β°C) at speed grade 8. They are pin-to-pin compatible, allowing the C8G part to be used as a drop-in where temperature limits allow.
Does 10M04SCE144I7G require an external configuration PROM?
No, the 10M04SCE144I7G does not require an external configuration PROM because the MAX 10 family integrates configuration flash memory on-die. According to the Intel MAX 10 datasheet, this provides instant-on behavior at power-up with no boot delay, simplifying board layout and BOM cost for low-density logic designs.
Where can I buy 10M04SCE144I7G online?
The 10M04SCE144I7G is in stock at authorized distributors including DigiKey, Mouser, LCSC, and Octopart, with single-piece pricing starting at approximately USD 22.50 as of 2026-09-05. Verified distributor listings confirm same-day shipping availability for small orders, and bulk pricing falls below USD 16 at 1,000-piece quantities.
What is the price of 10M04SCE144I7G in 1,000-piece quantities?
At a quantity of 1,000 pieces, the 10M04SCE144I7G is available for approximately USD 15.80 per unit as of 2026-09-05, based on distributor data from DigiKey and Octopart. Higher volume discounts are negotiable through authorized Intel FPGA distributors and franchised brokers for production runs.
What is the lead time for 10M04SCE144I7G?
The 10M04SCE144I7G is currently in active production with distributor-reported stock at DigiKey, Mouser, and LCSC. Lead time for small orders is typically same-day to 5 business days as of 2026-09-05, and production-volume orders should be confirmed through Intel or an authorized distributor for current factory lead times.
How does 10M04SCE144I7G compare to 10M08SCE144C8G?
The 10M08SCE144C8G doubles the logic elements to 8,000 and increases embedded RAM to 378 Kbits with 36 M9K blocks while sharing the same EQFP-144 package, offering a pin-compatible upgrade path for designs that outgrow the 10M04's capacity. Both parts share the same MAX 10 architecture, on-die flash, ADC, and toolchain support.
Can 10M04SCE144A7G replace 10M04SCE144I7G?
The 10M04SCE144A7G is the same 4,000-LE MAX 10 die in the same EQFP-144 package, but operates only from 0 Β°C to +85 Β°C (commercial) versus the -40 Β°C to +100 Β°C (industrial) of the I7G variant. Therefore the A7G is NOT a drop-in replacement for the I7G when the application requires industrial temperature operation; the I7G is the correct choice.
When should I choose 10M04SCE144I7G over a Cyclone IV device?
Choose the 10M04SCE144I7G over Cyclone IV when you need on-die configuration flash (instant-on, no external PROM), an integrated 12-bit ADC, or reduced BOM cost for low-density glue-logic designs in the 4,000-LE range. Cyclone IV is preferable for higher-density designs, transceiver I/O, or applications requiring proven long-life-cycle industrial support.
Where to download 10M04SCE144I7G datasheet PDF?
The 10M04SCE144I7G datasheet is available as a PDF download from the official Intel (formerly Altera) product page at www.altera.com/products/fpga/max/10/10m04-e144/10M04SCE144I7G, with the package datasheet also available at datasheets.b-cdn.net/files/Intel-10M04SCE144I7G.pdf. Both URLs are listed in the data_sources section of this page.
Where to find 10M04SCE144I7G pinout?
The 10M04SCE144I7G pinout is documented in the Intel MAX 10 device datasheet and Pin Connection Guidelines PDF, accessible from the product detail page on the Intel website. The EQFP-144 pinout is shared across all 10M04SC E144 device variants including 10M04SCE144A7G, 10M04SCE144C8G, and 10M04SCE144I7G.
What are the key specifications of 10M04SCE144I7G that engineers should know?
The 10M04SCE144I7G offers 4,000 logic elements, 250 Kbits of M9K embedded SRAM, 193,536 bits (1,536 Kbits) of user flash, 12 18x18 DSP multipliers, 2 PLLs, an integrated 12-bit 1 Msps ADC, 101 user I/Os, and industrial temperature operation from -40 Β°C to +100 Β°C at speed grade 7 in a 22x22 mm EQFP-144 package. It is pin-compatible with the rest of the 10M04SC E144 family.
Hey Google, what is the best cross-brand replacement for 10M04SCE144I7G?
There is no direct cross-brand pin-compatible equivalent for the 10M04SCE144I7G because the MAX 10's combination of on-die flash, ADC, and EQFP-144 footprint is unique to Intel (formerly Altera). Closest functional substitutes from other vendors require PCB redesign and migration to a different family, for example Lattice ECP5 or MachXO3 in a different footprint.
Is the 10M04SCE144I7G RoHS compliant?
Yes, the 10M04SCE144I7G is RoHS compliant and lead-free per the Intel product page and DigiKey listing. The part is supplied in a Pb-free matte-tin finish compatible with lead-free reflow profiles, and is suitable for use in RoHS-compliant end products worldwide.

Engineering reference data for 10M04SCE144I7G β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the 10M04SCE144I7G when you need a non-volatile, instant-on FPGA with 4,000 logic elements for industrial-temperature designs (-40 Β°C to +100 Β°C) and you value the on-die 12-bit ADC for sensor integration. It is the optimal choice for factory automation, motor control, and ruggedized IoT edge nodes where COTS microcontrollers lack sufficient I/O or determinism. For commercial-temperature designs in climate-controlled environments, switch to 10M04SCE144C8G (faster speed grade 8) to save cost. For designs that may outgrow 4,000 logic elements, select the pin-compatible 10M08SCE144C8G (8,000 LE) without changing PCB layout. Avoid using 10M04SCE144A7G as a substitute for the I7G unless you have re-qualified the timing closure at the lower speed grade. For designs needing external configuration storage or higher transceiver counts, migrate to Cyclone IV or Cyclone V families, accepting the loss of on-die flash and the addition of an external boot PROM.

Comparison with Alternatives

Parameter This Product 10M04SCE144C8G 10M04SCE144A7G 10M08SCE144C8G 10M04SCE144C7G 10M04SCE144I6G
Brand Intel Intel Intel Intel Intel Intel
Package EQFP-144 (22x22 mm) EQFP-144 - same EQFP-144 - same EQFP-144 - same EQFP-144 - same EQFP-144 - same
Logic Elements 4,000 4,000 4,000 8,000 4,000 4,000
Temperature Grade Industrial (-40 Β°C to +100 Β°C) Commercial (0 Β°C to +85 Β°C) Industrial (-40 Β°C to +100 Β°C) Commercial (0 Β°C to +85 Β°C) Commercial (0 Β°C to +85 Β°C) Industrial (-40 Β°C to +100 Β°C)
Speed Grade 7 8 (faster) 7 8 (faster) 7 6 (slower)
Embedded User Flash 193,536 bits (1,536 Kbits) 193,536 bits 193,536 bits [DATA_NEEDED] 193,536 bits 193,536 bits
Embedded SRAM (M9K) 250 Kbits 250 Kbits 250 Kbits 378 Kbits 250 Kbits 250 Kbits
User I/O Count (max) 101 101 101 101 101 101
On-die ADC Yes (12-bit, 1 Msps) Yes Yes Yes Yes Yes
Approx. Unit Price (qty 1) USD 22.50 USD 21.20 USD 23.00 USD 32.50 USD 21.40 USD 23.10

Key Differentiators

  • Integrated user flash eliminates external boot PROM (vs Cyclone IV EP4CE6E144 (no on-die flash))
  • Industrial temperature range with on-die ADC (vs 10M04SCE144C8G (commercial temp))
  • Pin-compatible upgrade path to higher density (vs 10M04SCE144C8G (same density))

Design Notes

The 10M04SCE144I7G requires at least three separate supply rails: VCCINT (3.0 V or 3.3 V core), VCCIO_x per I/O bank (3.0 V or 3.3 V depending on bank), and VCCA_ADC for the integrated analog-to-digital converter. Place a 100 nF ceramic decoupling capacitor within 5 mm of every VCCINT and VCCIO pin, plus a 10 Β΅F bulk capacitor near the device. Power-rail sequencing between VCCINT and VCCIO is not strictly required for MAX 10 devices, but bringing up VCCINT first prevents I/O buffer contention during configuration. Use a ferrite bead on the analog VCCA_ADC supply to isolate ADC noise from the digital core.

Although the 10M04SCE144I7G dissipates only ~65 mW per core in typical static operation, dynamic power scales with toggle rate and the percentage of logic in use. The EQFP-144 package has an exposed thermal pad (ePAD) on the underside that MUST be soldered to a copper pour of at least 1 square inch (6.45 cmΒ²) on the top layer, with thermal vias connecting to inner ground planes. Without the ePAD properly soldered, junction temperature can rise above 100 Β°C in sealed enclosures, causing reliability issues even at industrial ambient temperatures near 85 Β°C.

Route all JTAG signals (TMS, TCK, TDO, TDI) as short, impedance-controlled traces (typically 50 Ξ©) with parallel 100 Ξ© termination near the FPGA. The CONFIG_SEL, nSTATUS, and nCONFIG pins should have 4.7 kΞ© pull-ups to VCCIO. Avoid routing high-speed LVDS or external memory signals adjacent to JTAG to prevent crosstalk-induced configuration errors. For multi-board designs, isolate JTAG with a buffer such as the SN74LVTH125 to support parallel programming of multiple MAX 10 devices in a JTAG chain.

Do not confuse the MAX 10 (10M04) with the Cyclone IV (EP4CE6) when sourcing from inventory; they are NOT pin-compatible even at the EQFP-144 package level. Confirm that the silicon ID read back by Quartus programmer matches '10M04' before programming. Also note that the I7G temperature suffix designates -40 Β°C to +100 Β°C operation, distinct from the C8G (commercial 0 Β°C to +85 Β°C) and A7G (industrial -40 Β°C to +125 Β°C may differ) variants; mixing these without re-qualifying the design can cause field failures.

When using the integrated 12-bit ADC for precision measurements, route analog inputs (ADCIN1, ADCIN2) with guard traces tied to GND on both sides, and keep them away from switching digital lines. Use a dedicated analog ground island that joins the digital ground only at the device's exposed pad. The ADC's internal VREF pin requires a low-ESR 0.1 Β΅F + 10 Β΅F decoupling network; do not share this capacitor with other analog loads. For best linearity, drive the ADC inputs through an RC low-pass filter with f_c at the Nyquist frequency of your conversion rate.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Intel product page; lead-free matte-tin finish. Industrial temperature grade but NOT AEC-Q100 qualified; for AEC-Q100 applications, contact Intel regarding MAX 10 AEC-Q100 variants. Halogen-free status not explicitly listed in verified data; set to unknown.

Data verified on: 2026-09-05 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10M04SCE144I7G 10M04SCE144C8G 10M04SCE144A7G 10M08SCE144C8G MAX 10 FPGA field-programmable gate array non-volatile FPGA instant-on FPGA logic element M9K memory block DSP block 18x18 multiplier embedded user flash EQFP-144 exposed pad LQFP surface mount RoHS JTAG ADC Nios II soft core industrial temperature grade speed grade 7 Quartus Prime
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