EPM570ZM256C6N - MAX II 570 LE CPLD, 256-MBGA | Altera (Intel)
Référence : EPM570ZM256C6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $39.13 | $39,13 |
| 10 | $36.5 | $365,00 |
| 100 | $31.2 | $3 120,00 |
| 500 | $27.4 | $13 700,00 |
| 1 000 | $24.1 | $24 100,00 |
EPM570ZM256C6N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines AND/OR-array macrocell architecture with on-chip flash configuration memory. CPLDs sit between discrete 74-series glue logic and small FPGAs in the broader hierarchy of programmable logic, offering deterministic propagation delays, single-chip instant-on boot, and high I/O count at low unit cost. The MAX II family is widely deployed as "glue logic," bus-interface bridges, and I/O expander replacements for ASIC and ASSP functions in cost-sensitive industrial, consumer, and communications designs.
Key features of the EPM570ZM256C6N include 5.5 ns pin-to-pin logic delay (commercial speed grade -6), MultiVolt core supporting 1.8 V, 2.5 V, 3.3 V I/O standards, in-system programmability via JTAG, and operation across 0C to +85C commercial temperature. Internal core voltage is 1.71 V to 1.89 V (1.8 V typical), while I/O banks accept 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V inputs with 5.0 V-tolerant I/Os. The device also integrates 8 Kbits of user flash that designers can partition between configuration and general-purpose non-volatile storage.
Architecture combines a high-performance, low-power CMOS process with the non-volatile Flash memory block, eliminating external configuration PROM and offering live-at-power-up behavior. The 160 user I/Os in a 256-MBGA footprint enable dense board integration where TQFP-144 or QFP-100 packages cannot deliver sufficient I/O count. Designers benefit from deterministic timing suited to control-plane and bus-interface applications rather than DSP or high-speed datapath workloads.
Typical applications include I/O expansion and bus bridging for microcontrollers, glue logic replacement in industrial control boards, LED display control, multi-rail power-sequencing networks, telecommunications line-card interface glue, and consumer-electronics peripheral hubs. The wide I/O voltage range allows direct interfacing to legacy 5 V peripherals alongside modern 1.8 V SoCs.
When designing with the EPM570ZM256C6N, remember that the MBGA package requires X-ray or rework-station inspection for prototypes and BGA-qualified PCB assembly lines for production. Provide decoupling of 0.1 microfarad and 10 microfarad capacitors near each VCCIO bank, and ensure JTAG chain access for in-system programming. Use Quartus II Web Edition (or Quartus Prime Lite) for design entry, synthesis, and place-and-route.
This page synthesizes distributor pricing, drop-in alternatives from the MAX II vertical-migration family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EPM570ZM256C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570ZM256C6N (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Family, Package, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM1270ZM256C6N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM2210ZM256C6N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM570ZM256I6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM570ZM256C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.95 / unité
Voir la fiche technique →EPM570GM256C5N
✅ Remplacement direct✓ En stock
$18.6 / unité
Voir la fiche technique →EPM570ZM256C6N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| User I/Os | 160 |
| User Flash Memory | 8 Kbits |
| Boîtier | 256-MBGA (FineLine BGA) 11x11 mm |
| Pin/Pitch | 256 balls, 0.5 mm pitch (Heisener description) |
| Internal Core Voltage | 1.71 V to 1.89 V (1.8 V typical) |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V tolerant |
| Propagation Delay (tPD) | 9 ns (per Heisener listing for Z speed grade) |
| Programmable Type | In System Programmable (Flash, non-volatile) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Type de montage | Surface Mount (BGA) |
| Process Technology | 0.18 micron CMOS, 6-layer-metal flash |
| Statut RoHS | Lead-free (per Heisener listing) |
Guide de configuration des broches du EPM570ZM256C6N 256-mbga (fineline bga) 11x11 mm
Configuration des broches du EPM570ZM256C6N (boîtier 256-mbga (fineline bga) 11x11 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPM570ZM256C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPM570ZM256C6N convient pour 6 applications: Microcontroller I/O Expansion and Bus Bridging, Industrial Control Glue Logic Replacement, Telecommunications Line-Card Interface Glue, LED Display and Signage Control, Multi-Rail Power Sequencing and Supervisor Networks, Consumer Peripheral Hub and Interface Aggregator.
Microcontroller I/O Expansion and Bus Bridging
The EPM570ZM256C6N's 160 user I/Os and 570 LEs make it a strong fit as an I/O expander for resource-constrained microcontrollers that lack sufficient GPIO, UART, or peripheral count. Designers route address/data buses, PWM channels, and interrupt lines through the CPLD, gaining deterministic 9 ns pin-to-pin timing that simplifies real-time control firmware. MultiVolt I/O supports 1.8 V SoCs alongside legacy 5 V peripherals in the same design without level shifters. The 256-MBGA package enables dense placement beneath or beside the host MCU, while the on-chip 8 Kbit user flash provides non-volatile configuration storage for bridge-side defaults.
Recommandé
Industrial Control Glue Logic Replacement
As a drop-in replacement for multiple 74-series glue-logic packages (latches, decoders, multiplexers, bus switches), the EPM570ZM256C6N consolidates board area and reduces BOM complexity in industrial PLCs, motor controllers, and process-instrumentation front ends. The 9 ns propagation delay suits control-plane timing budgets where microsecond-level determinism matters more than nanosecond DSP throughput. Wide 0C to +85C commercial operating temperature and 5 V-tolerant I/Os interface directly to industrial sensor front-ends, optocouplers, and legacy 24 V-interface logic through external translators. Designers program the device once via JTAG; subsequent field updates reuse the same in-system-programming chain.
Recommandé
Telecommunications Line-Card Interface Glue
Telecom line cards and access-network equipment rely on the EPM570ZM256C6N for TDM bus multiplexing, framer-to-SERDES bridging, clock-domain crossing, and LED-status display driving. The 160 I/Os in a compact 256-MBGA footprint accommodate the dense back-panel connector count typical of compactPCI and ATCA cards. MultiVolt I/O banks interface directly to 1.8 V SERDES, 2.5 V framers, 3.3 V DSPs, and 5 V legacy glue from a single device. Non-volatile instant-on boot eliminates external configuration PROM, reducing board cost and boot-time risk in central-office deployments where deterministic power-up sequencing is mandatory.
Recommandé
LED Display and Signage Control
Large LED-matrix displays and electronic-signage controllers use the EPM570ZM256C6N for row/column scanning, PWM dimming, and high-speed multiplexing of shift-register chains. The 570 LE capacity drives dozens of PWM channels simultaneously while 160 I/Os address wide data buses to LED-driver ICs without external mux chips. The 9 ns tPD allows refresh rates above 1 kHz even for high-resolution panels, eliminating visible flicker. Non-volatile configuration means the display controller starts producing the boot pattern within microseconds of power-up, which is critical for unattended signage that must display information immediately after power restoration.
Recommandé
Multi-Rail Power Sequencing and Supervisor Networks
Power-supply designers integrate the EPM570ZM256C6N as a programmable power-sequencer for multi-rail ASIC, FPGA, and SoC boards, replacing discrete CD4013 / CD4538 timing chains with a single re-programmable device. Designers implement enable/disable logic, fault-propagation, and timing-delay chains in Verilog or VHDL, then load via JTAG; field updates re-sequence rails without PCB rework. The 8 Kbit user flash stores non-volatile trim and rail-margining profiles alongside configuration data. Wide 5 V-tolerant I/O drives external MOSFET gate-driver inputs directly, while 1.8 V core minimizes quiescent power in always-on supervisory paths.
Recommandé
Consumer Peripheral Hub and Interface Aggregator
Consumer-electronics motherboards for set-top boxes, gaming consoles, and home gateways deploy the EPM570ZM256C6N as a peripheral-aggregation hub that multiplexes USB, HDMI CEC, IR, keypad, and audio-control signals onto the main SoC. The 160 I/Os consolidate dozens of discrete logic functions into a single IC, lowering BOM cost and PCB area. Non-volatile instant-on boot enables ultra-fast wake-from-standby behavior because the hub logic is already configured by the time the SoC completes its own boot sequence. 5 V-tolerant I/Os interface directly to legacy IR receivers and keypad matrices, simplifying mixed-voltage consumer designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570ZM256C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM1270ZM256C6N | EPM2210ZM256C6N | EPM570ZM256I6N | EPM570ZM256C7N | EPM570GM256C5N |
|---|---|---|---|---|---|---|
| Package | 256-MBGA (FineLine BGA) 11x11 mm | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same | 256-MBGA (FineLine BGA) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements (LEs) | 570 | 1270 | 2210 | 570 | 570 | 570 |
| Macrocells | 440 | 980 | 1700 | 440 | 440 | 440 |
| User I/Os | 160 | 212 | 212 | 160 | 160 | 160 |
| Speed Grade (tPD) | Z6 (~9 ns) | Z6 (~9 ns) | Z6 (~9 ns) | Z6 (~9 ns) | C7 (~7 ns) | G5 (~5.5 ns) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Vertical Migration Compatible | N/A (base part) | Yes - direct upgrade | Yes - direct upgrade | Yes - temp-grade variant | Yes - speed-grade variant | Yes - speed-grade variant |
Principaux différenciateurs
- Highest I/O density in MAX II 256-MBGA family at base 570 LE density (vs EPM570T144C5N)
- Direct vertical migration path to higher densities in same footprint (vs EPM1270ZM256C6N)
- 8 Kbit user flash for non-volatile configuration storage (vs Discrete 74-series glue logic)
Notes de conception
The 256-MBGA package uses 0.5 mm ball pitch on an 11x11 mm substrate, which requires laser-drilled or micro-via PCB stack-ups for breakout routing. Use 4-layer FR-4 minimum with a dedicated ground plane directly under the BGA to control return-path impedance. Place 0.1 microfarad X7R decoupling capacitors within 2 mm of every VCCIO bank, plus 10 microfarad bulk tantalum or ceramic on each supply rail. Plan BGA fanout using dogbone or via-in-pad techniques depending on PCB fabricator capability.
Do not assume JTAG chain access is optional: in-system programmability requires dedicated TCK, TMS, TDI, TDO pins brought to a test header or boundary-scan connector. Forgetting JTAG access forces board rework if configuration updates are needed. Also note that the 1.8 V internal core is generated by an internal regulator from the VCCINT supply; the user only needs to supply 1.8 V externally on VCCINT pins, while VCCIO accepts 1.5/1.8/2.5/3.3 V per bank. Mixing VCCIO voltages across banks is permitted but requires careful bank-by-bank pin assignment in the Quartus Pin Planner.
Estimated: At maximum LE utilization (~90%) and 100 MHz toggle rate on 80 I/Os, dynamic power dissipation is approximately 200-300 mW with VCCIO at 3.3 V. The 256-MBGA package has a typical theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board, yielding a junction-to-ambient rise of 5-9 C above ambient - well within the 0C to +85C commercial range. No external heatsink is required; designers should still ensure adequate PCB copper for thermal spreading, especially if VCCIO banks run at 3.3 V with high switching activity.
Informations de conformité
Lead-free per Heisener listing. RoHS compliance verified via distributor product pages. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Industrial temperature variant EPM570ZM256I6N available for -40C to +100C operation.
