5CGXBC9A7U19C8N - Cyclone V GX FPGA, 301K LE, 484-FBGA | Intel
MPN: 5CGXBC9A7U19C8N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $232.4 | $58,100.00 |
| 500 | $219.75 | $109,875.00 |
Drop-in alternatives for 5CGXBC9A7U19C8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5CGXBC9A6U19C8N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CGXBC9A7U19I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CGXBC7C7U19C8N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$76.8 / Unit
View Datasheet β5CGXBC7C7U19C6N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
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β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5CGXBC9A7U19C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V GX |
| Logic Elements (LE) | 301,000 |
| Embedded Memory (bits) | 14,251,008 |
| DSP Blocks | 240 |
| Transceivers | 6 channels, up to 3.125 Gbps |
| Hard PCIe Gen2 Blocks | Yes |
| User I/O | 560 |
| Package | 484-ball FBGA (UBGA-19) |
| Process Node | TSMC 28 nm low-power |
| Operating Temperature | 0C to 85C (commercial) |
| Speed Grade | 8 |
| Configuration Modes | JTAG, AS, PS |
| External Memory Support | DDR2, DDR3, LPDDR2 |
| RoHS Status | Compliant |
5CGXBC9A7U19C8N 484-ball fbga (ubga-19) Pin Configuration Guide
Complete pinout information for 5CGXBC9A7U19C8N (484-ball fbga (ubga-19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CGXBC9A7U19C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CGXBC9A7U19C8N is suitable for 6 applications: Industrial Motor Control, PCIe I/O Card / Endpoint, Video Format Converter / Display Bridge, Industrial Machine Vision Frame Grabber, Small-Cell Wireless Backhaul, ASIC Prototyping / Emulation.
Industrial Motor Control
The 5CGXBC9A7U19C8N fits industrial multi-axis motor control because its 240 DSP blocks handle field-oriented-control math at typical 16 kHz PWM rates, while the 560 user I/O pins accept incremental encoder, SSI, and BiSS inputs across multiple axes. The 14 Mbit of embedded SRAM holds encoder-capture FIFOs and precomputed SVM lookup tables without external memory traffic. The hard PCIe Gen2 block is not required here but does not impede the design, and the commercial 0C-85C operating range covers most factory-floor enclosures. Designers using the 5CGXBC7C7U19C8N variant lose half the logic but gain cost headroom on lower-channel-count drives.
Recommended
PCIe I/O Card / Endpoint
The 5CGXBC9A7U19C8N is a strong fit for low-cost PCIe Gen2 endpoint cards because the device integrates a hard PCIe Gen2 IP block capable of x1 or x2 lane operation, removing the need for soft PCIe cores. The six 3.125 Gbps transceivers can additionally carry SGMII Ethernet, Aurora, or serial RapidIO side channels for hybrid I/O cards. The 301K logic elements absorb medium-complexity DMA engines and protocol stacks (for example, PXIe or custom avionics buses), and the 484-FBGA package keeps the board within a half-length PCIe card outline. Designers needing higher transceiver count step up to the Cyclone V GT family.
Recommended
Video Format Converter / Display Bridge
The 5CGXBC9A7U19C8N suits HDMI/DVI/DisplayPort bridging and color-space conversion because the 240 DSP blocks execute chroma resampling and HDR tone-mapping in real time at 4K60 rates, while the 14 Mbit of embedded memory holds multiple line buffers so the design avoids external DDR3 traffic for short pipelines. The 560 user I/O pins expose LVDS, TMDS, and LVCMOS pairs needed for parallel RGB or OpenLDI panels, and the transceiver channels support serial DisplayPort or SDI output. The 484-FBGA is preferred here because it provides sufficient I/O for parallel video at 4K without aggressive multiplexing.
Recommended
Industrial Machine Vision Frame Grabber
The 5CGXBC9A7U19C8N fits CoaXPress, Camera Link, and GigE Vision frame grabbers because the 301K logic elements handle wide-data-width deserialization and the 240 DSP blocks run Bayer demosaicing and lens-correction kernels. The 14 Mbit of embedded memory provides line and frame buffers for real-time preprocessing before host transfer, and the integrated PCIe Gen2 x2 endpoint moves frame data to the host at line rate. The commercial 0C-85C operating range is adequate for machine-vision enclosures; vision systems needing harsher thermal margins switch to the I7N speed grade variant.
Recommended
Small-Cell Wireless Backhaul
The 5CGXBC9A7U19C8N fits small-cell CPRI or OBSAI backhaul because the six 3.125 Gbps transceivers carry CPRI line rates up to option 4, while the 301K logic elements implement the PHY-layer scrambling, deframing, and packet-mapping functions. The hard PCIe Gen2 block links the FPGA to the baseband SoC on the same carrier board, and the 14 Mbit of embedded SRAM holds CPRI antenna-carrier maps. The 484-FBGA package supports controlled-impedance routing required for the CPRI lanes; designers pushing CPRI option 5 or 6 require Cyclone V GT transceivers.
Recommended
ASIC Prototyping / Emulation
The 5CGXBC9A7U19C8N works as a building block in multi-FPGAs ASIC prototypes because the 301K logic elements map roughly 3-5 million gates of ASIC logic with the help of the 240 DSP blocks for arithmetic-heavy RTL. The 14 Mbit of embedded memory holds emulated register files and small caches, and the 560 user I/O pins expose chip-to-chip interconnect channels that split the ASIC into FPGA partitions. The 484-FBGA package is acceptable for high-density interconnect boards; large ASICs use arrays of 9A7 devices stacked through high-speed transceivers.
Recommended
Recommended Products Summary
Engineering reference data for 5CGXBC9A7U19C8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CGXBC9A6U19C8N | 5CGXBC9A7U19I7N | 5CGXBC7C7U19C8N | 5CGXBC7C7U19C6N | 5CGXFC7C7U19C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) |
| Logic Elements | 301,000 | 301,000 | 301,000 | 149,500 | 149,500 | 149,500 |
| Embedded Memory (bits) | 14,251,008 | 14,251,008 | 14,251,008 | 7,024,640 | 7,024,640 | 7,024,640 |
| DSP Blocks | 240 | 240 | 240 | 156 | 156 | 156 |
| Transceivers | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 5 Gbps |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | -40C to 100C (industrial) | 0C to 85C | 0C to 85C | 0C to 85C |
Key Differentiators
- Higher logic density at the same 484-FBGA footprint (vs 5CGXBC7C7U19C8N)
- Higher transceiver throughput than GX mid-density (vs 5CGXFC7C7U19C8N (Cyclone V GT))
- Commercial vs industrial temperature grade (vs 5CGXBC9A7U19I7N)
Design Notes
Estimated: the 484-ball FBGA package requires a 4-layer to 8-layer PCB stack-up with microvia or via-in-pad for the inner balls. Ball pitch is 1.0 mm standard for this package. Plan the stack-up before pin assignment so that transceiver lanes and DDR3 byte groups can be routed length-matched; uncontrolled impedance on the transceiver pairs will fail PCIe Gen2 compliance.
The 5CGXBC9A7U19C8N has six transceiver channels up to 3.125 Gbps; AC-coupling capacitors on the serial lines must be placed within 1 inch of the FPGA balls and reference-grounded at the AC cap pads. Use 85-ohm differential routing for the transceiver pairs to meet PCIe Gen2 and SGMII compliance, with intra-pair skew held below 5 ps for the highest line rates.
Estimated: the 5CGXBC9A7U19C8N has a typical junction-to-ambient thermal resistance in the range of 14-18 C/W for the 484-FBGA package with adequate PCB thermal vias. At full fabric utilization in a sealed industrial enclosure the device may dissipate 3-5 W; design a thermal-via array under the central ball grid to keep the junction below 100C for reliability margins.
Configuration mode pin (MSEL) settings must match the chosen boot mode (AS, PS, JTAG); incorrect MSEL strapping is a common cause of first-power-up failure. The dual-purpose configuration pins become user I/O after configuration only if the design enables that option; otherwise the pins remain in high-impedance and pull against the designer's expectations.
The DDR3 interface on the 5CGXBC9A7U19C8N requires matched-length address/command/clock routing within byte groups; use the Quartus Prime pin planner to export the matched-length rules and follow them with +/- 25 mil tolerance on DQ byte lanes. Place the DDR3 termination VTT regulator close to the FPGA to minimize the regulated current loop.
Compliance Information
RoHS compliant per Cyclone V GX family datasheet. Not AEC-Q100 qualified (commercial 0C-85C grade); choose I7N speed-grade variants for industrial -40C to 100C operation.
