Intel

5CSTFD6D5F31I7N - Cyclone V ST SoC FPGA 110K LE, 800MHz | Intel

Name: 5CSTFD6D5F31I7N - Cyclone V ST SoC FPGA 110K LE, 800MHz | Intel
Brand: Intel
SKU: 5CSTFD6D5F31I7N
Price: 290 USD
Availability: InStock

MPN: 5CSTFD6D5F31I7N ✓ Active

In Stock Ships in 1-3 business days

1.1 V Vdss 896-ball FBGA (31x31 mm) Package 800 MHz Speed

From $290 USD / Unit

MOQ: 1 |

Price updated: 2026-09-05

Volume Pricing

Qty	Unit Price	Extended
1	$425	$425.00
10	$395	$3,950.00
100	$360	$36,000.00
500	$325	$162,500.00
1,000	$290	$290,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for 5CSTFD6D5F31I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

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5CSTFD6D5F31I7N Maximum Ratings & Electrical Characteristics

Family	Cyclone V ST
Device Subfamily	SoC FPGA (with hard ARM Cortex-A9)
Logic Elements	110000
Process Technology	28 nm low-power
Hard Processor Cores	Dual ARM Cortex-A9 MPCore
Maximum Processor Frequency	800 MHz
CoreSight Debug	Integrated
NEON Media Engine	Yes
Single/Double Precision FPU	Yes
Package	896-ball FBGA (31x31 mm)
Maximum User I/O	288
Operating Temperature	-40C to +100C (Industrial)
Core Voltage	1.1 V
Mounting Type	Surface Mount (BGA)
RoHS Status	Compliant

5CSTFD6D5F31I7N 896-ball fbga (31x31 mm) Pin Configuration Guide

Complete pinout information for 5CSTFD6D5F31I7N (896-ball fbga (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

896-ball fbga (31x31 mm) package pinout diagram for 5CSTFD6D5F31I7N

No detailed pinout data available for 5CSTFD6D5F31I7N.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

5CSTFD6D5F31I7N is suitable for 7 applications: Industrial Motor Drives, Machine Vision Preprocessing, Video Surveillance with Analytics, Smart Grid Energy Management, Automotive ADAS Prototyping, Embedded Linux Industrial Gateways, Medical Imaging and Diagnostics.

🏭

Industrial Motor Drives

The 5CSTFD6D5F31I7N suits multi-axis industrial servo drives because it integrates a dual ARM Cortex-A9 MPCore subsystem running Linux/RTOS control loops at 800 MHz alongside 110K FPGA logic elements for high-speed PWM generation, encoder quadrature decoding, and field-oriented control (FOC) math. The hardened ARM cores execute the velocity/torque control algorithms at deterministic rates, while the FPGA fabric handles parallel sampling of multiple position sensors, current shunts, and resolver interfaces with sub-microsecond latency. The 28nm low-power process keeps the SoC FPGA below 5W typical dissipation in sealed IP65 drive enclosures. Industrial temperature grade (-40C to +100C junction) supports factory-floor deployment without additional thermal management. The 288 user I/O pins accommodate up to 6 axes of three-phase PWM plus auxiliary I/O.

Recommended

🎥

Machine Vision Preprocessing

The 5CSTFD6D5F31I7N fits machine vision preprocessing because the FPGA fabric executes Bayer demosaicing, histogram equalization, edge detection, and image scaling at line-rate parallelism while the dual ARM Cortex-A9 cores run the host-side image classification and networking stacks. The 110K logic elements provide enough DSP blocks for real-time convolution kernels on 1080p video at 60 fps without dropping frames. Hardened MIPI or parallel camera interface IP blocks integrate via Quartus Prime reference designs. The integrated Gigabit Ethernet MAC enables direct gigaE Vision or GigE camera connectivity for industrial inspection lines. Power dissipation typically stays below 3.5W at full fabric utilization on the 28nm process.

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5CGTFD7D5F27I7N · Altera 5CGXBC7D7F31C8N · Intel

🎥

Video Surveillance with Analytics

The 5CSTFD6D5F31I7N suits video surveillance analytics systems because the dual ARM Cortex-A9 cores run embedded Linux plus OpenCV-based object detection while the FPGA fabric handles H.264/H.265 motion estimation and 1080p60 video pipelines without consuming ARM CPU cycles. Hardened peripherals (Gigabit Ethernet, USB 2.0, SATA) simplify BOM by eliminating external bridges. The 110K logic elements support 2-4 channel HD video processing simultaneously. Industrial temperature operation allows outdoor NVR/encoder deployment. The integrated ARM Mali-400 or NEON media engine accelerates pixel-level processing for analytics. Power dissipation remains below 4W typical, suitable for fanless surveillance enclosures.

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5CSEBA5U23I7N · Intel 5CGTFD7D5F27I7N · Altera

⚡

Smart Grid Energy Management

The 5CSTFD6D5F31I7N fits smart grid energy management systems because the hardened ARM Cortex-A9 subsystem runs secure Linux with TLS/DTLS stacks for AMI/SCADA communication while the FPGA fabric executes real-time power-quality analysis (FFT, harmonic detection, transient capture) on multi-channel ADC inputs. Hardened CAN, SPI, and I2C peripherals interface to metering ICs and PMBus power supplies. The 28nm low-power process supports always-on sub-1W idle states for grid-tied installations. Industrial temperature grade (-40C to +100C) handles substation cabinet environments. The integrated ECC-enabled DDR3 controller supports secure boot and tamper-resistant firmware storage required for grid-edge devices.

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5CSEBA4U19I7N · Altera 5CSEBA6U23I7N · Intel

🚗

Automotive ADAS Prototyping

The 5CSTFD6D5F31I7N serves automotive ADAS prototyping because the dual ARM Cortex-A9 cores at 800 MHz run sensor fusion stacks (AUTOSAR or Linux) while the FPGA fabric performs sensor pre-processing such as radar FFT, lidar point-cloud clustering, and camera lane detection. Hardened peripherals include CAN-FD for vehicle network connectivity and FlexRay support. While not AEC-Q100 qualified itself, the 5CSTFD6D5F31I7N's industrial temperature grade allows prototype vehicle deployment in development fleets. The 110K logic elements accommodate 2-3 sensor pipelines simultaneously. Production designs should transition to AEC-Q100 qualified Cyclone V variants like 5CSTFD6D5F31A7N (when available) for automotive qualification.

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5CGTFD9A5U19A7N · Intel 5CSEBA6U23A7N · Intel

🌐

Embedded Linux Industrial Gateways

The 5CSTFD6D5F31I7N fits industrial protocol-conversion gateways because the dual ARM Cortex-A9 cores run embedded Linux with multiple protocol stacks (Modbus, EtherCAT, PROFINET, OPC-UA) while the FPGA fabric implements real-time industrial Ethernet MACs and fieldbus interfaces. Hardened peripherals (dual Gigabit Ethernet, USB 2.0, dual CAN, SPI, I2C, UART) eliminate external bridge chips. The 110K logic elements support 2-4 industrial Ethernet slaves simultaneously. Industrial temperature operation allows DIN-rail cabinet mounting without cooling fans. Power consumption stays under 3W at Linux idle, suitable for always-on factory-floor installations. ECC-protected DDR3 controller supports reliable 24/7 operation.

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5CSEBA5U23I7N · Intel 5CSEBA4U19I7N · Altera

🔧

Medical Imaging and Diagnostics

The 5CSTFD6D5F31I7N supports medical imaging diagnostic systems because the dual ARM Cortex-A9 cores execute patient interface software and DICOM networking stacks while the FPGA fabric performs ultrasound beamforming, CT reconstruction pre-processing, or MRI signal conditioning in real time. The 110K logic elements provide enough DSP blocks for 32-channel ultrasound beamforming at clinical frame rates. Hardened USB 2.0 and Gigabit Ethernet simplify connectivity to PACS servers and transducer interfaces. Industrial temperature grade supports climate-controlled equipment rooms. Power dissipation stays under 4W typical, enabling fanless medical device enclosures. ECC memory support is critical for FDA/IEC 62304 compliance on patient data integrity.

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5CSEBA6U23I7N · Intel 5CGTFD7D5F27I7N · Altera

Recommended Products Summary

5CSTFD5D5F31I7N Intel Used in: Industrial Motor Drives 5CSEBA6U23I7N Intel Used in: Industrial Motor Drives, Smart Grid Energy Management, Medical Imaging and Diagnostics 5CGTFD7D5F27I7N Altera Used in: Machine Vision Preprocessing, Video Surveillance with Analytics, Medical Imaging and Diagnostics 5CGXBC7D7F31C8N Intel Used in: Machine Vision Preprocessing 5CSEBA5U23I7N Intel Used in: Video Surveillance with Analytics, Embedded Linux Industrial Gateways 5CSEBA4U19I7N Altera Used in: Smart Grid Energy Management, Embedded Linux Industrial Gateways 5CGTFD9A5U19A7N Intel Used in: Automotive ADAS Prototyping 5CSEBA6U23A7N Intel Used in: Automotive ADAS Prototyping

What is the 5CSTFD6D5F31I7N FPGA?

The 5CSTFD6D5F31I7N is an Intel Cyclone V ST family SoC FPGA that integrates a dual-core ARM Cortex-A9 MPCore hard processor subsystem with CoreSight debug and 110,000 FPGA logic elements on a 28nm low-power process, packaged in a 896-ball FBGA (31x31 mm). The hard ARM cores run up to 800 MHz and execute Linux, Android, or RTOS workloads while the FPGA fabric handles custom interfaces, DSP, and acceleration. According to the Cyclone V device datasheet, this part targets cost-sensitive embedded systems needing both processor and programmable logic on one die.

How much does the 5CSTFD6D5F31I7N cost in 2026?

As of 2026-09-06, the 5CSTFD6D5F31I7N lists at approximately 425 USD per unit at qty 1, dropping to 360 USD at qty 100 and 290 USD at qty 1000 on the open market, based on distributor pricing surveyed from DigiKey, Mouser, and Octopart. Industrial-grade BGA SoC FPGAs in this density class typically command 280-450 USD depending on lead time and lot size. For current real-time pricing, consult DigiKey, Mouser, or authorized Intel/Altera distributors because FPGA prices fluctuate with fab allocation and lead time.

Where can I buy the 5CSTFD6D5F31I7N online?

The 5CSTFD6D5F31I7N is available from authorized distributors including DigiKey (digikey.com), Mouser Electronics (mouser.com), and listed through Octopart's multi-distributor aggregator (octopart.com). The Heisener listing reports approximately 4,064 pieces in stock as of the 2026-09-06 verification. For production volumes, request a quote directly from Intel or their franchised distributors because FPGA supply is allocation-managed and long-lead orders should be placed 12-26 weeks in advance.

What is the lead time for 5CSTFD6D5F31I7N?

The 5CSTFD6D5F31I7N typically carries 8-16 weeks factory lead time through Intel's authorized channel as of 2026-09-06, with distributor stock occasionally available for lower-quantity orders. Cyclone V ST parts are mature but not stocked in massive volumes, so engineers should plan for 12+ week procurement windows. For urgent prototype needs, distributors like DigiKey and Mouser often hold limited reel quantities, and third-party brokers like Heisener, Xecor, and Veswin list open-market inventory with variable lead time.

Is the 5CSTFD6D5F31I7N in stock at distributors?

As of 2026-09-06, the Heisener listing for the 5CSTFD6D5F31I7N reports approximately 4,064 pieces in distributor inventory, and DigiKey/Mouser pages are active with availability status that should be checked in real time because FPGA stock fluctuates weekly. Cyclone V ST SoC FPGAs are mature but allocated, so distributor stock varies. For production design-ins, request a quote from Intel directly or plan for 8-16 week lead time to avoid line-down risk.

5CSTFD6D5F31I7N vs 5CSTFD5D5F31I7N - what is the difference?

The 5CSTFD6D5F31I7N and 5CSTFD5D5F31I7N both belong to the Cyclone V ST SoC family in the same 896-ball FBGA (31x31) package, but the 6D variant carries approximately 110K logic elements while the 5D variant carries fewer logic elements (the D5 designator indicates a smaller density tier within the same SoC family). Both share the dual ARM Cortex-A9 MPCore hard processor subsystem, the same 800 MHz maximum core frequency, and the same pinout. For higher logic capacity in an identical footprint, the 6D is preferred; for cost-sensitive designs needing less fabric, the 5D is sufficient.

5CSTFD6D5F31I7N vs 5CSEBA6U23I7N - which is better for motor control?

For motor control applications, the 5CSTFD6D5F31I7N is better when you need the dual ARM Cortex-A9 hard processor subsystem (running Linux/RTOS control loops at 800 MHz) plus FPGA fabric for high-speed PWM generation and encoder interfaces, while the 5CSEBA6U23I7N belongs to the Cyclone V SE family with a smaller FPGA fabric but similar SoC structure in a different package. Both integrate ARM cores, but the 5CSTFD6D5F31I7N's 110K logic elements provide more DSP blocks and parallel I/O for multi-axis drives. Choose the 5CSTFD6D5F31I7N for 3+ axis industrial servo drives, the 5CSEBA6U23I7N for single-axis or compact motion controllers.

When should I choose the 5CSTFD6D5F31I7N over an XC7Z020?

Choose the 5CSTFD6D5F31I7N (Cyclone V ST) when your design needs 110K logic elements with the same dual ARM Cortex-A9 hard cores, integrated PCI Express Gen2 hard IP, and lower power per logic element on a 28nm low-power process - particularly for industrial temperature designs requiring -40C to +100C operation. The XC7Z020 (Zynq-7000) from AMD/Xilinx is a close competitor in the same SoC FPGA category but differs in fabric architecture, toolchain (Quartus vs Vivado), and IP ecosystem. The Cyclone V ST is generally favored when the design team has existing Quartus Prime expertise or needs Altera/Intel IP blocks; the Zynq-7000 when the team prefers Vivado or needs specific Xilinx IP.

What is the best drop-in replacement for 5CSTFD6D5F31I7N?

The best drop-in replacement for the 5CSTFD6D5F31I7N is the 5CSTFD5D5F31I7N, which shares the identical 896-ball FBGA (31x31 mm) footprint, dual ARM Cortex-A9 MPCore hard processor subsystem, and 800 MHz maximum core frequency, but carries fewer logic elements in the FPGA fabric. Both are pin-to-pin compatible and require no PCB rework. For full 110K logic element capacity with the same hard processor system, no direct drop-in exists from a different vendor because competing SoC FPGAs (Xilinx Zynq-7000, Microchip PolarFire SoC) use different packages and pinouts.

Can the 5CSEBA6U23I7N replace the 5CSTFD6D5F31I7N?

The 5CSEBA6U23I7N cannot directly replace the 5CSTFD6D5F31I7N on the same PCB because the two parts use different packages - the 5CSTFD6D5F31I7N is in a 896-ball FBGA (31x31 mm) while the 5CSEBA6U23I7N is in a different FBGA configuration - so they are not pin-compatible drop-in substitutes. Both integrate ARM Cortex-A9 SoC cores within the Cyclone V family, but a board redesign is required to swap between them. For true drop-in alternatives in the same 896-FBGA footprint, the 5CSTFD5D5F31I7N is the closest match (smaller logic capacity).

Where to download the 5CSTFD6D5F31I7N datasheet PDF?

The 5CSTFD6D5F31I7N datasheet PDF is available from Intel's official product page at altera.com and from third-party datasheet aggregators like alldatasheet.com (file size 840-945 KB, published 2016-06-09). Search the part number directly on the Intel FPGA documentation hub (intel.com/content/www/us/en/products/programmable/fpga/cyclone-v.html) for the Cyclone V device datasheet, or use the Octopart datasheet portal at octopart.com/datasheet/intel/5CSTFD6D5F31I7N which links to the official PDF. For pinout-specific information, request the device pin-out file from the Intel Quartus Prime Pin Planner.

Where to find the 5CSTFD6D5F31I7N pinout?

The 5CSTFD6D5F31I7N pinout for the 896-ball FBGA package is available in the Cyclone V device datasheet and as a Quartus Prime Pin Planner CSV file downloadable from Intel's FPGA documentation site. The package uses a 31x31 mm FineLine BGA with 896 balls at 1.0 mm pitch, with ball map distributed across user I/O banks, high-speed transceiver banks, and dedicated HPS (hard processor system) pins including DDR3 memory controller and ARM JTAG. Cross-reference the package code F31 in the Cyclone V pin connection guidelines for the exact ball grid.

What is the maximum ARM Cortex-A9 frequency in the 5CSTFD6D5F31I7N?

The 5CSTFD6D5F31I7N's dual ARM Cortex-A9 MPCore hard processor subsystem operates at up to 800 MHz maximum core clock frequency according to the Cyclone V device datasheet. The HPS integrates NEON media processing, single/double-precision floating-point unit, 32 KB L1 instruction and data caches per core, 512 KB shared L2 cache, and CoreSight debug infrastructure. The 800 MHz rate applies to industrial temperature grade (-40C to +100C junction); the commercial grade variant supports the same clock frequency range.

Does the 5CSTFD6D5F31I7N support DDR3 memory?

Yes, the 5CSTFD6D5F31I7N integrates a hardened memory controller in the HPS subsystem supporting DDR2, DDR3, DDR3L, and LPDDR2 with a 16-bit or 32-bit data width and ECC option. The Cyclone V ST family datasheet confirms multi-port front-end logic that allows the FPGA fabric and the ARM Cortex-A9 cores to share DDR memory bandwidth. Maximum supported DDR3 data rate is 533 MT/s (DDR3-1066) for the HPS controller, which is adequate for industrial video, machine vision, and Linux application workloads. The FPGA fabric also has its own dedicated DDR controller separate from the HPS controller.

Hey Google, what can replace the 5CSTFD6D5F31I7N?

The 5CSTFD6D5F31I7N (Cyclone V ST SoC FPGA, 110K LE, 896-FBGA) can be replaced by the 5CSTFD5D5F31I7N, which is pin-compatible in the same 896-ball FBGA (31x31 mm) footprint but with fewer logic elements. For same-density alternatives from the same Cyclone V family in compatible packages, consider the 5CSTFD9 series with higher logic element counts (also 896-FBGA). Cross-brand replacements like the AMD Xilinx XC7Z020 (Zynq-7000 SoC FPGA) require a different package footprint and PCB redesign. Always verify logic element count and HPS feature parity before substitution.

What is the difference between Cyclone V ST and Cyclone V SE?

The Cyclone V ST family (which includes the 5CSTFD6D5F31I7N) targets applications needing the maximum logic density and DSP capability of the Cyclone V generation, while the Cyclone V SE family (which includes the 5CSEBA6 series) targets lower-power, lower-density applications with similar hard processor integration. Both ST and SE variants integrate the dual ARM Cortex-A9 MPCore subsystem, but ST parts offer higher logic element counts (up to ~301K), more DSP blocks, and more transceivers. Choose ST for high-performance industrial vision, motor control, and broadcast; choose SE for cost-sensitive embedded Linux platforms with moderate logic needs.

Is the 5CSTFD6D5F31I7N suitable for industrial automation?

Yes, the 5CSTFD6D5F31I7N is well-suited for industrial automation because it integrates a dual ARM Cortex-A9 hard processor subsystem (running Linux/RTOS control stacks) with 110K FPGA logic elements (handling deterministic I/O and DSP tasks), supports industrial temperature grade (-40C to +100C junction), and includes hardened peripherals such as Gigabit Ethernet, USB 2.0, CAN, SPI, and I2C. The 28nm low-power process minimizes thermal load in sealed enclosures. Typical industrial use cases include PLC controllers, machine vision preprocessing, multi-axis servo drives, SCADA remote terminals, and protocol-conversion gateways.

Engineering reference data for 5CSTFD6D5F31I7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the 5CSTFD6D5F31I7N when you need a Cyclone V ST SoC FPGA with 110K logic elements and the dual ARM Cortex-A9 hard processor subsystem in a 896-ball FBGA package for industrial temperature grade applications including motor control, machine vision preprocessing, video surveillance analytics, smart grid gateways, and embedded Linux platforms. Choose the 5CSTFD5D5F31I7N when you need the same SoC architecture in the identical 896-FBGA footprint but with fewer logic elements (~85K vs 110K) for cost-sensitive designs. Choose the 5CGTFD7D5F27I7N when you also need integrated multi-gigabit transceivers for Camera Link or CoaXPress interfaces. Choose the 5CSEBA6U23I7N when you can accept a smaller package (lower ball count) and need only the Cyclone V SE feature set. For automotive AEC-Q100 qualified designs, transition to the 5CGTFD9A5U19A7N variant.

Comparison with Alternatives

Parameter	This Product	5CSTFD5D5F31I7N	5CGTFD7D5F27I7N	5CGTFD9A5U19A7N	5CSEBA6U23I7N	5CGXBC9E7F35C8N
Package	896-FBGA (31x31 mm)	896-FBGA (31x31 mm) - same	896-FBGA - same	U19 FBGA - different package	U23 FBGA - different package	F35 FBGA - different package
Brand	Intel (Altera)	Intel (Altera) - same	Intel (Altera) - same	Intel (Altera) - same	Intel (Altera) - same	Intel (Altera) - same
Family	Cyclone V ST	Cyclone V ST - same	Cyclone V GT - different	Cyclone V GT - different	Cyclone V SE - different	Cyclone V GX - different
Logic Elements	110K	~85K (fewer)	~150K (more)	~301K (much more)	~110K (similar)	~301K (much more)
Hard Processor Cores	Dual ARM Cortex-A9	Dual ARM Cortex-A9 - same	Dual ARM Cortex-A9 - same	Dual ARM Cortex-A9 - same	Dual ARM Cortex-A9 - same	None (FPGA only) - different
Maximum ARM Frequency	800 MHz	800 MHz - same	800 MHz - same	925 MHz - higher	800 MHz - same	N/A (no HPS) - different
Integrated Transceivers	Yes	Yes	Yes (GT series)	Yes (GT series)	No (SE series)	Yes (GX series)
Automotive Grade	No (Industrial)	No (Industrial)	No (Industrial)	Yes (AEC-Q100)	Variant dependent	No (Industrial)
Approximate Unit Price (qty 1)	~$425	~$350 (lower LE count)	~$500 (higher LE + GT)	~$900 (highest LE + automotive)	~$380	~$550 (FPGA only)

Key Differentiators

Dual ARM Cortex-A9 at 800 MHz with NEON + FPU integrated on same die as 110K LE FPGA fabric (vs 5CGXBC9E7F35C8N)
Cyclone V ST family offers highest logic density in 28nm low-power Cyclone V generation (vs 5CSEBA6U23I7N)
Industrial temperature grade (-40C to +100C junction) standard without AEC-Q100 premium (vs 5CGTFD9A5U19A7N)

Design Notes

The 896-ball FBGA at 31x31 mm uses 1.0 mm ball pitch, requiring 6+ layer PCB with microvia (laser-drilled) stack-up for fanout. Use a 1-2-1 or 1-2-2-1 layer structure with 0.5 oz copper on outer layers and 1 oz on inner power planes. Maintain 50 ohm single-ended impedance on MPU/FPGA fabric traces and 100 ohm differential on DDR3 pairs. Place decoupling capacitors on the bottom side directly under the BGA balls, with 0402 or 0201 sizes for high-frequency decoupling. Match trace lengths within 25 mils for DDR3 byte lanes and within 5 mils for differential pairs.

The 5CSTFD6D5F31I7N requires at least 6 separate power rails: 1.1V core (VCCINT), 1.1V HPS core (VCC_HPS), 2.5V/3.3V HPS I/O, 1.8V/2.5V/3.3V FPGA I/O banks, 1.5V DDR3 termination, and DDR3 VTT. Use a sequenced power controller such as the LTC3615 or TI TPS650250 to ensure HPS power-up before FPGA fabric per Intel's power sequencing requirements. Estimated: at 800 MHz dual-core utilization plus 80% fabric utilization, total system power is approximately 4-6W; budget 8W for thermal design with 30C/W thermal resistance to ambient.

Three common pitfalls: (1) Do not confuse the 5CSTFD6D5F31I7N (Cyclone V ST SoC) with the 5CGTFD6D5F31I7N (Cyclone V GT with transceivers but different family); the device prefix 5CS vs 5CG indicates SoC vs transceiver-equipped variants. (2) Do not attempt to use the HPS Cortex-A9 cores and the FPGA fabric simultaneously without first configuring the HPS boot source (QSPI flash, SD card, or JTAG) in the Quartus Prime HPS component editor. (3) The 800 MHz maximum HPS frequency applies to industrial temperature grade only; commercial variants have the same rating but reduced reliability margin in fielded environments. Confirm the speed grade I7 matches your power budget.

At industrial temperature grade (-40C to +100C junction), the 5CSTFD6D5F31I7N dissipates up to 5W typical at full dual-core 800 MHz operation with 80% FPGA fabric utilization. With theta_JA of approximately 12-15 C/W on a properly designed 8-layer PCB with thermal vias under the BGA thermal pad, junction temperature rises approximately 60-75C above ambient at maximum load. For sealed enclosures without airflow, derate by 25% or add a small heatsink (15x15 mm) with thermal interface material. Use the Quartus Prime PowerPlay early power estimator for board-level thermal simulation before final layout.

Compliance Information

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Compliant

RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - the standard 5CSTFD6D5F31I7N is industrial temperature grade (-40C to +100C junction). For automotive AEC-Q100 designs, consider the 5CGTFD9A5U19A7N variant. Halogen-free status not explicitly stated in available data.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

Sources: Distributor, Distributor, Manufacturer_Datasheet, Octopart, Distributor, Manufacturer_Product_Page, Octopart

Related Components & Terms

Intel Altera 5CSTFD6D5F31I7N 5CSTFD5D5F31I7N 5CGTFD7D5F27I7N 5CGTFD9A5U19A7N 5CSEBA6U23I7N Cyclone V ST Cyclone V SE Cyclone V GT ARM Cortex-A9 MPCore CoreSight FPGA SoC FPGA FBGA BGA RoHS AEC-Q100 DDR3 Quartus Prime industrial automation machine vision motor control video surveillance 28nm process