Intel

EP1S25F1020C6 - 25K LE Stratix FPGA, 706 I/O, FBGA-1020 | Intel

Name: EP1S25F1020C6 - 25K LE Stratix FPGA, 706 I/O, FBGA-1020 | Intel
Brand: Intel
SKU: EP1S25F1020C6
Price: 425 USD
Availability: InStock

MPN: EP1S25F1020C6 ✗ End of Life

In Stock Ships in 1-3 business days

1.5 V Vdss 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) Package 6 Speed 1,944,576 Memory

From $425 USD / Unit

MOQ: 1 |

Price updated: 2026-09-06

Volume Pricing

Qty	Unit Price	Extended
1	$610.5	$610.50
10	$580	$5,800.00
100	$520	$52,000.00
500	$470	$235,000.00
1,000	$425	$425,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for EP1S25F1020C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1S25F1020C5

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📦 1020-ball FC-FBGA (33 x 33 mm)

Stratix · 25,660 · 2,566 · 1,944,576 bits (1.94 Mbits) · 706 · 130 nm CMOS · 1.5 V · 500 MHz

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EP1S25F1020C5N

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📦 1020-ball FC-FBGA (33 x 33 mm)

Stratix · 25660 · 2852 · 130 nm CMOS · 1.5 V · 500 MHz · 706 · 1020-ball FC-FBGA

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EP1S25F1020I6N

✅ Drop-In ⚠️ 参数待验证

Intel

📦 1020-ball FC-FBGA (33 x 33 mm)

Stratix · 25,660 · 2,566 · 1,944,576 bits · 706 · 706 · 1.5 V · 130 nm CMOS

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EP1S25F1020I7N

✅ Drop-In ⚠️ 参数待验证

📦 1020-ball FC-FBGA (33 x 33 mm)

industrial temperature grade and speed grade 7 (slower), same die/package, pin-to-pin compatible

📋 Reference alternative (not in catalog)

EP1S25F1020C7N

✅ Drop-In ⚠️ 参数待验证

📦 1020-ball FC-FBGA (33 x 33 mm)

speed grade 7 (slower timing), lead-free, same die/package, pin-to-pin compatible

📋 Reference alternative (not in catalog)

EP1S25F1020C8

✅ Drop-In ⚠️ 参数待验证

📦 1020-ball FC-FBGA (33 x 33 mm)

speed grade 8 (slowest internal timing), same die/package, pin-to-pin compatible

📋 Reference alternative (not in catalog)

EP1S25F1020C6 Maximum Ratings & Electrical Characteristics

Family	Stratix
Logic Elements	25,660
Logic Array Blocks (LABs)	2,566
Total Embedded Memory (bits)	1,944,576
User I/Os	706
Embedded Memory Type	TriMatrix (M512 + M4K + M-RAM)
DSP Blocks	Yes (hardware multipliers)
PLLs (Clock Management)	6
Process Technology	130 nm CMOS
Core Supply Voltage	1.5 V
Package	1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch)
Operating Temperature	0 C to +85 C (commercial extended)
Mounting Type	Surface Mount
Compliance / Lead-Free	Lead-free (per Altera family datasheet)

EP1S25F1020C6 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide

Complete pinout information for EP1S25F1020C6 (1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) package pinout diagram for EP1S25F1020C6

No detailed pinout data available for EP1S25F1020C6.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1S25F1020C6 is suitable for 6 applications: Telecommunications Switching Infrastructure, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Video Broadcast and Image Processing, Medical Imaging Front-End, Industrial Automation and Motor Control.

🌐

Telecommunications Switching Infrastructure

The EP1S25F1020C6 is well matched to high-speed telecom switching backplanes where the 706 user I/Os can drive wide parallel data buses and the 1,944,576 bits of TriMatrix embedded memory provide line-rate buffering. Its 1.5 V core and 130 nm CMOS architecture reach 450 MHz internal performance with low dynamic power, and the six PLLs handle multi-rate clocking across OC-48, OC-192, and Ethernet aggregate interfaces. Pairing the device with an external DDR SDRAM controller in the same FPGA reduces board area compared with discrete ASIC solutions while preserving reprogrammability for evolving protocols.

Recommended

✈️

Military and Aerospace Signal Processing

Stratix EP1S25F1020C6 devices have been widely designed into military radios, electronic warfare systems, and radar front-ends because of their high DSP block count, deep memory, and ruggedized package. The 1020-ball FC-FBGA with flip-chip interconnect provides excellent thermal performance and vibration tolerance, while the 706 user I/Os interface to high-speed ADCs, DACs, and FPGA Mezzanine Card (FMC) connectors. The commercial extended 0 C to +85 C temperature grade suffices for many ground-mobile applications; the EP1S25F1020I6N and I7N variants are drop-in alternatives for the industrial temperature range used in avionics platforms.

Recommended

EP1S25F1020I6N · Intel EP1S25F1020I7N (Industrial temperature grade, slower timing closure)

🖥️

ASIC Prototyping and Emulation

With 25,660 logic elements and 1.9 Mbits of TriMatrix memory, the EP1S25F1020C6 has historically been used as a building block in multi-FPGA ASIC prototyping systems where a single Stratix device emulates a partition of the target ASIC. The 706 user I/Os enable high-density board-to-board interconnect through pin-multiplexing daughter cards, while the 130 nm process delivers predictable timing closure in Quartus II. Multiple EP1S25F1020C6 devices can be tiled on a single prototyping board to emulate ASICs of several million gates. Designers should budget for the 1020-ball FC-FBGA footprint on each prototyping site.

Recommended

EP1S25F1020C5 · Altera EP1S20F780C6 · Intel

📺

Video Broadcast and Image Processing

The EP1S25F1020C6 supports real-time HD and SD video pipelines including de-interlacing, scaling, color-space conversion, and frame-rate conversion. Its 25,660 logic elements accommodate parallel DSP pipelines that process multiple video streams concurrently, and the embedded TriMatrix memory absorbs full-line video buffers without external SRAM. The six PLLs generate pixel clocks, memory clocks, and SDI serialization clocks from a single reference, while the 706 I/Os accommodate BT.656, BT.1120, HDMI, and SDI interfaces. The 1020-ball FC-FBGA also has enough balls for multi-channel DDR2 SDRAM controllers that act as frame store.

Recommended

EP1S25F1020C5N · Intel EP1S10F780C6 · Altera

💊

Medical Imaging Front-End

The EP1S25F1020C6 is suited to medical imaging modalities such as ultrasound, CT, and MRI front-end pre-processing where the device performs beamforming, channel summation, and digital down-conversion in real time. The DSP blocks accelerate fixed-point arithmetic, and the 1,944,576 bits of embedded memory store beamforming coefficients and intermediate channel data. The commercial extended temperature grade accommodates the controlled environment of medical carts and rack-mount systems. The 706 user I/Os interface to multi-channel high-speed ADCs that digitize the analog receiver chain at 40 to 80 MSPS per channel.

Recommended

EP1S25F1020C5 · Altera EP1S10F484C6 (Lower-cost companion FPGA for backend image reconstruction)

🏭

Industrial Automation and Motor Control

In high-end industrial servo drives and motion controllers, the EP1S25F1020C6 implements multi-axis PID loops, EtherCAT or PROFINET MACs, and safety logic in a single device. The 706 user I/Os interface to resolver-to-digital converters, encoder inputs, and high-voltage gate drivers through optocouplers, while the DSP blocks accelerate field-oriented control math. The six PLLs derive PWM carrier frequencies, ADC sample clocks, and communications clocks from a single crystal. The commercial extended 0 C to +85 C temperature range covers most factory-floor enclosures, with the EP1S25F1020I6N available as a drop-in variant for harsher installations.

Recommended

EP1S25F1020I6N · Intel EP1S20F672C6 · Altera

Recommended Products Summary

EP1S25F1020C5 Altera Used in: Telecommunications Switching Infrastructure, ASIC Prototyping and Emulation, Medical Imaging Front-End EP1S25F1020I6N Intel Used in: Telecommunications Switching Infrastructure, Military and Aerospace Signal Processing, Industrial Automation and Motor Control EP1S25F1020I7N Industrial temperature grade, slower timing closure Used in: Military and Aerospace Signal Processing EP1S20F780C6 Intel Used in: ASIC Prototyping and Emulation EP1S25F1020C5N Intel Used in: Video Broadcast and Image Processing EP1S10F780C6 Altera Used in: Video Broadcast and Image Processing EP1S10F484C6 Lower-cost companion FPGA for backend image reconstruction Used in: Medical Imaging Front-End EP1S20F672C6 Altera Used in: Industrial Automation and Motor Control

What is the logic element count of the EP1S25F1020C6?

The EP1S25F1020C6 contains 25,660 logic elements (LEs) organized in 2,566 Logic Array Blocks (LABs) according to the Stratix Family Data Sheet. Each LE is built around a 4-input fracturable look-up table with dedicated carry and register chains. This LE density places the device in the mid-range of the Stratix family and is suitable for multi-channel DSP pipelines.

What package does the EP1S25F1020C6 use?

The EP1S25F1020C6 is packaged in a 1020-ball flip-chip fine-pitch BGA (FC-FBGA) measuring 33 mm x 33 mm with a 1 mm ball pitch. According to the Stratix family datasheet, this package supports the 706 user I/O count on the EP1S25 device and requires multi-layer PCB fabrication with microvia or via-in-pad technology.

Is the EP1S25F1020C6 still in production?

The EP1S25F1020C6 has been classified as obsolete by Intel (formerly Altera) since the Stratix I family reached end-of-life. It is currently available only from authorized aftermarket distributors and brokers who hold remaining factory stock. For new designs, Intel recommends migrating to Stratix II, III, or later families.

How much embedded memory does the EP1S25F1020C6 have?

The EP1S25F1020C6 contains 1,944,576 bits of TriMatrix embedded SRAM, split across M512, M4K, and M-RAM block sizes per the Stratix Family Data Sheet. This mix supports small register buffers, large FIFO buffers, and deep lookup-table-based waveform storage without external SRAM. The total memory bandwidth scales with the system clock.

Where to buy the EP1S25F1020C6 online?

The EP1S25F1020C6 can be purchased from authorized aftermarket distributors (Lisleapex, Veswin, ExcessChip, Suntsu) and brokers listed on Octopart, as well as from remaining stock on DigiKey and Mouser. Pricing as of 2026-09-07 is approximately $610.50 per unit at qty 1. Lead time on the open market typically ranges from 2 to 6 weeks depending on stock availability.

What is the lead time for the EP1S25F1020C6?

Lead time for the EP1S25F1020C6 as of 2026-09-07 is approximately 2-6 weeks from authorized aftermarket distributors, depending on whether the stock is factory-traceable or broker-sourced. Obsolete parts often ship from multiple lots with mixed date codes. Request the date code and lot trace documentation up front to mitigate counterfeit risk.

Is the EP1S25F1020C6 in stock?

Stock availability of the EP1S25F1020C6 is limited and variable because the part has been obsolete since the Stratix I family end-of-life announcement. Octopart currently lists 1 active distributor with spot stock. For high-volume orders, contact Intel-authorized aftermarket suppliers directly and request a 12-month forecast.

EP1S25F1020C6 vs EP1S25F1020C5 - which is better for new designs?

The EP1S25F1020C6 is the speed-grade 6 variant of the Stratix EP1S25 family, while the EP1S25F1020C5 is the speed-grade 5 variant. Speed-grade 6 devices are slower in the timing closure sense (higher number equals slower internal timing), so C5 is preferred when timing margin matters and C6 is preferred when cost is the dominant factor.

What is the best drop-in replacement for the EP1S25F1020C6?

The best drop-in pin-compatible replacements for the EP1S25F1020C6 are other EP1S25F1020 variants in the same 1020-ball FC-FBGA package, namely EP1S25F1020C5, EP1S25F1020C5N, EP1S25F1020I7N, and EP1S25F1020I6N. They differ only in speed grade, temperature grade, or lead-free status, allowing direct PCB reuse.

EP1S25F1020C6 vs EP1S25B672C6 - which has more logic?

Both parts share the same 25,660 logic element count in the Stratix EP1S25 family, but the EP1S25F1020C6 is housed in a 1020-ball FC-FBGA package with 706 user I/Os, while the EP1S25B672C6 is in a smaller 672-ball BGA with fewer I/Os. Choose the F1020 variant when you need the maximum I/O count, the B672 variant when PCB routing density is constrained.

Can the EP1S10F780C6 replace the EP1S25F1020C6?

No, the EP1S10F780C6 is a smaller 10K-LE Stratix device in a 780-ball BGA and is NOT a drop-in replacement for the EP1S25F1020C6. It uses a different ballout, fewer logic resources (10K vs 25K LEs), and fewer I/Os. A migration requires re-synthesizing the design and re-laying out the PCB.

Where to download the EP1S25F1020C6 datasheet PDF?

The official Intel/Altera Stratix Family Data Sheet (Volume 1, Chapter 1) covering the EP1S25F1020C6 is available as a PDF from the Altera document library at https://www.altera.com/literature/hb/stx/ch_1_vol_1.pdf. The Stratix Device Handbook contains complete pinout, timing, and configuration information for the entire family.

Where to find the EP1S25F1020C6 pinout?

The complete EP1S25F1020C6 ballout diagram is provided in the Stratix Device Handbook, Volume 2, Chapter 7, which covers all 1020-ball FC-FBGA pin assignments for the EP1S25 device. The pinout PDF is hosted alongside the datasheet on the Altera literature server at https://www.altera.com/literature/hb/stx/. The Quartus II Pin Planner also exports the pinout as CSV.

What are the key specifications of the EP1S25F1020C6 that engineers should know?

The EP1S25F1020C6 integrates 25,660 logic elements, 2,566 LABs, 1,944,576 bits of TriMatrix embedded SRAM, 706 user I/Os, six PLLs, dedicated DSP blocks, and a 1.5 V core supply in a 1020-ball FC-FBGA package per the Stratix Family Data Sheet. It operates from 0 C to +85 C, supports LVDS, SSTL, and HSTL I/O standards, and runs up to 450 MHz internally. The 1 mm ball pitch requires microvia PCB technology.

What is the best Xilinx equivalent for the EP1S25F1020C6?

There is no true cross-vendor drop-in equivalent for the EP1S25F1020C6 because Xilinx and Altera use different ball patterns, configuration schemes, and IP cores. Functionally similar Xilinx parts in the same logic-density class include the Virtex-II Pro XC2VP50 or the Virtex-4 SX55, but these require a full re-design with new PCB layout, new configuration PROM, and new IP. Plan for several months of design effort when migrating across vendors.

Engineering reference data for EP1S25F1020C6 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1S25F1020C6 for mid-density Stratix I designs that require the full 706 user I/O count of the 1020-ball FC-FBGA package and where timing closure is feasible at the speed grade 6 timing bin. Switch to the EP1S25F1020C5 if your design cannot meet timing at speed grade 6 and you can accept the higher unit cost, or to EP1S25F1020I6N if the deployment requires -40 C to +100 C industrial temperature support. Switch to the EP1S25F1020C7N or C8 if the design timing is comfortably closed and you need additional cost savings. Avoid cross-package family members like the EP1S25B672C6 unless you can re-route the PCB, since the 672-ball package has only 456 user I/Os. For new designs in 2026, consider migrating to Stratix II or Stratix 10 for active long-term support.

Comparison with Alternatives

Parameter	This Product	EP1S25F1020C5	EP1S25F1020C5N	EP1S25F1020I6N	EP1S25F1020I7N	EP1S25F1020C7N	EP1S25F1020C8
Package	1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch)	1020-ball FC-FBGA (33 x 33 mm) - same	1020-ball FC-FBGA (33 x 33 mm) - same	1020-ball FC-FBGA (33 x 33 mm) - same	1020-ball FC-FBGA (33 x 33 mm) - same	1020-ball FC-FBGA (33 x 33 mm) - same	1020-ball FC-FBGA (33 x 33 mm) - same
Brand	Intel (formerly Altera)	Intel	Intel	Intel	Intel	Intel	Intel
Family / Process	Stratix / 130 nm CMOS	Stratix / 130 nm - same	Stratix / 130 nm - same	Stratix / 130 nm - same	Stratix / 130 nm - same	Stratix / 130 nm - same	Stratix / 130 nm - same
Speed Grade	6	5 (faster)	5 (faster)	6	7 (slower)	7 (slower)	8 (slowest)
Logic Elements	25,660	25,660 - same	25,660 - same	25,660 - same	25,660 - same	25,660 - same	25,660 - same
User I/Os	706	706 - same	706 - same	706 - same	706 - same	706 - same	706 - same
Embedded Memory (bits)	1,944,576	1,944,576 - same	1,944,576 - same	1,944,576 - same	1,944,576 - same	1,944,576 - same	1,944,576 - same
Operating Temperature	0 C to +85 C (commercial extended)	0 C to +85 C - same	0 C to +85 C - same	-40 C to +100 C (industrial)	-40 C to +100 C (industrial)	0 C to +85 C - same	0 C to +85 C - same

Key Differentiators

Mid-range density of 25,660 LEs in 1020-ball FC-FBGA (vs EP1S25B672C6)
Speed grade 6 balanced for cost and timing (vs EP1S25F1020C5)
Commercial extended temperature grade (vs EP1S25F1020I6N)

Design Notes

The 1020-ball FC-FBGA at 1 mm ball pitch requires microvia or via-in-pad PCB technology and at least 6 routing layers to escape the inner balls cleanly. Use sequential lamination with 1-2-1 or 1-2 build-up dielectrics so microvias can stitch from the top layer down to internal planes. Allocate a continuous GND plane directly under the BGA footprint and stitch vias around the perimeter every 2-3 balls to provide low-impedance return paths and to meet the Stratix Device Handbook EMI recommendations.

Estimated: at full 706-I/O switching utilization with internal clock running at 450 MHz and 1.5 V core, total die power can reach 5-7 W in this 33 mm x 33 mm FC-FBGA. With theta_JA of approximately 12-15 C/W (FC-FBGA with 1 m/s airflow per JEDEC JESD51), junction temperature rise above ambient is roughly 60-100 C. Ensure the chassis design provides at least 1 m/s airflow and that the thermal interface to the heatsink uses a 25-50 um thermal pad.

Place the EP1S25F1020C6 decoupling network as close to the package as possible: at least twenty 0.1 uF X7R ceramics distributed around the perimeter of the BGA, four 10 uF X5R bulk ceramics, and a single 100 uF tantalum or polymer cap. Decoupling caps must connect to a GND plane directly under the FPGA die, not to a side-plane, to minimize loop inductance. For LVDS or LVPECL inputs, keep trace lengths matched within 5 mil to avoid skew on the high-speed parallel bus.

The Stratix I configuration scheme requires a specific MSEL pin strapping for active serial (AS), passive serial (PS), or JTAG mode. Strapping MSEL incorrectly leaves the device unable to configure even with valid bitstream present. The EPC4 or EPC8 configuration PROM must be programmed with the correct .pof file, not the .sof, or configuration will fail at POR. Always verify configuration timing with the Quartus II Timing Analyzer before committing to board layout.

Compliance Information

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Lead Free

Yes

Halogen Free

Unknown

Conflict Minerals

Unknown

Lead-free per Altera Stratix Family Data Sheet. RoHS and REACH status marked unknown because the official Altera/Intel product page no longer publishes compliance certificates for obsolete parts; downstream brokers should provide a compliance document upon request.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

Sources: Manufacturer_Datasheet, Manufacturer_Datasheet, Distributor, Octopart, Distributor, Distributor, Distributor, Distributor, Octopart

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