H5CG48MEBDX014N - DDR5 16Gb 4800Mbps SDRAM | SK Hynix
MPN: H5CG48MEBDX014N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $52.1 | $52.10 |
| 10 | $49.49 | $494.90 |
| 100 | $46.89 | $4,689.00 |
| 500 | $44.29 | $22,145.00 |
| 1,000 | $41.68 | $41,680.00 |
Drop-in alternatives for H5CG48MEBDX014N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5CG48MEBDX018N
✅ Drop-In✓ In Stock
$1 / Unit
View Datasheet →H5CG48AGBDX014N
✅ Drop-In✓ In Stock
$70 / Unit
View Datasheet →H5CG48AGBDX018N
✅ Drop-In✓ In Stock
$87.42 / Unit
View Datasheet →H5CG48AGBDX014
✅ Drop-In✓ In Stock
$86 / Unit
View Datasheet →H5CG46AGBDX017N
✅ Drop-In✓ In Stock
$91.73 / Unit
View Datasheet →K4RAH086VB-BCQK
✅ Drop-In✓ In Stock
$6.75 / Unit
View Datasheet →H5CG48MEBDX014N Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM |
| Density | 16 Gbit |
| Organization | 2G x 8 |
| Data Rate | 4800 Mbps |
| Supply Voltage | 1.1 V |
| Row Address | 12 bits |
| Column Address | 9 bits |
| Die Generation | M-die |
| Operating Temperature | 0C to +95C |
| Package | FBGA-82 (11 x 10 mm) |
| Mounting Type | Surface Mount |
| Interface Type | Parallel, DDR5 |
| Memory Class | Synchronous DRAM |
| RoHS Status | Compliant |
| Speed Class | DDR5-4800 (PC5) |
H5CG48MEBDX014N fbga-82 (11 x 10 mm) Pin Configuration Guide
Complete pinout information for H5CG48MEBDX014N (fbga-82 (11 x 10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5CG48MEBDX014N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG48MEBDX014N is suitable for 6 applications: Server and Datacenter DIMMs, AI Accelerator and HPC Boards, Desktop and Workstation UDIMMs, Industrial and Embedded Computing, Networking and Telecommunications Equipment, Consumer Electronics and Smart Devices.
Server and Datacenter DIMMs
Server main memory is the primary application for the H5CG48MEBDX014N. Its x8 organization enables ECC-based RDIMM/LRDIMM designs where each memory symbol maps to a single device, delivering chipkill-class fault coverage for cloud and enterprise platforms. The DDR5-4800 speed bin aligns with current Intel Xeon and AMD EPYC memory specifications, while the 1.1 V operation lowers per-module power versus DDR4, reducing datacenter cooling load. The device is soldered onto module PCBs with length-matched fly-by command/address routing and onboard PMIC voltage conversion; the 16 Gb density allows 32 GB and 64 GB module capacity points with fewer devices per rank.
Recommended
AI Accelerator and HPC Boards
AI training and inference boards use DDR5 as high-capacity host-side memory feeding accelerators, where the H5CG48MEBDX014N's 16 Gbit density and 4800 Mbps rate provide the bandwidth needed for model weights and activation buffers. According to the HTElec DDR5 comparison guide, this part class is explicitly targeted at AI computing and high-performance embedded designs. In these boards, multiple x8 devices form wide 288-bit (ECC-protected) buses; the split VDD/VDDQ rails and on-die termination of DDR5 maintain signal integrity at 4800 MT/s across long PCB traces typical of accelerator form factors.
Recommended
Desktop and Workstation UDIMMs
Consumer and workstation UDIMMs use H5CG48MEBDX014N-class DDR5 devices to reach 16 GB, 32 GB, and 48 GB capacity points at DDR5-4800 speeds. The 1.1 V core voltage and DDR5's on-module PMIC simplify board power design, while x8 organization supports ECC on workstation platforms. In UDIMM assembly, the FBGA-82 devices are mounted on both sides of the PCB with fly-by CA routing; the 0C to +95C operating range covers standard desktop thermal envelopes. Its 4800 Mbps bin matches the memory specifications of mainstream desktop CPUs, making it a high-volume choice for PC OEM module builders.
Recommended
Industrial and Embedded Computing
Industrial controllers, edge servers, and network appliances embed DDR5 SO-DIMMs or solder-down memory using parts like the H5CG48MEBDX014N for high-bandwidth data logging, machine vision, and protocol processing. Alibaba listings for this MPN cite industrial control and telecommunications among target uses. The 16 Gbit density allows compact single-device SO-DIMM designs, and DDR5's lower 1.1 V operation reduces thermal design constraints in fanless enclosures. Designers should validate the 0C to +95C operating range against enclosure temperatures and derate bandwidth accordingly in sustained-traffic industrial workloads.
Recommended
Networking and Telecommunications Equipment
Routers, switches, and 5G baseband cards require large, fast working memory for packet buffering, flow tables, and control planes, making the H5CG48MEBDX014N a fit for networking line-card designs. Its 4800 Mbps rate supplies the random-access bandwidth needed for high packet-per-second processing, while the 16 Gbit density supports deep buffer scenarios in aggregation and core platforms. Broker channels serving telecom OEMs list this MPN for line-card memory upgrades. In these designs, x8 devices with ECC provide the reliability demanded by carrier-grade uptime requirements, and DDR5 refresh enhancements keep effective bandwidth high under load.
Recommended
Consumer Electronics and Smart Devices
Premium consumer electronics - smart TVs, gaming peripherals, set-top boxes, and mini PCs - integrate DDR5 components such as the H5CG48MEBDX014N where the 16 Gbit single-device density enables compact main-memory subsystems. Wolfchip product documentation lists consumer electronics and computing devices among the target applications for this DRAM. The 1.1 V operation meets energy-efficiency expectations of modern consumer platforms, and the FBGA-82 footprint is compatible with cost-optimized 4-layer module PCBs. Designers benefit from DDR5's improved power management architecture, which shifts regulation to a low-cost PMIC and reduces board-level voltage rail count.
Recommended
Recommended Products Summary
Engineering reference data for H5CG48MEBDX014N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG48MEBDX018N | H5CG48AGBDX014N | H5CG48AGBDX018N | K4RAH086VB-BCQK |
|---|---|---|---|---|---|
| Package | FBGA-82 (11x10 mm) | FBGA-82 (11x10 mm) - same | FBGA-82 (11x10 mm) - same | FBGA-82 (11x10 mm) - same | FBGA-82 (11x10 mm) - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Density | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit | 16 Gbit |
| Data Rate | 4800 Mbps | 4800 Mbps family, faster speed suffix | 4800 Mbps | 4800 Mbps family, faster speed suffix | 4800 Mbps class |
| Die Generation | M-die | M-die | A-die | A-die | [DATA_NEEDED] |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | [DATA_NEEDED] |
| Unit Price (qty 1) | $52.10 (as of 2026-09-05) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lower-risk availability via M-die second generation (vs H5CG48AGBDX018N)
- Faster-bin upgrade path within identical footprint (vs H5CG48MEBDX018N)
- JEDEC-standard FBGA-82 enables cross-brand dual sourcing (vs K4RAH086VB-BCQK)
Design Notes
DDR5-4800 signaling demands strict fly-by routing of command/address lines with per-byte DQ/DM/DQS length matching per the DDR5 DIMM design guides. Keep DQ trace skew within the controller's training window, use on-die termination settings from the manufacturer datasheet, and simulate eye diagrams at 4800 MT/s on your PCB stackup. Multi-rank configurations amplify stub effects, so validate with full-population modules before locking the layout.
The H5CG48MEBDX014N runs on a 1.1 V core with separate VDD and VDDQ domains per DDR5 architecture. On module designs, generate the 1.1 V rail with a dedicated PMIC (12 V auxiliary input on standard DIMMs). Decouple each supply ball with an array of ceramic capacitors placed within a few millimeters; DDR5 burst currents at 4800 MT/s create high di/dt events that demand low-inductance power delivery to avoid droop-triggered refresh retries.
When substituting M-die for A-die parts (e.g., H5CG48MEBDX014N for H5CG48AGBDX018N), retrain memory on first boot: SPD data, timing tables, and equalization presets differ between die generations even within the same footprint. Counterfeit risk is documented in the broker channel (mislabeled parts failing above 4400 MT/s per community reports), so buy from authorized distributors and verify date codes and speed bins by test.
Compliance Information
JLCPCB lists the H5CG48MEBDX014N as ROHS compliant. Other compliance attributes not stated in provided data.
