5CSXFC2C6U23C8N - Cyclone V SX SoC FPGA, 25K LE, 672-UBGA | Intel
MPN: 5CSXFC2C6U23C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $121 | $12,100.00 |
| 500 | $112 | $56,000.00 |
| 1,000 | $105 | $105,000.00 |
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View Datasheet →5CSXFC2C6U23C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX |
| Series | 5CSXC2 |
| Logic Elements | 25,000 |
| Architecture | MCU + FPGA (SoC with dual ARM Cortex-A9 MPCore + FPGA fabric) |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm |
| HPS Clock Frequency (max) | 600 MHz |
| Speed Grade | C8 |
| Package | 672-pin UBG (UBGA) 23x23 mm |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial) |
| Memory Interface | DDR3, DDR2, LPDDR2 hard memory controllers |
| DSP Blocks | Variable-precision DSP blocks |
| HPS Peripherals | EMAC, USB 2.0 OTG, NAND, SD/SDIO/MMC, SPI, UART, I2C, GPIO |
| Packaging | Tray |
| RoHS Status | Compliant |
5CSXFC2C6U23C8N 672-pin ubg (ubga) 23x23 mm Pin Configuration Guide
Complete pinout information for 5CSXFC2C6U23C8N (672-pin ubg (ubga) 23x23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC2C6U23C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC2C6U23C8N is suitable for 6 applications: Industrial Motor Control, Machine Vision and Industrial Imaging, Software Defined Radio Baseband, Smart Grid Energy Management, Portable Medical Imaging, Broadcast Video Processing.
Industrial Motor Control
The 5CSXFC2C6U23C8N fits multi-axis industrial motor control because its dual ARM Cortex-A9 MPCore HPS runs real-time control loops and fieldbus stacks (EtherCAT, PROFINET, EtherNet/IP) while the Cyclone V SX FPGA fabric accelerates time-critical PWM generation, encoder decoding, and current-loop math in variable-precision DSP blocks. The 25K LE count supports two to three axes of FOC (field-oriented control) including SVPWM modulators, Hall/encoder interfaces, and protection logic. The UBGA-672 (U23) package exposes enough HPS+FPGA I/O for parallel bus interfaces to power-stage gate drivers, multi-axis ADC sampling, and HMI peripherals.
Recommended
Machine Vision and Industrial Imaging
The 5CSXFC2C6U23C8N is a strong fit for machine-vision pre-processing and image-pipeline accelerators. Its SX-class FPGA fabric implements Bayer demosaic, color-space conversion, and Sobel/edge filters in parallel pipelined DSP blocks; the HPS runs classification algorithms, the Linux camera stack, and TCP/IP for result forwarding. With 25K LE plus variable-precision DSP, the device supports one 1080p60 image pipeline at full throughput. The UBGA-672 package exposes MIPI CSI-2 RX, parallel CMOS, and LVDS sensor interfaces alongside GigE-Vision MAC in the FPGA fabric.
Recommended
Software Defined Radio Baseband
The 5CSXFC2C6U23C8N suits SDR baseband processing because its SX-class FPGA fabric implements DDC/DUC, channelizers, and PHY-layer modulators in variable-precision DSP blocks, while the dual ARM Cortex-A9 HPS runs upper-layer protocol stacks (MAC, networking, GNU Radio). With 25K LE plus FPGA DSP, the device handles 2x2 MIMO LTE small-cell baseband or single-channel 20 MHz 5G NR baseband pre-processing. The 600 MHz HPS offloads scheduler and networking tasks from the FPGA, accelerating deterministic latency-critical paths.
Recommended
Smart Grid Energy Management
The 5CSXFC2C6U23C8N is well-suited to smart-grid energy and substation automation because the dual ARM Cortex-A9 HPS runs IEC 61850 stack and security, while the FPGA fabric accelerates GOOSE-message processing, Sampled Values (SV) stream decoding, and PMU/FFT math. With 25K LE plus variable-precision DSP, the device handles one feeder bay plus metering. The UBGA-672 U23 package supports multi-channel 16-bit ADC interfacing for current/voltage sensing and isolated Ethernet PHYs for process-bus connectivity.
Recommended
Portable Medical Imaging
The 5CSXFC2C6U23C8N fits portable ultrasound and point-of-care imaging because the dual ARM Cortex-A9 HPS runs Linux + application layer (DICOM, image rendering, GUI) while the FPGA fabric accelerates beamforming, FIR filters, and envelope-detection in variable-precision DSP blocks. With 25K LE, the device supports a 32-channel portable ultrasound beamformer. The C8 commercial speed grade and 28nm low-power process keep the device within portable-battery thermal envelopes; HPS peripherals (USB 2.0 OTG, SD/SDIO, EMAC) simplify connectivity.
Recommended
Broadcast Video Processing
The 5CSXFC2C6U23C8N is appropriate for broadcast video format conversion and overlay processing because the SX-class FPGA fabric implements multi-format scalers, color-space converters, and HDR metadata insertion in parallel pipelines; the ARM Cortex-A9 HPS runs Linux + control software for channel branding and audio mixing. With 25K LE plus embedded DSP, the device handles 1080p60 SDI-to-HDMI bridging with on-screen display overlay. The UBGA-672 U23 package supports multi-channel SDI, HDMI, and audio I/O via FPGA soft IP.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC2C6U23C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC2C6U23C7N | 5CSXFC2C6U23C6N | 5CSXFC2C6U23A7N | 5CSEBA6U23C8N | 5CSEBA6U23C7N | 5CSEBA5U23C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGA (U23) 23x23 mm | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same |
| Family / Sub-family | Cyclone V SX | Cyclone V SX - same | Cyclone V SX - same | Cyclone V SX - same | Cyclone V SE - different | Cyclone V SE - different | Cyclone V SE - different |
| Logic Elements | 25,000 | 25,000 (same) | 25,000 (same) | 25,000 (same) | 110,000 (+340%) | 110,000 (+340%) | 85,000 (+240%) |
| Speed Grade | C8 | C7 (-1 bin) | C6 (-2 bins) | A7 (automotive) | C8 (same) | C7 (-1 bin) | C8 (same) |
| HPS / Architecture | Dual ARM Cortex-A9 + SX FPGA fabric | Dual ARM Cortex-A9 + SX fabric - same | Dual ARM Cortex-A9 + SX fabric - same | Dual ARM Cortex-A9 + SX fabric - same | Dual ARM Cortex-A9 + SE fabric - same HPS, lower-power FPGA class | Dual ARM Cortex-A9 + SE fabric - same HPS | Dual ARM Cortex-A9 + SE fabric - same HPS |
| HPS Clock (max) | 600 MHz | 600 MHz - same | 600 MHz - same | 600 MHz - same | 925 MHz (higher) | 925 MHz (higher) | 925 MHz (higher) |
| Process / Core Voltage | 28 nm / 1.1 V | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same |
| Approx. Unit Price (qty 1, as of 2026-09-06) | $145.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Cyclone V SX sub-family with variable-precision DSP blocks (vs 5CSEBA6U23C8N (Cyclone V SE))
- 25K LE for cost-effective moderate-density designs (vs 5CSEBA6U23C8N (110K LE))
- C8 commercial speed grade - fastest commercial timing (vs 5CSXFC2C6U23C7N (C7 speed grade))
Design Notes
The Cyclone V SX 5CSXFC2C6U23C8N requires multiple power rails: a 1.1 V core rail (VCCINT), a 1.1 V/1.2 V HPS rail (VCC_HPS), and a 2.5 V/3.3 V I/O rail (VCCIO). The HPS and FPGA core can each draw 1-3 A under load. Use a 4-6 phase buck regulator or a dedicated PMIC (such as the Intel Enpirion EM2130x family) to supply VCCINT, and bulk decoupling with 4-8 ceramic capacitors placed symmetrically around the package periphery. Ensure each VCC_HPS pin has its own 0.1uF + 1uF + 10uF cap stack within 3 mm of the ball.
Estimated: at 1.1 V core, with HPS active (~1.5 W) and FPGA fabric ~75% utilized (~2.5 W), the SoC can dissipate 4 W. The UBGA-672 package theta_JA is approximately 14 C/W on a standard 4-layer JEDEC board with thermal vias, so junction temperature rises ~56 C above ambient. For commercial-temperature (0C to 85C ambient max), this is acceptable in still air but pushes the limit. For industrial enclosures, add 4-6 thermal vias under the package center and consider bottom-side copper pours of at least 4 cm^2. Always derate by 20-30% from the datasheet thermal resistance for production boards.
BGA escape routing demands a 0.8 mm or 1.0 mm pitch fanout. Use microvia (HDI) stack-ups where the top layer routes two rows between balls, then dog-bone fanout from inner rows to via-in-pad on deeper layers. Match length-matched pairs for DDR3: the HPS-side DDR3 controller supports up to DDR3-1066 (533 MHz). Pin-swap is not permitted on HPS peripheral pins without re-validating the Quartus Prime pin assignments; use the Pin Planner to assign and validate all HPS pin locations before tape-out.
Common pitfalls include: (1) forgetting to power-cycle the HPS reset after HPS configuration load (use the warm/cold reset toggles in Quartus); (2) ignoring the C8 vs C7 speed grade in timing closure - C8 (this part) is the fastest commercial grade, so timing margins are tighter than C7 alternatives; (3) not enabling the HPS-to-FPGA bridges (AXI/ Avalon) before software tries to access FPGA peripherals from the ARM cores; (4) using the wrong configuration mode - the 5CSXFC2C6U23C8N supports AS (Active Serial) x4 and JTAG, but defaults vary by board design.
Compliance Information
RoHS compliant per Intel/Altera product page. The C8 commercial speed grade is not AEC-Q100 qualified; for automotive, use the A7 speed variant 5CSXFC2C6U23A7N. Lead-free and halogen-free per package material declarations.
