A3PE3000-2FGG484 ProASIC3E FPGA 3M Gates FBGA | Microchip
Teilenummer: A3PE3000-2FGG484 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.35 | $42,35 |
| 10 | $38.7 | $387,00 |
| 100 | $34.2 | $3.420,00 |
| 500 | $30.85 | $15.425,00 |
| 1.000 | $28.9 | $28.900,00 |
A3PE3000-2FGG484 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric can be reconfigured after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses flash-based configuration cells, so the device is live at power-up and does not require an external boot memory. This makes it a member of the flash FPGA category, often considered when designers need instant-on, secure configuration, and lower system cost.
Key features include 516,096 total RAM bits, 341 user I/O, a -2 speed grade, 130nm technology, and flash-based single-chip operation. The device supports multiple I/O standards and includes programmable phase-locked loops (PLLs) and embedded memories. The FGG suffix indicates a green, lead-free 484-ball FBGA package, meeting RoHS requirements for modern manufacturing.
Architecturally, the A3PE3000-2FGG484 is built on Microchip's ProASIC3E flash FPGA fabric. Configuration data is stored in flash cells, providing inherent design security and instant-on capability. The device features 75,264 logic elements arranged as VersaTiles, and 516,096 bits of RAM. With a 1.5V core voltage and low static power, it fits power-sensitive applications where SRAM FPGAs would require configuration overhead.
Typical applications include communications infrastructure, industrial automation, medical imaging, aerospace and defense systems, and broadcast video equipment. In these systems, the FPGA implements protocol bridging, DSP pre-processing, and system control functions. The 3M gate density and 341 I/Os allow designers to replace multiple discrete logic devices with a single programmable part.
A key design consideration is power supply decoupling: place a 10uF bulk capacitor and multiple 0.1uF ceramics close to VCORE and VPLL pins. Because the FGG package uses a 1.0mm ball pitch, careful PCB breakout with micro-vias is recommended. Use thermal vias on the ground balls to improve heat transfer.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not all present in the manufacturer datasheet, giving engineers a faster path from selection to layout.
Drop-in-Alternativen für A3PE3000-2FGG484 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000-2FGG484 (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status, Family, Operating Temperature, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000-2FGG484I
✅ Drop-In✓ Auf Lager
$89.4 / Stück
Datenblatt ansehen →A3PE3000-1FGG484
✅ Drop-In✓ Auf Lager
$1425.71 / Stück
Datenblatt ansehen →A3PE3000-1FGG484I
✅ Drop-In✓ Auf Lager
$1336.6 / Stück
Datenblatt ansehen →A3PE3000-2FG484I
✅ Drop-In✓ Auf Lager
$59.6 / Stück
Datenblatt ansehen →A3PE3000L-FGG484
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG484I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000-2FGG484 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E (A3PE3000) |
| System Gates | 3,000,000 |
| Logic Elements | 75,264 |
| Total RAM Bits | 516,096 |
| User I/O | 341 |
| Speed Grade | -2 |
| Maximum Frequency | 310 MHz |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm |
| Gehäuse | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (lead-free, green package) |
| Package Finish | FGG (lead-free / green) |
A3PE3000-2FGG484 fgg (lead-free / green) Pinbelegungsleitfaden
Pinbelegung für A3PE3000-2FGG484 (fgg (lead-free / green)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000-2FGG484.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000-2FGG484 ist geeignet für 6 Anwendungs: Industrial Automation, Communications Infrastructure, Medical Imaging, Aerospace & Defense, Broadcast Video Equipment, Consumer & Portable Systems.
Industrial Automation
The A3PE3000-2FGG484 is well suited for industrial automation systems such as PLCs, robotics controllers, and motor-control gate arrays. Its flash-based architecture provides instant-on operation, which is valuable in safety systems and power-controlled equipment. The 3 million system gates and 341 user I/Os allow integration of motor encoder decoders, communication interfaces like EtherCAT and PROFINET, and custom PWM logic in one device. The 1.5V core reduces power dissipation in sealed industrial enclosures, and the 310MHz performance supports fast closed-loop control. The green FGG package aligns with lead-free RoHS requirements common in industrial products. For harsh environments with wide temperature swings, the industrial-temperature A3PE3000-2FGG484I should be considered, but the commercial variant is appropriate for standard factory floor temperatures. Board layouts benefit from the 1.0mm ball pitch, enabling standard FR-4 manufacturing processes.
Empfohlen
Communications Infrastructure
In communications infrastructure, the A3PE3000-2FGG484 can implement protocol bridging, packet processing, and interface aggregation. Its 341 user I/Os support multiple LVCMOS and differential I/O standards, making it useful for connecting Ethernet PHYs, SerDes devices, and backplane transceivers. The 516,096 total RAM bits provide fifo buffers for packet queueing, and the 310MHz performance handles line-rate tasks at moderate throughputs. Being flash-based, the FPGA configures itself immediately after power-on, eliminating configuration-loading delays that could affect synchronization in network equipment. Power efficiency is critical in remote radio head and edge computing applications; the 1.5V core and low static current help meet tight power budgets. The FGG lead-free package simplifies compliance with telecom environmental directives. Designers should verify I/O banking requirements and use Libero to assign pins to avoid bank conflicts.
Empfohlen
Medical Imaging
Medical imaging systems, including ultrasound, digital X-ray, and MRI control electronics, require FPGAs that can process image data with low latency and high reliability. The A3PE3000-2FGG484 provides enough logic to perform real-time image filtering, gain correction, and scan conversion. Its 516,096 bits of RAM support line buffers and frame stores. The 341 user I/O can interface with CMOS image sensors, ADCs, and display controllers. The flash-based configuration enables repeatable startup without external memory, reducing counterfeit risk in regulated medical equipment. Its 1.5V core helps meet the strict heat and noise requirements of imaging devices that are in close proximity to patients. The 23x23mm FBGA package is compact enough for embedded imaging boards. For medical systems requiring -40C operation or extended environmental testing, the A3PE3000-2FGG484I should be used. This FPGA is not a safety-rated device, so additional system-level measures are required.
Empfohlen
Aerospace & Defense
The A3PE3000-2FGG484 is used in aerospace and defense systems for secure mission processing, telemetry, and hardware-in-the-loop simulation. Its flash-based architecture gives inherent anti-tamper properties and configuration is stored on-chip, avoiding the risk of bitstream interception during external memory boot. The 3M gate density supports cryptographic algorithm acceleration, sensor fusion, and custom high-speed serial interfaces. The 310MHz performance and 341 I/O enable connections to RTCs, ADCs, and communication transceivers. The commercial temperature variant is not intended for extreme military environments, so the I-suffix industrial variant is preferred for deployed equipment. The 130nm process provides reasonably low power for compact avionics modules. PCB design must account for the FBGA ball pattern with appropriate thermal vias to meet the module's thermal requirements. Designers should follow Microchip's radiation-test data before using this part in spaceborne applications.
Empfohlen
Broadcast Video Equipment
Broadcast video infrastructure uses FPGAs to handle serial digital video interfaces, frame synchronization, and custom video processing algorithms. The A3PE3000-2FGG484 has enough logic to implement SDI framing, color space conversion, and overlays. Its 341 user I/Os can connect to multi-rate serializers, deserializers, and ancilliary data chips. The 516,096 RAM bits allow line delays and dual-port frame buffer windows. Because ProASIC3E is flash-based, video equipment starts up instantly, which is critical when switching between hot backup units. The 1.5V core keeps power consumption low enough for rack-mounted units. The 23x23mm FBGA fits on standard video processing cards. Designers should use controlled impedance traces for high-speed video signals and follow Microchip's pin assignment guidelines. The commercial temperature range covers most studio environments, while the industrial I variant is available for outside-broadcast vehicles and climate-controlled rigs.
Empfohlen
Consumer & Portable Systems
The A3PE3000-2FGG484 can serve as a flexible companion chip in consumer electronics such as display controllers, smart home hubs, and portable instrument modules. Its 3M gate density and low static power allow integration of image scaling, sensor data fusion, and encryption in one device. The 1.5V core reduces battery drain compared to older 1.8V or 2.5V devices, and the flash configuration eliminates the cost of a separate configuration flash. Its 341 I/O connect to application processors, displays, and memory. The package size is moderate for portable devices, though PCB space is more limited than in BGA packages with smaller pitch. The commercial temperature range covers typical consumer operating conditions. The green, lead-free FGG package is required for many consumer markets. When optimizing battery life, designers should review the power utilization report and leverage clock gating. The PLLs can generate multiple clocks from a single reference, reducing board oscillator count.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000-2FGG484 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000-2FGG484I | A3PE3000-1FGG484 | A3PE3000L-FGG484 |
|---|---|---|---|---|
| Package | FBGA-484 (23x23 mm, 1.0 mm pitch) | FBGA-484 (23x23 mm, 1.0 mm pitch) | FBGA-484 (23x23 mm, 1.0 mm pitch) | FBGA-484 (23x23 mm, 1.0 mm pitch) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade | -2 | -2 | -1 | L (low-power) |
| Temperature Grade | Commercial | Industrial | Commercial | Commercial |
Wichtigste Unterscheidungsmerkmale
- Speed grade -2 delivers 310 MHz system performance (vs. A3PE3000-1FGG484)
- Green lead-free FGG package with commercial temperature range (vs. A3PE3000-2FGG484I)
- Flash-based instant-on and no external configuration memory (vs. SRAM-based FPGAs (e.g., Xilinx Artix-7, Intel Cyclone V))
Designhinweise
Provide a clean 1.5V core supply with adequate decoupling. Place at least one 10uF bulk capacitor and multiple 0.1uF ceramic capacitors close to the VCORE and VPLL ball groups. For the 484-ball FBGA, use a dedicated power plane layer to keep impedance below 0.1 ohm up to 10 MHz. Estimated: dynamic current scales with toggling rate and clock frequency; use Microchip Libero SmartPower to estimate actual current before selecting the external DC-DC converter.
The FBGA-484 thermal performance depends on PCB copper area, airflow, and the number of thermal vias. Estimated: at 1.5W power dissipation, a 4-layer board with 1 oz copper can result in a junction-to-ambient rise of 30-50C. Place a 3x3 array of 0.3mm thermal vias under the die shadow connected to the ground plane. For high-utilization designs above 2W, add airflow or a dedicated thermal pad. Verify with the theta-JA value in the manufacturer datasheet.
Break out the 1.0mm pitch balls using micro-vias or blind vias to maximize routing channels. Keep high-speed I/O routes length-matched and use controlled-impedance design where required. Place bypass capacitors on the opposite side of the board directly under the VCC balls. Since this is a flash FPGA, it programs over JTAG; no external configuration flash is needed. Use the standard 4-wire JTAG interface with pull-ups and ground as recommended by Microchip.
Compliance-Informationen
The FGG suffix indicates a green, lead-free package, RoHS compliant per Microchip. Detailed REACH, halogen-free, and conflict minerals declarations were not present in the verified web data.
