EP1S30F1020C5 - Stratix 32K LE FPGA 1020-BGA | Intel
MPN: EP1S30F1020C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $140 | $14,000.00 |
| 500 | $118 | $59,000.00 |
| 1,000 | $99 | $99,000.00 |
Drop-in alternatives for EP1S30F1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F1020C6
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View Datasheet →EP1S30F1020C7
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View Datasheet →EP1S40F1020C5
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View Datasheet →EP1S60F1020C5
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S80F1020C5
✅ Drop-In📋 Reference alternative (not in catalog)
EP1S25F1020C5
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP1S30F1020C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 32,470 |
| Total Memory Bits | 3,317,184 |
| Total RAM Blocks | 32470 (per DigiKey descriptor) |
| User I/O Count | 726 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Operating Temperature Grade | Commercial Extended |
| Speed Grade | 5 (C5) |
| Package Type | 1020-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM-based, external PROM required |
| Development Tool | Quartus II (legacy) |
| RoHS Status | unknown |
EP1S30F1020C5 1020-ball fc-fbga (flip-chip fine-pitch bga) Pin Configuration Guide
Complete pinout information for EP1S30F1020C5 (1020-ball fc-fbga (flip-chip fine-pitch bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F1020C5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F1020C5 is suitable for 6 applications: High-Speed DSP Pipelines (Radar / Software Defined Radio), Telecommunications Protocol Bridging (SONET / SDH Framers), ASIC Prototyping and Emulation, Industrial Vision and Image Processing Systems, Test and Measurement Instrumentation, Defense and Aerospace Legacy Sustainment.
High-Speed DSP Pipelines (Radar / Software Defined Radio)
The EP1S30F1020C5 fits this application because its hardware multiplier blocks and TriMatrix memory deliver deterministic multi-GMAC throughput for FFT, FIR, and correlation kernels. At 500 MHz internal operation the part can sustain tens of GMACS, enough for multi-channel software-defined radio baseband or pulse-Doppler radar preprocessing. The 1020-ball FC-FBGA exposes 726 user I/Os - sufficient LVDS pairs to ingest ADC samples at hundreds of MSPS and route pre-processed data into external DDR memory. Designers typically instantiate the Stratix DSP blocks with the MegaCore DSP Builder flow and place MRAM blocks as ping-pong buffers to hide memory latency.
Recommended
Telecommunications Protocol Bridging (SONET / SDH Framers)
Telecom bridging designs map well to the EP1S30F1020C5 because the part's high I/O count (726) and wide bus widths fit parallel TDM framers and SERDES aggregation. The C5 speed grade closes timing on multi-gigabit LVDS links, while dedicated MRAM blocks absorb jitter buffers and pointer-arithmetic state. With up to 500 MHz core operation, the FPGA can run multiple OC-48 framer engines simultaneously and feed downstream ASICs. Quartus II SOPC Builder provides pre-verified UART/SPI/I2C cores to integrate processor housekeeping logic alongside the framer datapath.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping requires capacity, I/O, and predictable timing - all of which the EP1S30F1020C5 delivers at 32,470 LEs and 726 user I/Os. According to Stratix application notes, designers often combine two or more EP1S30 devices in a multi-FPGA partition to emulate mid-complexity ASICs (500K to 1M gate equivalents). The 130 nm process node provides timing characteristics that reasonably match ASIC libraries of that era, making it ideal for pre-silicon verification. The SRAM-based configuration lets engineers iterate RTL in minutes rather than the multi-week ASIC tape-out cycle.
Recommended
Industrial Vision and Image Processing Systems
The EP1S30F1020C5 suits machine-vision pipelines because its high I/O count accepts multi-channel Camera Link or LVDS camera inputs, while embedded DSP blocks execute Sobel, convolution, and color-space-conversion kernels in real time. With 3,317,184 bits of TriMatrix memory, the device holds line buffers and lookup tables for gamma correction without external SRAM. Industrial vision typically runs at 60-200 MHz pixel clocks - well within the C5 speed grade. The commercial-extended temperature grade (0 C to +85 C) covers most factory-floor enclosures, and the BGA package provides the mechanical robustness required by vibration-prone environments.
Recommended
Test and Measurement Instrumentation
Test-and-measurement equipment leverages the EP1S30F1020C5 because the part's flexible I/O supports arbitrary waveform generation, real-time protocol decoding, and high-speed ADC/DAC interfacing. The 1020-ball FC-FBGA exposes 726 user I/Os, allowing direct parallel connection to wide ADC buses without external multiplexing. Embedded TriMatrix memory buffers captured waveforms before DMA-ing to host processors. The C5 speed grade balances performance and cost for mainstream oscilloscope and logic-analyzer products where 250-400 MHz internal Fmax is adequate for triggering and protocol decoding logic.
Recommended
Defense and Aerospace Legacy Sustainment
Defense and aerospace programs sustain long life cycles (15-30 years), making the EP1S30F1020C5 a frequent bill-of-material incumbent for radar, EW, and avionics subsystems. According to Rochester Electronics and similar long-life suppliers, factory-traceable stock remains available for legacy sustainment where re-design is cost-prohibitive. The 130 nm process and SRAM-based configuration provide deterministic startup behavior required by MIL-spec systems, and the BGA package withstands the shock and vibration profiles of airborne platforms. Designers should plan for obsolescence management using form-fit-function equivalents within the Stratix family.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F1020C6 | EP1S30F1020C7 | EP1S40F1020C5 | EP1S60F1020C5 | EP1S80F1020C5 | EP1S25F1020C5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 32,470 | 32,470 (same die) | 32,470 (same die) | 41,250 (~+27%) | 57,120 (~+76%) | 79,040 (~+144%) | 25,660 (~-21%) |
| Speed Grade | C5 | C6 (faster) | C7 (fastest) | C5 (same) | C5 (same) | C5 (same) | C5 (same) |
| Maximum Internal Frequency | 500 MHz | 500 MHz (better Fmax bin) | 500 MHz (best Fmax bin) | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Total Memory Bits | 3,317,184 | 3,317,184 | 3,317,184 | 3,423,744 | 5,398,528 | 7,427,520 | 2,243,840 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Mid-capacity Stratix sweet spot with full 726 I/O exposure (vs EP1S25F1020C5)
- Lower-cost path with headroom upgrade to larger dies (vs EP1S80F1020C5)
- Single-fabric solution for high I/O + DSP + memory (vs Discrete DSP + glue logic)
Design Notes
The 1020-ball FC-FBGA package requires via-in-pad PCB construction with 0.8 mm or 1.0 mm ball pitch. Per Stratix hardware design guidelines, the PCB stack-up must include at least 6 layers with dedicated power and ground planes adjacent to the BGA fan-out area. Use microvia-in-pad (stacked or staggered) to route inner balls; signal integrity on the 1.5 V core and 3.3 V auxiliary rails depends on low-impedance plane capacitance directly under the device. Plan a 25-30 mm x 25-30 mm PCB keep-out for the BGA itself.
Estimated: at 500 MHz with 60-70% logic utilization, the EP1S30 core typically dissipates 5-8 W. The FC-FBGA exposes the die through the top surface for a heatsink attach. Designers should attach a 25x25 mm heatsink with thermal interface material and ensure airflow of at least 1.5 m/s. For enclosed chassis, derate by 20-30% and add a copper heat-spreader plane under the BGA. The 'F' (FC-FBGA) package supports higher power than wire-bond equivalents because the flip-chip solder balls provide a direct thermal path into the PCB inner planes.
Plan configuration memory carefully: the EP1S30 is SRAM-based, so the bitstream must be loaded from an external EPC configuration device or flash on every power-up. Per Altera application note AN-399, fast passive serial configuration takes 100-300 ms for a fully populated EP1S30; designers must hold nSTATUS low until the supply rails stabilize. Pinout is package-specific - the EP1S30F1020C5 ball map differs from the EP1S30F780 variant, so schematic reuse across packages is impossible. Quartus II version lock is also critical: a design compiled in v9.0 may not synthesize cleanly in v13.1 because of deprecated megafunctions.
Compliance Information
RoHS and lead-free status uncertain for EP1S30F1020C5 because the part was produced across lead and lead-free assembly generations. Confirm with supplier CoC. AEC-Q100 not applicable - this is a commercial-grade FPGA.
