5CSTFD6D5F31I7N - Cyclone V ST SoC FPGA 110K LE, 800MHz | Intel
Teilenummer: 5CSTFD6D5F31I7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $360 | $36.000,00 |
| 500 | $325 | $162.500,00 |
| 1.000 | $290 | $290.000,00 |
5CSTFD6D5F31I7N Übersicht
A SoC FPGA is an integrated circuit that combines a general-purpose processor (typically ARM Cortex-A) with programmable FPGA logic on a single silicon die, enabling designers to partition deterministic, high-throughput DSP and interface tasks to the FPGA fabric while running operating systems, control stacks, and application code on the application processors. This architecture sits within the broader hierarchy of embedded computing devices: SoC FPGA -> FPGA with embedded hard cores -> programmable logic device -> semiconductor. The Cyclone V ST family specifically targets low-power, cost-sensitive applications requiring ARM processing alongside moderate-density FPGA fabric.
Key features include dual ARM Cortex-A9 MPCore processors with CoreSight debug, NEON media processing engine, single/double-precision floating-point unit, and L1/L2 caches; on-chip memory controllers for DDR2/DDR3/LPDDR2; high-speed transceivers; and hardened peripherals including USB 2.0, Gigabit Ethernet, CAN, SPI, I2C, and UART. The 28nm low-power process minimizes both static and dynamic power consumption. Integrated PCI Express Gen2 hard IP blocks (x1/x2/x4 lanes) enable direct host connectivity without consuming FPGA fabric resources.
The Cyclone V ST architecture is optimized for systems requiring both deterministic FPGA acceleration and Linux/Android application processing in industrial, automotive, video processing, and motor control applications. The hard processor subsystem offloads the FPGA fabric from software tasks, while the programmable logic handles custom interfaces, parallel DSP pipelines, and timing-critical glue logic. According to the Altera Cyclone V device datasheet, the device supports industrial temperature grade (-40C to +100C junction).
Typical applications include industrial motor drives, machine vision, video surveillance with analytics, smart-grid energy management, automotive ADAS prototypes, and embedded Linux platforms requiring custom hardware acceleration. The 110K logic elements provide adequate capacity for moderate DSP pipelines and multi-protocol bridging.
Design considerations include PCB BGA routing complexity for the 896-ball package, multi-rail power sequencing requirements (typically 1.1V core, 1.8V/2.5V/3.3V I/O, DDR termination), JTAG and ARM CoreSight debug topology, and careful thermal management for industrial temperature operation.
This page synthesizes distributor pricing, same-family Cyclone V ST drop-in alternatives, and practical design considerations not found in the manufacturer datasheet.
Drop-in-Alternativen für 5CSTFD6D5F31I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSTFD6D5F31I7N (gleiche Bauform und Footprint) – abweichend in Package, Family, Logic Elements, Operating Temperature, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSTFD5D5F31I7N
✅ Drop-In✓ Auf Lager
$345 / Stück
Datenblatt ansehen →5CGTFD7D5F27I7N
✅ Drop-In✓ Auf Lager
$218.4 / Stück
Datenblatt ansehen →5CGTFD9A5U19A7N
✅ Drop-In✓ Auf Lager
$241.5 / Stück
Datenblatt ansehen →5CSEBA6U23I7N
✅ Drop-In✓ Auf Lager
$51.8 / Stück
Datenblatt ansehen →5CGXBC9E7F35C8N
✅ Drop-In✓ Auf Lager
$555.1 / Stück
Datenblatt ansehen →5CSTFD6D5F31I7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V ST |
| Device Subfamily | SoC FPGA (with hard ARM Cortex-A9) |
| Logic Elements | 110000 |
| Process Technology | 28 nm low-power |
| Hard Processor Cores | Dual ARM Cortex-A9 MPCore |
| Maximum Processor Frequency | 800 MHz |
| CoreSight Debug | Integrated |
| NEON Media Engine | Yes |
| Single/Double Precision FPU | Yes |
| Gehäuse | 896-ball FBGA (31x31 mm) |
| Maximum User I/O | 288 |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Core Voltage | 1.1 V |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
5CSTFD6D5F31I7N 896-ball fbga (31x31 mm) Pinbelegungsleitfaden
Pinbelegung für 5CSTFD6D5F31I7N (896-ball fbga (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSTFD6D5F31I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSTFD6D5F31I7N ist geeignet für 7 Anwendungs: Industrial Motor Drives, Machine Vision Preprocessing, Video Surveillance with Analytics, Smart Grid Energy Management, Automotive ADAS Prototyping, Embedded Linux Industrial Gateways, Medical Imaging and Diagnostics.
Industrial Motor Drives
The 5CSTFD6D5F31I7N suits multi-axis industrial servo drives because it integrates a dual ARM Cortex-A9 MPCore subsystem running Linux/RTOS control loops at 800 MHz alongside 110K FPGA logic elements for high-speed PWM generation, encoder quadrature decoding, and field-oriented control (FOC) math. The hardened ARM cores execute the velocity/torque control algorithms at deterministic rates, while the FPGA fabric handles parallel sampling of multiple position sensors, current shunts, and resolver interfaces with sub-microsecond latency. The 28nm low-power process keeps the SoC FPGA below 5W typical dissipation in sealed IP65 drive enclosures. Industrial temperature grade (-40C to +100C junction) supports factory-floor deployment without additional thermal management. The 288 user I/O pins accommodate up to 6 axes of three-phase PWM plus auxiliary I/O.
Empfohlen
Machine Vision Preprocessing
The 5CSTFD6D5F31I7N fits machine vision preprocessing because the FPGA fabric executes Bayer demosaicing, histogram equalization, edge detection, and image scaling at line-rate parallelism while the dual ARM Cortex-A9 cores run the host-side image classification and networking stacks. The 110K logic elements provide enough DSP blocks for real-time convolution kernels on 1080p video at 60 fps without dropping frames. Hardened MIPI or parallel camera interface IP blocks integrate via Quartus Prime reference designs. The integrated Gigabit Ethernet MAC enables direct gigaE Vision or GigE camera connectivity for industrial inspection lines. Power dissipation typically stays below 3.5W at full fabric utilization on the 28nm process.
Empfohlen
Video Surveillance with Analytics
The 5CSTFD6D5F31I7N suits video surveillance analytics systems because the dual ARM Cortex-A9 cores run embedded Linux plus OpenCV-based object detection while the FPGA fabric handles H.264/H.265 motion estimation and 1080p60 video pipelines without consuming ARM CPU cycles. Hardened peripherals (Gigabit Ethernet, USB 2.0, SATA) simplify BOM by eliminating external bridges. The 110K logic elements support 2-4 channel HD video processing simultaneously. Industrial temperature operation allows outdoor NVR/encoder deployment. The integrated ARM Mali-400 or NEON media engine accelerates pixel-level processing for analytics. Power dissipation remains below 4W typical, suitable for fanless surveillance enclosures.
Empfohlen
Smart Grid Energy Management
The 5CSTFD6D5F31I7N fits smart grid energy management systems because the hardened ARM Cortex-A9 subsystem runs secure Linux with TLS/DTLS stacks for AMI/SCADA communication while the FPGA fabric executes real-time power-quality analysis (FFT, harmonic detection, transient capture) on multi-channel ADC inputs. Hardened CAN, SPI, and I2C peripherals interface to metering ICs and PMBus power supplies. The 28nm low-power process supports always-on sub-1W idle states for grid-tied installations. Industrial temperature grade (-40C to +100C) handles substation cabinet environments. The integrated ECC-enabled DDR3 controller supports secure boot and tamper-resistant firmware storage required for grid-edge devices.
Empfohlen
Automotive ADAS Prototyping
The 5CSTFD6D5F31I7N serves automotive ADAS prototyping because the dual ARM Cortex-A9 cores at 800 MHz run sensor fusion stacks (AUTOSAR or Linux) while the FPGA fabric performs sensor pre-processing such as radar FFT, lidar point-cloud clustering, and camera lane detection. Hardened peripherals include CAN-FD for vehicle network connectivity and FlexRay support. While not AEC-Q100 qualified itself, the 5CSTFD6D5F31I7N's industrial temperature grade allows prototype vehicle deployment in development fleets. The 110K logic elements accommodate 2-3 sensor pipelines simultaneously. Production designs should transition to AEC-Q100 qualified Cyclone V variants like 5CSTFD6D5F31A7N (when available) for automotive qualification.
Empfohlen
Embedded Linux Industrial Gateways
The 5CSTFD6D5F31I7N fits industrial protocol-conversion gateways because the dual ARM Cortex-A9 cores run embedded Linux with multiple protocol stacks (Modbus, EtherCAT, PROFINET, OPC-UA) while the FPGA fabric implements real-time industrial Ethernet MACs and fieldbus interfaces. Hardened peripherals (dual Gigabit Ethernet, USB 2.0, dual CAN, SPI, I2C, UART) eliminate external bridge chips. The 110K logic elements support 2-4 industrial Ethernet slaves simultaneously. Industrial temperature operation allows DIN-rail cabinet mounting without cooling fans. Power consumption stays under 3W at Linux idle, suitable for always-on factory-floor installations. ECC-protected DDR3 controller supports reliable 24/7 operation.
Empfohlen
Medical Imaging and Diagnostics
The 5CSTFD6D5F31I7N supports medical imaging diagnostic systems because the dual ARM Cortex-A9 cores execute patient interface software and DICOM networking stacks while the FPGA fabric performs ultrasound beamforming, CT reconstruction pre-processing, or MRI signal conditioning in real time. The 110K logic elements provide enough DSP blocks for 32-channel ultrasound beamforming at clinical frame rates. Hardened USB 2.0 and Gigabit Ethernet simplify connectivity to PACS servers and transducer interfaces. Industrial temperature grade supports climate-controlled equipment rooms. Power dissipation stays under 4W typical, enabling fanless medical device enclosures. ECC memory support is critical for FDA/IEC 62304 compliance on patient data integrity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSTFD6D5F31I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSTFD5D5F31I7N | 5CGTFD7D5F27I7N | 5CGTFD9A5U19A7N | 5CSEBA6U23I7N | 5CGXBC9E7F35C8N |
|---|---|---|---|---|---|---|
| Package | 896-FBGA (31x31 mm) | 896-FBGA (31x31 mm) - same | 896-FBGA - same | U19 FBGA - different package | U23 FBGA - different package | F35 FBGA - different package |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | Cyclone V ST | Cyclone V ST - same | Cyclone V GT - different | Cyclone V GT - different | Cyclone V SE - different | Cyclone V GX - different |
| Logic Elements | 110K | ~85K (fewer) | ~150K (more) | ~301K (much more) | ~110K (similar) | ~301K (much more) |
| Hard Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 - same | Dual ARM Cortex-A9 - same | Dual ARM Cortex-A9 - same | Dual ARM Cortex-A9 - same | None (FPGA only) - different |
| Maximum ARM Frequency | 800 MHz | 800 MHz - same | 800 MHz - same | 925 MHz - higher | 800 MHz - same | N/A (no HPS) - different |
| Integrated Transceivers | Yes | Yes | Yes (GT series) | Yes (GT series) | No (SE series) | Yes (GX series) |
| Automotive Grade | No (Industrial) | No (Industrial) | No (Industrial) | Yes (AEC-Q100) | Variant dependent | No (Industrial) |
| Approximate Unit Price (qty 1) | ~$425 | ~$350 (lower LE count) | ~$500 (higher LE + GT) | ~$900 (highest LE + automotive) | ~$380 | ~$550 (FPGA only) |
Wichtigste Unterscheidungsmerkmale
- Dual ARM Cortex-A9 at 800 MHz with NEON + FPU integrated on same die as 110K LE FPGA fabric (vs. 5CGXBC9E7F35C8N)
- Cyclone V ST family offers highest logic density in 28nm low-power Cyclone V generation (vs. 5CSEBA6U23I7N)
- Industrial temperature grade (-40C to +100C junction) standard without AEC-Q100 premium (vs. 5CGTFD9A5U19A7N)
Designhinweise
The 896-ball FBGA at 31x31 mm uses 1.0 mm ball pitch, requiring 6+ layer PCB with microvia (laser-drilled) stack-up for fanout. Use a 1-2-1 or 1-2-2-1 layer structure with 0.5 oz copper on outer layers and 1 oz on inner power planes. Maintain 50 ohm single-ended impedance on MPU/FPGA fabric traces and 100 ohm differential on DDR3 pairs. Place decoupling capacitors on the bottom side directly under the BGA balls, with 0402 or 0201 sizes for high-frequency decoupling. Match trace lengths within 25 mils for DDR3 byte lanes and within 5 mils for differential pairs.
The 5CSTFD6D5F31I7N requires at least 6 separate power rails: 1.1V core (VCCINT), 1.1V HPS core (VCC_HPS), 2.5V/3.3V HPS I/O, 1.8V/2.5V/3.3V FPGA I/O banks, 1.5V DDR3 termination, and DDR3 VTT. Use a sequenced power controller such as the LTC3615 or TI TPS650250 to ensure HPS power-up before FPGA fabric per Intel's power sequencing requirements. Estimated: at 800 MHz dual-core utilization plus 80% fabric utilization, total system power is approximately 4-6W; budget 8W for thermal design with 30C/W thermal resistance to ambient.
Three common pitfalls: (1) Do not confuse the 5CSTFD6D5F31I7N (Cyclone V ST SoC) with the 5CGTFD6D5F31I7N (Cyclone V GT with transceivers but different family); the device prefix 5CS vs 5CG indicates SoC vs transceiver-equipped variants. (2) Do not attempt to use the HPS Cortex-A9 cores and the FPGA fabric simultaneously without first configuring the HPS boot source (QSPI flash, SD card, or JTAG) in the Quartus Prime HPS component editor. (3) The 800 MHz maximum HPS frequency applies to industrial temperature grade only; commercial variants have the same rating but reduced reliability margin in fielded environments. Confirm the speed grade I7 matches your power budget.
At industrial temperature grade (-40C to +100C junction), the 5CSTFD6D5F31I7N dissipates up to 5W typical at full dual-core 800 MHz operation with 80% FPGA fabric utilization. With theta_JA of approximately 12-15 C/W on a properly designed 8-layer PCB with thermal vias under the BGA thermal pad, junction temperature rises approximately 60-75C above ambient at maximum load. For sealed enclosures without airflow, derate by 25% or add a small heatsink (15x15 mm) with thermal interface material. Use the Quartus Prime PowerPlay early power estimator for board-level thermal simulation before final layout.
Compliance-Informationen
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - the standard 5CSTFD6D5F31I7N is industrial temperature grade (-40C to +100C junction). For automotive AEC-Q100 designs, consider the 5CGTFD9A5U19A7N variant. Halogen-free status not explicitly stated in available data.
