H5CG48MEBDX018N - DDR5 16Gb SDRAM FCBGA | SK Hynix
MPN: H5CG48MEBDX018N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $1 | $10.00 |
| 100 | $1 | $100.00 |
| 500 | $1 | $500.00 |
| 1,000 | $1 | $1,000.00 |
Drop-in alternatives for H5CG48MEBDX018N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5CG48AGBDX018N
✅ Drop-In✓ In Stock
$87.42 / Unit
View Datasheet →H5CG48AEBDX018N
✅ Drop-In📋 Reference alternative (not in catalog)
H5CG48MEBDX014N
✅ Drop-In✓ In Stock
$41.68 / Unit
View Datasheet →H5CG48AGBDX014N
✅ Drop-In✓ In Stock
$70 / Unit
View Datasheet →H5CG46AGBDX017N
✅ Drop-In✓ In Stock
$91.73 / Unit
View Datasheet →H5CG48MEBDX018N Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Density | 16Gb (2G x 8) |
| Organization | 2G x 8 |
| Bus Width | 8 bit |
| Supply Voltage | 1.1 V |
| Package | 78-ball FCBGA |
| Mounting Type | Surface Mount |
| Die Generation | M-die (family: A-die and M-die variants exist) |
| Operating Temperature | 0C to +95C (LCSC listing for M-die family part) |
| Interface Type | DDR5 parallel |
| On-Die ECC | Yes (DDR5 standard feature) |
H5CG48MEBDX018N 78-ball fcbga Pin Configuration Guide
Complete pinout information for H5CG48MEBDX018N (78-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5CG48MEBDX018N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG48MEBDX018N is suitable for 6 applications: PC and Workstation Main Memory, Server and Data Center RDIMM Modules, Embedded Computing Modules, Industrial Controllers and Automation, Networking and Communication Equipment, Consumer Electronics and Set-Top Platforms.
PC and Workstation Main Memory
The H5CG48MEBDX018N serves as a core building block for desktop and workstation DDR5 memory subsystems, where its 16Gb 2G x 8 organization lets a two-module 32GB kit use sixteen x8 devices across both sides of two UDIMMs. At a 1.1V VDD with on-die ECC, the part reduces per-bit power versus DDR4-3200 at comparable bandwidth, and its 78-ball FCBGA footprint matches the standard DDR5 x8 component ball map used by module designers. Performance consideration: memory-controller training firmware must support the M-die generation; systems validated on A-die parts (H5CG48AGBDX018N, DDR5-5600) typically require a BIOS update or timing-table addition to train M-die components reliably at the target bin.
Recommended
Server and Data Center RDIMM Modules
In data center servers, 16Gb x8 DDR5 components such as the H5CG48MEBDX018N populate RDIMM and LRDIMM modules where capacity per socket drives virtualization density. The DDR5 architecture moves the PMIC onto the module and increases bank groups, letting 16Gb x8 parts sustain higher effective bandwidth than DDR4-3200 x8 predecessors at roughly 20% lower standby power per bit. The device's on-die ECC reduces uncorrectable-bit risk in high-population deployments. Design consideration: registered clock drivers (e.g., a DDR5 RCD companion IC) generate the CA bus for all x8 components on the module, so substituting this M-die part requires the RCD and SPD firmware tables to include its die generation and speed bin for reliable training at 4800-5600 Mbps.
Recommended
Embedded Computing Modules
Embedded computing modules (COM Express, SMARC, and custom SBCs) use soldered-down 16Gb DDR5 components like the H5CG48MEBDX018N to achieve 2-4GB RAM per x8 device without SO-DIMM sockets, improving vibration tolerance and reducing profile. The 78-ball FCBGA package supports standard DDR5 fly-by or point-to-point routing; in point-to-point designs the memory controller can train this part directly. Its 1.1V rail simplifies power-tree design with a single DDR5 PMIC. Trade-off: soldered DRAM is not field-upgradable, so multi-sourcing at layout time - qualifying both this M-die part and the A-die H5CG48AGBDX018N on the same land pattern - protects against allocation gaps documented across the DDR5 supply chain in 2026.
Recommended
Industrial Controllers and Automation
Industrial programmable controllers, vision systems, and edge gateways need DRAM capacity for frame buffers and real-time data logging, making the 16Gb H5CG48MEBDX018N a fit where eMMC alone is too slow for working memory. The LCSC family listing specifies 0C to +95C operation, covering most factory-floor enclosures with forced or convection cooling. On-die ECC improves data integrity in electrically noisy environments, and the 1.1V FCBGA package keeps thermal density manageable: at typical DDR5-4800 active currents, a four-device bank dissipates on the order of 2-4W total (estimate based on family-class power figures, not a datasheet value for this MPN). Verify conduction cooling and copper pour under the BGA land pattern for sustained 85C ambient applications.
Recommended
Networking and Communication Equipment
Enterprise switches, routers, and 5G small-cell platforms use banks of 16Gb DDR5 x8 components such as the H5CG48MEBDX018N as packet-buffer and control-plane memory for network processors and CPUs. The 8-bit bus organization allows wide, flexibly banked subsystems (e.g., eight devices forming a 64-bit plus ECC channel), and DDR5's on-die ECC plus controller-side link ECC address the soft-error sensitivity of high-density packet buffers. Bandwidth at the family's 4800-5600 Mbps bins supports multi-gigabit line-rate forwarding with headroom. Design consideration: long fly-by traces on switch boards benefit from the DDR5 DFE and equalization on this generation; confirm the SoC memory-reference code includes M-die training profiles before layout release.
Recommended
Consumer Electronics and Set-Top Platforms
Smart TV SoCs, set-top boxes, and gaming peripherals deploy soldered 16Gb DDR5 components to reach 4-8GB unified memory in minimal board area, and the H5CG48MEBDX018N's 78-ball FCBGA and 1.1V supply match these cost- and power-sensitive designs. DDR5's lower VDD reduces standby power, a key metric for always-on consumer devices, while 4800-5600 Mbps bins give SoC integrators frequency options for cost-tiered product lines using one PCB footprint. Supply-chain note: consumer DRAM demand swings create allocation; the validated M-die/A-die interchangeability (documented in the April 2026 cross-reference guidance) lets consumer OEMs alternate between H5CG48MEBDX018N, H5CG48MEBDX014N, and H5CG48AGBDX018N as spot availability shifts, provided firmware training tables cover both die generations.
Recommended
Recommended Products Summary
Engineering reference data for H5CG48MEBDX018N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG48AGBDX018N | H5CG48AEBDX018N | H5CG48MEBDX014N | H5CG48AGBDX014N |
|---|---|---|---|---|---|
| Package | 78-ball FCBGA | 78-ball FCBGA - same | 78-ball FCBGA - same | 78-ball FCBGA - same | 78-ball FCBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density / Organization | 16Gb / 2G x 8 | 16Gb / 2G x 8 | 16Gb / 2G x 8 | 16Gb / 2G x 8 | 16Gb / 2G x 8 |
| Data Rate | [DATA_NEEDED] | 5600 Mbps | 5600 Mbps | 4800 Mbps | 4800 Mbps |
| Die Generation | M-die | A-die | A-die | M-die | A-die |
| Supply Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0C to +95C (family listing) | 0C to +85C (family listing) | [DATA_NEEDED] | 0C to +85C (family listing) | [DATA_NEEDED] |
| Availability (as of 2026-08/09) | [DATA_NEEDED] | 31,250 pcs (icDirectory, Aug 31, 2026); 1,509 pcs LCSC | [DATA_NEEDED] | Out of stock at LCSC; 17,920 pcs (Octopart CA) | [DATA_NEEDED] |
Key Differentiators
- M-die supply-resilience generation (vs H5CG48AGBDX018N)
- Identical footprint across die generations (vs H5CG48AEBDX018N)
- Trade-off: lower proven speed-bin availability than A-die (vs H5CG48AGBDX018N)
Design Notes
DDR5 x8 components require per-byte DQS timing and read/write training at the memory controller. When substituting between A-die (H5CG48AGBDX018N) and M-die parts on the same 78-ball FCBGA footprint, confirm the SoC or RCD firmware includes training profiles for both die generations; published cross-reference guidance notes that M-die parts are validated drop-ins for A-die only after controller support is confirmed. Maintain matched trace lengths within a byte lane and follow the DDR5 fly-by CA routing rules from the platform design guide.
The device runs from a 1.1V VDD (plus VDDQ rails per DDR5 specification). For soldered-down banks of four or more devices, budget power using the datasheet IDD currents for the specific speed bin, and place the DDR5 PMIC (with per-rail sense lines) close to the DRAM bank to control droop during simultaneous read/write bursts. Estimated: a four-device bank at DDR5-4800-class active currents dissipates roughly 2-4W total; verify against the actual datasheet IDD values rather than this estimate for thermal sign-off.
The 78-ball FCBGA needs a land pattern per the manufacturer datasheet ball map and an adequate via-in-pad or dog-bone escape strategy on 0.8mm-class ball pitch. Place a solid return plane directly under the DRAM bank, keep DQ/DQS routing on layers adjacent to that plane, and provide multiple GND balls to plane connections with short, wide vias. For thermal reliability above 2W per device, extend copper pour on the board side beneath the BGA; DRAM BGAs have no exposed thermal pad, so heat exits primarily through the balls.
Do not assume all H5CG48 suffixes are interchangeable in timing: the 014N suffix denotes DDR5-4800 while 018N corresponds to a faster bin, and mixing bins on a shared memory channel forces the entire channel to the slowest common bin. Also confirm the operating temperature grade of your exact MPN - LCSC lists 0C to +95C for one family member but 0C to +85C for another - before deploying in enclosed industrial environments.
Compliance Information
Compliance status not stated in the provided web data; request manufacturer compliance certificates from SK Hynix for the exact MPN.
