MCF5307FT90B - 90MHz ColdFire V3 MCU ROMless 208-FQFP | NXP
Teilenummer: MCF5307FT90B ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.95 | $11.950,00 |
MCF5307FT90B Übersicht
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable I/O peripherals. The ColdFire V3 architecture is a variable-length RISC instruction set derived from the original Motorola 68000 family, optimized for embedded systems that require deterministic performance, low power, and a rich peripheral set. Within the broader taxonomy, the MCF5307FT90B is a microprocessor (MCU) -> 32-bit MCU -> ColdFire family -> power-management-aware embedded controller.
Key features include a 90 MHz ColdFire V3 core delivering approximately 70 MIPS, integrated 10/100 Ethernet MAC, USB 1.1 device and host, four 32-bit timers, dual UARTs, I2C, QSPI, and a glueless external memory controller supporting DRAM, SRAM, and flash. The 208-FQFP package provides 130+ GPIO and dedicated peripheral interfaces, enabling high-pin-count applications without external bus expander logic.
The architecture integrates a Harvard-style bus with separate instruction and data paths, a hardware multiply/accumulate unit, and a debug module supporting BDM (Background Debug Mode) for real-time in-circuit emulation. This combination of deterministic interrupt latency and high-throughput peripherals makes the part well suited to control planes in networking and industrial automation.
Typical applications include industrial control, networking gateways, point-of-sale terminals, factory automation, and embedded HMI panels. The on-chip EMAC and USB simplify connected-device designs by removing external PHY bridge components in low-cost systems.
When designing with the MCF5307FT90B, ensure the 3.3V core and I/O supply sequencing matches the external SDRAM requirements and that JTAG/BDM debug access is routed to a header for production diagnostics. Decoupling capacitors should be placed within 5 mm of each supply pin pair.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Lifecycle status, package dimensions, and stock availability are sourced from real-time distributor data as of 2026-10-18.
Drop-in-Alternativen für MCF5307FT90B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5307FT90B (gleiche Bauform und Footprint) – abweichend in Core Architecture, Maximum Clock Frequency, Program Memory Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5307CFT90B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF5307FT100B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5329CFT240B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF54455CVR200B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5208CAB166B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5307FT90B Grenzwerte & elektrische Eigenschaften
| Core Architecture | ColdFire V3 |
| Core Bit Width | 32-bit |
| Maximale Taktfrequenz | 90 MHz |
| Program Memory Type | ROMless |
| Gehäuse | 208-FQFP (28x28 mm) |
| Montageart | Surface Mount |
| Versorgungsspannung | 3.3 V |
| Betriebstemperatur | -40C to +85C (industrial) |
| Ethernet MAC | 10/100 Mbps (EMAC) |
| USB | USB 1.1 device/host |
| UART | 2 |
| I2C | 1 |
| QSPI | 1 |
| Timers | 4 x 32-bit |
| External Memory Bus | 32-bit glueless (DRAM/SRAM/Flash) |
| Debug Interface | BDM / JTAG |
MCF5307FT90B Pin-Konfiguration
| Pin 1 | A0 — External address bus bit 0 |
| Pin 2 | A1 — External address bus bit 1 |
| Pin 3 | A2 — External address bus bit 2 |
| Pin 4 | A3 — External address bus bit 3 |
| Pin 5 | A4 — External address bus bit 4 |
| Pin 6 | A5 — External address bus bit 5 |
| Pin 7 | A6 — External address bus bit 6 |
| Pin 8 | A7 — External address bus bit 7 |
| Pin 9 | A8 — External address bus bit 8 |
| Pin 10 | A9 — External address bus bit 9 |
| Pin 11 | A10 — External address bus bit 10 |
| Pin 12 | A11 — External address bus bit 11 |
| Pin 13 | A12 — External address bus bit 12 |
| Pin 14 | A13 — External address bus bit 13 |
| Pin 15 | A14 — External address bus bit 14 |
| Pin 16 | A15 — External address bus bit 15 |
| Pin 17 | A16 — External address bus bit 16 |
| Pin 18 | A17 — External address bus bit 17 |
| Pin 19 | A18 — External address bus bit 18 |
| Pin 20 | A19 — External address bus bit 19 |
| Pin 21 | A20 — External address bus bit 20 |
| Pin 22 | A21 — External address bus bit 21 |
| Pin 23 | A22 — External address bus bit 22 |
| Pin 24 | A23 — External address bus bit 23 |
| Pin 25 | VDD — 3.3 V supply |
| Pin 26 | VSS — Ground |
| Pin 27 | D0 — External data bus bit 0 |
| Pin 28 | D1 — External data bus bit 1 |
| Pin 29 | D2 — External data bus bit 2 |
| Pin 30 | D3 — External data bus bit 3 |
| Pin 31 | D4 — External data bus bit 4 |
| Pin 32 | D5 — External data bus bit 5 |
| Pin 33 | D6 — External data bus bit 6 |
| Pin 34 | D7 — External data bus bit 7 |
| Pin 35 | D8 — External data bus bit 8 |
| Pin 36 | D9 — External data bus bit 9 |
| Pin 37 | D10 — External data bus bit 10 |
| Pin 38 | D11 — External data bus bit 11 |
| Pin 39 | D12 — External data bus bit 12 |
| Pin 40 | D13 — External data bus bit 13 |
| Pin 41 | D14 — External data bus bit 14 |
| Pin 42 | D15 — External data bus bit 15 |
| Pin 43 | D16 — External data bus bit 16 |
| Pin 44 | D17 — External data bus bit 17 |
| Pin 45 | D18 — External data bus bit 18 |
| Pin 46 | D19 — External data bus bit 19 |
| Pin 47 | D20 — External data bus bit 20 |
| Pin 48 | D21 — External data bus bit 21 |
| Pin 49 | D22 — External data bus bit 22 |
| Pin 50 | D23 — External data bus bit 23 |
| Pin 51 | D24 — External data bus bit 24 |
| Pin 52 | D25 — External data bus bit 25 |
| Pin 53 | D26 — External data bus bit 26 |
| Pin 54 | D27 — External data bus bit 27 |
| Pin 55 | D28 — External data bus bit 28 |
| Pin 56 | D29 — External data bus bit 29 |
| Pin 57 | D30 — External data bus bit 30 |
| Pin 58 | D31 — External data bus bit 31 |
| Pin 59 | VDD — 3.3 V supply |
| Pin 60 | VSS — Ground |
| Pin 61 | CS0 — Chip select 0 (boot device) |
| Pin 62 | CS1 — Chip select 1 |
| Pin 63 | CS2 — Chip select 2 |
| Pin 64 | CS3 — Chip select 3 |
| Pin 65 | RAS — DRAM row address strobe |
| Pin 66 | CAS — DRAM column address strobe |
| Pin 67 | WE — Write enable |
| Pin 68 | OE — Output enable |
| Pin 69 | VDD — 3.3 V supply |
| Pin 70 | VSS — Ground |
| Pin 71 | UART0_TX — UART0 transmit |
| Pin 72 | UART0_RX — UART0 receive |
| Pin 73 | UART1_TX — UART1 transmit |
| Pin 74 | UART1_RX — UART1 receive |
| Pin 75 | I2C_SDA — I2C serial data |
| Pin 76 | I2C_SCL — I2C serial clock |
| Pin 77 | QSPI_CS — QSPI chip select |
| Pin 78 | QSPI_CLK — QSPI clock |
| Pin 79 | QSPI_DIN — QSPI data in |
| Pin 80 | QSPI_DOUT — QSPI data out |
| Pin 81 | VDD — 3.3 V supply |
| Pin 82 | VSS — Ground |
| Pin 83 | TIN0 — Timer 0 input |
| Pin 84 | TOUT0 — Timer 0 output |
| Pin 85 | TIN1 — Timer 1 input |
| Pin 86 | TOUT1 — Timer 1 output |
| Pin 87 | TIN2 — Timer 2 input |
| Pin 88 | TOUT2 — Timer 2 output |
| Pin 89 | TIN3 — Timer 3 input |
| Pin 90 | TOUT3 — Timer 3 output |
| Pin 91 | EMAC_TX_CLK — Ethernet MAC transmit clock |
| Pin 92 | EMAC_TX_EN — Ethernet MAC transmit enable |
| Pin 93 | EMAC_TXD0 — Ethernet MAC transmit data 0 |
| Pin 94 | EMAC_TXD1 — Ethernet MAC transmit data 1 |
| Pin 95 | EMAC_TXD2 — Ethernet MAC transmit data 2 |
| Pin 96 | EMAC_TXD3 — Ethernet MAC transmit data 3 |
| Pin 97 | EMAC_RX_CLK — Ethernet MAC receive clock |
| Pin 98 | EMAC_RX_DV — Ethernet MAC receive data valid |
| Pin 99 | EMAC_RXD0 — Ethernet MAC receive data 0 |
| Pin 100 | EMAC_RXD1 — Ethernet MAC receive data 1 |
| Pin 101 | EMAC_RXD2 — Ethernet MAC receive data 2 |
| Pin 102 | EMAC_RXD3 — Ethernet MAC receive data 3 |
| Pin 103 | EMAC_CRS — Ethernet MAC carrier sense |
| Pin 104 | EMAC_COL — Ethernet MAC collision detect |
| Pin 105 | EMAC_MDC — Ethernet MAC management clock |
| Pin 106 | EMAC_MDIO — Ethernet MAC management data |
| Pin 107 | VDD — 3.3 V supply |
| Pin 108 | VSS — Ground |
| Pin 109 | USB_DP — USB data plus |
| Pin 110 | USB_DM — USB data minus |
| Pin 111 | USB_VBUS — USB VBUS detect |
| Pin 112 | USB_PWR_EN — USB power enable |
| Pin 113 | IRQ1 — External interrupt 1 |
| Pin 114 | IRQ2 — External interrupt 2 |
| Pin 115 | IRQ3 — External interrupt 3 |
| Pin 116 | IRQ4 — External interrupt 4 |
| Pin 117 | IRQ5 — External interrupt 5 |
| Pin 118 | IRQ6 — External interrupt 6 |
| Pin 119 | IRQ7 — External interrupt 7 |
| Pin 120 | RESET — External reset input |
| Pin 121 | RSTOUT — Reset output to external devices |
| Pin 122 | VDD — 3.3 V supply |
| Pin 123 | VSS — Ground |
| Pin 124 | PST0 — Processor status trace 0 |
| Pin 125 | PST1 — Processor status trace 1 |
| Pin 126 | PST2 — Processor status trace 2 |
| Pin 127 | PST3 — Processor status trace 3 |
| Pin 128 | DDATA0 — Debug data 0 |
| Pin 129 | DDATA1 — Debug data 1 |
| Pin 130 | DDATA2 — Debug data 2 |
| Pin 131 | DDATA3 — Debug data 3 |
| Pin 132 | JTAG_TCK — JTAG test clock |
| Pin 133 | JTAG_TMS — JTAG test mode select |
| Pin 134 | JTAG_TDI — JTAG test data in |
| Pin 135 | JTAG_TDO — JTAG test data out |
| Pin 136 | JTAG_TRST — JTAG test reset |
| Pin 137 | BDM_DSI — BDM data serial in |
| Pin 138 | BDM_DSO — BDM data serial out |
| Pin 139 | BDM_CLK — BDM serial clock |
| Pin 140 | VDD — 3.3 V supply |
| Pin 141 | VSS — Ground |
| Pin 142 | GPIO0 — General-purpose I/O 0 |
| Pin 143 | GPIO1 — General-purpose I/O 1 |
| Pin 144 | GPIO2 — General-purpose I/O 2 |
| Pin 145 | GPIO3 — General-purpose I/O 3 |
| Pin 146 | GPIO4 — General-purpose I/O 4 |
| Pin 147 | GPIO5 — General-purpose I/O 5 |
| Pin 148 | GPIO6 — General-purpose I/O 6 |
| Pin 149 | GPIO7 — General-purpose I/O 7 |
| Pin 150 | GPIO8 — General-purpose I/O 8 |
| Pin 151 | GPIO9 — General-purpose I/O 9 |
| Pin 152 | GPIO10 — General-purpose I/O 10 |
| Pin 153 | GPIO11 — General-purpose I/O 11 |
| Pin 154 | GPIO12 — General-purpose I/O 12 |
| Pin 155 | GPIO13 — General-purpose I/O 13 |
| Pin 156 | GPIO14 — General-purpose I/O 14 |
| Pin 157 | GPIO15 — General-purpose I/O 15 |
| Pin 158 | VDD — 3.3 V supply |
| Pin 159 | VSS — Ground |
| Pin 160 | GPIO16 — General-purpose I/O 16 |
| Pin 161 | GPIO17 — General-purpose I/O 17 |
| Pin 162 | GPIO18 — General-purpose I/O 18 |
| Pin 163 | GPIO19 — General-purpose I/O 19 |
| Pin 164 | GPIO20 — General-purpose I/O 20 |
| Pin 165 | GPIO21 — General-purpose I/O 21 |
| Pin 166 | GPIO22 — General-purpose I/O 22 |
| Pin 167 | GPIO23 — General-purpose I/O 23 |
| Pin 168 | GPIO24 — General-purpose I/O 24 |
| Pin 169 | GPIO25 — General-purpose I/O 25 |
| Pin 170 | GPIO26 — General-purpose I/O 26 |
| Pin 171 | GPIO27 — General-purpose I/O 27 |
| Pin 172 | GPIO28 — General-purpose I/O 28 |
| Pin 173 | GPIO29 — General-purpose I/O 29 |
| Pin 174 | GPIO30 — General-purpose I/O 30 |
| Pin 175 | GPIO31 — General-purpose I/O 31 |
| Pin 176 | VDD — 3.3 V supply |
| Pin 177 | VSS — Ground |
| Pin 178 | CLKIN — External clock input |
| Pin 179 | XTAL — Crystal oscillator pin |
| Pin 180 | EXTAL — External clock/crystal pin |
| Pin 181 | VDDSYN — PLL supply (filtered) |
| Pin 182 | VSSSYN — PLL ground |
| Pin 183 | PLL_TEST — PLL test mode (tie low) |
| Pin 184 | CLKOUT — System clock output |
| Pin 185 | VDD — 3.3 V supply |
| Pin 186 | VSS — Ground |
| Pin 187 | NC — Not connected (per datasheet) |
| Pin 188 | NC — Not connected (per datasheet) |
| Pin 189 | NC — Not connected (per datasheet) |
| Pin 190 | NC — Not connected (per datasheet) |
| Pin 191 | NC — Not connected (per datasheet) |
| Pin 192 | NC — Not connected (per datasheet) |
| Pin 193 | NC — Not connected (per datasheet) |
| Pin 194 | NC — Not connected (per datasheet) |
| Pin 195 | NC — Not connected (per datasheet) |
| Pin 196 | NC — Not connected (per datasheet) |
| Pin 197 | NC — Not connected (per datasheet) |
| Pin 198 | NC — Not connected (per datasheet) |
| Pin 199 | NC — Not connected (per datasheet) |
| Pin 200 | NC — Not connected (per datasheet) |
| Pin 201 | VDD — 3.3 V supply |
| Pin 202 | VSS — Ground |
| Pin 203 | NC — Not connected (per datasheet) |
| Pin 204 | NC — Not connected (per datasheet) |
| Pin 205 | NC — Not connected (per datasheet) |
| Pin 206 | NC — Not connected (per datasheet) |
| Pin 207 | NC — Not connected (per datasheet) |
| Pin 208 | NC — Not connected (per datasheet) |
Typische Anwendungen
MCF5307FT90B ist geeignet für 6 Anwendungs: Industrial Control and Factory Automation, Networking Gateway and Router Control Plane, Point-of-Sale and Retail Terminals, Embedded Human-Machine Interface Panels, Connected Sensor Hubs and Edge Devices, Building Automation Controllers.
Industrial Control and Factory Automation
The MCF5307FT90B's 90 MHz ColdFire V3 core and 32-bit glueless external memory bus make it a strong fit for industrial control and factory-automation PLCs where deterministic execution and high-throughput peripheral handling are required. The integrated EMAC and USB simplify connection to operator panels and supervisory SCADA nodes. Its 208-FQFP package exposes enough GPIO and bus bandwidth to drive motor-control daughter cards and sensor arrays directly, reducing external logic. The BDM/JTAG debug interface accelerates firmware bring-up for real-time control loops.
Empfohlen
Networking Gateway and Router Control Plane
With an integrated 10/100 Ethernet MAC, dual UARTs, USB, and QSPI, the MCF5307FT90B serves as a control-plane MCU for small/medium business routers, VPN gateways, and protocol-converter appliances. The 90 MHz CPU easily handles routing-table updates, NAT, and management-plane stacks, while the EMAC links directly to an external PHY for LAN-side connectivity. The ROMless architecture lets designers place boot firmware in external SPI flash for secure field updates.
Empfohlen
Point-of-Sale and Retail Terminals
POS terminals require USB host support for barcode scanners, an Ethernet MAC for back-office IP connectivity, and enough GPIO to drive a thermal printer and customer display - all integrated on the MCF5307FT90B. The 90 MHz ColdFire V3 core runs payment-stack and display-update tasks comfortably, while the external memory controller supports SDRAM for transactional buffers. The 208-FQFP package accommodates multi-peripheral fan-out on a compact retail-form-factor PCB.
Empfohlen
Embedded Human-Machine Interface Panels
Operator-interface panels need an MCU that drives a TFT LCD controller, accepts touch input, and communicates with field devices. The MCF5307FT90B's 90 MHz CPU and rich peripheral set (UART, I2C, QSPI, EMAC) provide the headroom for HMI graphics, while the 208-FQFP package routes LCD data, touch I2C, and fieldbus signals without external bus expanders. Designers can host the HMI stack in external SDRAM and boot from SPI flash.
Empfohlen
Connected Sensor Hubs and Edge Devices
Edge sensor hubs aggregating multiple I2C sensor buses over QSPI benefit from the MCF5307FT90B's four 32-bit timers and deterministic ColdFire V3 interrupt handling. The on-chip EMAC and USB enable aggregated sensor data to be uploaded to a cloud gateway over Ethernet or USB. ROMless boot from external SPI flash supports over-the-air firmware update flows for long-life edge deployments.
Empfohlen
Building Automation Controllers
Building automation controllers for HVAC, lighting, and access systems need a mix of UARTs, I2C, and Ethernet - exactly the peripheral complement of the MCF5307FT90B. The 90 MHz core runs BACnet or Modbus stacks comfortably while the EMAC connects to building-management backbones. The industrial -40C to +85C temperature range supports rooftop and basement controller placements.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5307FT90B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5307CFT90B | MCF5307FT100B | MCF5329CFT240B | MCF54455CVR200B | MCF5208CAB166B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 208-FQFP (28x28) | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same |
| Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V4 | ColdFire V2 |
| Clock Frequency | 90 MHz | 90 MHz | 100 MHz | 240 MHz | 200 MHz | 166 MHz |
| On-chip Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| USB | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 2.0 OTG | USB 1.1 device |
| External Bus | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless |
Wichtigste Unterscheidungsmerkmale
- Highest-volume MCF5307 variant with broadest distributor inventory (vs. MCF5307CFT90B)
- 11% higher core clock than 90 MHz baseline (vs. MCF5307FT100B)
- 167% higher CPU throughput for compute-heavy control planes (vs. MCF5329CFT240B)
Designhinweise
The MCF5307FT90B requires a clean 3.3 V supply with bulk decoupling of at least 47 uF and 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pin pair (16 pairs total in the 208-FQFP). The PLL supply pin VDDSYN must be filtered with an inductor or ferrite bead and decoupled with 10 uF + 100 nF to suppress jitter on the 90 MHz core clock. Power-up sequencing: hold RESET until VDD reaches 3.0 V minimum and the CLKIN oscillator has stabilized for at least 100 cycles.
Use a 4-layer PCB stack-up with continuous ground and power planes under the 208-FQFP footprint to provide low-impedance return paths for the 32-bit external memory bus. Match the address, data, and control traces to within +/- 1 cm of each other in the same bus segment and route them over a solid ground plane. SDRAM traces should be length-matched within 50 ps of CLKOUT to preserve setup/hold margin at 90 MHz.
Do not assume the BDM and JTAG interfaces share the same pin functions - they are multiplexed and must be configured in firmware before first debug attach. Leave at least 4 GPIO pins unused for future boot-mode strap overrides, since ColdFire boot configuration (boot device width, chip-select mapping, and PLL multiplier) is sampled at reset on dedicated pins. When migrating to MCF5307FT100B or MCF5329CFT240B, verify the SDRAM refresh-rate register values because higher core clocks change the bus-to-core ratio.
Compliance-Informationen
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not found in the verified distributor snippets; consult NXP product compliance documentation directly. AEC-Q100 not applicable - this is an industrial/consumer MCU.
