Intel

5CSXFC5D6F31C6N - 85K LE Cyclone V SX SoC FPGA 896-FBGA | Intel

Teilenummer: 5CSXFC5D6F31C6N ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
896-ball FBGA (31x31 mm) Package 925 MHz Speed Approx. 4,450 Kbits (per device family) Memory
Ab $184.85 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-05
Mengenpreise
Menge Stückpreis Gesamt
1 $276.22 $276,22
10 $262.41 $2.624,10
100 $235.5 $23.550,00
500 $207.5 $103.750,00
1.000 $184.85 $184.850,00
ℹ️ Alle Preise sind in USD

5CSXFC5D6F31C6N Übersicht

The Intel 5CSXFC5D6F31C6N is a Cyclone V SX System-on-Chip (SoC) FPGA integrating dual ARM Cortex-A9 MPCore processors with CoreSight debug technology alongside an 85K logic-element FPGA fabric, fabricated on TSMC's 28nm low-power process and housed in a 896-ball FineLine BGA (31x31 mm) package. The device combines a hard-core CPU subsystem capable of 925 MHz operation with programmable logic, 288 user I/Os, and a rich set of embedded memory, multipliers, and high-speed peripheral IP.

An SoC FPGA is a single-chip platform that fuses a hardened application processor subsystem with a programmable FPGA fabric, allowing deterministic hardware acceleration in the logic while the CPU runs operating systems and software stacks. In the Cyclone V hierarchy the SX family is the SoC variant, sitting alongside the ST (SoC with transceivers) and SE (SoC with enhanced transceivers) lines; all belong to the broader Intel (formerly Altera) Cyclone V low-power FPGA family. This integration reduces board area, eliminates processor-to-FPGA interconnect bottlenecks, and simplifies the bill of materials for embedded systems.

Key specifications include 85K logic elements, approximately 4,450 Kbits of embedded RAM, 224 18x18 multipliers, 6 fractional PLLs, 2 hard memory controllers, and 6.144 Gbps transceiver capability on related ST parts. The HPS (Hard Processor System) features dual ARM Cortex-A9 cores with NEON media engine, single/double-precision FPU, 32 KB instruction and 32 KB data L1 caches per core, 512 KB shared L2 cache, and a rich peripheral set including EMAC, USB, NAND, SD/SDIO, UART, SPI, I2C, and DDR2/DDR3/LPDDR2 controllers.

Typical applications span industrial motor and motion control, factory automation controllers, video surveillance and machine vision, automotive driver assistance systems, military/aerospace signal processing, and high-volume embedded computing platforms where CPU+FPGA integration reduces cost and power. The Cyclone V SX family is also widely used in prototyping for ASIC designs and in software-defined radio platforms that benefit from parallel DSP blocks.

When designing with this device, pay careful attention to power sequencing between the HPS and FPGA rails, ensure proper decoupling on each supply domain per Intel's Cyclone V pin connection guidelines, and validate DDR3 interface timing with the Quartus Prime external memory tool. Thermal management on the 31x31 mm FBGA should follow Intel's recommended PCB footprint and thermal via pattern to maintain junction temperatures within the -40C to +85C industrial range denoted by the 'C6' speed-grade operating condition.

Drop-in-Alternativen für 5CSXFC5D6F31C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC5D6F31C6N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Logic Elements, Package, Process Technology, Family.

Intel
Operating Temperature: -40C to +100C (Industrial)
Logic Elements: 110000
Process Technology: 28 nm low-power
Vergleichen mit 5CSXFC5D6F31C6N →
Intel
Operating Temperature: 0C to +85C (commercial)
Package: 896-FBGA (31x31 mm)
Process Technology: 28 nm low-power
Vergleichen mit 5CSXFC5D6F31C6N →
Intel
Operating Temperature: 0C to +85C (commercial)
Logic Elements: 85K
Package: 896-FBGA (31x31 mm)
Vergleichen mit 5CSXFC5D6F31C6N →
Intel
Operating Temperature: -40 C to +100 C (Industrial, TJ)
Package: 896-ball FBGA (31 x 31 mm)
Process Technology: 28 nm low-power
Vergleichen mit 5CSXFC5D6F31C6N →
Intel
Logic Elements: 110,000
Package: 896-ball FBGA (31 x 31 mm)
Process Technology: 28 nm TSMC low-power
Vergleichen mit 5CSXFC5D6F31C6N →
Intel
Operating Temperature: -40C to +100C (commercial grade C6 speed grade)
Logic Elements: 110,000
Package: 896-FBGA (31x31 mm)
Vergleichen mit 5CSXFC5D6F31C6N →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

5CSXFC6D6F31C6N

✅ Drop-In
Intel
📦 896-FBGA (31x31)
Cyclone V SX · SoC FPGA (FPGA + Hard Processor System) · 110,000 · Dual-core ARM Cortex-A9 MPCore with CoreSight · 925 MHz · 5.44 Mbit · 112 · 288

✓ Auf Lager

$285 / Stück

Datenblatt ansehen →

5CSXFC5D6F31C7N

✅ Drop-In
Intel
📦 896-FBGA (31x31)
SoC FPGA (HPS + FPGA fabric) · Cyclone V SX · Dual ARM Cortex-A9 MPCore with CoreSight · 85,000 · 32,075 · 800 MHz · 9 · 3.125 Gbps

✓ Auf Lager

$285 / Stück

Datenblatt ansehen →

5CSXFC5D6F31I7N

✅ Drop-In
Intel
📦 896-FBGA (31x31)
Cyclone V SX SoC FPGA · 85,000 · Dual ARM Cortex-A9 MPCore with CoreSight · 800 MHz · 1.1 V · 28 nm low-power · 896-ball FBGA (31 x 31 mm) · 1.0 mm

✓ Auf Lager

$138.2 / Stück

Datenblatt ansehen →

5CSTFD6D5F31I7N

✅ Drop-In
Intel
📦 896-FBGA (31x31)
Cyclone V ST · SoC FPGA (with hard ARM Cortex-A9) · 110000 · 28 nm low-power · Dual ARM Cortex-A9 MPCore · 800 MHz · Integrated · Yes

✓ Auf Lager

$290 / Stück

Datenblatt ansehen →
ℹ️ 1 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

5CSXFC5D6F31C6N Grenzwerte & elektrische Eigenschaften

Family Cyclone V SX (SoC FPGA)
Logic Elements 85,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight
Maximum HPS Frequency 925 MHz
Process Technology TSMC 28 nm low-power
Gehäuse 896-ball FBGA (31x31 mm)
User I/O Count 288
Embedded Memory Approx. 4,450 Kbits (per device family)
18x18 Multipliers 224
Fractional PLLs 6
Hard Memory Controllers 2
Transceivers Not integrated on SX (see ST family)
Speed Grade C6 (commercial)
Betriebstemperatur 0C to +85C (commercial, per speed-grade convention)
Montageart Surface Mount (BGA)
RoHS-Status Compliant

5CSXFC5D6F31C6N 896-ball fbga (31x31 mm) Pinbelegungsleitfaden

Pinbelegung für 5CSXFC5D6F31C6N (896-ball fbga (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 5CSXFC5D6F31C6N im 896-ball fbga (31x31 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC5D6F31C6N.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

5CSXFC5D6F31C6N ist geeignet für 7 Anwendungs: Industrial Motor and Motion Control, Factory Automation PLC and Edge Controller, Video Surveillance and Machine Vision, Automotive Driver Assistance (ADAS) Prototyping, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing.

🏭

Industrial Motor and Motion Control

The 5CSXFC5D6F31C6N is a strong fit for industrial multi-axis motion controllers because the FPGA fabric runs parallel current-loop and field-oriented-control algorithms in deterministic nanosecond-scale latency while the dual ARM Cortex-A9 MPCore HPS hosts the motion sequencer, trajectory planner, and industrial Ethernet stack (EtherCAT / PROFINET). With 85K logic elements and 224 18x18 multipliers, one SX SoC can replace a discrete DSP plus microcontroller pair. Designers place the device between the 24V industrial bus and the gate-driver stage, leveraging the 288 user I/Os for encoder, Hall-sensor, and PWM channels. Compared with a software-only solution on a microcontroller, this architecture shrinks the control loop period by roughly 5-10x and reduces PCB area.

🏭

Factory Automation PLC and Edge Controller

For PLCs and edge controllers, the 5CSXFC5D6F31C6N consolidates deterministic logic for IEC 61131-3 ladder execution, high-speed counters, and PWM with a Linux-capable Cortex-A9 HPS running containerized analytics on the same die. The 6 fractional PLLs drive precise timing for industrial Ethernet PHYs while the 2 hard memory controllers attach directly to DDR3 with ECC. With the 896-FBGA (31x31) package delivering 288 user I/Os, the device can fan out to dozens of isolated digital I/O channels. The result is a single-chip PLC with deterministic 100 us scan times and onboard edge analytics - replacing separate MCU + ASIC architectures.

🎥

Video Surveillance and Machine Vision

The 5CSXFC5D6F31C6N accelerates MIPI CSI-2 or parallel-camera image pipelines by running Bayer demosaic, HDR fusion, and motion detection in the FPGA fabric, while the dual ARM Cortex-A9 HPS runs ONNX-based object-detection inference. The 288 user I/Os expose multiple camera interfaces plus gigabit Ethernet for streaming, and the hard memory controllers feed DDR3 bandwidth to the video pipeline. Compared with a CPU-only solution, this SoC FPGA typically delivers 4-8x more frames per second per watt. Engineers place the device adjacent to the camera sensor array, using the 31x31 mm FBGA footprint to fit compact PoE-powered camera enclosures.

🚗

Automotive Driver Assistance (ADAS) Prototyping

The 5CSXFC5D6F31C6N serves as an ADAS prototyping platform where the FPGA fabric implements sensor-fusion pre-processing (radar FFT, lidar point-cloud clustering) while the Cortex-A9 HPS runs the perception stack. The 85K logic elements and 224 multipliers are sufficient to process 2-3 radar or lidar channels in parallel. Although the SX family is commercial-grade, the same die is available as 5CSXFC5D6F31I7N for industrial-grade in-cabin systems. Designers benefit from a software-defined path to automotive-qualified Cyclone V variants (5CGTFD9A5U19A7N automotive line). Compared with discrete DSP + MCU pairs, the SoC FPGA integration cuts sensor latency by 30-50%.

🌐

Software-Defined Radio (SDR) Baseband

In SDR baseband applications, the 5CSXFC5D6F31C6N handles real-time digital down-conversion, channelization, and demodulation in the FPGA fabric, while the HPS runs the protocol stack and network interface. The 224 18x18 multipliers and ~4,450 Kbits of embedded RAM support multiple narrowband channels simultaneously. For applications that need 6.144 Gbps transceivers, designers migrate to the pin-compatible 5CSTFD6D5F31I7N in the same F31 package. Compared with a pure-software SDR on a high-end CPU, the SoC FPGA delivers roughly 10-20x improvement in channels-per-watt at the cost of higher engineering complexity.

🖥️

ASIC Prototyping and Emulation

Designers use the 5CSXFC5D6F31C6N as a building block in ASIC prototyping farms because the 85K logic elements and hard memory controllers deliver deterministic timing for verifying register-transfer-level designs. Multiple SX SoCs can be cascaded via high-speed LVDS or transceivers (on ST variants) for multi-million-gate emulations. The Cortex-A9 HPS handles test-vector injection and result logging. Compared with expensive emulation platforms, this approach scales linearly and uses Quartus Prime's incremental compile flow. Engineers typically combine 3-4 SX F31 packages on a single daughter card to emulate 300K-500K gate ASICs.

✈️

Military and Aerospace Signal Processing

For ruggedized signal processing in military and aerospace applications, the 5CSXFC5D6F31C6N delivers deterministic latency for sensor signal conditioning, encryption acceleration, and protocol bridging, while the Cortex-A9 HPS runs a secure Linux or VxWorks stack. The FPGA fabric can host customer crypto IPs and the HPS handles key management. Designers pair the device with ruggedized DDR3L and conformal-coated PCB assemblies. Industrial-temperature variants (5CSXFC5D6F31I7N) and Intel's broader military-grade program provide screening options. Compared with discrete DSP + processor solutions, the SoC FPGA reduces SWaP-C (size, weight, power, cost) by 40-60% in many line-replaceable units.

What is the logic element count of 5CSXFC5D6F31C6N?
The 5CSXFC5D6F31C6N contains 85,000 logic elements in its Cyclone V SX FPGA fabric, paired with a dual-core ARM Cortex-A9 hard processor system running up to 925 MHz. According to the Intel Cyclone V Device Datasheet, the SX variant integrates the HPS and 288 user I/Os on the 896-ball FBGA (31x31 mm) package, enabling mixed CPU/FPGA workloads on a single die.
What is the maximum HPS clock frequency of 5CSXFC5D6F31C6N?
The HPS (Hard Processor System) in the 5CSXFC5D6F31C6N supports a maximum CPU clock of 925 MHz for the dual ARM Cortex-A9 MPCore subsystem. This frequency is documented in Intel's Cyclone V Device Datasheet and applies to the C6 commercial speed grade that this OPN carries. Designers must still validate peripheral and DDR memory timing independently.
Where can I download the 5CSXFC5D6F31C6N datasheet PDF?
The official 5CSXFC5D6F31C6N datasheet is available from Intel's product page at https://www.altera.com/products/fpga/cyclone/v/sx/5csxc5-f31/5CSXFC5D6F31C6N and the Alldatasheet mirror that hosts a 93-page Cyclone V Device Datasheet PDF (~945 KB). According to Intel, additional family-level documentation is found in the Cyclone V Device Handbook and Pin Connection Guidelines.
What is the pinout configuration of 5CSXFC5D6F31C6N?
The 5CSXFC5D6F31C6N is supplied in a 896-ball FineLine BGA (FBGA) measuring 31x31 mm, with ball pitch and matrix layout defined by the Cyclone V Device Datasheet pin connection guidelines. Full pin assignments must be generated from Quartus Prime via the Pin Planner for the target OPN, since many pins are dual-function between HPS peripherals, FPGA I/O banks, and configuration interfaces.
How much does the 5CSXFC5D6F31C6N cost as of September 2026?
The 5CSXFC5D6F31C6N is listed at approximately $276.22 unit price as of 2026-09-06 per Heisener distributor listings, with DigiKey showing it as ships-today. Distributor stock varied between 7,000 and 7,500 pieces across the sources surveyed, and lead time was listed as 'to be confirmed' with a tentative delivery window of late July to early October 2026.
Is the 5CSXFC5D6F31C6N in stock at distributors?
Yes, the 5CSXFC5D6F31C6N was reported in stock across multiple distributors as of 2026-09-06, with Heisener listing roughly 7,000 to 7,500 pieces and DigiKey advertising 'Buy now, ships today'. Despite the active stock signals, Intel has classified much of the Cyclone V family for last-time-buy on certain speed grades, so procurement teams should verify the latest lifecycle status before committing to long-term production.
What is the lead time for 5CSXFC5D6F31C6N orders?
Lead time for the 5CSXFC5D6F31C6N is listed as 'to be confirmed' on Heisener as of 2026-09-06, with estimated delivery ranging between July 25 and October 12 depending on shipping method. DigiKey advertises immediate shipment, while Octopart aggregates multiple distributors whose stock and lead-time should be compared in real time for the exact quantity needed.
5CSXFC5D6F31C6N vs 5CSXFC6D6F31C6N - which is better for high-logic designs?
The 5CSXFC5D6F31C6N offers 85,000 logic elements while the 5CSXFC6D6F31C6N delivers 110,000 logic elements, both in the same 896-FBGA (31x31) Cyclone V SX SoC package, according to DigiKey listings. Choose 5CSXFC6D6F31C6N for designs that need ~30% more FPGA fabric and DSP blocks; both share the HPS, transceivers and I/O count, so PCB layout is fully reusable.
Can I replace 5CSXFC5D6F31C6N with 5CSXFC6D6F31C6N on the same PCB?
Yes, the 5CSXFC6D6F31C6N is pin-to-pin compatible with the 5CSXFC5D6F31C6N in the 896-ball FBGA (31x31) package, sharing the same HPS, ball map, and configuration interface. The 5C6 variant adds roughly 25,000 logic elements and more DSP blocks at higher unit cost, making it a true drop-in upgrade when the design runs out of FPGA resources but the PCB footprint does not change.
When should I choose 5CSXFC5D6F31C6N over a Xilinx Zynq-7000?
Choose the 5CSXFC5D6F31C6N when the design needs a low-power SoC FPGA with mature Quartus tool flow, integrated DDR controllers, and a robust HPS peripheral set, especially for industrial and factory automation. The Cyclone V SX 28nm process typically delivers lower static power than competing 28nm Zynq-7000 devices; select Zynq-7000 instead when the design requires the Xilinx ecosystem, larger logic capacity per dollar at the high end, or Vivado-specific IP.
Is the 5CSXFC5D6F31C6N suitable for industrial motor control?
Yes, the 5CSXFC5D6F31C6N is well suited for industrial motor and motion control, where the FPGA fabric accelerates current-loop and field-oriented-control algorithms in parallel while the ARM Cortex-A9 HPS runs the higher-level motion sequencer and industrial Ethernet stack. The 896-FBGA variant gives enough I/O for multi-axis encoder interfaces, and the hard memory controllers handle deterministic DDR3 buffering for control loops.
What is the difference between 5CSXFC5D6F31C6N and 5CSXFC5C6U23I7N?
The 5CSXFC5D6F31C6N is the 896-ball FBGA (31x31) F31-package variant with the dual-core HPS, while the 5CSXFC5C6U23I7N is the smaller 672-pin UFBGA (23x23) F23-package Cyclone V SX option with comparable logic capacity but fewer user I/Os and a smaller board footprint. According to Intel ordering information, the U23 package is preferred when PCB area is constrained, while the F31 package is selected when maximum I/O count is required.
What is the best drop-in replacement for 5CSXFC5D6F31C6N?
The best drop-in replacement for the 5CSXFC5D6F31C6N is the 5CSXFC6D6F31C6N, which shares the identical 896-FBGA (31x31) package, same HPS subsystem, and same configuration interface but offers 110K logic elements versus 85K. For cost-down redesigns within the same package, the 5CSXFC5D6F31C7N (C7 speed grade) or 5CSXFC5D6F31I7N (industrial temperature) variants are also pin-compatible options.
What is the operating temperature range of 5CSXFC5D6F31C6N?
The 5CSXFC5D6F31C6N is specified for the commercial C6 speed grade, which by Intel convention targets a 0C to +85C junction temperature range. For industrial -40C to +100C operation, Intel offers the I7 speed grade variant of the same die (for example 5CSXFC5D6F31I7N) in the same F31 package, providing true drop-in thermal-range compatibility.
What software tools are needed to program 5CSXFC5D6F31C6N?
The 5CSXFC5D6F31C6N is programmed using Intel Quartus Prime design software, with the SoC EDS (Embedded Development Suite) providing ARM DS-5 / SoC EDS toolchain support for the dual Cortex-A9 HPS. Intel continues to support Cyclone V device families in Quartus Prime through dedicated device support packages; legacy Altera-era design files can be migrated using the Quartus Project Migrator utility.

Technische Referenzdaten für 5CSXFC5D6F31C6N – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the 5CSXFC5D6F31C6N when you need a mid-density Cyclone V SX SoC FPGA with 85K logic elements and the dual Cortex-A9 HPS in the largest 896-ball FBGA (31x31) package for maximum I/O. It is the right answer for industrial motor control, factory automation, and video pipelines where the HPS runs Linux and the FPGA accelerates deterministic DSP. Pick the 5CSXFC6D6F31C6N when 85K LEs proves insufficient - the +29% logic and additional DSP fit the same F31 footprint. Switch to the 5CSXFC5D6F31I7N for industrial temperature environments. Choose the 5CSTFD6D5F31I7N only when 6.144 Gbps transceivers are required; otherwise the SX family offers the lowest static power and smallest bill of materials.

Vergleich mit Alternativen

Parameter Dieses Produkt 5CSXFC6D6F31C6N 5CSXFC5D6F31C7N 5CSXFC5D6F31I7N 5CSTFD6D5F31I7N
Package 896-FBGA (31x31) 896-FBGA (31x31) 896-FBGA (31x31) 896-FBGA (31x31) 896-FBGA (31x31)
Brand Intel Intel Intel Intel Intel
Family Cyclone V SX Cyclone V SX Cyclone V SX Cyclone V SX Cyclone V ST (with transceivers)
Logic Elements 85,000 110,000 85,000 85,000 110,000
HPS Dual ARM Cortex-A9 up to 925 MHz Dual ARM Cortex-A9 up to 925 MHz Dual ARM Cortex-A9 up to 925 MHz Dual ARM Cortex-A9 up to 925 MHz Dual ARM Cortex-A9 up to 925 MHz
Transceivers None (SX family) None (SX family) None (SX family) None (SX family) 6.144 Gbps transceivers
Speed Grade C6 (commercial) C6 (commercial) C7 (commercial, faster) I7 (industrial -40C to +100C) I7 (industrial)
Operating Temperature 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C (industrial) -40C to +100C (industrial)
User I/O Count 288 288 288 288 288

Wichtigste Unterscheidungsmerkmale

  • Higher logic capacity in identical F31 896-FBGA package (vs. 5CSXFC5D6F31C7N)
  • Industrial temperature range with identical silicon (vs. 5CSXFC5D6F31C7N)
  • Integrated transceivers in pin-compatible F31 package (vs. 5CSXFC5D6F31I7N)
  • Single-chip CPU + FPGA integration reduces BOM and latency (vs. Discrete MCU + Cyclone FPGA)

Designhinweise

Power the 5CSXFC5D6F31C6N from a multi-rail supply delivering VCCINT (typically 1.1 V core), VCCA (analog 2.5 V), VCCD_PLL (PLL digital 1.1 V), and the HPS-specific VCC_HPS rails per Intel's Cyclone V Power Management user guide. Apply power-sequencing constraints: VCCA must not exceed VCCINT by more than 0.3 V during ramp, and the HPS core rail should be among the last to come up to prevent POR glitches. Bulk-decouple each supply domain with at least 22 uF of polymer tantalum plus 0.1 uF and 1 nF ceramic capacitors placed within 5 mm of every supply ball group. Without proper sequencing the HPS Cortex-A9 boot ROM may enter an unrecoverable state on cold start.

Estimated: at typical utilization (~70% LE, 50% DSP, 925 MHz HPS, DDR3 active) the 5CSXFC5D6F31C6N dissipates roughly 4-6 W. The 31x31 mm FBGA requires a thermal via array under the central ground balls per the Cyclone V package guidelines to keep theta_J-A near 12 C/W on a 6-layer 1-oz PCB. Without adequate vias the junction temperature can exceed 100C in enclosed enclosures, especially at the C6 commercial-grade 85C limit. Always validate with Quartus PowerPlay early in the design cycle and iterate on the thermal via pattern before committing PCB to fabrication.

Place all decoupling capacitors on the same PCB side as the FBGA, using short 12-20 mil-wide traces to minimize inductance. Route DDR3 signals to the HPS hard memory controller with length-matched 50-ohm impedance and 100-ohm differential pairs for the DDR3 differential clocks; cross-validation with Quartus Prime External Memory Interface Toolkit is mandatory before tape-out. Provide at least 6 PCB layers with dedicated ground and power planes adjacent to the FPGA side. Common pitfalls include routing the HPS JTAG and FPGA JTAG chains together without buffering (which prevents independent debug), and forgetting to add pull-ups on the HPS I2C lines.

Three recurring board bring-up pitfalls for the 5CSXFC5D6F31C6N: (1) failing to configure the MSEL pins correctly for the chosen configuration mode (AS, PS, FPP, JTAG) - leaving them floating can prevent configuration entirely; (2) not connecting the HPS_COLD_nRESET signal to the FPGA reset network, which causes the HPS to lock up when the FPGA fabric reconfigures; (3) underestimating the HPS clock jitter requirement - a noisy 25 MHz reference translates directly into Cortex-A9 jitter and Ethernet PHY errors. Always follow Intel's Cyclone V Pin Connection Guidelines document and validate clock trees with the Quartus TimeQuest timing analyzer before board bring-up.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and lead-free per Intel Cyclone V product family documentation. Commercial temperature grade (C6) - not AEC-Q100 qualified; for AEC-Q100 select the 5CGTFD9A5U19A7N automotive line. Halogen-free status not explicitly stated in the verified web data - set to unknown.

Daten verifiziert am: 2026-09-06 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

5CSXFC5D6F31C6N 5CSXFC5D6F31C6N datasheet Intel Cyclone V SX FPGA 85K 5CSXFC5D6F31C6N price 5CSXFC5D6F31C6N in stock Cyclone V SX SoC FPGA 896 FBGA 5CSXFC5D6F31C6N vs 5CSXFC6D6F31C6N 5CSXFC5D6F31C6N industrial motor control Cyclone V SX drop-in replacement 5CSXFC5D6F31C6N pin configuration dual ARM Cortex-A9 Cyclone V SoC 5CSXFC5D6F31C6N lead time

Verwandte Bauteile & Begriffe

Intel Altera 5CSXFC5D6F31C6N 5CSXFC6D6F31C6N 5CSXFC5D6F31C7N 5CSXFC5D6F31I7N 5CSTFD6D5F31I7N Cyclone V SX Cyclone V ST System on Chip FPGA ARM Cortex-A9 MPCore FPGA PLL FBGA package 28nm process DDR3 memory controller industrial motor control factory automation machine vision software-defined radio AEC-Q100 RoHS Quartus Prime
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