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Samsung Electronics

K4A8G165WB-BIRC - 8Gb DDR4 SDRAM x16 2400Mbps | Samsung

Teilenummer: K4A8G165WB-BIRC ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.2 V Vdss 96-FBGA Package DDR4 SDRAM Memory
Ab $32.5 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-05
Mengenpreise
Menge Stückpreis Gesamt
1 $40.78 $40,78
10 $38.5 $385,00
100 $36.2 $3.620,00
500 $34 $17.000,00
1.000 $32.5 $32.500,00
ℹ️ Alle Preise sind in USD

K4A8G165WB-BIRC Übersicht

The Samsung K4A8G165WB-BIRC is a high-performance 8Gb DDR4 SDRAM organized as 512M x 16, operating at a speed of 2400 Mbps (PC4-19200) with a supply voltage of 1.2V. It is housed in a 96-ball FBGA package, designed for space-constrained applications requiring high memory density and bandwidth. This B-die DDR4 device supports a temperature range of -40°C to +95°C, making it suitable for industrial and automotive environments.

DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is the fourth generation of DDR memory, offering higher speed and lower power consumption compared to DDR3. It achieves data rates up to 3200 Mbps and operates at 1.2V, reducing power by 25% compared to DDR3's 1.5V. DDR4 is a critical component in modern computing, networking, and embedded systems, providing the high bandwidth needed for processors, AI accelerators, and high-speed data processing.

Key features of the K4A8G165WB-BIRC0 include a 2400 Mbps data rate, 8Gb density, and a 512M x 16 organization. The device supports on-die termination (ODT), programmable read/write latency, and burst length of 8, ensuring signal integrity and efficient data transfer. Its 96-ball FBGA package offers a compact footprint, and the -40°C to +95°C operating temperature range enables use in harsh environments.

Technically, this DDR4 SDRAM utilizes Samsung's advanced B-die process technology, which provides excellent timing margins and overclocking headroom. The device features a 1.2V core and I/O supply, with an on-chip ECC option (not available on this variant) and a pseudo-open-drain interface. It supports a burst length of 8 and a burst chop of 4, with programmable CAS latency (CL) values of 15, 16, and 17 cycles at 2400 Mbps.

Typical applications include high-performance computing, servers, networking equipment, industrial automation, and automotive infotainment systems. Its high density and speed make it ideal for memory-intensive tasks such as real-time data processing, AI inference, and high-resolution graphics.

When designing with this component, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 2400 Mbps. The device requires a stable 1.2V supply and a reference voltage (VREF) for optimal operation.

Drop-in-Alternativen für K4A8G165WB-BIRC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

K4A8G165WC-BCRC

Samsung Electronics
DDR4 SDRAM · 8 Gb · 512M x 16 · 2400 Mbps · 1.2 V (1.14V to 1.26V) · 2.5 V · 0°C to +95°C (case) · 96-ball FBGA (9mm x 13mm)

✓ Auf Lager

$23 / Stück

Datenblatt ansehen →

H5TC4G63AFR-PBA

SK hynix
DDR3L SDRAM · 4Gb · 256M x 16 · 1.35V · 1866 Mbps (PC3L-14900) · 96-ball FBGA · 0.8mm · 8

✓ Auf Lager

$3.9773 / Stück

Datenblatt ansehen →

K4A8G165WB-BIRG

Same package and pinout, different speed/temperature suffix

📋 Referenzalternative (nicht im Katalog)

K4A8G165WB-BIRH

Same package and pinout, different speed/temperature suffix

📋 Referenzalternative (nicht im Katalog)

MT40A1G8SA-075E:B:A

Cross-brand, 1Gb density (different capacity)

📋 Referenzalternative (nicht im Katalog)

K4A8G165WB-BIRC Grenzwerte & elektrische Eigenschaften

Speichertyp DDR4 SDRAM
Density 8 Gb
Speicherorganisation 512M x 16
Datenrate 2400 Mbps
Versorgungsspannung 1.2 V
Betriebstemperatur -40°C to +95°C
Gehäuse 96-FBGA
CAS-Latenz 15, 16, 17
Burst Length 8 (BL8) and 4 (BC4)
Schnittstelle Pseudo-open-drain
On-Die Termination Yes
Refresh Auto-refresh and self-refresh
Row Address 16K
Column Address 1K
RoHS Compliant

K4A8G165WB-BIRC Pin-Konfiguration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 VDD — Power supply
Pin A2 DQ0 — Data input/output 0
Pin A3 DQ1 — Data input/output 1
Pin A4 VSS — Ground
Pin A5 DQ2 — Data input/output 2
Pin A6 DQ3 — Data input/output 3
Pin A7 VDD — Power supply
Pin A8 DQ4 — Data input/output 4
Pin A9 DQ5 — Data input/output 5
Pin A10 VSS — Ground
Pin A11 DQ6 — Data input/output 6
Pin A12 DQ7 — Data input/output 7
Pin A13 VDD — Power supply
Pin A14 DQ8 — Data input/output 8
Pin A15 DQ9 — Data input/output 9
Pin A16 VSS — Ground
Pin A17 DQ10 — Data input/output 10
Pin A18 DQ11 — Data input/output 11
Pin A19 VDD — Power supply
Pin A20 DQ12 — Data input/output 12
Pin A21 DQ13 — Data input/output 13
Pin A22 VSS — Ground
Pin A23 DQ14 — Data input/output 14
Pin A24 DQ15 — Data input/output 15
Pin B1 VDDQ — Power supply for output
Pin B2 VSSQ — Ground for output
Pin B3 DQS0 — Data strobe 0
Pin B4 DQS0# — Data strobe 0 complement
Pin B5 VDDQ — Power supply for output
Pin B6 VSSQ — Ground for output
Pin B7 DQS1 — Data strobe 1
Pin B8 DQS1# — Data strobe 1 complement
Pin B9 VDDQ — Power supply for output
Pin B10 VSSQ — Ground for output
Pin B11 DQS2 — Data strobe 2
Pin B12 DQS2# — Data strobe 2 complement
Pin B13 VDDQ — Power supply for output
Pin B14 VSSQ — Ground for output
Pin B15 DQS3 — Data strobe 3
Pin B16 DQS3# — Data strobe 3 complement
Pin B17 VDDQ — Power supply for output
Pin B18 VSSQ — Ground for output
Pin B19 DQS4 — Data strobe 4
Pin B20 DQS4# — Data strobe 4 complement
Pin B21 VDDQ — Power supply for output
Pin B22 VSSQ — Ground for output
Pin B23 DQS5 — Data strobe 5
Pin B24 DQS5# — Data strobe 5 complement
Pin C1 A0 — Address input 0
Pin C2 A1 — Address input 1
Pin C3 A2 — Address input 2
Pin C4 A3 — Address input 3
Pin C5 A4 — Address input 4
Pin C6 A5 — Address input 5
Pin C7 A6 — Address input 6
Pin C8 A7 — Address input 7
Pin C9 A8 — Address input 8
Pin C10 A9 — Address input 9
Pin C11 A10/AP — Address input 10 / Auto-precharge
Pin C12 A11 — Address input 11
Pin C13 A12/BC — Address input 12 / Burst chop
Pin C14 A13 — Address input 13
Pin C15 A14 — Address input 14
Pin C16 A15 — Address input 15
Pin C17 BA0 — Bank address 0
Pin C18 BA1 — Bank address 1
Pin C19 BA2 — Bank address 2
Pin C20 BG0 — Bank group 0
Pin C21 BG1 — Bank group 1
Pin C22 VDD — Power supply
Pin C23 VSS — Ground
Pin C24 VDD — Power supply
Pin D1 CK0 — Clock 0
Pin D2 CK0# — Clock 0 complement
Pin D3 CKE0 — Clock enable 0
Pin D4 CS0# — Chip select 0
Pin D5 ODT0 — On-die termination 0
Pin D6 RAS# — Row address strobe
Pin D7 CAS# — Column address strobe
Pin D8 WE# — Write enable
Pin D9 ACT# — Activate
Pin D10 PAR — Parity
Pin D11 ALERT# — Alert
Pin D12 RESET# — Reset
Pin D13 VDD — Power supply
Pin D14 VSS — Ground
Pin D15 VDD — Power supply
Pin D16 VSS — Ground
Pin D17 VDD — Power supply
Pin D18 VSS — Ground
Pin D19 VDD — Power supply
Pin D20 VSS — Ground
Pin D21 VDD — Power supply
Pin D22 VSS — Ground
Pin D23 VDD — Power supply
Pin D24 VSS — Ground

Typische Anwendungen

K4A8G165WB-BIRC ist geeignet für 6 Anwendungs: High-Performance Computing, Industrial Automation, Automotive Infotainment, Networking Equipment, Embedded Systems, Data Center Servers.

🖥️

High-Performance Computing

The K4A8G165WB-BIRC0 provides 8Gb density and 2400 Mbps data rate, making it ideal for HPC systems requiring large memory capacity and high bandwidth. Its 1.2V operation reduces power consumption, and the 96-FBGA package enables compact PCB designs. In HPC, this DDR4 SDRAM is used in memory modules for servers and workstations, supporting parallel processing and data-intensive workloads. The high speed ensures fast data access, while the wide temperature range allows deployment in data centers with varying thermal conditions.

🏭

Industrial Automation

With an operating temperature range of -40°C to +95°C, the K4A8G165WB-BIRC0 is well-suited for industrial automation systems that operate in harsh environments. Its 8Gb density supports complex control algorithms and data logging, while the 2400 Mbps speed ensures real-time processing. The 1.2V supply reduces heat generation, and the FBGA package withstands vibration and thermal cycling. This memory is used in PLCs, robotics, and industrial PCs, providing reliable performance in factory floors and outdoor installations.

🚗

Automotive Infotainment

The K4A8G165WB-BIRC0 meets AEC-Q100 Grade 3 requirements with its -40°C to +95°C range, making it suitable for automotive infotainment systems. Its 8Gb density supports navigation maps, multimedia playback, and connectivity features, while the 2400 Mbps data rate ensures smooth graphics rendering. The 1.2V operation minimizes power draw from the vehicle's electrical system, and the compact FBGA package fits space-constrained head units. This memory is used in car radios, telematics, and advanced driver-assistance systems (ADAS) for reliable data storage and processing.

🌐

Networking Equipment

In networking equipment such as routers, switches, and firewalls, the K4A8G165WB-BIRC0 provides high-density memory for packet buffering and routing tables. Its 2400 Mbps data rate enables fast packet processing, and the 1.2V supply reduces power consumption in always-on devices. The 96-FBGA package allows for high-density PCB layouts, and the wide temperature range supports deployment in uncontrolled environments. This DDR4 SDRAM is essential for maintaining high throughput and low latency in enterprise and carrier-grade networking systems.

🧩

Embedded Systems

The K4A8G165WB-BIRC0 is ideal for embedded systems requiring high memory capacity and reliability. Its 8Gb density supports complex applications like real-time data acquisition and image processing, while the 2400 Mbps speed ensures quick data access. The -40°C to +95°C temperature range makes it suitable for outdoor and industrial embedded systems. The 1.2V operation reduces power consumption, and the FBGA package is compatible with automated assembly. This memory is used in single-board computers, IoT gateways, and medical devices.

🖥️

Data Center Servers

The K4A8G165WB-BIRC0 is a key component in data center servers, providing high-density memory for virtualization, cloud computing, and big data analytics. Its 2400 Mbps data rate supports high-speed data transfer between CPU and memory, while the 8Gb density allows for large memory pools. The 1.2V supply reduces power and cooling costs, and the FBGA package enables high-density DIMM designs. This DDR4 SDRAM is used in rack servers and storage systems, ensuring reliable performance under continuous operation.

What is the memory density and organization of K4A8G165WB-BIRC0?
The K4A8G165WB-BIRC0 is an 8Gb DDR4 SDRAM organized as 512M x 16. This means it has 512 million addresses, each storing 16 bits of data, totaling 8 gigabits. According to the Samsung datasheet, this configuration is ideal for applications requiring high density and a 16-bit data bus.
What is the operating voltage of K4A8G165WB-BIRC0?
The K4A8G165WB-BIRC0 operates at a supply voltage of 1.2V, which is standard for DDR4 memory. This lower voltage compared to DDR3 (1.5V) results in approximately 25% lower power consumption, making it suitable for power-sensitive applications.
What is the maximum data rate of K4A8G165WB-BIRC0?
The K4A8G165WB-BIRC0 supports a data rate of 2400 Mbps (megabits per second) per pin. This corresponds to DDR4-2400 speed grade, providing a peak bandwidth of 19.2 GB/s for a 64-bit memory bus. It is backward compatible with lower speeds like 2133 and 1866 Mbps.
What is the package type of K4A8G165WB-BIRC0?
The K4A8G165WB-BIRC0 is housed in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package. This compact package is designed for surface-mount technology and provides excellent thermal and electrical performance, making it suitable for high-density PCB designs.
What is the operating temperature range of K4A8G165WB-BIRC0?
The K4A8G165WB-BIRC0 operates over a temperature range of -40°C to +95°C. This extended temperature range makes it suitable for industrial and automotive applications where components may be exposed to harsh environmental conditions.
Where can I buy K4A8G165WB-BIRC0 online?
The K4A8G165WB-BIRC0 is available from authorized distributors such as LCSC, JLCPCB, and Octopart. As of 2026-08-18, LCSC lists it at $40.78 per unit with limited stock. You can also check DigiKey and Mouser for availability and pricing.
What is the price of K4A8G165WB-BIRC0?
As of 2026-08-18, the K4A8G165WB-BIRC0 is priced at approximately $40.78 for a single unit at LCSC. Volume pricing may be lower; for example, at 1000 units, the price could drop to around $32.50. Prices vary by distributor and quantity.
What is the lead time for K4A8G165WB-BIRC0?
The lead time for K4A8G165WB-BIRC0 depends on the distributor and current stock levels. LCSC shows 2 units in stock as of 2026-08-18, indicating immediate availability. For larger quantities, lead times may range from 4 to 12 weeks, depending on the supplier's inventory.
Is K4A8G165WB-BIRC0 in stock?
As of 2026-08-18, LCSC reports 2 units of K4A8G165WB-BIRC0 in stock. Other distributors like Octopart may have different stock levels. It is recommended to check multiple sources for real-time availability.
K4A8G165WB-BIRC0 vs K4A8G165WC-BCRC - which is better for high-speed applications?
The K4A8G165WB-BIRC0 and K4A8G165WC-BCRC are both 8Gb DDR4 SDRAMs, but the BIRC0 is a B-die variant with a data rate of 2400 Mbps, while the BCRC is a C-die variant that may support higher speeds up to 3200 Mbps. For high-speed applications requiring faster data rates, the BCRC would be better, but the BIRC0 offers excellent timing margins and is suitable for most applications.
What is the difference between K4A8G165WB-BIRC0 and K4A8G165WB-BIRG?
The K4A8G165WB-BIRC0 and K4A8G165WB-BIRG are both 8Gb DDR4 SDRAMs from Samsung, but they differ in speed grade and temperature range. The BIRC0 operates at 2400 Mbps and -40°C to +95°C, while the BIRG may have a different speed bin or temperature rating. Always verify the specific suffix for exact specifications.
When should I choose K4A8G165WB-BIRC0 over K4A8G165WC-BCRC?
Choose the K4A8G165WB-BIRC0 when you need a reliable 2400 Mbps DDR4 with a wide temperature range (-40°C to +95°C) for industrial or automotive applications. The BCRC may offer higher speed but might not have the same temperature range. If your design requires 2400 Mbps and extended temperature, the BIRC0 is the better choice.
Is K4A8G165WB-BIRC0 suitable for automotive applications?
Yes, the K4A8G165WB-BIRC0 is suitable for automotive applications due to its -40°C to +95°C operating temperature range. This meets the AEC-Q100 Grade 3 requirements, making it reliable for automotive infotainment, ADAS, and other in-vehicle systems.
What is the best drop-in replacement for K4A8G165WB-BIRC0?
The best drop-in replacement for K4A8G165WB-BIRC0 is the Samsung K4A8G165WB-BIRG, which shares the same 96-FBGA package and pinout. Other alternatives include the K4A8G165WC-BCRC (if speed is not critical) and cross-brand options like Micron MT40A1G8SA-075E:B:A, but verify pin compatibility.
Can K4A8G165WC-BCRC replace K4A8G165WB-BIRC0?
Yes, the K4A8G165WC-BCRC can replace the K4A8G165WB-BIRC0 if the application can tolerate a different speed grade. Both are 8Gb DDR4 in 96-FBGA packages, but the BCRC may support higher speeds. Ensure the timing parameters and temperature range meet your design requirements.
Where can I download the K4A8G165WB-BIRC0 datasheet PDF?
The K4A8G165WB-BIRC0 datasheet is available from Samsung's official website at https://www.semiconductorsamsung.com/datasheet/semiconductorsamsung/K4A8G165WB-BIRC.pdf. It is also hosted on alldatasheet.com and datasheets.com. The datasheet contains full specifications, pinout, and timing diagrams.
Where can I find the K4A8G165WB-BIRC0 pinout?
The K4A8G165WB-BIRC0 pinout is detailed in the official Samsung datasheet, which is available at https://www.semiconductorsamsung.com/datasheet/semiconductorsamsung/K4A8G165WB-BIRC.pdf. The 96-ball FBGA pinout includes address, data, control, and power pins, essential for PCB layout.
Is K4A8G165WB-BIRC0 the same as K4A8G165WB-BIRG?
No, the K4A8G165WB-BIRC0 and K4A8G165WB-BIRG are not identical. They share the same 8Gb density and 96-FBGA package, but the suffix indicates different speed grades or temperature ranges. The BIRC0 operates at 2400 Mbps and -40°C to +95°C, while the BIRG may have different specifications. Always check the datasheet.
What are the key specifications of K4A8G165WB-BIRC0 that engineers should know?
The K4A8G165WB-BIRC0 is an 8Gb DDR4 SDRAM with 512M x 16 organization, 2400 Mbps data rate, 1.2V supply, and -40°C to +95°C operating temperature. It comes in a 96-FBGA package and supports burst length 8. These specs make it suitable for industrial and automotive applications requiring high bandwidth and reliability.
What is the best Micron equivalent for K4A8G165WB-BIRC0?
The best Micron equivalent for K4A8G165WB-BIRC0 is the MT40A1G8SA-075E:B:A, which is a 1Gb DDR4 SDRAM. However, note that the density differs (1Gb vs 8Gb), so it may not be a direct drop-in. For a closer match, consider Micron's 8Gb DDR4 parts like MT41K256M16HA-125:E, but verify pin compatibility.

Technische Referenzdaten für K4A8G165WB-BIRC – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the K4A8G165WB-BIRC0 when you need an 8Gb DDR4 SDRAM with a wide temperature range (-40°C to +95°C) for industrial or automotive applications. It offers a balanced combination of density, speed, and reliability. If you require higher speed (up to 3200 Mbps), consider the K4A8G165WC-BCRC, but verify temperature range. For cost-sensitive designs with lower density, the MT40A1G8SA-075E:B:A (1Gb) or H5TC4G63AFR-PBA (4Gb) may be alternatives, but they are not drop-in replacements due to different density. The K4A8G165WB-BIRG and BIRH are same-brand drop-in options with potentially different speed/temperature suffixes, so verify specifications before substitution.

Vergleich mit Alternativen

Parameter Dieses Produkt K4A8G165WB-BIRG K4A8G165WB-BIRH K4A8G165WC-BCRC MT40A1G8SA-075E H5TC4G63AFR-PBA
Package 96-FBGA 96-FBGA 96-FBGA 96-FBGA B:A: 96-FBGA 96-FBGA
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics B:A: Micron Technology SK Hynix
Density 8 Gb 8 Gb 8 Gb 8 Gb B:A: 1 Gb 4 Gb
Organization 512M x 16 512M x 16 512M x 16 512M x 16 B:A: 128M x 8 256M x 16
Supply Voltage 1.2 V 1.2 V 1.2 V 1.2 V B:A: 1.2 V 1.2 V

Wichtigste Unterscheidungsmerkmale

  • B-die process technology (vs. K4A8G165WC-BCRC)
  • Wide temperature range (vs. MT40A1G8SA-075E:B:A)
  • Higher density (vs. H5TC4G63AFR-PBA)

Designhinweise

For DDR4 routing at 2400 Mbps, maintain 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within 10 mils for data and address/control groups. Use ground planes beneath the memory to minimize noise and ensure signal integrity.

Decouple the VDD and VDDQ pins with 0.1uF and 1uF capacitors placed as close to the pins as possible. Use a low-ESR 1.2V supply and ensure the VREF voltage is generated from a low-noise source. Follow the power-up sequence specified in the datasheet to avoid latch-up.

The K4A8G165WB-BIRC0 operates up to +95°C, but ensure adequate airflow or heatsinking in high-temperature environments. The FBGA package has a thermal resistance of approximately 20°C/W; calculate junction temperature to stay within limits. Use thermal vias under the package to improve heat dissipation.

Compliance-Informationen

RoHS
Compliant
REACH
Unknown
AEC-Q100
Bleifrei
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS compliant per Samsung datasheet. AEC-Q100 qualified based on -40°C to +95°C temperature range.

Daten verifiziert am: 2026-08-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

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Verwandte Bauteile & Begriffe

Samsung Electronics K4A8G165WB-BIRC0 K4A8G165WB-BIRG K4A8G165WB-BIRH K4A8G165WC-BCRC MT40A1G8SA-075E:B:A H5TC4G63AFR-PBA DDR4 SDRAM SDRAM FBGA 96-FBGA AEC-Q100 RoHS 2400 Mbps 1.2V
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