EPM570ZM256C6N - MAX II 570 LE CPLD, 256-MBGA | Altera (Intel)
Teilenummer: EPM570ZM256C6N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $39.13 | $39,13 |
| 10 | $36.5 | $365,00 |
| 100 | $31.2 | $3.120,00 |
| 500 | $27.4 | $13.700,00 |
| 1.000 | $24.1 | $24.100,00 |
EPM570ZM256C6N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines AND/OR-array macrocell architecture with on-chip flash configuration memory. CPLDs sit between discrete 74-series glue logic and small FPGAs in the broader hierarchy of programmable logic, offering deterministic propagation delays, single-chip instant-on boot, and high I/O count at low unit cost. The MAX II family is widely deployed as "glue logic," bus-interface bridges, and I/O expander replacements for ASIC and ASSP functions in cost-sensitive industrial, consumer, and communications designs.
Key features of the EPM570ZM256C6N include 5.5 ns pin-to-pin logic delay (commercial speed grade -6), MultiVolt core supporting 1.8 V, 2.5 V, 3.3 V I/O standards, in-system programmability via JTAG, and operation across 0C to +85C commercial temperature. Internal core voltage is 1.71 V to 1.89 V (1.8 V typical), while I/O banks accept 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V inputs with 5.0 V-tolerant I/Os. The device also integrates 8 Kbits of user flash that designers can partition between configuration and general-purpose non-volatile storage.
Architecture combines a high-performance, low-power CMOS process with the non-volatile Flash memory block, eliminating external configuration PROM and offering live-at-power-up behavior. The 160 user I/Os in a 256-MBGA footprint enable dense board integration where TQFP-144 or QFP-100 packages cannot deliver sufficient I/O count. Designers benefit from deterministic timing suited to control-plane and bus-interface applications rather than DSP or high-speed datapath workloads.
Typical applications include I/O expansion and bus bridging for microcontrollers, glue logic replacement in industrial control boards, LED display control, multi-rail power-sequencing networks, telecommunications line-card interface glue, and consumer-electronics peripheral hubs. The wide I/O voltage range allows direct interfacing to legacy 5 V peripherals alongside modern 1.8 V SoCs.
When designing with the EPM570ZM256C6N, remember that the MBGA package requires X-ray or rework-station inspection for prototypes and BGA-qualified PCB assembly lines for production. Provide decoupling of 0.1 microfarad and 10 microfarad capacitors near each VCCIO bank, and ensure JTAG chain access for in-system programming. Use Quartus II Web Edition (or Quartus Prime Lite) for design entry, synthesis, and place-and-route.
This page synthesizes distributor pricing, drop-in alternatives from the MAX II vertical-migration family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EPM570ZM256C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPM570ZM256C6N (gleiche Bauform und Footprint) – abweichend in Process Technology, Operating Temperature, Family, Package, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPM1270ZM256C6N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPM2210ZM256C6N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPM570ZM256I6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EPM570ZM256C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.95 / Stück
Datenblatt ansehen →EPM570GM256C5N
✅ Drop-In✓ Auf Lager
$18.6 / Stück
Datenblatt ansehen →EPM570ZM256C6N Grenzwerte & elektrische Eigenschaften
| Series | MAX II |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 160 |
| User Flash Memory | 8 Kbits |
| Gehäuse | 256-MBGA (FineLine BGA) 11x11 mm |
| Pin/Pitch | 256 balls, 0.5 mm pitch (Heisener description) |
| Internal Core Voltage | 1.71 V to 1.89 V (1.8 V typical) |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Propagation Delay (tPD) | 9 ns (per Heisener listing for Z speed grade) |
| Programmable Type | In System Programmable (Flash, non-volatile) |
| Betriebstemperatur | 0C to +85C (commercial) |
| Montageart | Surface Mount (BGA) |
| Process Technology | 0.18 micron CMOS, 6-layer-metal flash |
| RoHS-Status | Lead-free (per Heisener listing) |
EPM570ZM256C6N 256-mbga (fineline bga) 11x11 mm Pinbelegungsleitfaden
Pinbelegung für EPM570ZM256C6N (256-mbga (fineline bga) 11x11 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPM570ZM256C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPM570ZM256C6N ist geeignet für 6 Anwendungs: Microcontroller I/O Expansion and Bus Bridging, Industrial Control Glue Logic Replacement, Telecommunications Line-Card Interface Glue, LED Display and Signage Control, Multi-Rail Power Sequencing and Supervisor Networks, Consumer Peripheral Hub and Interface Aggregator.
Microcontroller I/O Expansion and Bus Bridging
The EPM570ZM256C6N's 160 user I/Os and 570 LEs make it a strong fit as an I/O expander for resource-constrained microcontrollers that lack sufficient GPIO, UART, or peripheral count. Designers route address/data buses, PWM channels, and interrupt lines through the CPLD, gaining deterministic 9 ns pin-to-pin timing that simplifies real-time control firmware. MultiVolt I/O supports 1.8 V SoCs alongside legacy 5 V peripherals in the same design without level shifters. The 256-MBGA package enables dense placement beneath or beside the host MCU, while the on-chip 8 Kbit user flash provides non-volatile configuration storage for bridge-side defaults.
Empfohlen
Industrial Control Glue Logic Replacement
As a drop-in replacement for multiple 74-series glue-logic packages (latches, decoders, multiplexers, bus switches), the EPM570ZM256C6N consolidates board area and reduces BOM complexity in industrial PLCs, motor controllers, and process-instrumentation front ends. The 9 ns propagation delay suits control-plane timing budgets where microsecond-level determinism matters more than nanosecond DSP throughput. Wide 0C to +85C commercial operating temperature and 5 V-tolerant I/Os interface directly to industrial sensor front-ends, optocouplers, and legacy 24 V-interface logic through external translators. Designers program the device once via JTAG; subsequent field updates reuse the same in-system-programming chain.
Empfohlen
Telecommunications Line-Card Interface Glue
Telecom line cards and access-network equipment rely on the EPM570ZM256C6N for TDM bus multiplexing, framer-to-SERDES bridging, clock-domain crossing, and LED-status display driving. The 160 I/Os in a compact 256-MBGA footprint accommodate the dense back-panel connector count typical of compactPCI and ATCA cards. MultiVolt I/O banks interface directly to 1.8 V SERDES, 2.5 V framers, 3.3 V DSPs, and 5 V legacy glue from a single device. Non-volatile instant-on boot eliminates external configuration PROM, reducing board cost and boot-time risk in central-office deployments where deterministic power-up sequencing is mandatory.
Empfohlen
LED Display and Signage Control
Large LED-matrix displays and electronic-signage controllers use the EPM570ZM256C6N for row/column scanning, PWM dimming, and high-speed multiplexing of shift-register chains. The 570 LE capacity drives dozens of PWM channels simultaneously while 160 I/Os address wide data buses to LED-driver ICs without external mux chips. The 9 ns tPD allows refresh rates above 1 kHz even for high-resolution panels, eliminating visible flicker. Non-volatile configuration means the display controller starts producing the boot pattern within microseconds of power-up, which is critical for unattended signage that must display information immediately after power restoration.
Empfohlen
Multi-Rail Power Sequencing and Supervisor Networks
Power-supply designers integrate the EPM570ZM256C6N as a programmable power-sequencer for multi-rail ASIC, FPGA, and SoC boards, replacing discrete CD4013 / CD4538 timing chains with a single re-programmable device. Designers implement enable/disable logic, fault-propagation, and timing-delay chains in Verilog or VHDL, then load via JTAG; field updates re-sequence rails without PCB rework. The 8 Kbit user flash stores non-volatile trim and rail-margining profiles alongside configuration data. Wide 5 V-tolerant I/O drives external MOSFET gate-driver inputs directly, while 1.8 V core minimizes quiescent power in always-on supervisory paths.
Empfohlen
Consumer Peripheral Hub and Interface Aggregator
Consumer-electronics motherboards for set-top boxes, gaming consoles, and home gateways deploy the EPM570ZM256C6N as a peripheral-aggregation hub that multiplexes USB, HDMI CEC, IR, keypad, and audio-control signals onto the main SoC. The 160 I/Os consolidate dozens of discrete logic functions into a single IC, lowering BOM cost and PCB area. Non-volatile instant-on boot enables ultra-fast wake-from-standby behavior because the hub logic is already configured by the time the SoC completes its own boot sequence. 5 V-tolerant I/Os interface directly to legacy IR receivers and keypad matrices, simplifying mixed-voltage consumer designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPM570ZM256C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPM1270ZM256C6N | EPM2210ZM256C6N | EPM570ZM256I6N | EPM570ZM256C7N | EPM570GM256C5N |
|---|---|---|---|---|---|---|
| Package | 256-MBGA (FineLine BGA) 11x11 mm | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements (LEs) | 570 | 1270 | 2210 | 570 | 570 | 570 |
| Macrocells | 440 | 980 | 1700 | 440 | 440 | 440 |
| User I/Os | 160 | 212 | 212 | 160 | 160 | 160 |
| Speed Grade (tPD) | Z6 (~9 ns) | Z6 (~9 ns) | Z6 (~9 ns) | Z6 (~9 ns) | C7 (~7 ns) | G5 (~5.5 ns) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Vertical Migration Compatible | N/A (base part) | Yes - direct upgrade | Yes - direct upgrade | Yes - temp-grade variant | Yes - speed-grade variant | Yes - speed-grade variant |
Wichtigste Unterscheidungsmerkmale
- Highest I/O density in MAX II 256-MBGA family at base 570 LE density (vs. EPM570T144C5N)
- Direct vertical migration path to higher densities in same footprint (vs. EPM1270ZM256C6N)
- 8 Kbit user flash for non-volatile configuration storage (vs. Discrete 74-series glue logic)
Designhinweise
The 256-MBGA package uses 0.5 mm ball pitch on an 11x11 mm substrate, which requires laser-drilled or micro-via PCB stack-ups for breakout routing. Use 4-layer FR-4 minimum with a dedicated ground plane directly under the BGA to control return-path impedance. Place 0.1 microfarad X7R decoupling capacitors within 2 mm of every VCCIO bank, plus 10 microfarad bulk tantalum or ceramic on each supply rail. Plan BGA fanout using dogbone or via-in-pad techniques depending on PCB fabricator capability.
Do not assume JTAG chain access is optional: in-system programmability requires dedicated TCK, TMS, TDI, TDO pins brought to a test header or boundary-scan connector. Forgetting JTAG access forces board rework if configuration updates are needed. Also note that the 1.8 V internal core is generated by an internal regulator from the VCCINT supply; the user only needs to supply 1.8 V externally on VCCINT pins, while VCCIO accepts 1.5/1.8/2.5/3.3 V per bank. Mixing VCCIO voltages across banks is permitted but requires careful bank-by-bank pin assignment in the Quartus Pin Planner.
Estimated: At maximum LE utilization (~90%) and 100 MHz toggle rate on 80 I/Os, dynamic power dissipation is approximately 200-300 mW with VCCIO at 3.3 V. The 256-MBGA package has a typical theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of 5-9 C above ambient - well within the 0C to +85C commercial range. No external heatsink is required; designers should still ensure adequate PCB copper for thermal spreading, especially if VCCIO banks run at 3.3 V with high switching activity.
Compliance-Informationen
Lead-free per Heisener listing. RoHS compliance verified via distributor product pages. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Industrial temperature variant EPM570ZM256I6N available for -40C to +100C operation.
