EP1S25F780C5 - Stratix I FPGA, 25,660 LEs, 597 I/O, 780-FBGA | Altera / Intel
Teilenummer: EP1S25F780C5 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1549.9 | $1.549,90 |
| 10 | $1472.5 | $14.725,00 |
| 25 | $1399.2 | $34.980,00 |
| 100 | $1299 | $129.900,00 |
| 250 | $1249.5 | $312.375,00 |
EP1S25F780C5 Übersicht
An FPGA (Field-Programmable Gate Array) is a programmable logic device in the semiconductor hierarchy: FPGA -> programmable logic -> ASIC-class device -> integrated circuit. FPGAs are used to implement custom digital logic, glue logic, signal processing pipelines, and high-speed interfaces after the PCB has been fabricated, enabling late-stage design changes and accelerating time to market versus a full ASIC. Stratix I FPGAs were Altera's first generation to combine embedded multipliers, large TriMatrix memory blocks, and high-speed LVDS transceivers on a single die.
Key differentiating features include 80 (typical) embedded DSP blocks for 9x9-bit to 36x36-bit multiplication, 14 clock networks with up to 8 PLLs per device, support for external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and 1.5 V core operation. The 780-FBGA package exposes 597 user I/O across 8 banks, providing abundant LVDS pairs and routing flexibility for memory-rich and I/O-intensive designs.
The architecture is well suited to telecom line cards, digital video broadcasting equipment, and high-speed serial interfaces where a large logic budget plus embedded multipliers reduce external component count. The 'C5' speed grade trades absolute Fmax for lower static power, making the C5 variant a typical choice for industrial-grade designs that prioritize thermal margin over raw clock rate.
Typical applications include telecom baseband processing, software-defined radio (SDR), high-end image processing, and ASIC prototyping platforms. Designers should pay particular attention to power estimation with the Quartus II PowerPlay tool because the static current scales strongly with VCCINT and junction temperature.
Drop-in-Alternativen für EP1S25F780C5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1S25F780C5 (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, DSP Blocks, Mounting Type, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1S25F780C6N
✅ Drop-In✓ Auf Lager
$780 / Stück
Datenblatt ansehen →EP1S25F780C7
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1S25F780I7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1S25F780I6N
✅ Drop-In✓ Auf Lager
$1250 / Stück
Datenblatt ansehen →EP1S25F780C5N
✅ Drop-In✓ Auf Lager
$595 / Stück
Datenblatt ansehen →EP1S25F780C7N
✅ Drop-In✓ Auf Lager
$588.2 / Stück
Datenblatt ansehen →EP1S25F780C5 Grenzwerte & elektrische Eigenschaften
| Family | Stratix I |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Total RAM Bits | 1,944,576 |
| Embedded Multipliers (DSP blocks) | 80 (typical) |
| User I/O Count | 597 |
| Gehäuse | 780-FBGA (29x29 mm) |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V |
| Speed Grade | C5 |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial) |
| Process Technology | 0.13 µm CMOS, SRAM-based |
| LVDS Performance | Up to 7.6 Gbps (claim per family datasheet) |
| PLLs | Up to 8 per device |
| Global Clock Networks | 14 |
| Montageart | Surface Mount (SMT, BGA) |
| RoHS-Status | Compliant per Altera product page |
EP1S25F780C5 780-fbga (29x29 mm) Pinbelegungsleitfaden
Pinbelegung für EP1S25F780C5 (780-fbga (29x29 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1S25F780C5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1S25F780C5 ist geeignet für 6 Anwendungs: Telecom Line-Card Interface, Software-Defined Radio (SDR) Baseband, High-End Video Broadcast Processing, ASIC Prototyping Platform, Industrial High-Speed Motion Control, Medical Imaging Pre-Processor.
Telecom Line-Card Interface
The EP1S25F780C5's 25,660 Logic Elements plus 80 embedded DSP blocks and 597 user I/O make it well suited for telecom line-card interfaces where multi-protocol bridging and packet processing must coexist on one board. Its TriMatrix embedded memory provides 1,944,576 bits for buffer descriptors, lookup tables, and traffic-shaping queues; the dedicated DDR/DDR2/QDR memory interface controllers centre DQS on byte lanes without external delay lines. With the C5 speed grade, designers trade absolute Fmax for lower static power in thermally constrained PoL bays. The 780-FBGA package's 29 × 29 mm footprint exposes enough LVDS pairs for SGMII, SPI-4.2, and POS-PHY Level 4 interconnects while keeping board layer count manageable. Compared to a discrete ASIC + companion FPGA design, the EP1S25F780C5 collapses glue logic, framer, and SERDES bridge into one silicon, simplifying the BOM.
Empfohlen
Software-Defined Radio (SDR) Baseband
For SDR baseband designs, the EP1S25F780C5's 80 dedicated 9 × 9-bit to 36 × 36-bit multipliers enable FFT, FIR, and channelisation pipelines that would otherwise need a separate DSP chip. The TriMatrix memory's true-dual-port blocks support simultaneous ADC sample buffering and DAC waveform generation at rates above 100 MSPS, while the 14 global clock networks and up to 8 PLLs allow multiple ADC/DAC clock domains with sub-ps jitter. The 597 I/O accommodate LVDS ADC data buses, control planes, and high-speed serial links without external muxing. Designers commonly use the C5 grade to balance thermal budget against Fmax, since SDR enclosures are usually sealed without forced-air cooling. The 1.5 V VCCINT core further lowers power relative to earlier 2.5 V FPGAs, helping meet MIL-STD-704 or ETSI EN 300 019 thermal envelopes.
Empfohlen
High-End Video Broadcast Processing
Broadcast video processing benefits from the EP1S25F780C5's 7.6 Gbps LVDS capability and 597 user I/O, which support HD-SDI, 3G-SDI, and dual-link SDI inputs in parallel with DVB-ASI or SMPTE 310 streams. Its 80 embedded multipliers handle chroma upsampling, scaling, and deinterlacing without external DSP chips; the 1,944,576-bit embedded RAM provides multiple line buffers for high-quality motion-adaptive deinterlacing. Designers use the C5 speed grade to keep static power in check for studio rack equipment that runs 24/7. The 780-FBGA's dense BGA fan-out also simplifies multilayer PCB stack-up for high-speed serial video. Compared to a multi-chip ASIC + FPGA approach, the EP1S25F780C5 reduces board area while supporting late-binding changes via SRAM-based configuration.
Empfohlen
ASIC Prototyping Platform
The EP1S25F780C5 is commonly used as a vehicle for ASIC prototyping because 25,660 LEs provide enough headroom to instantiate a multi-million-gate ASIC's RTL at lower clock rates while preserving functional accuracy. The Stratix I TriMatrix memory blocks, 597 I/O, and dedicated external memory interfaces allow prototype mapping of complex SoC subsystems, including ARM-style AHB/AXI bridges and DDR controllers. Quartus II's incremental compilation supports multi-engineer teams to bring up RTL blocks in parallel on the same device, shortening tape-out schedules. The C5 speed grade's slower Fmax is often sufficient for functional verification where the goal is feature bring-up rather than at-speed validation. The 780-FBGA package also routes cleanly into Logic Analyzer pods and breakout adapters, which is essential during multi-clock-domain debug sessions.
Empfohlen
Industrial High-Speed Motion Control
Industrial motion controllers benefit from the EP1S25F780C5's combination of 80 DSP blocks (for PID, state-space, and Kalman filters), 597 I/O (for encoder, resolver, and resolver-to-digital feedback channels), and 1.5 V low-power operation that suits 24 V industrial bus systems. The 14 global clock networks synchronise multiple axis loops without jitter skew, and the C5 commercial speed grade handles typical 50–200 kHz PWM switching frequencies with margin to spare. The 780-FBGA's package-level thermal performance supports fan-less operation when paired with adequate PCB copper pours. Designers can also integrate safety logic such as STO (Safe Torque Off) directly in the FPGA, eliminating external safety relays. According to the Stratix device handbook, the FPGA's configuration is reloadable on the factory floor for field upgrades, which is critical for serviceability in industrial automation.
Empfohlen
Medical Imaging Pre-Processor
Medical imaging pre-processing pipelines such as CT, ultrasound, and digital X-ray benefit from the EP1S25F780C5's parallel DSP capacity (80 multipliers) for beamforming, image reconstruction, and noise filtering. The TriMatrix memory's true-dual-port blocks enable simultaneous ADC sample ingestion and processed-frame transmission to a host CPU, while the DDR/DDR2 controllers handle large image frame buffers. With 597 I/O, the FPGA can connect to multiple analog front ends plus Camera Link or LVDS display outputs without glue logic. The C5 speed grade's lower static power also helps meet IEC 60601-1 thermal limits for medical cart equipment. Designers typically implement DICOM metadata insertion and on-screen overlay directly in the FPGA, offloading the host processor. The 780-FBGA package's 29 × 29 mm footprint simplifies routing of high-speed differential pairs on medical-grade PCBs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1S25F780C5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1S25F780C6N | EP1S25F780C7 | EP1S25F780I7N | EP1S25F780I6N | EP1S25F780C5N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C5 | C6 | C7 | I7 | I6 | C5 |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Count | 597 | 597 | 597 | 597 | 597 | 597 |
| Embedded RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Embedded Multipliers (DSP) | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C (Industrial) | -40°C to +100°C (Industrial) | 0°C to +85°C |
Wichtigste Unterscheidungsmerkmale
- Highest mid-density Stratix I with 597 user I/O (vs. EP1S20F780C5N)
- C5 grade balances Fmax against thermal margin (vs. EP1S25F780C7N)
- TriMatrix memory architecture with 1,944,576 bits (vs. EP1S10F780C5N)
Designhinweise
Estimated: Stratix I devices draw 1–3 W of static current at 1.5 V VCCINT scaled with junction temperature and design utilisation. Designers must size the 1.5 V regulator to handle Icc_int peaks above 3 A during simultaneous block-RAM write bursts. Use Altera's PowerPlay Early Power Estimator before layout to balance decoupling against inductor saturation current, and add 220 µF bulk caps near each VCCINT pin group to suppress inrush during power-up.
The 780-FBGA's 1.0 mm ball pitch demands a minimum 8-layer PCB stack-up with 50 Ω controlled-impedance routing for LVDS pairs. According to Altera's Stratix I hardware design guidelines, all eight I/O banks require dedicated VCCIO rails that can be driven from independent supplies (1.5 V, 1.8 V, 2.5 V, 3.3 V). Decoupling: place 0.1 µF and 0.01 µF X7R ceramics within 100 mils of every VCCINT/VCCIO pin pair to suppress simultaneous switching noise.
Configuration will fail silently if the EPCS configuration memory is mis-sized for the bitstream; the EP1S25F780C5 typically needs an EPCS16 or larger. Always strap MSEL pins correctly for the chosen configuration mode (AS, PS, FPP, JTAG) before power-up; mixing modes causes the device to remain in reset. Also, the C5 speed grade trades Fmax for thermal margin—do not close timing at C7 margins and assume C5 will work without re-running the Quartus II timing analysis.
Compliance-Informationen
RoHS compliance per Altera product page; 'N' suffix denotes Pb-free / RoHS ball finish. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC at the part level).
