5M570ZF256I5N - MAX V CPLD 440 Logic Elements FBGA-256 | Intel
Teilenummer: 5M570ZF256I5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $16.1 | $16,10 |
| 10 | $14.5 | $145,00 |
| 100 | $12.95 | $1.295,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $10.26 | $10.260,00 |
5M570ZF256I5N Übersicht
A Complex Programmable Logic Device (CPLD) is a non-volatile, flash-based programmable logic IC that sits in the system hierarchy between simple glue-logic PAL/GAL devices and high-density FPGAs. CPLDs typically offer deterministic pin-to-pin propagation delays (tPD measured in nanoseconds, not picoseconds), predictable timing closure, and unlimited in-system reprogrammability. They are widely used for I/O expansion, bus bridging, power-up sequencing, and logic integration where deterministic latency and instant-on behavior matter more than raw logic density.
Key features of the 5M570ZF256I5N include 7.0 ns pin-to-pin propagation delay (tPD1), 118.3 MHz maximum internal performance, 8 Kbits of user flash memory, internal oscillator (3.33 MHz), JTAG/IEEE 1149.1 boundary-scan support, 4 mA I/O drive strength, and a commercial-to-industrial operating temperature range (–40 °C to +100 °C, I-suffix grade). The FBGA-256 package exposes up to 159 user I/Os with MultiVolt I/O supporting 1.2 V to 3.3 V interfacing, enabling direct connection to legacy 5 V-tolerant logic through proper external biasing.
The MAX V architecture uses a logic-array-block (LAB) structure with each LAB containing 10 LEs and an interconnect matrix. The 5M570Z variant is the largest density point in the family, providing the headroom needed for multi-bus bridge, LED-display multiplexing, and control-logic consolidation designs. Compared to FPGAs, the MAX V CPLD consumes far less standby power, fits smaller packages for its I/O count, and provides deterministic 7 ns delays regardless of routing complexity.
Typical applications include I/O expansion and level translation between 1.8 V processors and 3.3 V peripherals, power-up/down sequencing for multi-rail systems, bus bridging between legacy microcontrollers and modern SoCs, LED display multiplexing drivers, industrial control logic replacement for discrete 74-series logic, and glue-logic integration in routers, switches, and consumer devices.
When designing with this part, ensure the FBGA-256 land pattern follows IPC-7351 microvia-compatible guidelines and use Intel Quartus Prime (free Lite Edition) for synthesis, fitting, and JTAG programming. The 5M570Z's non-volatile configuration means the device functions immediately at power-up without an external boot loader, an important advantage for safety-critical boot sequencing.
This page synthesizes distributor pricing as of 2026-09-06, drop-in alternative MPNs across both same-brand and cross-brand options, and practical PCB layout and Quartus Prime toolchain notes not collocated on any single manufacturer or distributor page.
Drop-in-Alternativen für 5M570ZF256I5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5M570ZF256I5N (gleiche Bauform und Footprint) – abweichend in Configuration Memory, Package, Mounting Type, Programming Interface, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5M570ZF256C5N
✅ Drop-In✓ Auf Lager
$13.2 / Stück
Datenblatt ansehen →5M570ZF256C4N
✅ Drop-In✓ Auf Lager
$6.42 / Stück
Datenblatt ansehen →5M570ZF256A5N
✅ Drop-In✓ Auf Lager
$17.4 / Stück
Datenblatt ansehen →5M570ZF256I5N Grenzwerte & elektrische Eigenschaften
| Family | MAX V |
| Device Type | CPLD - Complex Programmable Logic Device |
| Logic Elements (LEs) | 440 |
| Macro Cells | 440 |
| Maximum User I/Os | 159 |
| User Flash Memory | 8 Kbits (8192 bits) |
| Pin-to-Pin Propagation Delay (tPD1) | 7.0 ns |
| Maximum Internal Frequency | 118.3 MHz |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) |
| MultiVolt I/O Voltage (VCCIO) | 1.2 V to 3.3 V |
| Operating Temperature Range (I grade) | -40 °C to +100 °C (industrial) |
| I/O Drive Strength | 4 mA |
| Internal Oscillator | 3.33 MHz |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Gehäuse | 256-ball FBGA (FineLine BGA), 17 mm × 17 mm |
| Montageart | Surface Mount (SMT) |
| Configuration Memory | Non-volatile flash (instant-on) |
| RoHS-Status | Compliant |
5M570ZF256I5N 256-ball fbga (fineline bga), 17 mm × 17 mm Pinbelegungsleitfaden
Pinbelegung für 5M570ZF256I5N (256-ball fbga (fineline bga), 17 mm × 17 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5M570ZF256I5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5M570ZF256I5N ist geeignet für 6 Anwendungs: I/O Expansion and Level Translation, Power-Up / Power-Down Sequencing, Bus Bridging and Protocol Conversion, LED Display Multiplexing and Signage, Industrial Control Logic Replacement (74-Series Glue), Networking Equipment Glue Logic.
I/O Expansion and Level Translation
The 5M570ZF256I5N is well suited to I/O expansion and voltage-level translation between modern 1.8 V application processors and legacy 3.3 V peripherals. Its MultiVolt I/O banks natively support 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V rails on a per-bank basis, eliminating external level-shifters in mixed-voltage designs. The 159 user I/Os in FBGA-256 provide ample headroom to expose GPIOs, SPI, I2C, UART, and PWM channels that the host SoC lacks. Deterministic 7.0 ns tPD1 timing means handshake and interrupt latencies are predictable, which is critical for real-time control loops and industrial HMI panels. Pair it with a low-cost microcontroller (e.g., STM32G0 or PIC16) on the 3.3 V side for a robust, BOM-light bridge.
Empfohlen
Power-Up / Power-Down Sequencing
Multi-rail systems (FPGA + DDR + SerDes + analog) require strict power-rail sequencing to avoid latch-up and in-rush damage. The 5M570ZF256I5N's non-volatile flash configuration means the device is fully active the moment VCCINT crosses 1.71 V, with no external boot PROM or FPGA bitstream load delay. Its 8 Kbits of user flash and 440 macro cells are sufficient to host PG (power-good) arbiter logic, watchdog timers, and MOSFET gate-driver pulse generation. The industrial –40 °C to +100 °C temperature range supports telecom, server, and industrial chassis deployments. Compared to a sequencer ASIC, the CPLD offers field-upgradable sequencing firmware via JTAG and provides 159 I/Os to control dozens of rails in high-end systems.
Empfohlen
Bus Bridging and Protocol Conversion
The 5M570ZF256I5N bridges incompatible bus protocols between legacy microcontrollers and modern SoCs — for example, parallel 8/16-bit SRAM to AXI, I2C to SPI, or UART to I2S. The 118.3 MHz maximum internal frequency is more than adequate to clock-shift up to 80 Mbps serial streams while leaving headroom for state-machine logic. The 256-ball FBGA package exposes the I/O density needed to terminate wide buses (e.g., 16-bit SRAM plus control plus interrupts) without external mux/demux chips. Non-volatile configuration ensures the bridge is functional at power-on, eliminating any boot-time communication dead zones. This makes it popular in industrial PLCs, telecom line cards, and aftermarket automotive infotainment adapters.
Empfohlen
LED Display Multiplexing and Signage
Large LED matrix displays (stadium scoreboards, transit signage, retail video walls) require precise row/column multiplexing with no visible flicker. The 5M570ZF256I5N's deterministic 7 ns pin-to-pin delay and 118.3 MHz internal frequency easily drive 32+ row scans at 1 kHz refresh rates without row-to-row timing skew. Its 159 user I/Os are sufficient to drive column drivers directly through 4 mA current-limited outputs or to feed external MOSFET drivers for high-current panels. The non-volatile configuration removes any startup flicker that would otherwise reveal the boot process. The industrial temperature range supports outdoor and semi-outdoor deployments, while FBGA-256 keeps the PCB compact behind tight LED driver pitch.
Empfohlen
Industrial Control Logic Replacement (74-Series Glue)
The 5M570ZF256I5N replaces dozens of 74HC/74AHC glue-logic ICs (latches, muxes, decoders, AND/OR gates) on legacy industrial PCBs, reducing BOM count and improving reliability. With 440 LEs and 8 Kbits user flash, one CPLD can implement a full board's worth of decode, latch, and interrupt-aggregation logic in a single 17 × 17 mm FBGA-256 package. Industrial –40 °C to +100 °C operation and MultiVolt I/O make it ideal for 24 V factory-automation backplanes that mix 3.3 V controllers with 5 V peripheral logic. The JTAG interface (IEEE 1149.1) simplifies boundary-scan testing for manufacturing. Existing 74-series designs can be ported with Quartus Prime synthesis at zero NRE cost.
Empfohlen
Networking Equipment Glue Logic
Routers, switches, and small-cell base stations use the 5M570ZF256I5N for PHY-to-MAC interface glue, MDIO/SMI bus arbitration, fan-speed control, and front-panel LED management. The 159 user I/Os support multi-port Gigabit Ethernet designs where each PHY requires MDC/MDIO plus interrupt plus reset/clock-enable signals. CPLDs in this role outperform microcontrollers because their deterministic timing guarantees PHY reset and strap-pin sequencing without RTOS jitter. The 7 ns tPD1 timing accommodates 25 MHz MDC clocks with comfortable margin. Industrial temperature and long-life Intel supply commitment make it attractive for carrier-grade equipment with 10+ year field-deployment horizons.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5M570ZF256I5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5M570ZF256C5N | 5M570ZF256C4N | 5M570ZF256A5N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-256 | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Logic Elements | 440 | 440 | 440 | 440 |
| Maximum User I/Os | 159 | 159 | 159 | 159 |
| tPD1 (Pin-to-Pin Delay) | 7.0 ns | 7.0 ns | ~7.5 ns | 7.0 ns |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | Automotive / extended grade |
| Core Supply (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Wichtigste Unterscheidungsmerkmale
- Highest-density MAX V CPLD with 159 user I/Os in a single FBGA-256 package (vs. 5M2210ZF256I5N)
- Industrial temperature grade with no price premium vs commercial (vs. 5M570ZF256C5N)
- Non-volatile flash configuration enables true instant-on at power-up (vs. SRAM-based FPGAs (e.g. Cyclone IV E))
Designhinweise
The FBGA-256 package on the 5M570ZF256I5N is a 1.0 mm-pitch FineLine BGA, 17 × 17 mm. Use IPC-7351 microvia-compatible land patterns with NSMD (non-solder-mask-defined) pads to maximize pad-to-pad spacing and improve assembly yield. Place at least four via-in-pad thermal vias under the BGA thermal balls to a continuous inner ground plane; this lowers junction-to-ambient thermal resistance and reduces the BGA reball risk during lead-free reflow. Estimated: a fully-populated 4-layer FR-4 board with 9 thermal vias under the thermal balls typically achieves θJA in the 20–25 °C/W range (manufacturer datasheet figure used as reference).
Do not confuse MAX V 'I-suffix' industrial-grade devices with 'A-suffix' automotive-grade devices: the 5M570ZF256I5N is rated to –40 °C to +100 °C, while the 5M570ZF256A5N covers the extended automotive temperature profile. Using the wrong grade in an automotive under-hood or outdoor enclosure design will result in timing drift and potential logic errors below 0 °C. Also note that 5M570ZF256C5N is commercial grade only (0 °C to +85 °C) and is NOT a drop-in for industrial-temperature designs even though it shares the same FBGA-256 footprint.
JTAG signals (TCK, TMS, TDI, TDO, TRST) must be routed as a bus with matched lengths within ~50 mils to preserve signal integrity at typical 10–33 MHz TCK rates. Add 10 kΩ pull-ups on TCK, TMS, TDI and a 10 kΩ pull-down on TRST for stable boundary-scan operation. Decouple every VCCINT/VCCIO pin pair with a 0.1 µF X7R ceramic capacitor placed within 2 mm of the ball, plus a single bulk 10 µF tantalum or polymer capacitor per voltage rail. For MultiVolt bank mixing, keep noisy switching I/O on separate VCCIO banks from sensitive clock or analog-adjacent signals.
Compliance-Informationen
RoHS and REACH compliance per Intel MAX V family product page. Industrial temperature grade (I-suffix) supports –40 °C to +100 °C. AEC-Q100 qualification not applicable for this industrial-grade CPLD; for automotive AEC-Q100 designs use 5M570ZF256A5N.
