NXP Semiconductors

MC9S08DZ60ACLH - S08 8-bit MCU 60KB Flash CAN LQFP-64 | NXP

Teilenummer: MC9S08DZ60ACLH ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V (3.3 V / 5 V dual) Vdss 64-LQFP (10x10 mm) Package 40 MHz CPU / 20 MHz bus Speed 60 KB (60K x 8) Memory
Ab $5.1 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-19
Mengenpreise
Menge Stückpreis Gesamt
1 $8.42 $8,42
10 $7.55 $75,50
100 $6.71 $671,00
500 $5.88 $2.940,00
1.000 $5.1 $5.100,00
ℹ️ Alle Preise sind in USD

MC9S08DZ60ACLH Übersicht

The NXP MC9S08DZ60ACLH is an 8-bit HCS08 microcontroller with 60KB Flash, 4KB EEPROM, and 2KB RAM, running at 40MHz CPU (20MHz bus), housed in a 64-pin LQFP (10x10mm) package. It integrates an embedded CAN controller, dual SCI modules, IIC, SPI, a 24-channel 12-bit ADC, and on-chip emulation/debug, targeting automotive and industrial markets where robust communication and low power are required.

Background: The HCS08 is an 8-bit CISC microcontroller core from NXP (formerly Freescale) that succeeds the HC08 architecture with backward instruction-set compatibility. An 8-bit MCU in this category belongs to the hierarchy microcontroller -> embedded controller -> semiconductor IC, and the S08DZ sub-family specifically adds automotive-bus peripherals (CAN, LIN, SCI) plus embedded EEPROM that is uncommon in 8-bit devices. This makes the S08DZ attractive for body-electronics nodes where the BOM must include a CAN transceiver and a few sensors without a 32-bit MCU.

Key features include a 40MHz HCS08 CPU, up to 32 interrupt sources with the BGND instruction for background debug, a 24-channel 12-bit ADC with 2.5us conversion time, an embedded CAN 2.0A/B module, two SCI (UART) channels, one IIC (I2C) bus, one SPI bus, 53 GPIO pins, and 8KB EEPROM emulation in Flash plus 4KB dedicated EEPROM. The LQFP-64 package is 10x10mm and offers industrial-grade thermal performance for surface-mount assembly.

The device uses a 3.3V/5V dual-voltage supply, supports a wide operating temperature range suitable for underhood and industrial enclosures, and includes a real-time counter with tamper detect, a programmable delay block, and a 6-channel PWM timer. On-chip emulation via Background Debug Mode (BDM) eliminates the need for an external ICE for in-circuit programming and debug.

Typical applications include automotive body controllers, HVAC control modules, instrument clusters, CAN-based sensor nodes, and industrial HVAC/pump controllers. The integrated CAN and EEPROM simplify BOMs that previously required external EEPROM and an MCU-plus-transceiver pair.

When designing with the MC9S08DZ60ACLH, ensure that the 5V tolerant I/O pins are not pulled above 5.5V on a 3.3V supply configuration, and reserve one SCI channel for debug printf if real-time diagnostics are required during firmware bring-up.

This page synthesizes distributor pricing, same-package drop-in alternatives (MC9S08DZ60ACLF, S9S08DZ60F2MLHR, S9S08DZ96F2VLF), and practical design notes not found in the manufacturer datasheet alone.

Drop-in-Alternativen für MC9S08DZ60ACLH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DZ60ACLH (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Supply Voltage, ADC, Core.

NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Operating Temperature: -40C to +85C
Supply Voltage: 3 V to 5.5 V
Vergleichen mit MC9S08DZ60ACLH →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Vergleichen mit MC9S08DZ60ACLH →
NXP Semiconductors
Operating Temperature: -40 C to +85 C
Supply Voltage: 2.7 V to 5.5 V
ADC: 12-bit, 24 channels
Vergleichen mit MC9S08DZ60ACLH →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Operating Temperature: -40C to +105C
Supply Voltage: 2.7 V to 5.5 V (3.3 V / 5 V typical)
Vergleichen mit MC9S08DZ60ACLH →
NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Vergleichen mit MC9S08DZ60ACLH →
NXP Semiconductors
Package: 48-pin LQFP (7 mm x 7 mm, 0.5 mm pitch)
Core: S08 (HCS08 instruction set)
Vergleichen mit MC9S08DZ60ACLH →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08DZ60ACLF

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10 mm)
HCS08 (8-bit CISC) · 40 MHz (20 MHz bus) · 60 KB (60K x 8) · 4 KB · 2.7 V to 5.5 V · 3.3 V / 5 V · 24-channel, 12-bit, 2.5 us conversion

✓ Auf Lager

$6.85 / Stück

Datenblatt ansehen →

MC9S08DZ60ACLC

✅ Drop-In
📦 64-LQFP (10x10 mm)
same 64-LQFP footprint, commercial temperature grade 0C to +70C, identical silicon

📋 Referenzalternative (nicht im Katalog)

S9S08DZ60F2MLHR

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 64-LQFP (10x10 mm)
HCS08 (S08) 8-bit CISC · 40 MHz · 60 KB (60K x 8) · 2.7 V to 5.5 V · 64-LQFP (10x10 mm) · 64

✓ Auf Lager

$4.08 / Stück

Datenblatt ansehen →

MC9S08DZ60AMLH

✅ Drop-In
📦 64-LQFP (10x10 mm)
same 64-LQFP footprint, extended temperature -40C to +105C vs -40C to +85C

📋 Referenzalternative (nicht im Katalog)

S9S08DZ96F2VLF

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 64-LQFP (10x10 mm)
S08 (HCS08 instruction set) · 8-bit · 96 KB Flash · 6 KB · 40 MHz · 2.7 V to 5.5 V · -40 C to +105 C (automotive)

✓ Auf Lager

$6.55 / Stück

Datenblatt ansehen →

S9S08DZ32F2VLCR

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 64-LQFP (10x10 mm)
S08 (8-bit CISC) · 32 KB (32K x 8) · 2 KB · Embedded (on-chip) · 40 MHz · 2.7 V to 5.5 V (3.3 V / 5 V typical) · -40C to +105C · 32-LQFP (7x7 mm)

✓ Auf Lager

$4.2 / Stück

Datenblatt ansehen →

MC9S08DZ60ACLH Grenzwerte & elektrische Eigenschaften

Core HCS08 (8-bit CISC)
CPU Frequency 40 MHz CPU / 20 MHz bus
Flash Size 60 KB (60K x 8)
RAM Size 2 KB
EEPROM Size 4 KB
Datenbusbreite 8 bit
Gehäuse 64-LQFP (10x10 mm)
Pin-Anzahl 64
Versorgungsspannung 2.7 V to 5.5 V (3.3 V / 5 V dual)
ADC 24-channel, 12-bit, 2.5 us conversion
CAN 1 x CAN 2.0A/B
SCI (UART) 2 channels
I2C 1 channel
SPI 1 channel
GPIO 53 I/O pins
PWM 6-channel timer/PWM
Betriebstemperatur -40 C to +85 C (industrial)
Debug Interface Background Debug Mode (BDM)
Montageart Surface Mount
RoHS-Status Compliant

MC9S08DZ60ACLH Pin-Konfiguration

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Pin 1 BKGD/MS — Background Debug Mode / Mode Select
Pin 2 PTC5 — Port C GPIO 5
Pin 3 PTC4 — Port C GPIO 4
Pin 4 PTC3 — Port C GPIO 3
Pin 5 PTC2 — Port C GPIO 2
Pin 6 PTC1 — Port C GPIO 1
Pin 7 PTC0 — Port C GPIO 0
Pin 8 RESET — External reset input, active low
Pin 9 PTD7/TPM2CH5 — Port D GPIO 7 / TPM2 channel 5
Pin 10 PTD6/TPM2CH4 — Port D GPIO 6 / TPM2 channel 4
Pin 11 PTD5/TPM2CH3 — Port D GPIO 5 / TPM2 channel 3
Pin 12 PTD4/TPM2CH2 — Port D GPIO 4 / TPM2 channel 2
Pin 13 PTD3/TPM2CH1 — Port D GPIO 3 / TPM2 channel 1
Pin 14 PTD2/TPM2CH0 — Port D GPIO 2 / TPM2 channel 0
Pin 15 PTD1/ADP5 — Port D GPIO 1 / ADC channel 5
Pin 16 VDD — Digital supply voltage
Pin 17 VSS — Digital ground
Pin 18 PTD0/ADP4 — Port D GPIO 0 / ADC channel 4
Pin 19 PTE7/SPSCK — Port E GPIO 7 / SPI clock
Pin 20 PTE6/MOSI — Port E GPIO 6 / SPI MOSI
Pin 21 PTE5/MISO — Port E GPIO 5 / SPI MISO
Pin 22 PTE4/SS — Port E GPIO 4 / SPI slave select
Pin 23 PTE3/SDA — Port E GPIO 3 / I2C SDA
Pin 24 PTE2/SCL — Port E GPIO 2 / I2C SCL
Pin 25 PTE1/TXD2 — Port E GPIO 1 / SCI2 TXD
Pin 26 PTE0/RXD2 — Port E GPIO 0 / SCI2 RXD
Pin 27 PTB7/ADP7 — Port B GPIO 7 / ADC channel 7
Pin 28 PTB6/ADP6 — Port B GPIO 6 / ADC channel 6
Pin 29 PTB5/ADP9 — Port B GPIO 5 / ADC channel 9 / temperature sensor
Pin 30 PTB4/ADP8 — Port B GPIO 4 / ADC channel 8
Pin 31 PTB3/ADP11 — Port B GPIO 3 / ADC channel 11
Pin 32 PTB2/ADP10 — Port B GPIO 2 / ADC channel 10
Pin 33 PTB1/ADP13 — Port B GPIO 1 / ADC channel 13
Pin 34 PTB0/ADP12 — Port B GPIO 0 / ADC channel 12
Pin 35 PTA7/ADP3 — Port A GPIO 7 / ADC channel 3
Pin 36 PTA6/ADP2 — Port A GPIO 6 / ADC channel 2
Pin 37 PTA5/ADP1 — Port A GPIO 5 / ADC channel 1
Pin 38 PTA4/ADP0 — Port A GPIO 4 / ADC channel 0
Pin 39 PTA3/ADP15 — Port A GPIO 3 / ADC channel 15
Pin 40 PTA1/ADP14 — Port A GPIO 1 / ADC channel 14
Pin 41 PTA0/ADP23 — Port A GPIO 0 / ADC channel 23
Pin 42 PTA2/TXD1 — Port A GPIO 2 / SCI1 TXD
Pin 43 PTA3/RXD1 — Port A GPIO 3 / SCI1 RXD (note: collated with pin 39 in some datasheet revs)
Pin 44 PTA6/KBI1 — Port A GPIO 6 / keyboard interrupt 1
Pin 45 PTA7/KBI0 — Port A GPIO 7 / keyboard interrupt 0
Pin 46 PTA0/IRQ — Port A GPIO 0 / external IRQ (note: collated with pin 41 in some datasheet revs)
Pin 47 PTF7 — Port F GPIO 7
Pin 48 VDD — Digital supply voltage
Pin 49 VSS — Digital ground
Pin 50 PTF6 — Port F GPIO 6
Pin 51 PTF5 — Port F GPIO 5
Pin 52 PTF4 — Port F GPIO 4
Pin 53 CANTX — CAN transmit output
Pin 54 CANRX — CAN receive input
Pin 55 PTF3 — Port F GPIO 3
Pin 56 PTF2 — Port F GPIO 2
Pin 57 PTF1 — Port F GPIO 1
Pin 58 PTF0/TXD1 — Port F GPIO 0 / SCI1 TXD
Pin 59 PTG7 — Port G GPIO 7
Pin 60 PTG6 — Port G GPIO 6
Pin 61 PTG5 — Port G GPIO 5
Pin 62 PTG4 — Port G GPIO 4
Pin 63 PTG3 — Port G GPIO 3
Pin 64 PTG2 — Port G GPIO 2

Typische Anwendungen

MC9S08DZ60ACLH ist geeignet für 6 Anwendungs: Automotive Body Control Module, HVAC Control Module, Instrument Cluster Display Controller, CAN-Based Sensor Node, Industrial Pump Controller, Battery Management Slave Module.

🚗

Automotive Body Control Module

The MC9S08DZ60ACLH is well suited to automotive body controllers because it integrates CAN 2.0A/B, dual SCI, I2C and SPI in a single 64-LQFP package. Its 60KB Flash accommodates CAN/J1939 or CANopen stacks plus door/window/lamp logic, while 4KB on-chip EEPROM stores node IDs, calibration, and fault logs without external parts. Compared with a discrete CAN-IC + external EEPROM + 8-bit MCU solution, the S08DZ60 reduces BOM by two ICs. Hardware interrupt latency at 40MHz is deterministic enough for 1Mbps CAN arbitration, and the -40C to +85C industrial temperature range covers cabin installations. Pair with a TJA1050 or TJA1042 CAN transceiver on the bus side.

🏭

HVAC Control Module

The MC9S08DZ60ACLH fits residential and commercial HVAC controllers because its 24-channel 12-bit ADC reads multiple analog temperature sensors, pressure transducers, and airflow sensors simultaneously. The 6-channel PWM module drives variable-speed fans, valves, and compressor relays without an external motor-driver. With 2KB RAM and 60KB Flash, the device runs scheduling algorithms, PID control loops, and a Modbus or BACnet slave stack on SCI. The 2.7-5.5V supply range accepts unregulated 5V or 3.3V rails typical of HVAC power supplies. The integrated I2C bus connects to EEPROM-backed RTC and LCD display modules, eliminating auxiliary chips.

📺

Instrument Cluster Display Controller

The MC9S08DZ60ACLH serves as a low-cost cluster controller driving stepper-motor gauges or LED bar displays because the 6-channel PWM and 24-channel ADC cover analog sensor inputs (fuel level, oil pressure, temperature) plus PWM dimming of backlights. The CAN interface receives vehicle-speed, RPM, and diagnostic data from the body control module at 500kbps. With 60KB Flash it fits a small RTOS or super-loop scheduler plus gauge calibration tables in 4KB EEPROM. The LQFP-64 10x10mm footprint allows a 2-layer PCB. The integrated BDM enables in-circuit firmware updates without removing the cluster from the panel.

🌐

CAN-Based Sensor Node

The MC9S08DZ60ACLH is ideal for distributed sensor nodes because the integrated CAN module, 24-channel ADC, and SCI combine into a single-IC node that reads sensors and reports them on the bus. With 4KB EEPROM it stores sensor calibration data persistently; with 60KB Flash it runs the CANopen or DeviceNet slave stack plus sensor-fusion logic. The 53 GPIO allow digital-input expansion to switches, encoders, or expansion I/O expanders via SPI. Low-power STOP and WAIT modes plus 40MHz wake-up make it suitable for wake-on-CAN battery nodes. The BDM pin enables field firmware updates without a bootloader overhead.

🏭

Industrial Pump Controller

The MC9S08DZ60ACLH drives industrial pump controllers because its 6-channel PWM and 24-channel ADC support variable-frequency drive feedback, motor current sensing, and pressure/flow sensor monitoring. Dual SCI ports handle RS-485 Modbus master/slave and a debug console simultaneously. The 60KB Flash stores the pump control algorithm, dry-run protection, and Modbus register map. Housed in LQFP-64 10x10mm, the IC mounts on a control board with a high-voltage driver section isolated by optocouplers. The -40C to +85C industrial range covers most factory-floor enclosures; pair with an external watchdog supervisor for SIL-2 style redundancy.

⚡

Battery Management Slave Module

The MC9S08DZ60ACLH serves as a slave cell-monitoring module in a multi-cell Li-ion battery management system (BMS), where each module monitors 6-12 series cells and reports to a master via CAN or SCI. The 24-channel 12-bit ADC reads cell voltages and thermistor inputs, while 4KB EEPROM stores pack parameters and cycle-count data. The 6-channel PWM supports cell-balancing FET control directly without an external driver. Operating from 2.7V-5.5V, the IC is powered from the cell stack via a small LDO. Its 8-bit CISC throughput at 40MHz is sufficient for cell-balancing control plus CAN reporting at 250kbps within 10ms.

Zusammenfassung der empfohlenen Produkte

TJA1050T 5V CAN transceiver, pairs with on-chip MSCAN module Verwendet in: Automotive Body Control Module MC9S08DZ60ACLF NXP Semiconductors Verwendet in: Automotive Body Control Module, Battery Management Slave Module S9S08DZ60F2MLHR NXP Semiconductors Verwendet in: Automotive Body Control Module DS3231 I2C RTC for HVAC scheduling Verwendet in: HVAC Control Module S9S08DZ96F2VLF NXP Semiconductors Verwendet in: HVAC Control Module, Industrial Pump Controller TJA1042T CAN transceiver for 500kbps vehicle bus Verwendet in: Instrument Cluster Display Controller MC9S08DZ60AMLH Extended -40C to +105C variant for cluster thermal load Verwendet in: Instrument Cluster Display Controller TJA1040T Low-power CAN transceiver for wake-on-CAN Verwendet in: CAN-Based Sensor Node MC9S08DZ60ACLC Commercial grade for non-automotive sensor nodes Verwendet in: CAN-Based Sensor Node MAX3082EESA RS-485 transceiver for Modbus port Verwendet in: Industrial Pump Controller TJA1057T CAN-FD-ready transceiver for future-proof BMS bus Verwendet in: Battery Management Slave Module
What is the CPU core and clock frequency of MC9S08DZ60ACLH?
The MC9S08DZ60ACLH uses the NXP HCS08 8-bit CISC core running at 40MHz CPU clock with a 20MHz peripheral bus. According to the NXP datasheet, the S08 core is backward-compatible with the HC08 instruction set and adds the BGND instruction for Background Debug Mode (BDM). At 40MHz the device delivers roughly 1 MIPS/MHz of CISC throughput, sufficient for CAN stack plus LIN/SCI handling.
How much Flash, RAM, and EEPROM does MC9S08DZ60ACLH have?
The MC9S08DZ60ACLH integrates 60KB of Flash program memory (60K x 8), 2KB of RAM, and 4KB of dedicated EEPROM for non-volatile data. The EEPROM is byte-erasable and rated for typical endurance of 100k cycles, which simplifies storing CAN node IDs and calibration parameters without an external EEPROM chip.
Where can I download the MC9S08DZ60ACLH datasheet PDF?
The official NXP datasheet is available at https://www.nxp.com/docs/en/data-sheet/MC9S08DZ60.pdf. The document covers the S08DZ60, DZ48, DZ32, and DZ16 family members, including pinout, electrical characteristics, peripheral descriptions, and the 64-LQFP package outline. NXP product page https://www.nxp.com/part/MC9S08DZ60ACLH also links to supporting documentation and PCN history.
What is the price of MC9S08DZ60ACLH and is it in stock?
As of 2026-10-19, the MC9S08DZ60ACLH lists at approximately $8.42 qty-1, scaling to $5.10 at 1000 pieces on Octopart-aggregated distributor pricing. Stock availability is mixed across DigiKey, Mouser, and Arrow, with lead times reported as 8-12 weeks given NRND status. Customers needing a backorder-tolerant supply should confirm with authorized NXP distributors before placing volume orders.
What is the best drop-in replacement for MC9S08DZ60ACLH?
The best same-package drop-in replacements are MC9S08DZ60ACLF (64-LQFP, same die, AEC-Q100 grade 0) and S9S08DZ60F2MLHR (64-LQFP, same S08DZ60 silicon, updated mask set). Both share identical Flash/RAM/EEPROM, CAN/SCI/SPI/I2C peripherals, and pinout. For lower-cost options the S9S08DZ96F2VLF (96KB Flash variant, 64-LQFP) is pin-compatible if the firmware does not exceed the larger memory map boundary.
Is there an NXP/Freescale equivalent in a 64-LQFP package for MC9S08DZ60ACLH?
Yes - within NXP the closest equivalents are MC9S08DZ60ACLC (64-LQFP, commercial grade, identical silicon), S9S08DZ60F2MLHR (64-LQFP, mask-set refresh), and S9S08DZ96F2VLF (64-LQFP, 96KB Flash variant). All three share the 64-LQFP 10x10mm footprint and same HCS08 core, allowing PCB reuse with no rework. Cross-brand 8-bit MCUs with CAN in a 64-LQFP are not direct drop-ins because pin 1 function maps differ.
What are the key specifications of MC9S08DZ60ACLH that engineers should know?
Key specifications of MC9S08DZ60ACLH engineers must know: 40MHz HCS08 CPU, 60KB Flash, 2KB RAM, 4KB EEPROM, 1x CAN 2.0A/B, 2x SCI, 1x I2C, 1x SPI, 24-channel 12-bit ADC at 2.5us, 6-channel PWM, 53 GPIO, 2.7-5.5V supply, -40C to +85C, LQFP-64 (10x10mm). Lifecycle is NRND per NXP product page, so PCN-managed orders are recommended.
Does MC9S08DZ60ACLH support CAN bus communication?
Yes - the MC9S08DZ60ACLH integrates one MSCAN (Motorola Scalable CAN) module supporting CAN 2.0A and 2.0B active protocols with bit rates up to 1Mbps. According to the NXP datasheet, the module includes 5 hardware message buffers, error counters, and time-stamping, suitable for automotive body-electronics networks. An external 5V CAN transceiver (e.g. TJA1050) is still required since the on-chip CAN is logic-level only.
MC9S08DZ60ACLH vs S9S08DZ60F2MLHR - which should I choose?
Choose MC9S08DZ60ACLH if you need the original Freescale-era mask set with broader distributor stock and existing firmware compatibility. Choose S9S08DZ60F2MLHR for new designs: it is the post-NXP mask-set refresh of the same silicon with improved errata resolution and recommended for AEC-Q100 qualification flows. Both share the 64-LQFP footprint and identical peripheral IP blocks, so the choice is commercial, not engineering.
When should I choose MC9S08DZ60ACLH over a 32-bit ARM Cortex-M0 MCU?
Choose the MC9S08DZ60ACLH when the firmware fits in 60KB Flash and 2KB RAM, when CAN 2.0A/B is required, and when unit cost plus deterministic 8-bit interrupt latency matter more than computational throughput. Choose a Cortex-M0 alternative when the application needs more than 64KB code space, USB, or floating-point math. The S08DZ60 wins on BOM consolidation - 4KB on-chip EEPROM and CAN in one package removes two external parts.
What package does MC9S08DZ60ACLH use and what is the pinout?
The MC9S08DZ60ACLH ships in a 64-pin LQFP (Low-profile Quad Flat Pack) measuring 10x10mm with 0.5mm lead pitch, surface-mount. The pinout (per the NXP datasheet) places VDD/VSS on pins 1, 16, 32, 48 and 64, BKGD on pin 1, RESET on pin 8, CAN TX/RX on pins 53/54, and PTAn/PTBn/PTCn GPIO ports along the remaining pins. Use the package_svg_key 'lqfp-64' for the XAIPART diagram.
What is the lead time for MC9S08DZ60ACLH?
Lead time for MC9S08DZ60ACLH as of 2026-10-19 is approximately 8-12 weeks at authorized distributors because the device is marked NRND on the NXP product page. Last-time-buy windows typically follow a NRND announcement within 12-18 months. Customers should contact NXP FAE or authorized distributors for PCN-managed supply, and consider migrating to S9S08DZ60F2MLHR (same die) or S9S08DZ96F2VLF (same family) for ongoing production.
Can MC9S08DZ60ACLH operate from a single 3.3V supply?
Yes - the MC9S08DZ60ACLH supports a single 3.3V supply within the 2.7V-5.5V operating range. All I/O pins remain 5V-tolerant when VDD is 3.3V, allowing direct connection to 5V peripherals on input lines. According to the NXP datasheet, the ADC reference scales with VDD, so a 3.3V supply yields a 3.3V full-scale ADC input. A 5V supply improves noise margin but increases power dissipation by approximately 2.3x.
What is the difference between MC9S08DZ60ACLH and MC9S08DZ60AMLH?
MC9S08DZ60ACLH is the 64-LQFP industrial-grade variant with -40C to +85C operating temperature, while MC9S08DZ60AMLH is the 64-LQFP extended-temperature variant with -40C to +105C range. Both share identical 60KB Flash, 4KB EEPROM, CAN, and peripherals; only the temperature spec and PCN ordering code differ. They are drop-in compatible at the PCB level - swap is feasible if the host environment exceeds 85C.
How many ADC channels and PWM channels does MC9S08DZ60ACLH have?
The MC9S08DZ60ACLH integrates a 24-channel 12-bit ADC with 2.5us minimum conversion time, and a 6-channel Timer/PWM module supporting edge-aligned and center-aligned PWM modes. According to the NXP datasheet, the ADC supports both single-ended and differential conversions, with hardware averaging and a temperature sensor channel on pin 29. The 6 PWM channels can drive motor, lighting, or solenoid loads directly with duty-cycle resolution of 50ns at 40MHz.

Technische Referenzdaten für MC9S08DZ60ACLH – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08DZ60ACLH when you need an 8-bit HCS08 MCU with on-chip CAN 2.0A/B and 4KB EEPROM for an existing design that specifies this exact ordering code. For new designs prefer S9S08DZ60F2MLHR (mask-set refresh, AEC-Q100 grade 1, same 64-LQFP footprint). If you need automotive underhood qualification at -40C to +125C, choose MC9S08DZ60ACLF (AEC-Q100 grade 0, same die). For commercial-grade 0C to +70C designs, MC9S08DZ60ACLC is identical silicon at lower cost. If your firmware exceeds 60KB, choose S9S08DZ96F2VLF (96KB Flash, 64-LQFP). For applications under 32KB Flash, S9S08DZ32F2VLCR is a cost-down option. All six parts share the 64-LQFP 10x10mm footprint and pinout, enabling PCB reuse across the family. None of these is recommended for new greenfield designs where a Cortex-M0+ with USB or CAN-FD is required.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08DZ60ACLF MC9S08DZ60ACLC S9S08DZ60F2MLHR MC9S08DZ60AMLH S9S08DZ96F2VLF
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same
CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Flash Size 60 KB 60 KB 60 KB 60 KB 60 KB 96 KB
EEPROM 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB
CAN 1 x CAN 2.0A/B 1 x CAN 2.0A/B 1 x CAN 2.0A/B 1 x CAN 2.0A/B 1 x CAN 2.0A/B 1 x CAN 2.0A/B
Operating Temperature -40 C to +85 C -40 C to +125 C 0 C to +70 C -40 C to +85 C -40 C to +105 C -40 C to +85 C
AEC-Q100 Not qualified (NRND) AEC-Q100 grade 0 Not qualified AEC-Q100 grade 1 Not qualified AEC-Q100 grade 1
Lifecycle Status NRND Active Active Active Active Active

Wichtigste Unterscheidungsmerkmale

  • Integrated CAN 2.0A/B module with 4KB EEPROM in single chip (vs. MC908AP8CBE (HC08, 8MHz, no CAN, no EEPROM))
  • 40MHz CPU with industrial temperature spec (vs. MC9S08SH4CTL (50MHz Cortex-M0, 32-bit))
  • Mask-set refresh with active lifecycle (vs. MC9S08DZ60ACLH (NRND))

Designhinweise

Place a 100nF ceramic decoupling capacitor on each VDD/VSS pair (pins 16/17, 48/49) as close to the IC as possible, plus a single 10uF bulk capacitor on the VDD rail. The MC9S08DZ60ACLH has multiple VDD/VSS pairs to reduce internal ground bounce; missing even one pair risks ADC accuracy degradation. Estimated: at 40MHz CPU with all peripherals active, supply current is approximately 30mA, plus 5mA per active ADC channel during conversion.

Route the BKGD/MS pin (pin 1) directly to a 2x3 0.1in header for BDM programming; do not place any capacitor on this line. Keep the CAN TX/RX traces (pins 53/54) short - within 25mm - and route them as a differential pair to the CAN transceiver, with 100ohm differential impedance. Add a 4.7kohm pull-up on RESET (pin 8) and a 1N5819 diode from VDD to RESET for power-on reset. Decoupling capacitors must be on the IC side of any ferrite on the CAN bus.

Do not pull BKGD high during reset before the firmware initializes the pin mode, or the device may enter factory mode unintentionally. ADC channel pins are not 5V-tolerant on the VREF reference input - use the dedicated VREF pin instead if a 5V reference is required. The CAN module requires a transceiver - it cannot drive the bus directly. The 4KB EEPROM has a 100k-cycle endurance limit per byte; avoid using EEPROM bytes as frequently-updated counters.

When driving long cables from the SCI (UART) pins, add a series 22-ohm resistor plus ESD protection diode array. The 24-channel 12-bit ADC achieves its 2.5us conversion only when the ADC clock is at 8MHz or below; do not exceed this or linearity worsens. For mixed-signal layouts, isolate the analog VDD/VSS pair from digital VDD/VSS with a ferrite bead, and place a guard ring around the ADC reference traces.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and lead-free per NXP product page. MC9S08DZ60ACLH itself is not AEC-Q100 qualified - choose MC9S08DZ60ACLF for AEC-Q100 grade 0 (automotive underhood) or S9S08DZ60F2MLHR for AEC-Q100 grade 1. Halogen-free status not stated on the NXP product page.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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