K4B4G1646D-BCMA0 - 4Gb DDR3 SDRAM 256Mx16 | Samsung
Teilenummer: K4B4G1646D-BCMA0 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.8 | $78,00 |
| 100 | $7.2 | $720,00 |
| 500 | $6.5 | $3.250,00 |
| 1.000 | $5.9 | $5.900,00 |
K4B4G1646D-BCMA0 Übersicht
DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random Access Memory) is a type of volatile memory that transfers data on both edges of the clock, doubling the data rate compared to DDR2. It features a prefetch buffer of 8n, enabling high bandwidth while operating at lower voltages (1.5V) than previous generations. DDR3 is widely used in PCs, servers, and embedded systems where high speed and capacity are required.
Key features include a 256M x 16 organization, 1866 Mbps data rate, and 1.5V supply voltage. The device supports auto precharge, asynchronous reset, ZQ calibration, data mask, and dynamic on-chip termination (DTC), enhancing signal integrity and system reliability. The 96-ball FBGA package provides a compact footprint suitable for space-constrained designs.
Technically, the K4B4G1646D-BCMA0 utilizes Samsung's advanced DRAM process technology, ensuring low power consumption and high-speed operation. The D-die revision offers improved timing margins and reduced latency compared to earlier dies. The device operates over a temperature range of 0°C to 85°C, making it suitable for commercial and industrial applications.
Typical applications include main memory in laptops and desktops, networking equipment such as routers and switches, and embedded systems like set-top boxes and industrial controllers. Its high density and speed make it ideal for applications requiring large memory footprints and fast data access.
When designing with this component, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The device is RoHS compliant and halogen-free, meeting environmental standards.
Drop-in-Alternativen für K4B4G1646D-BCMA0 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit K4B4G1646D-BCMA0 (gleiche Bauform und Footprint) – abweichend in Package, Supply Voltage, Memory Type, Memory Size, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
K4B4G1646D-BCMA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K4B4G1646D-BFMA
✅ Drop-In✓ Auf Lager
$6.5 / Stück
Datenblatt ansehen →K4B4G1646D-BYMA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
K4B4G1646E-BMMA
✅ Drop-In✓ Auf Lager
$16.0781 / Stück
Datenblatt ansehen →MT41K256M16HA-125
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.3636 / Stück
Datenblatt ansehen →K4B4G1646D-BCMA0 Grenzwerte & elektrische Eigenschaften
| Speichertyp | DDR3 SDRAM |
| Speichergröße | 4 Gb |
| Speicherorganisation | 256M x 16 |
| Datenrate | 1866 Mbps |
| Versorgungsspannung | 1.5 V |
| Betriebstemperatur | 0°C to 85°C |
| Gehäuse | 96-FBGA |
| Montageart | Surface Mount |
| Memory Interface | Parallel |
| RoHS | Compliant |
| Halogenfrei | Yes |
| Lead Free | Yes |
| Lebenszyklusstatus | EOL |
| Technology | DDR3 |
| Number of Terminals | 96 |
K4B4G1646D-BCMA0 Pin-Konfiguration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
Typische Anwendungen
K4B4G1646D-BCMA0 ist geeignet für 6 Anwendungs: Laptop and Desktop Memory, Networking Equipment, Embedded Systems, Consumer Electronics, Industrial Automation, Medical Devices.
Laptop and Desktop Memory
The K4B4G1646D-BCMA0 provides 4Gb DDR3-1866 memory for laptops and desktops, offering high bandwidth for multitasking and multimedia. Its 256Mx16 organization suits dual-channel configurations, and the 1.5V operation reduces power consumption. When used as main memory, it interfaces with the CPU's memory controller via a parallel bus, requiring careful signal integrity design. The 96-FBGA package allows compact module designs, and the 1866 Mbps data rate supports fast application loading and smooth system performance.
Empfohlen
Networking Equipment
In routers and switches, the K4B4G1646D-BCMA0 serves as packet buffer memory, handling high-throughput data. Its 1866 Mbps speed and 4Gb capacity enable efficient packet processing and forwarding. The device's auto precharge and ZQ calibration features improve signal integrity in high-speed designs. Placed on the PCB near the network processor, it requires proper termination and decoupling to maintain signal quality. The commercial temperature range supports typical networking environments, and the FBGA package aids in thermal management.
Empfohlen
Embedded Systems
The K4B4G1646D-BCMA0 is ideal for embedded systems like set-top boxes and industrial controllers, providing reliable memory for firmware and data storage. Its 4Gb density and 256Mx16 organization offer ample space for applications, while the 1.5V supply minimizes power draw. The device's dynamic on-chip termination (DTC) simplifies PCB layout by reducing external components. Operating from 0°C to 85°C, it suits most industrial environments. The FBGA package's small footprint is advantageous in space-limited designs.
Empfohlen
Consumer Electronics
In consumer devices like smart TVs and gaming consoles, the K4B4G1646D-BCMA0 provides high-speed memory for graphics and application processing. Its 1866 Mbps data rate supports smooth video playback and responsive user interfaces. The 4Gb capacity allows multiple applications to run concurrently. The device's low operating voltage contributes to energy efficiency, important for battery-powered or energy-conscious products. The FBGA package enables slim device designs, and the RoHS compliance meets environmental standards.
Empfohlen
Industrial Automation
The K4B4G1646D-BCMA0 is used in industrial automation for data logging and real-time control. Its 4Gb capacity stores process data, while the 1866 Mbps speed ensures quick access. The device's robustness over 0°C to 85°C makes it suitable for factory floors. With features like auto precharge and ZQ calibration, it maintains reliable operation in noisy environments. The FBGA package's thermal characteristics help dissipate heat in enclosed cabinets. Proper ESD protection is recommended in industrial settings.
Empfohlen
Medical Devices
In medical devices such as patient monitors and diagnostic equipment, the K4B4G1646D-BCMA0 provides reliable memory for data acquisition and processing. Its 4Gb density supports large datasets, and the 1866 Mbps speed enables real-time analysis. The device's low power consumption is beneficial for portable devices. Operating within 0°C to 85°C, it meets typical medical environment requirements. The FBGA package allows compact device designs, and RoHS compliance ensures safety. Signal integrity is critical in medical applications, so follow layout guidelines.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für K4B4G1646D-BCMA0 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | K4B4G1646D-BCMA | K4B4G1646D-BFMA | K4B4G1646D-BYMA | K4B4G1646E-BMMA | MT41K256M16HA-125 |
|---|---|---|---|---|---|---|
| Package | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- High data rate of 1866 Mbps (vs. MT41K256M16HA-125)
- Samsung D-die reliability (vs. K4B4G1646E-BMMA)
- RoHS and halogen-free compliance (vs. MT41K256M16HA-125)
Designhinweise
Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise. Use a solid ground plane and route data lines with matched lengths to ensure signal integrity at 1866 Mbps. Follow the layout guidelines in the Samsung datasheet for the 96-FBGA package.
The K4B4G1646D-BCMA0 operates up to 85°C. Ensure adequate airflow or a thermal pad to dissipate heat in high-density designs. The FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. In enclosed systems, add ventilation or heatsinks if necessary.
Do not exceed the absolute maximum ratings for VDD (1.575V) and VDDQ. Ensure proper termination for DQ and DQS signals to prevent reflections. The device is EOL, so verify availability and consider alternative parts for new designs. Also, ensure the memory controller supports DDR3-1866 timing.
Compliance-Informationen
RoHS compliant and halogen-free per datasheet. REACH and conflict minerals status not specified in provided data.
