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SK hynix

H5CG48AGBDX014 - 16Gb DDR5 SDRAM 4800Mbps | SK hynix | Server Memory

Teilenummer: H5CG48AGBDX014 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.1 V Vdss 82-ball FBGA Package
Ab $86 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-04
Mengenpreise
Menge Stückpreis Gesamt
1 $92.5 $92,50
10 $90.1 $901,00
100 $88.4 $8.840,00
500 $87.42 $43.710,00
1.000 $86 $86.000,00
ℹ️ Alle Preise sind in USD

H5CG48AGBDX014 Übersicht

The SK hynix H5CG48AGBDX014 is a 16Gb (2Gx8) DDR5 SDRAM component rated for 4800 Mbps data rate at 1.1V, housed in an 82-ball FBGA package and featuring on-die ECC (ODECC) for enhanced data integrity in server, mainstream PC, and industrial memory designs.

DDR5 SDRAM is the fifth generation of double-data-rate synchronous DRAM, the memory technology at the base of the DRAM -> memory IC -> semiconductor hierarchy. Compared with DDR4, DDR5 improves speed, density, and power efficiency, and standardizes on-die ECC so that server-class data reliability can be maintained even in mainstream form factors. The JEDEC-standard DDR5 interface moves to two independent 32-bit sub-channels per DIMM, improving effective bandwidth and channel utilization.

The H5CG48AGBDX014 delivers 16Gb of density in a single x8 component, enabling high-capacity UDIMM, RDIMM, and soldered-down memory solutions. Its 1.1V VDD reduces per-bit energy versus 1.2V DDR4, while the 4800 Mbps speed grade supports mainstream server and desktop platforms. On-die ECC detects and corrects single-bit internal DRAM errors, reducing system-level soft-error exposure.

According to the SK hynix DDR5 e-Catalogue, SK hynix shipped the world's first DDR5 in a server solution, positioning this family for AI, big data, and cloud workloads. Typical applications include server main memory modules, high-performance desktops, embedded computing, networking appliances, and industrial systems migrating from DDR4.

Designers should note that DDR5 components require PMIC-managed power rails (on-module for DIMMs), on-die termination (ODT), and decision-feedback equalization (DFE) support at the memory controller, so BIOS/MRC and controller training sequences must be validated for the exact component speed bin.

This page adds value beyond the datasheet by consolidating drop-in cross-reference candidates, distributor pricing context, and sourcing guidance for the allocation-constrained DDR5 component market.

Drop-in-Alternativen für H5CG48AGBDX014 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit H5CG48AGBDX014 (gleiche Bauform und Footprint) – abweichend in Package, Density, Interface, Data Rate, RoHS Status.

SK hynix
Density: 16 Gb
Interface: DDR5 (JEDEC DDR5 SDRAM)
Data Rate: 5600 Mbps/pin
Vergleichen mit H5CG48AGBDX014 →
SK hynix
Package: FBGA (surface mount)
Density: 16 Gb
Interface: DDR5 (Double Data Rate 5)
Vergleichen mit H5CG48AGBDX014 →
SK hynix
Interface: DDR5 SDRAM interface
Data Rate: 5600 Mbps/pin (DDR5-5600)
RoHS Status: Compliant (per JLCPCB/LCSC listing)
Vergleichen mit H5CG48AGBDX014 →
SK hynix
Package: 78-ball FBGA
Density: 16 Gb (2G x 8)
Interface: DDR5, 2 independent 8-bit sub-channels
Vergleichen mit H5CG48AGBDX014 →
SK hynix
Package: FBGA-82
Density: 16 Gbit
Interface: DDR5 (Double Data Rate 5)
Vergleichen mit H5CG48AGBDX014 →
SK hynix
Package: 82-ball FCBGA (JEDEC DDR5 78/82-ball)
Density: 16 Gb (2G x 8)
Interface: JEDEC DDR5
Vergleichen mit H5CG48AGBDX014 →
SK hynix
Package: FBGA-82 (11 x 10 mm)
Density: 16 Gbit
RoHS Status: Compliant
Vergleichen mit H5CG48AGBDX014 →
SK hynix
Package: 78-ball FCBGA
Density: 16Gb (2G x 8)
Vergleichen mit H5CG48AGBDX014 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

H5CG48AGBDX018N

✅ Drop-In
SK hynix
📦 82-ball FBGA
DDR5 SDRAM · 16 Gb (2G x 8) · 2G x 8 · 5600 Mbps · 1.1 V · 8 bit · 82-ball FCBGA (JEDEC DDR5 78/82-ball) · Surface Mount

✓ Auf Lager

$87.42 / Stück

Datenblatt ansehen →

H5CG48AGBDX018

✅ Drop-In
SK hynix
📦 82-ball FBGA
DDR5 SDRAM · 16 Gbit · 2G x 8 · 5600 Mbps/pin (DDR5-5600) · 2800 MHz · 1.1 V · FBGA-82 · Surface Mount

✓ Auf Lager

$63.9844 / Stück

Datenblatt ansehen →

H5CG48MEBDX014N

✅ Drop-In
SK hynix
📦 82-ball FBGA
DDR5 SDRAM · 16 Gbit · 2G x 8 · 4800 Mbps · 1.1 V · 12 bits · 9 bits · M-die

✓ Auf Lager

$41.68 / Stück

Datenblatt ansehen →

H5CG48MEBDX018N

✅ Drop-In
SK hynix
📦 82-ball FBGA
DDR5 SDRAM · 16Gb (2G x 8) · 2G x 8 · 8 bit · 1.1 V · 78-ball FCBGA · Surface Mount

✓ Auf Lager

$1 / Stück

Datenblatt ansehen →

H5CG48AGBDX014 Grenzwerte & elektrische Eigenschaften

Manufacturer SK hynix
Product Type DDR5 SDRAM Component
Density 16Gb (2Gx8)
Speicherorganisation 2G x 8
Datenrate 4800 Mbps
Supply Voltage (VDD) 1.1 V
Error Correction On-die ECC (ODECC)
Gehäuse 82-ball FBGA
Schnittstellentyp DDR5 (double data rate, 5th generation)
Application Segment Server, mainstream PC, industrial
Configuration Target UDIMM / RDIMM / soldered-down
Termination On-die termination (ODT)
Montageart Surface Mount

H5CG48AGBDX014 82-ball fbga Pinbelegungsleitfaden

Pinbelegung für H5CG48AGBDX014 (82-ball fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für H5CG48AGBDX014 im 82-ball fbga-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für H5CG48AGBDX014.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

H5CG48AGBDX014 ist geeignet für 6 Anwendungs: Server Main Memory (RDIMM), High-Performance Desktop UDIMM, AI and Big Data Compute Nodes, Networking Appliances, Industrial Embedded Computing, Test and Measurement Systems.

🖥️

Server Main Memory (RDIMM)

The H5CG48AGBDX014 fits server main memory modules where per-bit power and error resilience dominate the design. Its 16Gb 2Gx8 organization lets one RDIMM rank reach 32GB with sixteen components, while DDR5-4800 at 1.1V cuts memory power versus comparable DDR4-3200 solutions. On-die ECC corrects internal single-bit errors, complementing RDIMM side-band ECC for full server reliability coverage. In the module, the component's 4800 Mbps bus connects through the registered clock driver and data buffers; the trade-off versus faster bins is lower peak bandwidth but better channel-margin and lower cost at scale. SK hynix positioned its DDR5 family for the AI and big-data era with the world's first DDR5 server solution.

🖥️

High-Performance Desktop UDIMM

For enthusiast and workstation desktops, the H5CG48AGBDX014 provides 16Gb per component, enabling 32GB single-rank UDIMMs with only sixteen chips and clean signal routing. The 2Gx8 organization with DDR5-4800 matches the JEDEC default speed support of mainstream desktop CPU memory controllers, guaranteeing out-of-the-box compatibility without overclocking profiles. Its 1.1V supply and ODECC reduce thermal load inside cramped desktop chassis, improving long-term retention reliability. In a UDIMM, the components connect directly to the 288-pin DDR5 edge connector; unlike RDIMMs there is no register, so trace-length matching and ODT settings from the memory controller directly govern achievable bus speed. Higher 5600 bins can be substituted where the platform supports them.

🖥️

AI and Big Data Compute Nodes

SK hynix introduced its DDR5 family explicitly to enable the era of AI and big data, and the H5CG48AGBDX014 contributes the memory capacity those workloads demand. Dense 16Gb components let 2U servers carry terabytes of main memory for in-memory analytics, model training data staging, and caching tiers between HBM/accelerator memory and storage. The DDR5 two-sub-channel architecture raises effective bandwidth utilization for the bursty access patterns typical of data pipelines, while 4800 Mbps per pin at 1.1V balances throughput against the aggressive power budgets of dense compute racks. On-die ECC keeps silent data corruption risk low across the large component counts such systems require.

🌐

Networking Appliances

Routers, switches, and security gateways need large packet buffers and flow tables that exceed what SRAM or embedded memory can economically provide. The H5CG48AGBDX014 supplies 16Gb of DDR5 per component with 4800 Mbps bandwidth, supporting line-rate processing in aggregation platforms while its 1.1V operation eases thermal design in fanless or constrained enclosures. In soldered-down configurations, two components provide 4GB of buffering directly on the control card, and the FBGA footprint keeps routing short between the network processor and memory. On-die ECC protects against soft errors during long-duty-cycle operation, an important consideration for telecom infrastructure targeting high availability service levels.

🏭

Industrial Embedded Computing

Industrial PCs, machine-vision controllers, and edge AI gateways migrating from DDR4 to DDR5 platforms use the H5CG48AGBDX014 for main memory. Its 16Gb density allows compact COM Express or SMARC carrier designs to reach 8-16GB with only four to eight components soldered directly on the module, improving vibration tolerance versus SO-DIMM sockets. DDR5-4800 at 1.1V delivers the bandwidth needed for multi-camera vision pipelines and local inference while lowering memory-rail power in passively cooled enclosures. Designers must confirm the component temperature grade matches the industrial ambient range and validate DDR5 controller training across the full temperature span, since training margins differ from DDR4 platforms.

🔧

Test and Measurement Systems

High-speed oscilloscopes, logic analyzers, and protocol testers require deep capture memory to retain long acquisitions at full sample rate. The H5CG48AGBDX014 provides 16Gb per component at DDR5-4800, giving instrument designers substantially more streaming depth per chip than DDR4-class parts, with on-die ECC safeguarding measurement record integrity during extended thermal soak. Banks of these components, organized across 64-bit or 128-bit buses, feed acquisition ASICs and FPGAs; the 82-ball FBGA supports the dense multichip layouts typical of acquisition memory boards. Because instrument platforms have long service lives, qualifying both the A-die and M-die (H5CG48MEBDX014N) variants protects against future allocation gaps.

What is the H5CG48AGBDX014?
The H5CG48AGBDX014 is an SK hynix 16Gb DDR5 SDRAM component organized as 2Gx8, rated at 4800 Mbps with 1.1V operation in an 82-ball FBGA package. It features on-die ECC (ODECC) and targets server, mainstream PC, and industrial memory designs, per distributor listings and SK hynix DDR5 family documentation.
What is the data rate and voltage of the H5CG48AGBDX014?
The H5CG48AGBDX014 operates at 4800 Mbps with a 1.1V supply, per Alibaba product listings for this exact MPN (H5CG48AGBDX014 DDR5 SDRAM 16Gb 2Gx8 DDR5-4800 1.1V ODECC 82-ball FBGA). The 1.1V rail is the JEDEC DDR5 standard VDD, lowering energy per bit versus the 1.2V of DDR4 and reducing memory subsystem power in server and desktop platforms.
How much memory does the H5CG48AGBDX014 provide?
The H5CG48AGBDX014 provides 16Gb (2 gigabytes) of DDR5 DRAM, organized as 2G words x 8 bits. Typical 32GB server modules use sixteen of these x8 components per rank across the 82-ball FBGA layout. When designing a module or soldered-down subsystem, verify the component's speed bin (4800 Mbps here) matches the memory controller's training requirements and the module SPD configuration.
Does the H5CG48AGBDX014 support ECC?
Yes, the H5CG48AGBDX014 supports on-die ECC (ODECC), which detects and corrects single-bit errors that occur inside the DRAM die itself. This is a standardized DDR5 feature, unlike DDR4 where server-grade reliability required side-band ECC bits at the module level. Note that ODECC protects internal data paths but does not replace link-level ECC (such as RDIMM side-band ECC) for bus errors; both are used together in server designs.
What package does the H5CG48AGBDX014 use?
The H5CG48AGBDX014 uses an 82-ball FBGA package, per Alibaba's listing for this MPN. Closely related SK hynix DDR5 components (such as the H5CG48AGBDX018N listed on LCSC) share the 82-ball FBGA (approximately 11 x 9.5 mm) footprint. The FBGA (fine-pitch ball grid array) format enables high-density module assembly with standard SMT reflow processes used in DRAM module manufacturing.
What is the best drop-in replacement for the H5CG48AGBDX014?
The closest drop-in replacement is the SK hynix H5CG48MEBDX014N, a newer M-die variant with the same 16Gb 2Gx8 organization, DDR5-4800 speed, and 82-ball FBGA footprint. Cross-reference analysis published for the DDR5 family confirms that A-die and M-die variants share identical ball assignments and mechanical dimensions, so solder stencils, routing, and placement programs work without modification. Always verify the speed bin suffix (014 = 4800) matches your controller requirements before substituting.
Is the H5CG48AGBDX014 compatible with H5CG48AGBDX018N designs?
The H5CG48AGBDX014 and H5CG48AGBDX018N share the same 82-ball FBGA package and 16Gb 2Gx8 organization, but they differ in speed bin: the 014 suffix denotes DDR5-4800 while the 018 suffix denotes DDR5-5600. For 4800 Mbps designs the parts are electrically interchangeable on the same PCB, but system BIOS/MRC memory training should be re-validated when changing speed bins, and the module SPD data must reflect the installed component's bin.
Where can I buy the H5CG48AGBDX014 and what is the price?
The H5CG48AGBDX014 is primarily sourced through RFQ channels and independent distributors, since DDR5 components in this class move through module-maker allocation rather than open distribution stock. For reference, the closely related H5CG48AGBDX018N lists around $87.42 (in stock at LCSC), and the LCSC-linked CJK listing shows approximately 535 CNY. XAIPART lists tier pricing from $92.50 at qty 1 down to $86.00 at qty 1000, as of 2026-09-05.
Is the H5CG48AGBDX014 in stock and what is the lead time?
Availability of the H5CG48AGBDX014 varies with current market turnover, demand from newer DDR5 programs, and remaining channel stock, as stated by sourcing specialist Source Memory Chips. DDR5 component allocation is managed by SK hynix toward major module customers, so channel lead times can range from in-stock RFQ fulfillment to several weeks. XAIPART reviews stock position and lead-time visibility before providing sourcing feedback - submit an RFQ for a firm quote.
H5CG48AGBDX014 vs H5CG48MEBDX014N - which is better for server memory?
For server memory, both deliver identical functionality: 16Gb, 2Gx8, DDR5-4800, 1.1V, on-die ECC, and the same 82-ball FBGA footprint. The H5CG48MEBDX014N is the newer M-die version, which typically offers better future supply continuity because active production has migrated to the M-die process. The A-die H5CG48AGBDX014 may offer better pricing on remaining channel stock. For new designs facing multi-year production, prefer the M-die; for short-run builds, the lower-cost available option wins.
When should I choose the H5CG48AGBDX014 over DDR4 components like the H5ANAG6NCMR-XNI?
Choose the H5CG48AGBDX014 when your platform requires DDR5: new server CPU generations (Intel Xeon Scalable 4th gen+, AMD EPYC 9004+), higher bandwidth per channel, or lower power per bit at 1.1V versus 1.2V DDR4. The 16Gb density also doubles per-component capacity versus most 8Gb DDR4 parts. Stick with DDR4 parts like the H5ANAG6NCMR series only when supporting legacy DDR4 platforms, since DDR5 components are not backward-compatible electrically or physically.
What is the best Micron equivalent for the H5CG48AGBDX014?
Micron's DDR5 16Gb x8 component family (MT62F-series) is the most frequently cited cross-brand equivalent class for SK hynix DDR5 chips, offering matching density, organization, speed bins, and FBGA footprints for module assembly. However, pin-to-pin equivalence between different DRAM vendors at the component level must be verified against both vendors' datasheets for the exact speed and temperature grade, and validated in your controller's memory training. XAIPART stocks Micron DDR5 components such as the MT62F1536M64D8EK-023 for module-level designs.
Where can I download the H5CG48AGBDX014 datasheet PDF?
The official SK hynix DDR5 component documentation, including datasheets, device operation manuals, and the part number decoder, is available through the SK hynix Downloads portal at product.skhynix.com/support/downloads.go. SK hynix gates detailed DDR5 datasheets behind business registration in some regions; Source Memory Chips also hosts an H5CG48AGBDX014 datasheet download page. Never design from third-party summaries - obtain the official component datasheet revision matching your exact speed/temp code.
What are the key specifications of the H5CG48AGBDX014 that engineers should know?
Key H5CG48AGBDX014 specifications: 16Gb DDR5 SDRAM density in a 2Gx8 organization; 4800 Mbps data rate (DDR5-4800 speed bin); 1.1V VDD supply per JEDEC DDR5; on-die ECC (ODECC); 82-ball FBGA package; surface-mount assembly for DIMM and soldered-down designs; targeting server, mainstream PC, and industrial segments. The 014 suffix encodes the 4800 speed bin per the SK hynix part number decoder. These parameters determine module SPD programming, controller training settings, and PCB stackup decisions.
Is the H5CG48AGBDX014 suitable for industrial embedded designs?
Yes. Source Memory Chips notes the H5CG48AGBDX014 is commonly considered for server, embedded, and performance-oriented designs moving beyond older DDR4 platforms. Industrial suitability depends on verifying the component's operating temperature grade against your enclosure environment and confirming your processor's DDR5 controller supports the 4800 speed bin with ODECC. For harsh environments, consider industrial-temperature SK hynix DDR5 variants and validate the FBGA solder-joint reliability under your thermal cycling profile.

Technische Referenzdaten für H5CG48AGBDX014 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the H5CG48AGBDX014 when your DDR5 platform targets the JEDEC 4800 Mbps baseline and you want maximum controller compatibility with A-die channel pricing - ideal for mainstream server RDIMMs, desktop UDIMMs, and industrial boards. Choose the H5CG48AGBDX018N or H5CG48MEBDX018N when your memory controller is validated for DDR5-5600 and you need the extra bandwidth. Choose the H5CG48MEBDX014N for new multi-year-lifecycle designs where supply continuity from the newer M-die process outweighs a possible small price premium - it is a verified same-footprint drop-in. Avoid this component entirely for DDR4 platforms; use SK hynix H5ANAG6/H5ANAG8 DDR4 components instead, since DDR5 is not backward-compatible electrically or mechanically. Always decode the full ordering code via the SK hynix part number decoder to confirm speed and temperature grade before BOM release.

Vergleich mit Alternativen

Parameter Dieses Produkt H5CG48AGBDX018N H5CG48MEBDX014N H5CG48MEBDX018N
Brand SK hynix SK hynix SK hynix SK hynix
Package 82-ball FBGA 82-ball FBGA - same 82-ball FBGA - same 82-ball FBGA - same
Density 16Gb 16Gb 16Gb 16Gb
Organization 2G x 8 2G x 8 2G x 8 2G x 8
Data Rate 4800 Mbps 5600 Mbps 4800 Mbps 5600 Mbps
Supply Voltage 1.1 V 1.1 V 1.1 V 1.1 V
On-die ECC Yes (ODECC) Yes (ODECC) Yes (ODECC) Yes (ODECC)
Die Generation A-die A-die M-die (newer process) M-die (newer process)
Primary Segments Server, mainstream PC, industrial Server, PC, industrial Server, PC, industrial Server, PC, industrial

Wichtigste Unterscheidungsmerkmale

  • Lower platform power at DDR5 standard voltage (vs. H5ANAG6NCMR-XNI (DDR4))
  • Cost-effective entry speed bin (vs. H5CG48AGBDX018N)
  • A-die channel stock availability (vs. H5CG48MEBDX014N)

Designhinweise

DDR5-4800 operation requires careful fly-by command/address routing with per-byte data-mask (DBI) and DQS differential pairs length-matched within tight tolerances. On UDIMM and soldered-down designs, follow the SK hynix DDR5 device operation documentation for ODT and write-levelization settings. The DDR5 DFE (decision feedback equalization) on the DRAM side must be enabled and trained by the controller - do not assume DDR4 training routines port over; budget firmware bring-up time for DDR5 memory-training validation across process, voltage, and temperature corners.

The H5CG48AGBDX014 runs on the DDR5-standard 1.1V VDD rail, but DDR5 systems also require VDDQ (1.1V) and VPP (1.8V) rails. On DIMM designs, DDR5 moves the PMIC onto the module itself, so select a module PMIC rated for the total load of sixteen 16Gb components. On soldered-down boards, provide clean 1.1V rails with bulk and high-frequency decoupling close to each component, and verify rail sequencing per the DDR5 specification before releasing power-tree design.

The '014' suffix in the MPN encodes the 4800 Mbps speed bin - substituting an 018N (5600) part is footprint-compatible but changes SPD content and controller training targets, while substituting a slower bin is not possible. Also verify die revision (A-die vs M-die) acceptance in platform qualified-vendor lists, since some server BIOS/MRC releases whitelist specific die revisions. Obtain the official SK hynix part number decoder from the downloads portal to decode the full ordering code including temperature grade before committing a BOM.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Compliance data not present in the provided verified web data; consult the official SK hynix datasheet and product compliance documentation.

Daten verifiziert am: 2026-09-05 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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SK hynix H5CG48AGBDX014 H5CG48AGBDX018N H5CG48MEBDX014N H5CG48MEBDX018N DDR5 SDRAM DRAM memory IC double data rate DRAM ODECC on-die ECC 82-ball FBGA FBGA surface mount DDR5-4800 1.1V VDD on-die termination JEDEC RDIMM UDIMM server memory AI and big data compute PMIC decision feedback equalization SPD
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