EP1S25F780C5 - Stratix I FPGA, 25,660 LEs, 597 I/O, 780-FBGA | Altera / Intel
MPN: EP1S25F780C5 ⚠ آخرین فرصت خریدEP1S25F780C5 نمای کلی
An FPGA (Field-Programmable Gate Array) is a programmable logic device in the semiconductor hierarchy: FPGA -> programmable logic -> ASIC-class device -> integrated circuit. FPGAs are used to implement custom digital logic, glue logic, signal processing pipelines, and high-speed interfaces after the PCB has been fabricated, enabling late-stage design changes and accelerating time to market versus a full ASIC. Stratix I FPGAs were Altera's first generation to combine embedded multipliers, large TriMatrix memory blocks, and high-speed LVDS transceivers on a single die.
Key differentiating features include 80 (typical) embedded DSP blocks for 9x9-bit to 36x36-bit multiplication, 14 clock networks with up to 8 PLLs per device, support for external memory interfaces such as DDR SDRAM, QDR SRAM, and ZBT SRAM, and 1.5 V core operation. The 780-FBGA package exposes 597 user I/O across 8 banks, providing abundant LVDS pairs and routing flexibility for memory-rich and I/O-intensive designs.
The architecture is well suited to telecom line cards, digital video broadcasting equipment, and high-speed serial interfaces where a large logic budget plus embedded multipliers reduce external component count. The 'C5' speed grade trades absolute Fmax for lower static power, making the C5 variant a typical choice for industrial-grade designs that prioritize thermal margin over raw clock rate.
Typical applications include telecom baseband processing, software-defined radio (SDR), high-end image processing, and ASIC prototyping platforms. Designers should pay particular attention to power estimation with the Quartus II PowerPlay tool because the static current scales strongly with VCCINT and junction temperature.
جایگزین‌های drop-in برای EP1S25F780C5 — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EP1S25F780C5 (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Speed Grade, DSP Blocks, Mounting Type, Process Technology.
EP1S25F780C6N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1S25F780C7
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1S25F780I7N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP1S25F780I6N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1S25F780C5N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1S25F780C7N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP1S25F780C5 حداکثر مقادیر مجاز و مشخصات الکتریکی
| Family | Stratix I |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Total RAM Bits | 1,944,576 |
| Embedded Multipliers (DSP blocks) | 80 (typical) |
| User I/O Count | 597 |
| بسته‌بندی | 780-FBGA (29x29 mm) |
| Core Voltage (VCCINT) | 1.425 V to 1.575 V |
| Speed Grade | C5 |
| Operating Temperature (TJ) | 0 °C to +85 °C (commercial) |
| Process Technology | 0.13 µm CMOS, SRAM-based |
| LVDS Performance | Up to 7.6 Gbps (claim per family datasheet) |
| PLLs | Up to 8 per device |
| Global Clock Networks | 14 |
| نوع نصب | Surface Mount (SMT, BGA) |
| وضعیت RoHS | Compliant per Altera product page |
راهنمای پیکربندی پین EP1S25F780C5 780-fbga (29x29 mm)
پیکربندی پین برای EP1S25F780C5 (پکیج 780-fbga (29x29 mm)). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای EP1S25F780C5.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
EP1S25F780C5 مناسب است برای 6 کاربردs: Telecom Line-Card Interface, Software-Defined Radio (SDR) Baseband, High-End Video Broadcast Processing, ASIC Prototyping Platform, Industrial High-Speed Motion Control, Medical Imaging Pre-Processor.
Telecom Line-Card Interface
The EP1S25F780C5's 25,660 Logic Elements plus 80 embedded DSP blocks and 597 user I/O make it well suited for telecom line-card interfaces where multi-protocol bridging and packet processing must coexist on one board. Its TriMatrix embedded memory provides 1,944,576 bits for buffer descriptors, lookup tables, and traffic-shaping queues; the dedicated DDR/DDR2/QDR memory interface controllers centre DQS on byte lanes without external delay lines. With the C5 speed grade, designers trade absolute Fmax for lower static power in thermally constrained PoL bays. The 780-FBGA package's 29 × 29 mm footprint exposes enough LVDS pairs for SGMII, SPI-4.2, and POS-PHY Level 4 interconnects while keeping board layer count manageable. Compared to a discrete ASIC + companion FPGA design, the EP1S25F780C5 collapses glue logic, framer, and SERDES bridge into one silicon, simplifying the BOM.
پیشنهادی
Software-Defined Radio (SDR) Baseband
For SDR baseband designs, the EP1S25F780C5's 80 dedicated 9 × 9-bit to 36 × 36-bit multipliers enable FFT, FIR, and channelisation pipelines that would otherwise need a separate DSP chip. The TriMatrix memory's true-dual-port blocks support simultaneous ADC sample buffering and DAC waveform generation at rates above 100 MSPS, while the 14 global clock networks and up to 8 PLLs allow multiple ADC/DAC clock domains with sub-ps jitter. The 597 I/O accommodate LVDS ADC data buses, control planes, and high-speed serial links without external muxing. Designers commonly use the C5 grade to balance thermal budget against Fmax, since SDR enclosures are usually sealed without forced-air cooling. The 1.5 V VCCINT core further lowers power relative to earlier 2.5 V FPGAs, helping meet MIL-STD-704 or ETSI EN 300 019 thermal envelopes.
پیشنهادی
High-End Video Broadcast Processing
Broadcast video processing benefits from the EP1S25F780C5's 7.6 Gbps LVDS capability and 597 user I/O, which support HD-SDI, 3G-SDI, and dual-link SDI inputs in parallel with DVB-ASI or SMPTE 310 streams. Its 80 embedded multipliers handle chroma upsampling, scaling, and deinterlacing without external DSP chips; the 1,944,576-bit embedded RAM provides multiple line buffers for high-quality motion-adaptive deinterlacing. Designers use the C5 speed grade to keep static power in check for studio rack equipment that runs 24/7. The 780-FBGA's dense BGA fan-out also simplifies multilayer PCB stack-up for high-speed serial video. Compared to a multi-chip ASIC + FPGA approach, the EP1S25F780C5 reduces board area while supporting late-binding changes via SRAM-based configuration.
پیشنهادی
ASIC Prototyping Platform
The EP1S25F780C5 is commonly used as a vehicle for ASIC prototyping because 25,660 LEs provide enough headroom to instantiate a multi-million-gate ASIC's RTL at lower clock rates while preserving functional accuracy. The Stratix I TriMatrix memory blocks, 597 I/O, and dedicated external memory interfaces allow prototype mapping of complex SoC subsystems, including ARM-style AHB/AXI bridges and DDR controllers. Quartus II's incremental compilation supports multi-engineer teams to bring up RTL blocks in parallel on the same device, shortening tape-out schedules. The C5 speed grade's slower Fmax is often sufficient for functional verification where the goal is feature bring-up rather than at-speed validation. The 780-FBGA package also routes cleanly into Logic Analyzer pods and breakout adapters, which is essential during multi-clock-domain debug sessions.
پیشنهادی
Industrial High-Speed Motion Control
Industrial motion controllers benefit from the EP1S25F780C5's combination of 80 DSP blocks (for PID, state-space, and Kalman filters), 597 I/O (for encoder, resolver, and resolver-to-digital feedback channels), and 1.5 V low-power operation that suits 24 V industrial bus systems. The 14 global clock networks synchronise multiple axis loops without jitter skew, and the C5 commercial speed grade handles typical 50–200 kHz PWM switching frequencies with margin to spare. The 780-FBGA's package-level thermal performance supports fan-less operation when paired with adequate PCB copper pours. Designers can also integrate safety logic such as STO (Safe Torque Off) directly in the FPGA, eliminating external safety relays. According to the Stratix device handbook, the FPGA's configuration is reloadable on the factory floor for field upgrades, which is critical for serviceability in industrial automation.
پیشنهادی
Medical Imaging Pre-Processor
Medical imaging pre-processing pipelines such as CT, ultrasound, and digital X-ray benefit from the EP1S25F780C5's parallel DSP capacity (80 multipliers) for beamforming, image reconstruction, and noise filtering. The TriMatrix memory's true-dual-port blocks enable simultaneous ADC sample ingestion and processed-frame transmission to a host CPU, while the DDR/DDR2 controllers handle large image frame buffers. With 597 I/O, the FPGA can connect to multiple analog front ends plus Camera Link or LVDS display outputs without glue logic. The C5 speed grade's lower static power also helps meet IEC 60601-1 thermal limits for medical cart equipment. Designers typically implement DICOM metadata insertion and on-screen overlay directly in the FPGA, offloading the host processor. The 780-FBGA package's 29 × 29 mm footprint simplifies routing of high-speed differential pairs on medical-grade PCBs.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EP1S25F780C5 — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EP1S25F780C6N | EP1S25F780C7 | EP1S25F780I7N | EP1S25F780I6N | EP1S25F780C5N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C5 | C6 | C7 | I7 | I6 | C5 |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Count | 597 | 597 | 597 | 597 | 597 | 597 |
| Embedded RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Embedded Multipliers (DSP) | 80 | 80 | 80 | 80 | 80 | 80 |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | -40°C to +100°C (Industrial) | -40°C to +100°C (Industrial) | 0°C to +85°C |
تفاوت‌های کلیدی
- Highest mid-density Stratix I with 597 user I/O (در مقابلEP1S20F780C5N)
- C5 grade balances Fmax against thermal margin (در مقابلEP1S25F780C7N)
- TriMatrix memory architecture with 1,944,576 bits (در مقابلEP1S10F780C5N)
یادداشت‌های طراحی
Estimated: Stratix I devices draw 1–3 W of static current at 1.5 V VCCINT scaled with junction temperature and design utilisation. Designers must size the 1.5 V regulator to handle Icc_int peaks above 3 A during simultaneous block-RAM write bursts. Use Altera's PowerPlay Early Power Estimator before layout to balance decoupling against inductor saturation current, and add 220 µF bulk caps near each VCCINT pin group to suppress inrush during power-up.
The 780-FBGA's 1.0 mm ball pitch demands a minimum 8-layer PCB stack-up with 50 Ω controlled-impedance routing for LVDS pairs. According to Altera's Stratix I hardware design guidelines, all eight I/O banks require dedicated VCCIO rails that can be driven from independent supplies (1.5 V, 1.8 V, 2.5 V, 3.3 V). Decoupling: place 0.1 µF and 0.01 µF X7R ceramics within 100 mils of every VCCINT/VCCIO pin pair to suppress simultaneous switching noise.
Configuration will fail silently if the EPCS configuration memory is mis-sized for the bitstream; the EP1S25F780C5 typically needs an EPCS16 or larger. Always strap MSEL pins correctly for the chosen configuration mode (AS, PS, FPP, JTAG) before power-up; mixing modes causes the device to remain in reset. Also, the C5 speed grade trades Fmax for thermal margin—do not close timing at C7 margins and assume C5 will work without re-running the Quartus II timing analysis.
اطلاعات انطباق
RoHS compliance per Altera product page; 'N' suffix denotes Pb-free / RoHS ball finish. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC at the part level).
