MCF5307FT90B - 90MHz ColdFire V3 MCU ROMless 208-FQFP | NXP
Référence : MCF5307FT90B ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1 495,00 |
| 500 | $13.2 | $6 600,00 |
| 1 000 | $11.95 | $11 950,00 |
MCF5307FT90B Présentation
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable I/O peripherals. The ColdFire V3 architecture is a variable-length RISC instruction set derived from the original Motorola 68000 family, optimized for embedded systems that require deterministic performance, low power, and a rich peripheral set. Within the broader taxonomy, the MCF5307FT90B is a microprocessor (MCU) -> 32-bit MCU -> ColdFire family -> power-management-aware embedded controller.
Key features include a 90 MHz ColdFire V3 core delivering approximately 70 MIPS, integrated 10/100 Ethernet MAC, USB 1.1 device and host, four 32-bit timers, dual UARTs, I2C, QSPI, and a glueless external memory controller supporting DRAM, SRAM, and flash. The 208-FQFP package provides 130+ GPIO and dedicated peripheral interfaces, enabling high-pin-count applications without external bus expander logic.
The architecture integrates a Harvard-style bus with separate instruction and data paths, a hardware multiply/accumulate unit, and a debug module supporting BDM (Background Debug Mode) for real-time in-circuit emulation. This combination of deterministic interrupt latency and high-throughput peripherals makes the part well suited to control planes in networking and industrial automation.
Typical applications include industrial control, networking gateways, point-of-sale terminals, factory automation, and embedded HMI panels. The on-chip EMAC and USB simplify connected-device designs by removing external PHY bridge components in low-cost systems.
When designing with the MCF5307FT90B, ensure the 3.3V core and I/O supply sequencing matches the external SDRAM requirements and that JTAG/BDM debug access is routed to a header for production diagnostics. Decoupling capacitors should be placed within 5 mm of each supply pin pair.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Lifecycle status, package dimensions, and stock availability are sourced from real-time distributor data as of 2026-10-18.
Alternatives de remplacement direct pour MCF5307FT90B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5307FT90B (même facteur de forme et même empreinte) — différant par Core Architecture, Maximum Clock Frequency, Program Memory Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF5307CFT90B
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5307FT100B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5329CFT240B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF54455CVR200B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5208CAB166B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCF5307FT90B Valeurs maximales et caractéristiques électriques
| Core Architecture | ColdFire V3 |
| Core Bit Width | 32-bit |
| Fréquence d'horloge maximale | 90 MHz |
| Program Memory Type | ROMless |
| Boîtier | 208-FQFP (28x28 mm) |
| Type de montage | Surface Mount |
| Tension d'alimentation | 3.3 V |
| Température de fonctionnement | -40C to +85C (industrial) |
| Ethernet MAC | 10/100 Mbps (EMAC) |
| USB | USB 1.1 device/host |
| UART | 2 |
| I2C | 1 |
| QSPI | 1 |
| Timers | 4 x 32-bit |
| External Memory Bus | 32-bit glueless (DRAM/SRAM/Flash) |
| Debug Interface | BDM / JTAG |
Configuration des broches de MCF5307FT90B
| Broche 1 | A0 — External address bus bit 0 |
| Broche 2 | A1 — External address bus bit 1 |
| Broche 3 | A2 — External address bus bit 2 |
| Broche 4 | A3 — External address bus bit 3 |
| Broche 5 | A4 — External address bus bit 4 |
| Broche 6 | A5 — External address bus bit 5 |
| Broche 7 | A6 — External address bus bit 6 |
| Broche 8 | A7 — External address bus bit 7 |
| Broche 9 | A8 — External address bus bit 8 |
| Broche 10 | A9 — External address bus bit 9 |
| Broche 11 | A10 — External address bus bit 10 |
| Broche 12 | A11 — External address bus bit 11 |
| Broche 13 | A12 — External address bus bit 12 |
| Broche 14 | A13 — External address bus bit 13 |
| Broche 15 | A14 — External address bus bit 14 |
| Broche 16 | A15 — External address bus bit 15 |
| Broche 17 | A16 — External address bus bit 16 |
| Broche 18 | A17 — External address bus bit 17 |
| Broche 19 | A18 — External address bus bit 18 |
| Broche 20 | A19 — External address bus bit 19 |
| Broche 21 | A20 — External address bus bit 20 |
| Broche 22 | A21 — External address bus bit 21 |
| Broche 23 | A22 — External address bus bit 22 |
| Broche 24 | A23 — External address bus bit 23 |
| Broche 25 | VDD — 3.3 V supply |
| Broche 26 | VSS — Ground |
| Broche 27 | D0 — External data bus bit 0 |
| Broche 28 | D1 — External data bus bit 1 |
| Broche 29 | D2 — External data bus bit 2 |
| Broche 30 | D3 — External data bus bit 3 |
| Broche 31 | D4 — External data bus bit 4 |
| Broche 32 | D5 — External data bus bit 5 |
| Broche 33 | D6 — External data bus bit 6 |
| Broche 34 | D7 — External data bus bit 7 |
| Broche 35 | D8 — External data bus bit 8 |
| Broche 36 | D9 — External data bus bit 9 |
| Broche 37 | D10 — External data bus bit 10 |
| Broche 38 | D11 — External data bus bit 11 |
| Broche 39 | D12 — External data bus bit 12 |
| Broche 40 | D13 — External data bus bit 13 |
| Broche 41 | D14 — External data bus bit 14 |
| Broche 42 | D15 — External data bus bit 15 |
| Broche 43 | D16 — External data bus bit 16 |
| Broche 44 | D17 — External data bus bit 17 |
| Broche 45 | D18 — External data bus bit 18 |
| Broche 46 | D19 — External data bus bit 19 |
| Broche 47 | D20 — External data bus bit 20 |
| Broche 48 | D21 — External data bus bit 21 |
| Broche 49 | D22 — External data bus bit 22 |
| Broche 50 | D23 — External data bus bit 23 |
| Broche 51 | D24 — External data bus bit 24 |
| Broche 52 | D25 — External data bus bit 25 |
| Broche 53 | D26 — External data bus bit 26 |
| Broche 54 | D27 — External data bus bit 27 |
| Broche 55 | D28 — External data bus bit 28 |
| Broche 56 | D29 — External data bus bit 29 |
| Broche 57 | D30 — External data bus bit 30 |
| Broche 58 | D31 — External data bus bit 31 |
| Broche 59 | VDD — 3.3 V supply |
| Broche 60 | VSS — Ground |
| Broche 61 | CS0 — Chip select 0 (boot device) |
| Broche 62 | CS1 — Chip select 1 |
| Broche 63 | CS2 — Chip select 2 |
| Broche 64 | CS3 — Chip select 3 |
| Broche 65 | RAS — DRAM row address strobe |
| Broche 66 | CAS — DRAM column address strobe |
| Broche 67 | WE — Write enable |
| Broche 68 | OE — Output enable |
| Broche 69 | VDD — 3.3 V supply |
| Broche 70 | VSS — Ground |
| Broche 71 | UART0_TX — UART0 transmit |
| Broche 72 | UART0_RX — UART0 receive |
| Broche 73 | UART1_TX — UART1 transmit |
| Broche 74 | UART1_RX — UART1 receive |
| Broche 75 | I2C_SDA — I2C serial data |
| Broche 76 | I2C_SCL — I2C serial clock |
| Broche 77 | QSPI_CS — QSPI chip select |
| Broche 78 | QSPI_CLK — QSPI clock |
| Broche 79 | QSPI_DIN — QSPI data in |
| Broche 80 | QSPI_DOUT — QSPI data out |
| Broche 81 | VDD — 3.3 V supply |
| Broche 82 | VSS — Ground |
| Broche 83 | TIN0 — Timer 0 input |
| Broche 84 | TOUT0 — Timer 0 output |
| Broche 85 | TIN1 — Timer 1 input |
| Broche 86 | TOUT1 — Timer 1 output |
| Broche 87 | TIN2 — Timer 2 input |
| Broche 88 | TOUT2 — Timer 2 output |
| Broche 89 | TIN3 — Timer 3 input |
| Broche 90 | TOUT3 — Timer 3 output |
| Broche 91 | EMAC_TX_CLK — Ethernet MAC transmit clock |
| Broche 92 | EMAC_TX_EN — Ethernet MAC transmit enable |
| Broche 93 | EMAC_TXD0 — Ethernet MAC transmit data 0 |
| Broche 94 | EMAC_TXD1 — Ethernet MAC transmit data 1 |
| Broche 95 | EMAC_TXD2 — Ethernet MAC transmit data 2 |
| Broche 96 | EMAC_TXD3 — Ethernet MAC transmit data 3 |
| Broche 97 | EMAC_RX_CLK — Ethernet MAC receive clock |
| Broche 98 | EMAC_RX_DV — Ethernet MAC receive data valid |
| Broche 99 | EMAC_RXD0 — Ethernet MAC receive data 0 |
| Broche 100 | EMAC_RXD1 — Ethernet MAC receive data 1 |
| Broche 101 | EMAC_RXD2 — Ethernet MAC receive data 2 |
| Broche 102 | EMAC_RXD3 — Ethernet MAC receive data 3 |
| Broche 103 | EMAC_CRS — Ethernet MAC carrier sense |
| Broche 104 | EMAC_COL — Ethernet MAC collision detect |
| Broche 105 | EMAC_MDC — Ethernet MAC management clock |
| Broche 106 | EMAC_MDIO — Ethernet MAC management data |
| Broche 107 | VDD — 3.3 V supply |
| Broche 108 | VSS — Ground |
| Broche 109 | USB_DP — USB data plus |
| Broche 110 | USB_DM — USB data minus |
| Broche 111 | USB_VBUS — USB VBUS detect |
| Broche 112 | USB_PWR_EN — USB power enable |
| Broche 113 | IRQ1 — External interrupt 1 |
| Broche 114 | IRQ2 — External interrupt 2 |
| Broche 115 | IRQ3 — External interrupt 3 |
| Broche 116 | IRQ4 — External interrupt 4 |
| Broche 117 | IRQ5 — External interrupt 5 |
| Broche 118 | IRQ6 — External interrupt 6 |
| Broche 119 | IRQ7 — External interrupt 7 |
| Broche 120 | RESET — External reset input |
| Broche 121 | RSTOUT — Reset output to external devices |
| Broche 122 | VDD — 3.3 V supply |
| Broche 123 | VSS — Ground |
| Broche 124 | PST0 — Processor status trace 0 |
| Broche 125 | PST1 — Processor status trace 1 |
| Broche 126 | PST2 — Processor status trace 2 |
| Broche 127 | PST3 — Processor status trace 3 |
| Broche 128 | DDATA0 — Debug data 0 |
| Broche 129 | DDATA1 — Debug data 1 |
| Broche 130 | DDATA2 — Debug data 2 |
| Broche 131 | DDATA3 — Debug data 3 |
| Broche 132 | JTAG_TCK — JTAG test clock |
| Broche 133 | JTAG_TMS — JTAG test mode select |
| Broche 134 | JTAG_TDI — JTAG test data in |
| Broche 135 | JTAG_TDO — JTAG test data out |
| Broche 136 | JTAG_TRST — JTAG test reset |
| Broche 137 | BDM_DSI — BDM data serial in |
| Broche 138 | BDM_DSO — BDM data serial out |
| Broche 139 | BDM_CLK — BDM serial clock |
| Broche 140 | VDD — 3.3 V supply |
| Broche 141 | VSS — Ground |
| Broche 142 | GPIO0 — General-purpose I/O 0 |
| Broche 143 | GPIO1 — General-purpose I/O 1 |
| Broche 144 | GPIO2 — General-purpose I/O 2 |
| Broche 145 | GPIO3 — General-purpose I/O 3 |
| Broche 146 | GPIO4 — General-purpose I/O 4 |
| Broche 147 | GPIO5 — General-purpose I/O 5 |
| Broche 148 | GPIO6 — General-purpose I/O 6 |
| Broche 149 | GPIO7 — General-purpose I/O 7 |
| Broche 150 | GPIO8 — General-purpose I/O 8 |
| Broche 151 | GPIO9 — General-purpose I/O 9 |
| Broche 152 | GPIO10 — General-purpose I/O 10 |
| Broche 153 | GPIO11 — General-purpose I/O 11 |
| Broche 154 | GPIO12 — General-purpose I/O 12 |
| Broche 155 | GPIO13 — General-purpose I/O 13 |
| Broche 156 | GPIO14 — General-purpose I/O 14 |
| Broche 157 | GPIO15 — General-purpose I/O 15 |
| Broche 158 | VDD — 3.3 V supply |
| Broche 159 | VSS — Ground |
| Broche 160 | GPIO16 — General-purpose I/O 16 |
| Broche 161 | GPIO17 — General-purpose I/O 17 |
| Broche 162 | GPIO18 — General-purpose I/O 18 |
| Broche 163 | GPIO19 — General-purpose I/O 19 |
| Broche 164 | GPIO20 — General-purpose I/O 20 |
| Broche 165 | GPIO21 — General-purpose I/O 21 |
| Broche 166 | GPIO22 — General-purpose I/O 22 |
| Broche 167 | GPIO23 — General-purpose I/O 23 |
| Broche 168 | GPIO24 — General-purpose I/O 24 |
| Broche 169 | GPIO25 — General-purpose I/O 25 |
| Broche 170 | GPIO26 — General-purpose I/O 26 |
| Broche 171 | GPIO27 — General-purpose I/O 27 |
| Broche 172 | GPIO28 — General-purpose I/O 28 |
| Broche 173 | GPIO29 — General-purpose I/O 29 |
| Broche 174 | GPIO30 — General-purpose I/O 30 |
| Broche 175 | GPIO31 — General-purpose I/O 31 |
| Broche 176 | VDD — 3.3 V supply |
| Broche 177 | VSS — Ground |
| Broche 178 | CLKIN — External clock input |
| Broche 179 | XTAL — Crystal oscillator pin |
| Broche 180 | EXTAL — External clock/crystal pin |
| Broche 181 | VDDSYN — PLL supply (filtered) |
| Broche 182 | VSSSYN — PLL ground |
| Broche 183 | PLL_TEST — PLL test mode (tie low) |
| Broche 184 | CLKOUT — System clock output |
| Broche 185 | VDD — 3.3 V supply |
| Broche 186 | VSS — Ground |
| Broche 187 | NC — Not connected (per datasheet) |
| Broche 188 | NC — Not connected (per datasheet) |
| Broche 189 | NC — Not connected (per datasheet) |
| Broche 190 | NC — Not connected (per datasheet) |
| Broche 191 | NC — Not connected (per datasheet) |
| Broche 192 | NC — Not connected (per datasheet) |
| Broche 193 | NC — Not connected (per datasheet) |
| Broche 194 | NC — Not connected (per datasheet) |
| Broche 195 | NC — Not connected (per datasheet) |
| Broche 196 | NC — Not connected (per datasheet) |
| Broche 197 | NC — Not connected (per datasheet) |
| Broche 198 | NC — Not connected (per datasheet) |
| Broche 199 | NC — Not connected (per datasheet) |
| Broche 200 | NC — Not connected (per datasheet) |
| Broche 201 | VDD — 3.3 V supply |
| Broche 202 | VSS — Ground |
| Broche 203 | NC — Not connected (per datasheet) |
| Broche 204 | NC — Not connected (per datasheet) |
| Broche 205 | NC — Not connected (per datasheet) |
| Broche 206 | NC — Not connected (per datasheet) |
| Broche 207 | NC — Not connected (per datasheet) |
| Broche 208 | NC — Not connected (per datasheet) |
Applications typiques
MCF5307FT90B convient pour 6 applications: Industrial Control and Factory Automation, Networking Gateway and Router Control Plane, Point-of-Sale and Retail Terminals, Embedded Human-Machine Interface Panels, Connected Sensor Hubs and Edge Devices, Building Automation Controllers.
Industrial Control and Factory Automation
The MCF5307FT90B's 90 MHz ColdFire V3 core and 32-bit glueless external memory bus make it a strong fit for industrial control and factory-automation PLCs where deterministic execution and high-throughput peripheral handling are required. The integrated EMAC and USB simplify connection to operator panels and supervisory SCADA nodes. Its 208-FQFP package exposes enough GPIO and bus bandwidth to drive motor-control daughter cards and sensor arrays directly, reducing external logic. The BDM/JTAG debug interface accelerates firmware bring-up for real-time control loops.
Recommandé
Networking Gateway and Router Control Plane
With an integrated 10/100 Ethernet MAC, dual UARTs, USB, and QSPI, the MCF5307FT90B serves as a control-plane MCU for small/medium business routers, VPN gateways, and protocol-converter appliances. The 90 MHz CPU easily handles routing-table updates, NAT, and management-plane stacks, while the EMAC links directly to an external PHY for LAN-side connectivity. The ROMless architecture lets designers place boot firmware in external SPI flash for secure field updates.
Recommandé
Point-of-Sale and Retail Terminals
POS terminals require USB host support for barcode scanners, an Ethernet MAC for back-office IP connectivity, and enough GPIO to drive a thermal printer and customer display - all integrated on the MCF5307FT90B. The 90 MHz ColdFire V3 core runs payment-stack and display-update tasks comfortably, while the external memory controller supports SDRAM for transactional buffers. The 208-FQFP package accommodates multi-peripheral fan-out on a compact retail-form-factor PCB.
Recommandé
Embedded Human-Machine Interface Panels
Operator-interface panels need an MCU that drives a TFT LCD controller, accepts touch input, and communicates with field devices. The MCF5307FT90B's 90 MHz CPU and rich peripheral set (UART, I2C, QSPI, EMAC) provide the headroom for HMI graphics, while the 208-FQFP package routes LCD data, touch I2C, and fieldbus signals without external bus expanders. Designers can host the HMI stack in external SDRAM and boot from SPI flash.
Recommandé
Connected Sensor Hubs and Edge Devices
Edge sensor hubs aggregating multiple I2C sensor buses over QSPI benefit from the MCF5307FT90B's four 32-bit timers and deterministic ColdFire V3 interrupt handling. The on-chip EMAC and USB enable aggregated sensor data to be uploaded to a cloud gateway over Ethernet or USB. ROMless boot from external SPI flash supports over-the-air firmware update flows for long-life edge deployments.
Recommandé
Building Automation Controllers
Building automation controllers for HVAC, lighting, and access systems need a mix of UARTs, I2C, and Ethernet - exactly the peripheral complement of the MCF5307FT90B. The 90 MHz core runs BACnet or Modbus stacks comfortably while the EMAC connects to building-management backbones. The industrial -40C to +85C temperature range supports rooftop and basement controller placements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5307FT90B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5307CFT90B | MCF5307FT100B | MCF5329CFT240B | MCF54455CVR200B | MCF5208CAB166B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 208-FQFP (28x28) | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same |
| Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V4 | ColdFire V2 |
| Clock Frequency | 90 MHz | 90 MHz | 100 MHz | 240 MHz | 200 MHz | 166 MHz |
| On-chip Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| USB | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 2.0 OTG | USB 1.1 device |
| External Bus | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless |
Principaux différenciateurs
- Highest-volume MCF5307 variant with broadest distributor inventory (vs MCF5307CFT90B)
- 11% higher core clock than 90 MHz baseline (vs MCF5307FT100B)
- 167% higher CPU throughput for compute-heavy control planes (vs MCF5329CFT240B)
Notes de conception
The MCF5307FT90B requires a clean 3.3 V supply with bulk decoupling of at least 47 uF and 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pin pair (16 pairs total in the 208-FQFP). The PLL supply pin VDDSYN must be filtered with an inductor or ferrite bead and decoupled with 10 uF + 100 nF to suppress jitter on the 90 MHz core clock. Power-up sequencing: hold RESET until VDD reaches 3.0 V minimum and the CLKIN oscillator has stabilized for at least 100 cycles.
Use a 4-layer PCB stack-up with continuous ground and power planes under the 208-FQFP footprint to provide low-impedance return paths for the 32-bit external memory bus. Match the address, data, and control traces to within +/- 1 cm of each other in the same bus segment and route them over a solid ground plane. SDRAM traces should be length-matched within 50 ps of CLKOUT to preserve setup/hold margin at 90 MHz.
Do not assume the BDM and JTAG interfaces share the same pin functions - they are multiplexed and must be configured in firmware before first debug attach. Leave at least 4 GPIO pins unused for future boot-mode strap overrides, since ColdFire boot configuration (boot device width, chip-select mapping, and PLL multiplier) is sampled at reset on dedicated pins. When migrating to MCF5307FT100B or MCF5329CFT240B, verify the SDRAM refresh-rate register values because higher core clocks change the bus-to-core ratio.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not found in the verified distributor snippets; consult NXP product compliance documentation directly. AEC-Q100 not applicable - this is an industrial/consumer MCU.
