MC9S12D64MPVE - 16-bit HCS12 MCU 64KB Flash 25MHz LQFP-112 | NXP
Teilenummer: MC9S12D64MPVE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.92 | $14,92 |
| 10 | $13.43 | $134,30 |
| 100 | $11.95 | $1.195,00 |
| 500 | $10.51 | $5.255,00 |
| 1.000 | $9.84 | $9.840,00 |
MC9S12D64MPVE Übersicht
A microcontroller (MCU) is a single-chip computer that combines a CPU core, volatile and non-volatile memory, and a set of peripherals used to interface with sensors, actuators and other digital logic. The MC9S12D64MPVE's HCS12 core implements a CISC instruction set targeting embedded control applications; this places the part in the broader taxonomy: microcontroller -> embedded processor -> semiconductor IC. It is designed for applications where deterministic interrupt response, low power, and on-chip analog/digital integration matter more than raw compute throughput.
Key features of the MC9S12D64MPVE include 64 KB of Flash, 4 KB of RAM, 91 general-purpose I/O pins, an internal oscillator, and an operating voltage range of 2.5 V / 5 V. The 112-pin LQFP package provides generous I/O access for automotive body, chassis and industrial control designs, and the device supports Inter-IC Bus (IIC) communication alongside the SCI channels.
Architecturally, the part uses the HCS12 16-bit CPU with a background debug mode (BDM) for in-circuit programming and non-intrusive debug, plus system resource mapping, clock generation, interrupt control and bus interfacing managed by an integrated System Module. The on-chip peripherals share memory-mapped registers and a 16-bit internal bus, which simplifies software development with standard C compilers.
Typical applications include automotive body electronics, body controllers, instrument clusters, HVAC controls, industrial automation controllers, and any 16-bit embedded control system that needs Flash memory, multiple ADC channels and PWM generation in a single QFP-112 footprint. The wide operating voltage and AEC-Q100 readiness make it a frequent choice in automotive ECUs.
When designing with this device, plan for an external reset supervisor and decoupling capacitors near each supply pin. Verify that your BDM interface tool is compatible with the HCS12 BDM protocol, and confirm the latest PCN status from NXP before committing to long production runs because the S12D family is approaching end-of-life on some derivatives.
Drop-in-Alternativen für MC9S12D64MPVE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12D64MPVE (gleiche Bauform und Footprint) – abweichend in ADC, Program Memory Size, Package, Core Architecture, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12D64CFUER
✅ Drop-In✓ Auf Lager
$10.4 / Stück
Datenblatt ansehen →MC9S12D64MFUER
✅ Drop-In✓ Auf Lager
$1.0524 / Stück
Datenblatt ansehen →MC9S12DG256CPVE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12DP512CPVER
✅ Drop-In✓ Auf Lager
$64.0452 / Stück
Datenblatt ansehen →MC9S12DT256CPVE
✅ Drop-In✓ Auf Lager
$20.85 / Stück
Datenblatt ansehen →MC9S12E64CPVE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12DJ64MPVE
✅ Drop-In✓ Auf Lager
$10.75 / Stück
Datenblatt ansehen →S9S12XS64J1MAL
✅ Drop-In✓ Auf Lager
$9.1 / Stück
Datenblatt ansehen →MC9S12D64MPVE Grenzwerte & elektrische Eigenschaften
| Core | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | 25 MHz |
| Program Memory Type | Flash |
| Program Memory Size | 64 KB (64K x 8) |
| RAM Size | 4 KB |
| Number of I/O | 91 |
| Gehäuse / Bauform | 112-LQFP (20 x 20 mm) |
| Oscillator Type | Internal |
| Betriebsversorgungsspannung | 2.5 V / 5 V |
| ADC | Two 8-channel, 10-bit |
| PWM Channels | 8 |
| Timers | 8-channel IC/OC enhanced capture timer |
| Serial Interfaces | 2x SCI (asynchronous) |
| I2C (Inter-IC Bus) | Yes |
| Montageart | Surface Mount |
| Packaging | Tray |
| RoHS-Status | Compliant |
MC9S12D64MPVE Pin-Konfiguration
| Pin 1 | PA0 — Port A bit 0 / general-purpose I/O |
| Pin 2 | PA1 — Port A bit 1 / general-purpose I/O |
| Pin 3 | PA2 — Port A bit 2 / general-purpose I/O |
| Pin 4 | PA3 — Port A bit 3 / general-purpose I/O |
| Pin 5 | PA4 — Port A bit 4 / general-purpose I/O |
| Pin 6 | PA5 — Port A bit 5 / general-purpose I/O |
| Pin 7 | PA6 — Port A bit 6 / general-purpose I/O |
| Pin 8 | PA7 — Port A bit 7 / general-purpose I/O |
| Pin 9 | VSS — Digital ground |
| Pin 10 | VDDR — Voltage regulator supply (internal regulator) |
| Pin 11 | VDDX — External I/O supply (5 V or 3.3 V) |
| Pin 12 | VSSX — External I/O ground |
| Pin 13 | RESET — External reset input (active low) |
| Pin 14 | BKGD — Background Debug Mode pin |
| Pin 15 | PE0 — Port E bit 0 / general-purpose I/O |
| Pin 16 | PE1 — Port E bit 1 / general-purpose I/O |
| Pin 17 | PE2 — Port E bit 2 / general-purpose I/O |
| Pin 18 | PE3 — Port E bit 3 / general-purpose I/O |
| Pin 19 | PE4 — Port E bit 4 / general-purpose I/O |
| Pin 20 | PE5 — Port E bit 5 / general-purpose I/O |
| Pin 21 | PE6 — Port E bit 6 / general-purpose I/O |
| Pin 22 | PE7 — Port E bit 7 / general-purpose I/O |
| Pin 23 | PH0 — Port H bit 0 / general-purpose I/O |
| Pin 24 | PH1 — Port H bit 1 / general-purpose I/O |
| Pin 25 | PH2 — Port H bit 2 / general-purpose I/O |
| Pin 26 | PH3 — Port H bit 3 / general-purpose I/O |
| Pin 27 | PH4 — Port H bit 4 / general-purpose I/O |
| Pin 28 | PH5 — Port H bit 5 / general-purpose I/O |
| Pin 29 | PH6 — Port H bit 6 / general-purpose I/O |
| Pin 30 | PH7 — Port H bit 7 / general-purpose I/O |
| Pin 31 | PJ0 — Port J bit 0 / general-purpose I/O |
| Pin 32 | PJ1 — Port J bit 1 / general-purpose I/O |
| Pin 33 | PJ2 — Port J bit 2 / general-purpose I/O |
| Pin 34 | PJ3 — Port J bit 3 / general-purpose I/O |
| Pin 35 | PJ4 — Port J bit 4 / general-purpose I/O |
| Pin 36 | PJ5 — Port J bit 5 / general-purpose I/O |
| Pin 37 | PJ6 — Port J bit 6 / general-purpose I/O |
| Pin 38 | PJ7 — Port J bit 7 / general-purpose I/O |
| Pin 39 | PK0 — Port K bit 0 / general-purpose I/O |
| Pin 40 | PK1 — Port K bit 1 / general-purpose I/O |
| Pin 41 | PK2 — Port K bit 2 / general-purpose I/O |
| Pin 42 | PK3 — Port K bit 3 / general-purpose I/O |
| Pin 43 | PK4 — Port K bit 4 / general-purpose I/O |
| Pin 44 | PK5 — Port K bit 5 / general-purpose I/O |
| Pin 45 | PK6 — Port K bit 6 / general-purpose I/O |
| Pin 46 | PK7 — Port K bit 7 / general-purpose I/O |
| Pin 47 | PM0 — Port M bit 0 / general-purpose I/O |
| Pin 48 | PM1 — Port M bit 1 / general-purpose I/O |
| Pin 49 | PM2 — Port M bit 2 / general-purpose I/O |
| Pin 50 | PM3 — Port M bit 3 / general-purpose I/O |
| Pin 51 | PM4 — Port M bit 4 / general-purpose I/O |
| Pin 52 | PM5 — Port M bit 5 / general-purpose I/O |
| Pin 53 | PM6 — Port M bit 6 / general-purpose I/O |
| Pin 54 | PM7 — Port M bit 7 / general-purpose I/O |
| Pin 55 | PP0 — Port P bit 0 / PWM channel 0 |
| Pin 56 | PP1 — Port P bit 1 / PWM channel 1 |
| Pin 57 | PP2 — Port P bit 2 / PWM channel 2 |
| Pin 58 | PP3 — Port P bit 3 / PWM channel 3 |
| Pin 59 | PP4 — Port P bit 4 / PWM channel 4 |
| Pin 60 | PP5 — Port P bit 5 / PWM channel 5 |
| Pin 61 | PP6 — Port P bit 6 / PWM channel 6 |
| Pin 62 | PP7 — Port P bit 7 / PWM channel 7 |
| Pin 63 | PS0 — Port S bit 0 / SCI0 TX |
| Pin 64 | PS1 — Port S bit 1 / SCI0 RX |
| Pin 65 | PS2 — Port S bit 2 / SCI1 TX |
| Pin 66 | PS3 — Port S bit 3 / SCI1 RX |
| Pin 67 | PS4 — Port S bit 4 / general-purpose I/O |
| Pin 68 | PS5 — Port S bit 5 / general-purpose I/O |
| Pin 69 | PS6 — Port S bit 6 / general-purpose I/O |
| Pin 70 | PS7 — Port S bit 7 / general-purpose I/O |
| Pin 71 | PT0 — Port T bit 0 / IC/OC timer channel 0 |
| Pin 72 | PT1 — Port T bit 1 / IC/OC timer channel 1 |
| Pin 73 | PT2 — Port T bit 2 / IC/OC timer channel 2 |
| Pin 74 | PT3 — Port T bit 3 / IC/OC timer channel 3 |
| Pin 75 | PT4 — Port T bit 4 / IC/OC timer channel 4 |
| Pin 76 | PT5 — Port T bit 5 / IC/OC timer channel 5 |
| Pin 77 | PT6 — Port T bit 6 / IC/OC timer channel 6 |
| Pin 78 | PT7 — Port T bit 7 / IC/OC timer channel 7 |
| Pin 79 | PAD0 — ADC channel 0 (AN0) |
| Pin 80 | PAD1 — ADC channel 1 (AN1) |
| Pin 81 | PAD2 — ADC channel 2 (AN2) |
| Pin 82 | PAD3 — ADC channel 3 (AN3) |
| Pin 83 | PAD4 — ADC channel 4 (AN4) |
| Pin 84 | PAD5 — ADC channel 5 (AN5) |
| Pin 85 | PAD6 — ADC channel 6 (AN6) |
| Pin 86 | PAD7 — ADC channel 7 (AN7) |
| Pin 87 | PAD8 — ADC channel 8 (AN8) / AN8 |
| Pin 88 | PAD9 — ADC channel 9 (AN9) / AN9 |
| Pin 89 | PAD10 — ADC channel 10 (AN10) |
| Pin 90 | PAD11 — ADC channel 11 (AN11) |
| Pin 91 | PAD12 — ADC channel 12 (AN12) |
| Pin 92 | PAD13 — ADC channel 13 (AN13) |
| Pin 93 | PAD14 — ADC channel 14 (AN14) |
| Pin 94 | PAD15 — ADC channel 15 (AN15) |
| Pin 95 | VRH — ADC high reference voltage |
| Pin 96 | VRL — ADC low reference voltage |
| Pin 97 | VDDA — ADC analog supply |
| Pin 98 | VSSA — ADC analog ground |
| Pin 99 | NC — Not connected (per datasheet) |
| Pin 100 | XCLKS — Colpitts/Pierce oscillator mode select |
| Pin 101 | EXTAL — External clock input / crystal |
| Pin 102 | XTAL — Crystal oscillator feedback |
| Pin 103 | TEST — Test mode pin (must be held low in normal operation) |
| Pin 104 | DBGEE — Debug EEPROM enable |
| Pin 105 | MODC — Mode C strap pin |
| Pin 106 | PB0 — Port B bit 0 / general-purpose I/O |
| Pin 107 | PB1 — Port B bit 1 / general-purpose I/O |
| Pin 108 | PB2 — Port B bit 2 / general-purpose I/O |
| Pin 109 | PB3 — Port B bit 3 / general-purpose I/O |
| Pin 110 | PB4 — Port B bit 4 / general-purpose I/O |
| Pin 111 | PB5 — Port B bit 5 / general-purpose I/O |
| Pin 112 | PB6 — Port B bit 6 / general-purpose I/O |
Typische Anwendungen
MC9S12D64MPVE ist geeignet für 7 Anwendungs: Automotive Body Electronics, Industrial Automation Controllers, HVAC Climate Control, Instrument Cluster Displays, Battery Management Systems, Consumer Appliance Control, Security and Access Control Panels.
Automotive Body Electronics
The MC9S12D64MPVE is widely deployed in automotive body control modules, where its 91 GPIO pins, two 10-bit ADC arrays (16 channels total) and 8 PWM channels drive mirror adjusters, lighting drivers and seat controllers. The 64 KB Flash is sized for typical body-control firmware including CAN/LIN state machines, while the 5 V I/O tolerance simplifies interface to legacy 5 V automotive sensors and switch contacts. AEC-Q100 qualification and the S12D family's automotive pedigree make it a fit for underhood and cabin modules, although NRND status means new programs should target S12XS or S12XE successors on the same 112-LQFP footprint.
Empfohlen
Industrial Automation Controllers
In industrial automation, the MC9S12D64MPVE is used for PLC expansion modules, motor starters and small inverter controls. Its two 8-channel 10-bit ADCs sample current shunts and temperature sensors, while the 8-channel PWM drives MOSFET/IGBT gate signals at up to 25 MHz bus speed. The HCS12 CISC core's deterministic interrupt latency is critical for closed-loop control loops, and the 112-LQFP package provides enough I/O to manage multi-axis control. Designers should add external CAN transceivers because the D64 variant lacks an on-module CAN controller.
Empfohlen
HVAC Climate Control
The MC9S12D64MPVE fits HVAC climate controllers that require multiple analog inputs for NTC temperature sensors, digital outputs for damper and blower drivers, and PWM channels for variable-speed fan control. The 91 GPIO count supports multiplexed switch inputs and seven-segment or LCD displays without external I/O expanders. Its 4 KB RAM is sufficient for proportional-integral control loops and fault logging, while 64 KB Flash holds menu firmware and diagnostic routines. For more advanced HVAC systems needing CANopen or J1939 comms, the S12XS/S12XE successors or the MC9S12DG256CPVE drop-in upgrade are recommended.
Empfohlen
Instrument Cluster Displays
Instrument cluster applications use the MC9S12D64MPVE to drive gauge stepper motors, read vehicle speed sensors and manage warning-indicator LEDs. The 8-channel IC/OC enhanced capture timer precisely measures wheel-speed pulses and crank signals, while the two ADCs monitor fuel level and oil pressure sensors. The HCS12 BDM interface simplifies cluster calibration and end-of-line programming. Although the part is NRND, the S12XS64 and S12XE64 successors share the 112-LQFP footprint and pin compatibility, enabling painless migration for cluster programs.
Empfohlen
Battery Management Systems
The MC9S12D64MPVE can serve as a slave controller in distributed battery management systems, where its two 8-channel ADCs monitor cell voltages and temperatures across 12-16 Li-ion cells. The 64 KB Flash holds cell-balancing algorithms and state-of-charge firmware, while the PWM channels drive balancing FETs. Its 2.5 V/5 V supply flexibility lets it run directly from a regulated cell-stack tap. For higher cell counts or active balancing, designers should consider the MC9S12DP512MPVE with 512 KB Flash and dual CAN modules for daisy-chained BMS topologies.
Empfohlen
Consumer Appliance Control
White-goods and consumer appliances such as washing machines, dishwashers and induction cooktops use the MC9S12D64MPVE for motor control, user-interface scan and safety monitoring. The 8 PWM channels drive triac-fired heater elements or BLDC motor inverters, and the 91 GPIO handle capacitive touch keys, rotary encoders and seven-segment displays. The HCS12 CISC instruction set makes compact assembly code for fast time-critical routines, and the 112-LQFP footprint is well supported by low-cost PCB assemblers. Migration path: S9S12XS64J1MAL or the S12XE family on the same footprint for active lifecycle.
Empfohlen
Security and Access Control Panels
Access control panels and alarm systems use the MC9S12D64MPVE to scan keypads, drive piezo buzzers, and interface to magnetic-door sensors. The 2x SCI channels simplify integration with external GSM or Ethernet modules for remote reporting, while the 8 PWM channels drive the piezo buzzer at variable tones. The HCS12's wide 2.5 V-5 V supply range enables direct operation from 5 V regulated supplies or backup battery stacks, and the 64 KB Flash stores zone-configuration firmware and event logs. Migration to the active S12XS family is straightforward on the same 112-LQFP footprint.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12D64MPVE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12D64CFUER | MC9S12DG256CPVE | MC9S12E64CPVE | S9S12XS64J1MAL |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20 x 20 mm) | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same | 112-LQFP - same |
| Core | HCS12 (16-bit CISC) | HCS12 | HCS12 | Enhanced HCS12E | HCS12 + XGATE coprocessor |
| Max CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 64 KB | 64 KB (same) | 256 KB | 64 KB | 64 KB |
| RAM Size | 4 KB | 4 KB (same) | 12 KB | 4 KB | 4 KB |
| CAN Module | No | No | Yes | Yes | Yes |
| EEPROM | No | No | 4 KB | Yes | No |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
Wichtigste Unterscheidungsmerkmale
- Active S12XS successor with XGATE coprocessor and CAN on same LQFP-112 footprint (vs. S9S12XS64J1MAL)
- Drop-in upgrade path with 4x Flash and 3x RAM on same 112-LQFP pinout (vs. MC9S12DG256CPVE)
- 512 KB Flash for memory-intensive applications on same LQFP-112 footprint (vs. MC9S12DP512CPVER)
Designhinweise
The MC9S12D64MPVE uses two supply rails: VDDX/VSSX for external I/O at 5 V (or 3.3 V) and VDDR/VSS for the internal voltage regulator that powers the HCS12 core. Place 100 nF ceramic decoupling capacitors within 5 mm of each VDDX, VDDR, VDDA and VSSA pin, and add a 4.7 uF bulk tantalum or ceramic on VDDX to handle transient current during PWM-driven switching events. Tie TEST low through a 1 k resistor to keep the device in normal run mode.
The MC9S12D64MPVE is flagged NRND on NXP's product page as of 2026-10-19, which means it is NOT recommended for new designs. Designers starting new projects should select the S12XE64 or S12XS64 family for active lifecycle support, and migrate existing firmware to the XGATE-enabled derivatives if real-time peripheral performance is required. Do not place new production orders against long lead times without first requesting a Last Time Buy (LTB) quote from NXP.
Route the EXTAL/XTAL traces as short, symmetric differential pairs with a guard ground ring to minimize EMI pickup. Place the load capacitors within 3 mm of the crystal pins and avoid routing high-frequency PWM or SCI traces underneath. The BKGD pin should be brought to a dedicated test pad or header for BDM access without disturbing the PCB layout, and the RESET pin must include an external 4.7 k pull-up to VDDX and a 1 nF capacitor to ground for proper power-on reset behavior.
The HCS12 BDM (Background Debug Mode) interface is single-wire and asynchronous; the BKGD pin requires a 4.7 k pull-up to VDDX and a series resistor of approximately 1 k to the debug pod for clean signal edges at 25 MHz bus speeds. Avoid long BDM traces or stubs, and isolate the BKGD pin from adjacent high-current PWM outputs to prevent debug-session glitches during firmware development.
Compliance-Informationen
AEC-Q100 qualified per NXP S12D family documentation; lead-free and RoHS/REACH compliant. NRND status as of 2026-10-19; consult NXP for automotive PPAP renewal.
