EPM570F100C4N - MAX II CPLD, 440 LEs, 100-FBGA | Intel
MPN: EPM570F100C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.63 | $23.63 |
| 10 | $21.5 | $215.00 |
| 100 | $18.95 | $1,895.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $14.32 | $14,320.00 |
Drop-in alternatives for EPM570F100C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM570F100C5N
β Drop-Inβ In Stock
$5.2 / Unit
View Datasheet βEPM570F100A5N
β Drop-Inβ In Stock
$9.85 / Unit
View Datasheet βEPM1270F100C4N
β Drop-Inπ Reference alternative (not in catalog)
EPM2210F100C4N
β Drop-Inπ Reference alternative (not in catalog)
EPM240F100C4N
β Drop-Inβ In Stock
$7.05 / Unit
View Datasheet βEPM570F100I4N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EPM570F100C4N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 440 LE |
| Macrocells | 440 |
| Maximum User I/O | 80 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| User Flash Memory | 4.4 Kbits |
| Configuration Technology | Flash (non-volatile, instant-on) |
| Operating Voltage (Core) | 3.3 V (internal regulator) |
| I/O Voltage Support (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Package | 100-FBGA (FineLine BGA) 11 mm x 11 mm |
| Operating Temperature | 0 C to +85 C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Hot Socketing | Yes |
EPM570F100C4N 100-fbga (fineline bga) 11 mm x 11 mm Pin Configuration Guide
Complete pinout information for EPM570F100C4N (100-fbga (fineline bga) 11 mm x 11 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570F100C4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570F100C4N is suitable for 6 applications: Microcontroller I/O Expansion, Bus Interface Bridging, Address Decoding and Chip Select, LED Display and Signage Control, Power Sequencing and Supervisor, Industrial Control and Automation.
Microcontroller I/O Expansion
The EPM570F100C4N's 80 user I/Os and instant-on configuration make it ideal for expanding the limited I/O count of low-pin-count microcontrollers. With 440 logic elements, it can implement multi-port UART bridges, PWM generators, and GPIO expanders in a single chip, reducing BOM cost and PCB area. The deterministic 5.4 ns pin-to-pin delay ensures glitch-free response to time-critical interrupts.
Recommended
Bus Interface Bridging
Use the EPM570F100C4N as a glue-logic bridge between microcontrollers and peripherals with mismatched bus protocols. The MultiVolt I/O (1.5 V to 3.3 V) enables level translation between legacy 5 V-tolerant signals and modern low-voltage rails, eliminating discrete translator ICs. The JTAG boundary-scan support simplifies board-level testing in production.
Recommended
Address Decoding and Chip Select
The EPM570F100C4N excels at generating address-decoded chip-select signals for memory and peripheral banks in microprocessor systems. With 5.4 ns propagation delay, it meets the timing requirements of fast external memory interfaces while the 440 LEs can decode large address spaces. Hot-socketing allows live insertion in CompactPCI or VME backplane designs.
Recommended
LED Display and Signage Control
In LED matrix and signage controllers, the EPM570F100C4N drives row/column multiplexing, PWM dimming, and refresh timing with deterministic latency. The 80 user I/Os can directly drive multiple 8-bit or 16-bit data buses to LED driver chips, while the 4.4 Kbits of user Flash can store lookup tables for gamma correction or color mapping in the device itself.
Recommended
Power Sequencing and Supervisor
Program the EPM570F100C4N as a multi-rail power sequencer for FPGA, ASIC, or SoC-based systems. Its instant-on Flash configuration guarantees deterministic startup behavior, while logic elements implement watchdog timers, voltage monitoring, and reset distribution. The 1.5 V to 3.3 V I/O range interfaces directly to most supervisor ICs and PMBus controllers.
Recommended
Industrial Control and Automation
With deterministic timing and instant-on operation, the EPM570F100C4N suits industrial PLC I/O modules, motor control interfaces, and sensor signal conditioning. The 100-FBGA package handles moderate vibration, while commercial temperature grade covers most factory-floor applications. Pair it with the EPM570F100I4N industrial variant for -40C to +100C operation in outdoor cabinets.
Recommended
Recommended Products Summary
Engineering reference data for EPM570F100C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F100C5N | EPM1270F100C4N | EPM2210F100C4N | EPM240F100C4N |
|---|---|---|---|---|---|
| Package | 100-FBGA (FineLine BGA) 11x11 mm | 100-FBGA (FineLine BGA) - same | 100-FBGA (FineLine BGA) - same | 100-FBGA (FineLine BGA) - same | 100-FBGA (FineLine BGA) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 440 LE | 440 LE | 1,270 LE | 2,210 LE | 192 LE |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | 6.5 ns | 5.4 ns | 5.4 ns | 4.7 ns |
| Maximum User I/O | 80 | 80 | 100 | 100 | 80 |
| User Flash Memory | 4.4 Kbits | 4.4 Kbits | 8 Kbits | 8 Kbits | 2.0 Kbits |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Configuration Technology | Flash (non-volatile) | Flash | Flash | Flash | Flash |
Key Differentiators
- Highest density at lowest cost in 100-FBGA (vs EPM240F100C4N)
- Vertical migration path within the same package (vs EPM1270F100C4N / EPM2210F100C4N)
- Faster than C5 speed grade (vs EPM570F100C5N)
Design Notes
The 100-FBGA package has a 1.0 mm ball pitch requiring 4-layer or 6-layer PCB with microvia-in-pad or standard via fan-out. Place VCCIO and VCCINT decoupling capacitors (0.1 uF ceramic + 10 uF bulk) within 5 mm of the respective power balls. Use multiple vias on power and ground pads to minimize inductance for the high-speed internal regulator switching.
Do not confuse the EPM570F100C4N (commercial) with the EPM570F100I4N (industrial -40C to +100C). The C suffix designates commercial 0C to +85C temperature range. Also note the speed grade: C4 = 5.4 ns, C5 = 6.5 ns, A5 = 5.0 ns. Always order the exact part number that matches your timing budget and environmental requirements.
Route JTAG signals (TCK, TMS, TDI, TDO) with 50 ohm controlled impedance and keep traces under 50 mm. Add 10 kohm pull-ups on TMS and TDI to ensure valid logic levels during configuration. For multi-device JTAG chains, daisy-chain TDI to TDO and connect TCK/TMS in parallel; consult AN 39 for boundary-scan chain ordering.
Compliance Information
RoHS and REACH compliant per Intel/Altera product declaration. Lead-free BGA balls. Not AEC-Q100 qualified - choose EPM570F100I4N for industrial temperature, or a dedicated automotive CPLD for AEC-Q100 requirements.
