EP1S30F1020C6 - Stratix FPGA 33K LE, 726 I/O, 1020-BBGA | Altera
Teilenummer: EP1S30F1020C6 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $355 | $3.550,00 |
| 100 | $318.5 | $31.850,00 |
| 500 | $285 | $142.500,00 |
| 1.000 | $262 | $262.000,00 |
EP1S30F1020C6 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic functionality is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM cells. FPGAs sit in the wider hierarchy programmable logic device (PLD) -> programmable logic -> logic IC -> integrated circuit, and they are commonly chosen over ASICs for low-volume designs, fast time-to-market, and field-upgradable hardware. The Stratix family is positioned for high-performance DSP, communications, and signal-processing applications.
Key features of the EP1S30F1020C6 include support for multiple I/O standards (LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X), up to 12 clock management PLLs (depending on variant), True-LVDS with data rates up to several hundred Mbps, dedicated hardware multipliers for DSP, and TriMatrix memory architecture with three block RAM sizes (M512, M4K, M-RAM). The device also offers embedded hard IP for PCI, PCI-X, and external memory interfaces such as DDR SDRAM and QDR SRAM.
The architecture combines a multi-level routing fabric, embedded DSP blocks for high-throughput arithmetic, and rich clocking with phase-locked loops and dedicated clock pins. This combination enables the device to sustain high DSP throughput on FIR filters and FFT pipelines, while the embedded transceivers (not present on EP1S30; transceiver support is on Stratix GX variants) are not applicable here, so designers rely on LVDS pairs for high-speed serial-style I/O.
Typical applications include high-speed digital signal processing (FFT, FIR, encryption engines), telecom baseband processing, test and measurement instrumentation, video and imaging pipelines, and high-density glue logic in ASIC-prototype designs. The wide I/O count makes it well suited to systems that aggregate many parallel data buses.
When designing with the EP1S30F1020C6, plan power distribution carefully: the 1.5 V core with multiple I/O banks requires multiple decoupling capacitors near the BGA balls. The 1020-ball FCBGA footprint demands PCB layers with microvia technology and matched-impedance routing for LVDS pairs.
This page combines distributor pricing, drop-in Stratix same-die alternatives, and practical design notes that go beyond the original Altera datasheet. Compared with a bare parametric listing, it provides a clearer view of pin-compatible replacements and trade-offs.
Drop-in-Alternativen für EP1S30F1020C6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1S30F1020C6 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package Type, Family, Logic Elements, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1S30F1020C7
✅ Drop-In✓ Auf Lager
$575 / Stück
Datenblatt ansehen →EP1S30F1020C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1015 / Stück
Datenblatt ansehen →EP1S30F1020C5N
✅ Drop-In✓ Auf Lager
$1095 / Stück
Datenblatt ansehen →EP1S30F1020C5
✅ Drop-In✓ Auf Lager
$99 / Stück
Datenblatt ansehen →EP1S25F1020C6
✅ Drop-In✓ Auf Lager
$425 / Stück
Datenblatt ansehen →EP1S30F1020C6 Grenzwerte & elektrische Eigenschaften
| Family | Stratix |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 micrometer SRAM, all-layer copper |
| Logic Elements | 32470 |
| Total RAM Bits | 3317184 |
| DSP Blocks | 28 |
| Embedded Multipliers | Yes, 9-bit x 9-bit elements |
| User I/O Pins | 726 |
| Gehäuse | 1020-ball FCBGA (BBGA) |
| Montageart | Surface Mount |
| Speed Grade | 6 |
| Temperature Grade | Commercial (C) |
| Configuration Method | SRAM-based, JTAG boundary-scan |
| Betriebstemperatur | 0C to +85C (commercial) |
EP1S30F1020C6 1020-ball fcbga (bbga) Pinbelegungsleitfaden
Pinbelegung für EP1S30F1020C6 (1020-ball fcbga (bbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1S30F1020C6.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1S30F1020C6 ist geeignet für 6 Anwendungs: High-Speed DSP and FFT Pipelines, Telecom Baseband Processing, Test and Measurement Instrumentation, Video and Imaging Pipelines, ASIC Prototyping and Hardware Emulation, Industrial Control and High-Density Glue Logic.
High-Speed DSP and FFT Pipelines
The EP1S30F1020C6 fits this application because of its 32470 logic elements and 28 dedicated DSP blocks with embedded 9-bit by 9-bit multipliers, which together sustain high throughput on FIR filters and FFT pipelines. Its TriMatrix embedded memory (M512, M4K, M-RAM blocks totaling 3.3 Mbits) provides the on-chip storage needed for coefficient tables and intermediate FFT stages without external memory accesses. With up to 726 user I/O pins, the device can aggregate multiple parallel data streams. Designers typically instantiate block RAM in M4K blocks for tap delays and use DSP blocks for multiply-accumulate paths. Trade-off: the EP1S30 lacks the high-speed transceivers of Stratix GX, so multi-Gbps serial links need companion SerDes ICs.
Empfohlen
Telecom Baseband Processing
Telecom baseband designs benefit from the EP1S30F1020C6 because it integrates hardware multipliers and a rich clock network with multiple PLLs, enabling parallel demodulation and channelization paths. The 1.5 V core on 0.13 micrometer SRAM process gives predictable timing margins for chip-rate processing, while 726 user I/O pins accommodate multiple antenna data streams and backhaul interfaces. The Stratix family supports external memory interfaces (DDR SDRAM, QDR SRAM) through dedicated I/O and hard IP, which the EP1S30 leverages for buffering air-interface samples. Compared with ASIC implementations, the FPGA path shortens time-to-market for evolving radio standards at the cost of higher per-unit power.
Empfohlen
Test and Measurement Instrumentation
Test equipment designers choose the EP1S30F1020C6 for its high logic density, deep embedded RAM, and flexible I/O that supports multiple logic-analyzer or protocol-analyzer front ends. The JTAG boundary-scan interface eases in-system test, while the SRAM-based configuration lets the same hardware be reused for many test patterns simply by reloading the bitstream. With 726 I/O pins, the part can interface with many simultaneous DUTs, and the 1020-ball BGA allows fine-grained I/O placement for controlled-impedance signal paths. Quantified benefit: engineers can fold protocol logic, capture buffers, and trigger engines into one device instead of multiple smaller FPGAs.
Empfohlen
Video and Imaging Pipelines
The EP1S30F1020C6 fits video processing because its 3.3 Mbits of block RAM hold line buffers and frame statistics, while the DSP blocks accelerate pixel-rate operations like color-space conversion and 2D filtering. The 726 I/O pins easily route parallel RGB, HDMI-style parallel buses, and camera link interfaces; dedicated PLL-rich clocking multiplies low-frequency reference clocks to the pixel clocks required by the pipeline. Compared with a discrete ASSP plus memory, the FPGA route lets the same hardware serve multiple video standards by changing the bitstream. Trade-off: large BGA and many I/O banks demand multi-layer PCB with controlled-impedance routing for LVDS data pairs.
Empfohlen
ASIC Prototyping and Hardware Emulation
Engineers use the EP1S30F1020C6 as an ASIC prototype target because its 32470 LEs can map sizable blocks of an RTL design while the embedded multipliers and block RAM substitute for DSP and memory macros. Multiple EP1S30 parts can be tiled together on a multi-FPGA prototyping board to emulate larger ASICs, using LVDS between boards for inter-chip signals. The SRAM-based configuration allows fast design iterations, since each RTL revision just requires a new bitstream rather than a new chip spin. Trade-off: timing closure for very high-frequency ASIC IP needs the -7 speed grade rather than the -6, and power is higher than the final ASIC.
Empfohlen
Industrial Control and High-Density Glue Logic
The EP1S30F1020C6 fits industrial control systems where many parallel buses, encoder counters, and safety interlocks must be aggregated into one programmable platform. Its 726 I/O pins can directly interface with legacy parallel peripherals, while the 28 DSP blocks accelerate motor-control math such as Park/Clarke transforms and field-weakening loops. The commercial temperature grade (0C to +85C) suits most factory-floor enclosures, and the SRAM configuration allows field updates when control algorithms evolve. Compared with discrete CPLD plus MCU architectures, the FPGA approach consolidates logic into a single device but trades power efficiency for flexibility.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1S30F1020C6 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1S30F1020C7 | EP1S30F1020C6N | EP1S30F1020C5N | EP1S30F1020C5 | EP1S25F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-BBGA (FCBGA) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Speed Grade | 6 | 7 (faster) | 6 (same) | 5 (slower) | 5 (slower) | 6 (same) |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) |
| Terminal Finish | SnPb (non-N suffix) | SnPb | Lead-free (Pb-free) | Lead-free (Pb-free) | SnPb | SnPb |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Wichtigste Unterscheidungsmerkmale
- Same die, faster speed grade for high-margin timing closure (vs. EP1S30F1020C7)
- Lead-free terminal finish variant for RoHS products (vs. EP1S30F1020C6N)
- Lower-cost lead-free option with reduced speed (vs. EP1S30F1020C5N)
- Reduced-logic variant in the same package for cost optimization (vs. EP1S25F1020C6)
Designhinweise
The EP1S30F1020C6 requires a 1.5 V core rail plus separate VCCIO supplies per I/O bank (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on standards). Place 0.1 uF X7R decoupling capacitors within 5 mm of each BGA ball group covering the core, and add bulk 22-47 uF tantalum or polymer capacitors per rail to handle transient in-rush during configuration. Estimated in-rush on the 1.5 V core at configuration can exceed 4 A on a 1020-BBGA Stratix device; size the regulator for at least 5 A continuous and 8 A transient.
The 1020-ball FCBGA has a ball pitch near 1.0 mm; escape routing requires at least a 6-layer stack-up with 0.0762 mm (3 mil) line width and 0.1016 mm (4 mil) spaces on outer microvia layers, and 0.127 mm (5 mil) width/space on inner stripline layers. Use laser-drilled stacked microvias under the BGA pads and ensure signal-integrity simulation is done for LVDS pairs routed between adjacent balls. Matched-length routing within 150 ps is needed for parallel LVDS buses such as LVDS or LVPECL interfaces to the EP1S30.
LVDS and LVPECL outputs on the Stratix need 100 ohm differential termination at the receiver placed as close to the receiver pins as possible. Keep series-termination resistors (22-33 ohm) on point-to-point LVDS for stub-length tuning. Maintain at least 3W spacing between LVDS pairs and other high-speed signals. Use ground-reference stitching vias every 50 mil along the route for return-path continuity. The EP1S30 supports True-LVDS and emulated-LVDS; True-LVDS has dedicated hardware SERDES pins and is preferred for >400 Mbps operation.
Common pitfalls when designing with the EP1S30F1020C6: (1) attempting to source obsolete parts from a single distributor - lead times can stretch 8-12 weeks; (2) ignoring MSL floor-life requirements when opening the dry-pack bag - the 1020-BBGA is moisture-sensitive and reflow without proper bake-out causes delamination; (3) using the wrong bitstream file - speed-grade specific .sof/.pof files must be selected to match the device variant; (4) mixing configuration modes between JTAG and fast passive serial without proper MSEL pin pull configuration, which can brick the boot.
Compliance-Informationen
RoHS and REACH status not confirmed in the verified distributor listings provided; the EP1S30F1020C6N variant is the lead-free option in the family. AEC-Q100 is not applicable to FPGAs. Conflict-minerals and halogen-free status unknown from the supplied data.
