EP1S25F780C6N - Stratix 25K LE FPGA, 597 I/O, 780-BGA | Altera
MPN: EP1S25F780C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1053.51 | $1,053.51 |
| 10 | $980 | $9,800.00 |
| 50 | $905 | $45,250.00 |
| 100 | $850 | $85,000.00 |
| 500 | $780 | $390,000.00 |
Drop-in alternatives for EP1S25F780C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F780C5N
✅ Drop-In✓ In Stock
$595 / Unit
View Datasheet →EP1S25F780C6
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View Datasheet →EP1S25F780I6N
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$1250 / Unit
View Datasheet →EP1S20F780C6N
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$188.75 / Unit
View Datasheet →EP1S10F780C6N
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP1S25F780C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 597 |
| Number of LABs | 2,566 |
| DSP Blocks | 80 |
| PLLs | 12 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V |
| Package | 780-BGA (FC-FBGA, FineLine) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (Commercial) |
| Configuration Method | JTAG, Passive Serial, Passive Parallel |
| RoHS Status | Compliant |
| Speed Grade | C6 |
EP1S25F780C6N 780-bga (fc-fbga, fineline) Pin Configuration Guide
Complete pinout information for EP1S25F780C6N (780-bga (fc-fbga, fineline) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F780C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F780C6N is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed Telecommunications Infrastructure, Video Broadcast and Image Processing, Industrial Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Medical Imaging Accelerator.
ASIC Prototyping and Emulation
The EP1S25F780C6N's 25,660 logic elements and 1,944,576 bits of TriMatrix memory make it a proven platform for ASIC emulation and rapid prototyping of multi-million-gate designs. Its 80 DSP blocks and 12 PLLs allow prototyping of complex DSP subsystems alongside custom logic, while the 597 user I/O pins map cleanly to high-pin-count ASICs. Compared to ASIC fabrication cycles of 6-12 months, a single Stratix FPGA can validate RTL in days, dramatically reducing time-to-silicon. Use Quartus II with the Design Partitioning flow to map large ASIC partitions across multiple FPGAs.
Recommended
High-Speed Telecommunications Infrastructure
Telecom line cards and switching fabrics benefit from the EP1S25F780C6N's high logic density, 597 I/O count, and support for multiple high-speed I/O standards including LVDS and HSTL. The 12 on-chip PLLs provide the multi-frequency clock synthesis required for SONET/SDH, Ethernet MACs, and ATM fabric interfacing. Per the Stratix datasheet, the embedded memory supports per-port buffering at wire rates, while 80 DSP blocks accelerate forward error correction and channel equalization. This combination is well-matched to mid-2000s telecom equipment still in field service.
Recommended
Video Broadcast and Image Processing
Broadcast video processing cards leverage the EP1S25F780C6N's parallel processing capability, with 80 DSP blocks delivering the throughput needed for real-time HD-SDI processing, color space conversion, and motion-adaptive deinterlacing. The 1,944,576 bits of embedded memory provide line-buffer and frame-buffer storage without external SRAM in many designs, while 597 I/O pins support multi-channel SDI/HDMI input and output expansion. Quartus II MegaWizard IP cores for SDI, AES, and MPEG provide a fast development starting point for broadcast OEMs maintaining legacy equipment.
Recommended
Industrial Test and Measurement Instrumentation
ATE (Automatic Test Equipment) and high-end oscilloscopes employ the EP1S25F780C6N for waveform synthesis, pattern generation, and real-time DSP-based signal analysis. The 12 PLLs and 597 I/O pins enable precise timing alignment across multiple measurement channels, while 80 DSP blocks accelerate FFT, FIR filtering, and modulation analysis required for vector signal analysis. Per the Stratix datasheet, the device's deterministic routing architecture supports fine-grained timing closure for sub-nanosecond jitter requirements in T&M applications.
Recommended
Military and Aerospace Signal Processing
Legacy defense programs continue to use the EP1S25F780C6N for radar signal processing, electronic warfare subsystems, and secure communications. The 25,660 logic elements, 597 user I/O, and 80 DSP blocks support multi-channel digital beamforming, pulse compression, and cryptographic acceleration. While the C6 speed grade is commercial-temperature, the EP1S25F780I6N industrial variant is often used in aerospace enclosures with controlled thermal environments. Per Altera's military/aerospace legacy documentation, Stratix devices meet the long-lifecycle support requirements typical of defense programs.
Recommended
Medical Imaging Accelerator
Medical imaging systems such as ultrasound scanners, CT reconstruction boards, and MRI pre-processors use the EP1S25F780C6N for parallel DSP-based beamforming and image reconstruction. The 80 DSP blocks deliver the multiply-accumulate throughput needed for real-time tomographic reconstruction, while 1,944,576 bits of TriMatrix memory provide on-chip buffering of intermediate results to reduce external memory bandwidth pressure. The 597 I/O count supports multi-channel analog front-end interfacing typical of premium ultrasound carts, and the C6 speed grade meets timing closure for high-frame-rate imaging.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F780C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F780C5N | EP1S25F780C6 | EP1S25F780I6N | EP1S20F780C6N | EP1S10F780C6N |
|---|---|---|---|---|---|---|
| Package | 780-BGA (FC-FBGA) | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same | 780-BGA (FC-FBGA) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 18,460 | 10,570 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,669,248 | 920,448 |
| User I/O Count | 597 | 597 | 597 | 597 | 586 | 426 |
| Speed Grade | C6 | C5 (slower) | C6 | I6 (industrial temp) | C6 | C6 |
| DSP Blocks | 80 | 80 | 80 | 80 | 64 | 40 |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- 25,660 logic elements - the highest in the Stratix 780-BGA family tier (vs EP1S20F780C6N)
- 80 DSP blocks for parallel multiply-accumulate throughput (vs EP1S10F780C6N)
- Commercial C6 speed grade with widest distributor availability (vs EP1S25F780I6N)
Design Notes
Estimated: Stratix FPGAs at full utilization (25,660 LE, 80 DSP blocks at high toggle rates) can dissipate 5-10 W. The 780-FBGA package requires substantial PCB thermal management; per the Stratix Device Family Data Sheet, designers should implement at least a 4-layer PCB with dedicated ground/power planes and provide thermal vias beneath the BGA array. Junction temperature must remain below 125C for commercial grade; use the Altera PowerPlay Early Power Estimator before layout commitment to plan thermal dissipation. For enclosed chassis without airflow, attach a heatsink directly to the package top via thermal interface material.
The 780-FBGA FineLine BGA package uses a 1.0 mm ball pitch, requiring PCB fabrication capabilities of 4/4 mil line/space and microvia or stacked-via technology. Per Altera's package guidelines, route all signals on inner layers to escape the BGA, and dedicate outer microvia layers for power and ground fan-out. Use the manufacturer's recommended decoupling scheme: 0.1 uF and 0.01 uF ceramic capacitors placed as close as possible to every power pin pair, plus bulk capacitors on each supply rail.
Configuration pin handling is a frequent source of design errors. The MSEL pins must be tied to the correct logic levels to select the desired configuration scheme (AS, AP, PS, PP, or JTAG). Per the Stratix datasheet, the nCE and nCONFIG pins require external 10 kohm pull-up resistors to VCC, and the configuration clock (DCLK) line must be length-matched for reliable data transfer. Forgetting to connect CONF_DONE to a status LED or processor GPIO is a common debugging pitfall - this is the primary indicator that configuration has completed successfully.
I/O bank voltage compatibility must be planned at the schematic stage. The 597 user I/O pins are divided into multiple I/O banks, each supporting a configurable VCCIO voltage (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and VREF supply. Mixing incompatible I/O standards across banks without proper VREF planning causes level-shifter errors. Quartus II's Pin Planner tool validates I/O assignments against bank constraints before board fabrication, which should be run as a mandatory pre-layout check.
Compliance Information
RoHS compliant per Altera/Intel legacy product page. Lead-free 780-FBGA package. Not AEC-Q100 qualified (FPGA is not an automotive-grade part). NRND status; verify supply continuity with authorized distributors for new programs.
