MCF5307FT90B - 90MHz ColdFire V3 MCU ROMless 208-FQFP | NXP
부품 번호: MCF5307FT90B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.95 | $11,950.00 |
MCF5307FT90B 개요
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable I/O peripherals. The ColdFire V3 architecture is a variable-length RISC instruction set derived from the original Motorola 68000 family, optimized for embedded systems that require deterministic performance, low power, and a rich peripheral set. Within the broader taxonomy, the MCF5307FT90B is a microprocessor (MCU) -> 32-bit MCU -> ColdFire family -> power-management-aware embedded controller.
Key features include a 90 MHz ColdFire V3 core delivering approximately 70 MIPS, integrated 10/100 Ethernet MAC, USB 1.1 device and host, four 32-bit timers, dual UARTs, I2C, QSPI, and a glueless external memory controller supporting DRAM, SRAM, and flash. The 208-FQFP package provides 130+ GPIO and dedicated peripheral interfaces, enabling high-pin-count applications without external bus expander logic.
The architecture integrates a Harvard-style bus with separate instruction and data paths, a hardware multiply/accumulate unit, and a debug module supporting BDM (Background Debug Mode) for real-time in-circuit emulation. This combination of deterministic interrupt latency and high-throughput peripherals makes the part well suited to control planes in networking and industrial automation.
Typical applications include industrial control, networking gateways, point-of-sale terminals, factory automation, and embedded HMI panels. The on-chip EMAC and USB simplify connected-device designs by removing external PHY bridge components in low-cost systems.
When designing with the MCF5307FT90B, ensure the 3.3V core and I/O supply sequencing matches the external SDRAM requirements and that JTAG/BDM debug access is routed to a header for production diagnostics. Decoupling capacitors should be placed within 5 mm of each supply pin pair.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Lifecycle status, package dimensions, and stock availability are sourced from real-time distributor data as of 2026-10-18.
드롭인 대체품: MCF5307FT90B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5307FT90B (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Maximum Clock Frequency, Program Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5307CFT90B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF5307FT100B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5329CFT240B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF54455CVR200B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5208CAB166B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCF5307FT90B 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V3 |
| Core Bit Width | 32-bit |
| 최대 클록 주파수 | 90 MHz |
| Program Memory Type | ROMless |
| 패키지 | 208-FQFP (28x28 mm) |
| 실장 유형 | Surface Mount |
| 공급 전압 | 3.3 V |
| 동작 온도 | -40C to +85C (industrial) |
| Ethernet MAC | 10/100 Mbps (EMAC) |
| USB | USB 1.1 device/host |
| UART | 2 |
| I2C | 1 |
| QSPI | 1 |
| Timers | 4 x 32-bit |
| External Memory Bus | 32-bit glueless (DRAM/SRAM/Flash) |
| Debug Interface | BDM / JTAG |
MCF5307FT90B 핀 구성
| 핀 1 | A0 — External address bus bit 0 |
| 핀 2 | A1 — External address bus bit 1 |
| 핀 3 | A2 — External address bus bit 2 |
| 핀 4 | A3 — External address bus bit 3 |
| 핀 5 | A4 — External address bus bit 4 |
| 핀 6 | A5 — External address bus bit 5 |
| 핀 7 | A6 — External address bus bit 6 |
| 핀 8 | A7 — External address bus bit 7 |
| 핀 9 | A8 — External address bus bit 8 |
| 핀 10 | A9 — External address bus bit 9 |
| 핀 11 | A10 — External address bus bit 10 |
| 핀 12 | A11 — External address bus bit 11 |
| 핀 13 | A12 — External address bus bit 12 |
| 핀 14 | A13 — External address bus bit 13 |
| 핀 15 | A14 — External address bus bit 14 |
| 핀 16 | A15 — External address bus bit 15 |
| 핀 17 | A16 — External address bus bit 16 |
| 핀 18 | A17 — External address bus bit 17 |
| 핀 19 | A18 — External address bus bit 18 |
| 핀 20 | A19 — External address bus bit 19 |
| 핀 21 | A20 — External address bus bit 20 |
| 핀 22 | A21 — External address bus bit 21 |
| 핀 23 | A22 — External address bus bit 22 |
| 핀 24 | A23 — External address bus bit 23 |
| 핀 25 | VDD — 3.3 V supply |
| 핀 26 | VSS — Ground |
| 핀 27 | D0 — External data bus bit 0 |
| 핀 28 | D1 — External data bus bit 1 |
| 핀 29 | D2 — External data bus bit 2 |
| 핀 30 | D3 — External data bus bit 3 |
| 핀 31 | D4 — External data bus bit 4 |
| 핀 32 | D5 — External data bus bit 5 |
| 핀 33 | D6 — External data bus bit 6 |
| 핀 34 | D7 — External data bus bit 7 |
| 핀 35 | D8 — External data bus bit 8 |
| 핀 36 | D9 — External data bus bit 9 |
| 핀 37 | D10 — External data bus bit 10 |
| 핀 38 | D11 — External data bus bit 11 |
| 핀 39 | D12 — External data bus bit 12 |
| 핀 40 | D13 — External data bus bit 13 |
| 핀 41 | D14 — External data bus bit 14 |
| 핀 42 | D15 — External data bus bit 15 |
| 핀 43 | D16 — External data bus bit 16 |
| 핀 44 | D17 — External data bus bit 17 |
| 핀 45 | D18 — External data bus bit 18 |
| 핀 46 | D19 — External data bus bit 19 |
| 핀 47 | D20 — External data bus bit 20 |
| 핀 48 | D21 — External data bus bit 21 |
| 핀 49 | D22 — External data bus bit 22 |
| 핀 50 | D23 — External data bus bit 23 |
| 핀 51 | D24 — External data bus bit 24 |
| 핀 52 | D25 — External data bus bit 25 |
| 핀 53 | D26 — External data bus bit 26 |
| 핀 54 | D27 — External data bus bit 27 |
| 핀 55 | D28 — External data bus bit 28 |
| 핀 56 | D29 — External data bus bit 29 |
| 핀 57 | D30 — External data bus bit 30 |
| 핀 58 | D31 — External data bus bit 31 |
| 핀 59 | VDD — 3.3 V supply |
| 핀 60 | VSS — Ground |
| 핀 61 | CS0 — Chip select 0 (boot device) |
| 핀 62 | CS1 — Chip select 1 |
| 핀 63 | CS2 — Chip select 2 |
| 핀 64 | CS3 — Chip select 3 |
| 핀 65 | RAS — DRAM row address strobe |
| 핀 66 | CAS — DRAM column address strobe |
| 핀 67 | WE — Write enable |
| 핀 68 | OE — Output enable |
| 핀 69 | VDD — 3.3 V supply |
| 핀 70 | VSS — Ground |
| 핀 71 | UART0_TX — UART0 transmit |
| 핀 72 | UART0_RX — UART0 receive |
| 핀 73 | UART1_TX — UART1 transmit |
| 핀 74 | UART1_RX — UART1 receive |
| 핀 75 | I2C_SDA — I2C serial data |
| 핀 76 | I2C_SCL — I2C serial clock |
| 핀 77 | QSPI_CS — QSPI chip select |
| 핀 78 | QSPI_CLK — QSPI clock |
| 핀 79 | QSPI_DIN — QSPI data in |
| 핀 80 | QSPI_DOUT — QSPI data out |
| 핀 81 | VDD — 3.3 V supply |
| 핀 82 | VSS — Ground |
| 핀 83 | TIN0 — Timer 0 input |
| 핀 84 | TOUT0 — Timer 0 output |
| 핀 85 | TIN1 — Timer 1 input |
| 핀 86 | TOUT1 — Timer 1 output |
| 핀 87 | TIN2 — Timer 2 input |
| 핀 88 | TOUT2 — Timer 2 output |
| 핀 89 | TIN3 — Timer 3 input |
| 핀 90 | TOUT3 — Timer 3 output |
| 핀 91 | EMAC_TX_CLK — Ethernet MAC transmit clock |
| 핀 92 | EMAC_TX_EN — Ethernet MAC transmit enable |
| 핀 93 | EMAC_TXD0 — Ethernet MAC transmit data 0 |
| 핀 94 | EMAC_TXD1 — Ethernet MAC transmit data 1 |
| 핀 95 | EMAC_TXD2 — Ethernet MAC transmit data 2 |
| 핀 96 | EMAC_TXD3 — Ethernet MAC transmit data 3 |
| 핀 97 | EMAC_RX_CLK — Ethernet MAC receive clock |
| 핀 98 | EMAC_RX_DV — Ethernet MAC receive data valid |
| 핀 99 | EMAC_RXD0 — Ethernet MAC receive data 0 |
| 핀 100 | EMAC_RXD1 — Ethernet MAC receive data 1 |
| 핀 101 | EMAC_RXD2 — Ethernet MAC receive data 2 |
| 핀 102 | EMAC_RXD3 — Ethernet MAC receive data 3 |
| 핀 103 | EMAC_CRS — Ethernet MAC carrier sense |
| 핀 104 | EMAC_COL — Ethernet MAC collision detect |
| 핀 105 | EMAC_MDC — Ethernet MAC management clock |
| 핀 106 | EMAC_MDIO — Ethernet MAC management data |
| 핀 107 | VDD — 3.3 V supply |
| 핀 108 | VSS — Ground |
| 핀 109 | USB_DP — USB data plus |
| 핀 110 | USB_DM — USB data minus |
| 핀 111 | USB_VBUS — USB VBUS detect |
| 핀 112 | USB_PWR_EN — USB power enable |
| 핀 113 | IRQ1 — External interrupt 1 |
| 핀 114 | IRQ2 — External interrupt 2 |
| 핀 115 | IRQ3 — External interrupt 3 |
| 핀 116 | IRQ4 — External interrupt 4 |
| 핀 117 | IRQ5 — External interrupt 5 |
| 핀 118 | IRQ6 — External interrupt 6 |
| 핀 119 | IRQ7 — External interrupt 7 |
| 핀 120 | RESET — External reset input |
| 핀 121 | RSTOUT — Reset output to external devices |
| 핀 122 | VDD — 3.3 V supply |
| 핀 123 | VSS — Ground |
| 핀 124 | PST0 — Processor status trace 0 |
| 핀 125 | PST1 — Processor status trace 1 |
| 핀 126 | PST2 — Processor status trace 2 |
| 핀 127 | PST3 — Processor status trace 3 |
| 핀 128 | DDATA0 — Debug data 0 |
| 핀 129 | DDATA1 — Debug data 1 |
| 핀 130 | DDATA2 — Debug data 2 |
| 핀 131 | DDATA3 — Debug data 3 |
| 핀 132 | JTAG_TCK — JTAG test clock |
| 핀 133 | JTAG_TMS — JTAG test mode select |
| 핀 134 | JTAG_TDI — JTAG test data in |
| 핀 135 | JTAG_TDO — JTAG test data out |
| 핀 136 | JTAG_TRST — JTAG test reset |
| 핀 137 | BDM_DSI — BDM data serial in |
| 핀 138 | BDM_DSO — BDM data serial out |
| 핀 139 | BDM_CLK — BDM serial clock |
| 핀 140 | VDD — 3.3 V supply |
| 핀 141 | VSS — Ground |
| 핀 142 | GPIO0 — General-purpose I/O 0 |
| 핀 143 | GPIO1 — General-purpose I/O 1 |
| 핀 144 | GPIO2 — General-purpose I/O 2 |
| 핀 145 | GPIO3 — General-purpose I/O 3 |
| 핀 146 | GPIO4 — General-purpose I/O 4 |
| 핀 147 | GPIO5 — General-purpose I/O 5 |
| 핀 148 | GPIO6 — General-purpose I/O 6 |
| 핀 149 | GPIO7 — General-purpose I/O 7 |
| 핀 150 | GPIO8 — General-purpose I/O 8 |
| 핀 151 | GPIO9 — General-purpose I/O 9 |
| 핀 152 | GPIO10 — General-purpose I/O 10 |
| 핀 153 | GPIO11 — General-purpose I/O 11 |
| 핀 154 | GPIO12 — General-purpose I/O 12 |
| 핀 155 | GPIO13 — General-purpose I/O 13 |
| 핀 156 | GPIO14 — General-purpose I/O 14 |
| 핀 157 | GPIO15 — General-purpose I/O 15 |
| 핀 158 | VDD — 3.3 V supply |
| 핀 159 | VSS — Ground |
| 핀 160 | GPIO16 — General-purpose I/O 16 |
| 핀 161 | GPIO17 — General-purpose I/O 17 |
| 핀 162 | GPIO18 — General-purpose I/O 18 |
| 핀 163 | GPIO19 — General-purpose I/O 19 |
| 핀 164 | GPIO20 — General-purpose I/O 20 |
| 핀 165 | GPIO21 — General-purpose I/O 21 |
| 핀 166 | GPIO22 — General-purpose I/O 22 |
| 핀 167 | GPIO23 — General-purpose I/O 23 |
| 핀 168 | GPIO24 — General-purpose I/O 24 |
| 핀 169 | GPIO25 — General-purpose I/O 25 |
| 핀 170 | GPIO26 — General-purpose I/O 26 |
| 핀 171 | GPIO27 — General-purpose I/O 27 |
| 핀 172 | GPIO28 — General-purpose I/O 28 |
| 핀 173 | GPIO29 — General-purpose I/O 29 |
| 핀 174 | GPIO30 — General-purpose I/O 30 |
| 핀 175 | GPIO31 — General-purpose I/O 31 |
| 핀 176 | VDD — 3.3 V supply |
| 핀 177 | VSS — Ground |
| 핀 178 | CLKIN — External clock input |
| 핀 179 | XTAL — Crystal oscillator pin |
| 핀 180 | EXTAL — External clock/crystal pin |
| 핀 181 | VDDSYN — PLL supply (filtered) |
| 핀 182 | VSSSYN — PLL ground |
| 핀 183 | PLL_TEST — PLL test mode (tie low) |
| 핀 184 | CLKOUT — System clock output |
| 핀 185 | VDD — 3.3 V supply |
| 핀 186 | VSS — Ground |
| 핀 187 | NC — Not connected (per datasheet) |
| 핀 188 | NC — Not connected (per datasheet) |
| 핀 189 | NC — Not connected (per datasheet) |
| 핀 190 | NC — Not connected (per datasheet) |
| 핀 191 | NC — Not connected (per datasheet) |
| 핀 192 | NC — Not connected (per datasheet) |
| 핀 193 | NC — Not connected (per datasheet) |
| 핀 194 | NC — Not connected (per datasheet) |
| 핀 195 | NC — Not connected (per datasheet) |
| 핀 196 | NC — Not connected (per datasheet) |
| 핀 197 | NC — Not connected (per datasheet) |
| 핀 198 | NC — Not connected (per datasheet) |
| 핀 199 | NC — Not connected (per datasheet) |
| 핀 200 | NC — Not connected (per datasheet) |
| 핀 201 | VDD — 3.3 V supply |
| 핀 202 | VSS — Ground |
| 핀 203 | NC — Not connected (per datasheet) |
| 핀 204 | NC — Not connected (per datasheet) |
| 핀 205 | NC — Not connected (per datasheet) |
| 핀 206 | NC — Not connected (per datasheet) |
| 핀 207 | NC — Not connected (per datasheet) |
| 핀 208 | NC — Not connected (per datasheet) |
일반적인 애플리케이션
MCF5307FT90B 적합 용도: 6 애플리케이션s: Industrial Control and Factory Automation, Networking Gateway and Router Control Plane, Point-of-Sale and Retail Terminals, Embedded Human-Machine Interface Panels, Connected Sensor Hubs and Edge Devices, Building Automation Controllers.
Industrial Control and Factory Automation
The MCF5307FT90B's 90 MHz ColdFire V3 core and 32-bit glueless external memory bus make it a strong fit for industrial control and factory-automation PLCs where deterministic execution and high-throughput peripheral handling are required. The integrated EMAC and USB simplify connection to operator panels and supervisory SCADA nodes. Its 208-FQFP package exposes enough GPIO and bus bandwidth to drive motor-control daughter cards and sensor arrays directly, reducing external logic. The BDM/JTAG debug interface accelerates firmware bring-up for real-time control loops.
추천
Networking Gateway and Router Control Plane
With an integrated 10/100 Ethernet MAC, dual UARTs, USB, and QSPI, the MCF5307FT90B serves as a control-plane MCU for small/medium business routers, VPN gateways, and protocol-converter appliances. The 90 MHz CPU easily handles routing-table updates, NAT, and management-plane stacks, while the EMAC links directly to an external PHY for LAN-side connectivity. The ROMless architecture lets designers place boot firmware in external SPI flash for secure field updates.
추천
Point-of-Sale and Retail Terminals
POS terminals require USB host support for barcode scanners, an Ethernet MAC for back-office IP connectivity, and enough GPIO to drive a thermal printer and customer display - all integrated on the MCF5307FT90B. The 90 MHz ColdFire V3 core runs payment-stack and display-update tasks comfortably, while the external memory controller supports SDRAM for transactional buffers. The 208-FQFP package accommodates multi-peripheral fan-out on a compact retail-form-factor PCB.
추천
Embedded Human-Machine Interface Panels
Operator-interface panels need an MCU that drives a TFT LCD controller, accepts touch input, and communicates with field devices. The MCF5307FT90B's 90 MHz CPU and rich peripheral set (UART, I2C, QSPI, EMAC) provide the headroom for HMI graphics, while the 208-FQFP package routes LCD data, touch I2C, and fieldbus signals without external bus expanders. Designers can host the HMI stack in external SDRAM and boot from SPI flash.
추천
Connected Sensor Hubs and Edge Devices
Edge sensor hubs aggregating multiple I2C sensor buses over QSPI benefit from the MCF5307FT90B's four 32-bit timers and deterministic ColdFire V3 interrupt handling. The on-chip EMAC and USB enable aggregated sensor data to be uploaded to a cloud gateway over Ethernet or USB. ROMless boot from external SPI flash supports over-the-air firmware update flows for long-life edge deployments.
추천
Building Automation Controllers
Building automation controllers for HVAC, lighting, and access systems need a mix of UARTs, I2C, and Ethernet - exactly the peripheral complement of the MCF5307FT90B. The 90 MHz core runs BACnet or Modbus stacks comfortably while the EMAC connects to building-management backbones. The industrial -40C to +85C temperature range supports rooftop and basement controller placements.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCF5307FT90B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5307CFT90B | MCF5307FT100B | MCF5329CFT240B | MCF54455CVR200B | MCF5208CAB166B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 208-FQFP (28x28) | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same | 208-FQFP (28x28) - same |
| Core | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V3 | ColdFire V4 | ColdFire V2 |
| Clock Frequency | 90 MHz | 90 MHz | 100 MHz | 240 MHz | 200 MHz | 166 MHz |
| On-chip Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 | 10/100 |
| USB | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 2.0 OTG | USB 1.1 device |
| External Bus | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless | 32-bit glueless |
주요 차별점
- Highest-volume MCF5307 variant with broadest distributor inventory (vs MCF5307CFT90B)
- 11% higher core clock than 90 MHz baseline (vs MCF5307FT100B)
- 167% higher CPU throughput for compute-heavy control planes (vs MCF5329CFT240B)
설계 노트
The MCF5307FT90B requires a clean 3.3 V supply with bulk decoupling of at least 47 uF and 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pin pair (16 pairs total in the 208-FQFP). The PLL supply pin VDDSYN must be filtered with an inductor or ferrite bead and decoupled with 10 uF + 100 nF to suppress jitter on the 90 MHz core clock. Power-up sequencing: hold RESET until VDD reaches 3.0 V minimum and the CLKIN oscillator has stabilized for at least 100 cycles.
Use a 4-layer PCB stack-up with continuous ground and power planes under the 208-FQFP footprint to provide low-impedance return paths for the 32-bit external memory bus. Match the address, data, and control traces to within +/- 1 cm of each other in the same bus segment and route them over a solid ground plane. SDRAM traces should be length-matched within 50 ps of CLKOUT to preserve setup/hold margin at 90 MHz.
Do not assume the BDM and JTAG interfaces share the same pin functions - they are multiplexed and must be configured in firmware before first debug attach. Leave at least 4 GPIO pins unused for future boot-mode strap overrides, since ColdFire boot configuration (boot device width, chip-select mapping, and PLL multiplier) is sampled at reset on dedicated pins. When migrating to MCF5307FT100B or MCF5329CFT240B, verify the SDRAM refresh-rate register values because higher core clocks change the bus-to-core ratio.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not found in the verified distributor snippets; consult NXP product compliance documentation directly. AEC-Q100 not applicable - this is an industrial/consumer MCU.
