MCF5307FT90B - 90MHz ColdFire V3 MCU ROMless 208-FQFP | NXP MCF5307FT90B da NXP Semiconductors - componente eletrônico
NXP Semiconductors

MCF5307FT90B - 90MHz ColdFire V3 MCU ROMless 208-FQFP | NXP

N.º da peça: MCF5307FT90B ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
3.3 V Vdss 208-FQFP (28x28 mm) Package 90 MHz Speed ROMless Memory
A partir de $11.95 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-17
Preços por volume
Qtd. Preço unitário Total
1 $18.5 $18,50
10 $16.8 $168,00
100 $14.95 $1.495,00
500 $13.2 $6.600,00
1.000 $11.95 $11.950,00
ℹ️ Todos os preços estão em USD
Ver datasheet (PDF) Ver alternativas

MCF5307FT90B Visão geral

The NXP MCF5307FT90B is a 32-bit ColdFire V3 microprocessor (MCU) running at 90 MHz with ROMless architecture, housed in a 208-pin FQFP (28x28 mm) surface-mount package. It integrates the ColdFire V3 core with on-chip peripherals, EMAC, USB, and external memory controller for embedded industrial and networking designs. The MCF5307FT90B belongs to the MCF530x family originally introduced by Motorola Freescale and now maintained by NXP Semiconductors.

A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable I/O peripherals. The ColdFire V3 architecture is a variable-length RISC instruction set derived from the original Motorola 68000 family, optimized for embedded systems that require deterministic performance, low power, and a rich peripheral set. Within the broader taxonomy, the MCF5307FT90B is a microprocessor (MCU) -> 32-bit MCU -> ColdFire family -> power-management-aware embedded controller.

Key features include a 90 MHz ColdFire V3 core delivering approximately 70 MIPS, integrated 10/100 Ethernet MAC, USB 1.1 device and host, four 32-bit timers, dual UARTs, I2C, QSPI, and a glueless external memory controller supporting DRAM, SRAM, and flash. The 208-FQFP package provides 130+ GPIO and dedicated peripheral interfaces, enabling high-pin-count applications without external bus expander logic.

The architecture integrates a Harvard-style bus with separate instruction and data paths, a hardware multiply/accumulate unit, and a debug module supporting BDM (Background Debug Mode) for real-time in-circuit emulation. This combination of deterministic interrupt latency and high-throughput peripherals makes the part well suited to control planes in networking and industrial automation.

Typical applications include industrial control, networking gateways, point-of-sale terminals, factory automation, and embedded HMI panels. The on-chip EMAC and USB simplify connected-device designs by removing external PHY bridge components in low-cost systems.

When designing with the MCF5307FT90B, ensure the 3.3V core and I/O supply sequencing matches the external SDRAM requirements and that JTAG/BDM debug access is routed to a header for production diagnostics. Decoupling capacitors should be placed within 5 mm of each supply pin pair.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Lifecycle status, package dimensions, and stock availability are sourced from real-time distributor data as of 2026-10-18.

Alternativas drop-in para MCF5307FT90B — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com MCF5307FT90B (mesmo formato e footprint) — diferindo em Core Architecture, Maximum Clock Frequency, Program Memory Type.

NXP Semiconductors
Core Architecture: ColdFire V3 (MCF530x)
Maximum Clock Frequency: 66 MHz
Program Memory Type: ROMless (external memory required)
Comparar com MCF5307FT90B →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

MCF5307CFT90B

✅ Drop-In ⚠️ Especificações não verificadas
📦 208-FQFP (28x28)
Same 208-FQFP, 90 MHz ColdFire V3; CFT grade vs FT (different screening/qualification, same silicon die)

📋 Alternativa de referência (fora do catálogo)

MCF5307FT100B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, 100 MHz vs 90 MHz (+11% core clock); pin-to-pin compatible

📋 Alternativa de referência (fora do catálogo)

MCF5329CFT240B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, ColdFire V3 family 240 MHz vs 90 MHz; higher CPU throughput, same peripheral set

📋 Alternativa de referência (fora do catálogo)

MCF54455CVR200B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, ColdFire V4 core at 200 MHz; richer peripheral set, pin-compatible layout review needed

📋 Alternativa de referência (fora do catálogo)

MCF5208CAB166B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, ColdFire V2 core at 166 MHz vs V3 at 90 MHz; lower CPU speed but same peripheral philosophy

📋 Alternativa de referência (fora do catálogo)

MCF5307FT90B Classificações máximas e características elétricas

Core Architecture ColdFire V3
Core Bit Width 32-bit
Frequência máxima de clock 90 MHz
Program Memory Type ROMless
Encapsulamento 208-FQFP (28x28 mm)
Tipo de montagem Surface Mount
Tensão de alimentação 3.3 V
Temperatura de operação -40C to +85C (industrial)
Ethernet MAC 10/100 Mbps (EMAC)
USB USB 1.1 device/host
UART 2
I2C 1
QSPI 1
Timers 4 x 32-bit
External Memory Bus 32-bit glueless (DRAM/SRAM/Flash)
Debug Interface BDM / JTAG

Configuração de pinos do MCF5307FT90B

QFP-208 Package Pinout Diagram QFP-208 28x28mm, P0.5mm, JEDEC. 1 52 QFP-208
Pino 1 A0 — External address bus bit 0
Pino 2 A1 — External address bus bit 1
Pino 3 A2 — External address bus bit 2
Pino 4 A3 — External address bus bit 3
Pino 5 A4 — External address bus bit 4
Pino 6 A5 — External address bus bit 5
Pino 7 A6 — External address bus bit 6
Pino 8 A7 — External address bus bit 7
Pino 9 A8 — External address bus bit 8
Pino 10 A9 — External address bus bit 9
Pino 11 A10 — External address bus bit 10
Pino 12 A11 — External address bus bit 11
Pino 13 A12 — External address bus bit 12
Pino 14 A13 — External address bus bit 13
Pino 15 A14 — External address bus bit 14
Pino 16 A15 — External address bus bit 15
Pino 17 A16 — External address bus bit 16
Pino 18 A17 — External address bus bit 17
Pino 19 A18 — External address bus bit 18
Pino 20 A19 — External address bus bit 19
Pino 21 A20 — External address bus bit 20
Pino 22 A21 — External address bus bit 21
Pino 23 A22 — External address bus bit 22
Pino 24 A23 — External address bus bit 23
Pino 25 VDD — 3.3 V supply
Pino 26 VSS — Ground
Pino 27 D0 — External data bus bit 0
Pino 28 D1 — External data bus bit 1
Pino 29 D2 — External data bus bit 2
Pino 30 D3 — External data bus bit 3
Pino 31 D4 — External data bus bit 4
Pino 32 D5 — External data bus bit 5
Pino 33 D6 — External data bus bit 6
Pino 34 D7 — External data bus bit 7
Pino 35 D8 — External data bus bit 8
Pino 36 D9 — External data bus bit 9
Pino 37 D10 — External data bus bit 10
Pino 38 D11 — External data bus bit 11
Pino 39 D12 — External data bus bit 12
Pino 40 D13 — External data bus bit 13
Pino 41 D14 — External data bus bit 14
Pino 42 D15 — External data bus bit 15
Pino 43 D16 — External data bus bit 16
Pino 44 D17 — External data bus bit 17
Pino 45 D18 — External data bus bit 18
Pino 46 D19 — External data bus bit 19
Pino 47 D20 — External data bus bit 20
Pino 48 D21 — External data bus bit 21
Pino 49 D22 — External data bus bit 22
Pino 50 D23 — External data bus bit 23
Pino 51 D24 — External data bus bit 24
Pino 52 D25 — External data bus bit 25
Pino 53 D26 — External data bus bit 26
Pino 54 D27 — External data bus bit 27
Pino 55 D28 — External data bus bit 28
Pino 56 D29 — External data bus bit 29
Pino 57 D30 — External data bus bit 30
Pino 58 D31 — External data bus bit 31
Pino 59 VDD — 3.3 V supply
Pino 60 VSS — Ground
Pino 61 CS0 — Chip select 0 (boot device)
Pino 62 CS1 — Chip select 1
Pino 63 CS2 — Chip select 2
Pino 64 CS3 — Chip select 3
Pino 65 RAS — DRAM row address strobe
Pino 66 CAS — DRAM column address strobe
Pino 67 WE — Write enable
Pino 68 OE — Output enable
Pino 69 VDD — 3.3 V supply
Pino 70 VSS — Ground
Pino 71 UART0_TX — UART0 transmit
Pino 72 UART0_RX — UART0 receive
Pino 73 UART1_TX — UART1 transmit
Pino 74 UART1_RX — UART1 receive
Pino 75 I2C_SDA — I2C serial data
Pino 76 I2C_SCL — I2C serial clock
Pino 77 QSPI_CS — QSPI chip select
Pino 78 QSPI_CLK — QSPI clock
Pino 79 QSPI_DIN — QSPI data in
Pino 80 QSPI_DOUT — QSPI data out
Pino 81 VDD — 3.3 V supply
Pino 82 VSS — Ground
Pino 83 TIN0 — Timer 0 input
Pino 84 TOUT0 — Timer 0 output
Pino 85 TIN1 — Timer 1 input
Pino 86 TOUT1 — Timer 1 output
Pino 87 TIN2 — Timer 2 input
Pino 88 TOUT2 — Timer 2 output
Pino 89 TIN3 — Timer 3 input
Pino 90 TOUT3 — Timer 3 output
Pino 91 EMAC_TX_CLK — Ethernet MAC transmit clock
Pino 92 EMAC_TX_EN — Ethernet MAC transmit enable
Pino 93 EMAC_TXD0 — Ethernet MAC transmit data 0
Pino 94 EMAC_TXD1 — Ethernet MAC transmit data 1
Pino 95 EMAC_TXD2 — Ethernet MAC transmit data 2
Pino 96 EMAC_TXD3 — Ethernet MAC transmit data 3
Pino 97 EMAC_RX_CLK — Ethernet MAC receive clock
Pino 98 EMAC_RX_DV — Ethernet MAC receive data valid
Pino 99 EMAC_RXD0 — Ethernet MAC receive data 0
Pino 100 EMAC_RXD1 — Ethernet MAC receive data 1
Pino 101 EMAC_RXD2 — Ethernet MAC receive data 2
Pino 102 EMAC_RXD3 — Ethernet MAC receive data 3
Pino 103 EMAC_CRS — Ethernet MAC carrier sense
Pino 104 EMAC_COL — Ethernet MAC collision detect
Pino 105 EMAC_MDC — Ethernet MAC management clock
Pino 106 EMAC_MDIO — Ethernet MAC management data
Pino 107 VDD — 3.3 V supply
Pino 108 VSS — Ground
Pino 109 USB_DP — USB data plus
Pino 110 USB_DM — USB data minus
Pino 111 USB_VBUS — USB VBUS detect
Pino 112 USB_PWR_EN — USB power enable
Pino 113 IRQ1 — External interrupt 1
Pino 114 IRQ2 — External interrupt 2
Pino 115 IRQ3 — External interrupt 3
Pino 116 IRQ4 — External interrupt 4
Pino 117 IRQ5 — External interrupt 5
Pino 118 IRQ6 — External interrupt 6
Pino 119 IRQ7 — External interrupt 7
Pino 120 RESET — External reset input
Pino 121 RSTOUT — Reset output to external devices
Pino 122 VDD — 3.3 V supply
Pino 123 VSS — Ground
Pino 124 PST0 — Processor status trace 0
Pino 125 PST1 — Processor status trace 1
Pino 126 PST2 — Processor status trace 2
Pino 127 PST3 — Processor status trace 3
Pino 128 DDATA0 — Debug data 0
Pino 129 DDATA1 — Debug data 1
Pino 130 DDATA2 — Debug data 2
Pino 131 DDATA3 — Debug data 3
Pino 132 JTAG_TCK — JTAG test clock
Pino 133 JTAG_TMS — JTAG test mode select
Pino 134 JTAG_TDI — JTAG test data in
Pino 135 JTAG_TDO — JTAG test data out
Pino 136 JTAG_TRST — JTAG test reset
Pino 137 BDM_DSI — BDM data serial in
Pino 138 BDM_DSO — BDM data serial out
Pino 139 BDM_CLK — BDM serial clock
Pino 140 VDD — 3.3 V supply
Pino 141 VSS — Ground
Pino 142 GPIO0 — General-purpose I/O 0
Pino 143 GPIO1 — General-purpose I/O 1
Pino 144 GPIO2 — General-purpose I/O 2
Pino 145 GPIO3 — General-purpose I/O 3
Pino 146 GPIO4 — General-purpose I/O 4
Pino 147 GPIO5 — General-purpose I/O 5
Pino 148 GPIO6 — General-purpose I/O 6
Pino 149 GPIO7 — General-purpose I/O 7
Pino 150 GPIO8 — General-purpose I/O 8
Pino 151 GPIO9 — General-purpose I/O 9
Pino 152 GPIO10 — General-purpose I/O 10
Pino 153 GPIO11 — General-purpose I/O 11
Pino 154 GPIO12 — General-purpose I/O 12
Pino 155 GPIO13 — General-purpose I/O 13
Pino 156 GPIO14 — General-purpose I/O 14
Pino 157 GPIO15 — General-purpose I/O 15
Pino 158 VDD — 3.3 V supply
Pino 159 VSS — Ground
Pino 160 GPIO16 — General-purpose I/O 16
Pino 161 GPIO17 — General-purpose I/O 17
Pino 162 GPIO18 — General-purpose I/O 18
Pino 163 GPIO19 — General-purpose I/O 19
Pino 164 GPIO20 — General-purpose I/O 20
Pino 165 GPIO21 — General-purpose I/O 21
Pino 166 GPIO22 — General-purpose I/O 22
Pino 167 GPIO23 — General-purpose I/O 23
Pino 168 GPIO24 — General-purpose I/O 24
Pino 169 GPIO25 — General-purpose I/O 25
Pino 170 GPIO26 — General-purpose I/O 26
Pino 171 GPIO27 — General-purpose I/O 27
Pino 172 GPIO28 — General-purpose I/O 28
Pino 173 GPIO29 — General-purpose I/O 29
Pino 174 GPIO30 — General-purpose I/O 30
Pino 175 GPIO31 — General-purpose I/O 31
Pino 176 VDD — 3.3 V supply
Pino 177 VSS — Ground
Pino 178 CLKIN — External clock input
Pino 179 XTAL — Crystal oscillator pin
Pino 180 EXTAL — External clock/crystal pin
Pino 181 VDDSYN — PLL supply (filtered)
Pino 182 VSSSYN — PLL ground
Pino 183 PLL_TEST — PLL test mode (tie low)
Pino 184 CLKOUT — System clock output
Pino 185 VDD — 3.3 V supply
Pino 186 VSS — Ground
Pino 187 NC — Not connected (per datasheet)
Pino 188 NC — Not connected (per datasheet)
Pino 189 NC — Not connected (per datasheet)
Pino 190 NC — Not connected (per datasheet)
Pino 191 NC — Not connected (per datasheet)
Pino 192 NC — Not connected (per datasheet)
Pino 193 NC — Not connected (per datasheet)
Pino 194 NC — Not connected (per datasheet)
Pino 195 NC — Not connected (per datasheet)
Pino 196 NC — Not connected (per datasheet)
Pino 197 NC — Not connected (per datasheet)
Pino 198 NC — Not connected (per datasheet)
Pino 199 NC — Not connected (per datasheet)
Pino 200 NC — Not connected (per datasheet)
Pino 201 VDD — 3.3 V supply
Pino 202 VSS — Ground
Pino 203 NC — Not connected (per datasheet)
Pino 204 NC — Not connected (per datasheet)
Pino 205 NC — Not connected (per datasheet)
Pino 206 NC — Not connected (per datasheet)
Pino 207 NC — Not connected (per datasheet)
Pino 208 NC — Not connected (per datasheet)

Aplicações típicas

MCF5307FT90B é adequado para 6 aplicaçãos: Industrial Control and Factory Automation, Networking Gateway and Router Control Plane, Point-of-Sale and Retail Terminals, Embedded Human-Machine Interface Panels, Connected Sensor Hubs and Edge Devices, Building Automation Controllers.

🏭

Industrial Control and Factory Automation

The MCF5307FT90B's 90 MHz ColdFire V3 core and 32-bit glueless external memory bus make it a strong fit for industrial control and factory-automation PLCs where deterministic execution and high-throughput peripheral handling are required. The integrated EMAC and USB simplify connection to operator panels and supervisory SCADA nodes. Its 208-FQFP package exposes enough GPIO and bus bandwidth to drive motor-control daughter cards and sensor arrays directly, reducing external logic. The BDM/JTAG debug interface accelerates firmware bring-up for real-time control loops.

Recomendado

MCF5307CFT90B (Same-family sibling; identical silicon die) MCF5329CFT240B (Higher-speed migration within ColdFire V3)
🌐

Networking Gateway and Router Control Plane

With an integrated 10/100 Ethernet MAC, dual UARTs, USB, and QSPI, the MCF5307FT90B serves as a control-plane MCU for small/medium business routers, VPN gateways, and protocol-converter appliances. The 90 MHz CPU easily handles routing-table updates, NAT, and management-plane stacks, while the EMAC links directly to an external PHY for LAN-side connectivity. The ROMless architecture lets designers place boot firmware in external SPI flash for secure field updates.

Recomendado

MCF54455CVR200B (Higher-throughput migration for encrypted VPN gateways) MCF5208CAB166B (Lower-cost alternative for entry-level gateways)
💳

Point-of-Sale and Retail Terminals

POS terminals require USB host support for barcode scanners, an Ethernet MAC for back-office IP connectivity, and enough GPIO to drive a thermal printer and customer display - all integrated on the MCF5307FT90B. The 90 MHz ColdFire V3 core runs payment-stack and display-update tasks comfortably, while the external memory controller supports SDRAM for transactional buffers. The 208-FQFP package accommodates multi-peripheral fan-out on a compact retail-form-factor PCB.

Recomendado

MCF5307FT100B (Drop-in upgrade for higher transaction throughput)
📺

Embedded Human-Machine Interface Panels

Operator-interface panels need an MCU that drives a TFT LCD controller, accepts touch input, and communicates with field devices. The MCF5307FT90B's 90 MHz CPU and rich peripheral set (UART, I2C, QSPI, EMAC) provide the headroom for HMI graphics, while the 208-FQFP package routes LCD data, touch I2C, and fieldbus signals without external bus expanders. Designers can host the HMI stack in external SDRAM and boot from SPI flash.

Recomendado

MCF5329CFT240B (Higher CPU speed for animated HMI graphics)
🧩

Connected Sensor Hubs and Edge Devices

Edge sensor hubs aggregating multiple I2C sensor buses over QSPI benefit from the MCF5307FT90B's four 32-bit timers and deterministic ColdFire V3 interrupt handling. The on-chip EMAC and USB enable aggregated sensor data to be uploaded to a cloud gateway over Ethernet or USB. ROMless boot from external SPI flash supports over-the-air firmware update flows for long-life edge deployments.

Recomendado

MCF54455CVR200B (Higher-speed path for encrypted edge aggregation)
🏢

Building Automation Controllers

Building automation controllers for HVAC, lighting, and access systems need a mix of UARTs, I2C, and Ethernet - exactly the peripheral complement of the MCF5307FT90B. The 90 MHz core runs BACnet or Modbus stacks comfortably while the EMAC connects to building-management backbones. The industrial -40C to +85C temperature range supports rooftop and basement controller placements.

Recomendado

MCF5307CFT90B (Identical silicon, alternate screening grade)

Resumo dos produtos recomendados

MCF5307CFT90B Same-family sibling; identical silicon die Usado em: Industrial Control and Factory Automation, Building Automation Controllers MCF5329CFT240B Higher-speed migration within ColdFire V3 Usado em: Industrial Control and Factory Automation, Embedded Human-Machine Interface Panels MCF54455CVR200B Higher-throughput migration for encrypted VPN gateways Usado em: Networking Gateway and Router Control Plane, Connected Sensor Hubs and Edge Devices MCF5208CAB166B Lower-cost alternative for entry-level gateways Usado em: Networking Gateway and Router Control Plane MCF5307FT100B Drop-in upgrade for higher transaction throughput Usado em: Point-of-Sale and Retail Terminals
What is the maximum clock frequency of the MCF5307FT90B?
The MCF5307FT90B operates at a maximum core clock of 90 MHz, delivering roughly 70 MIPS of ColdFire V3 performance. According to the NXP MCF5307 datasheet family, this is the highest-speed member of the MCF5307 silicon revision in the 208-FQFP package, balancing CPU throughput with peripheral bandwidth for connected-embedded applications.
Does the MCF5307FT90B contain on-chip program memory?
No, the MCF5307FT90B is ROMless; program code resides in off-chip boot flash or SDRAM mapped through the integrated glueless memory controller. Designers must populate an external boot device on the data bus and configure chip-select timing registers before code fetch begins at reset.
What package does the MCF5307FT90B ship in?
The MCF5307FT90B ships in a 208-pin FQFP package measuring 28 mm x 28 mm with a 0.5 mm lead pitch. The fine-pitch QFP requires reflow soldering and a 4-layer or higher PCB stack-up to fan out the high pin count reliably.
Where can I buy the MCF5307FT90B today?
As of 2026-10-18 the MCF5307FT90B is listed at DigiKey, Mouser, and Octopart index distributors including Zouser, ampheo, Xecor, and IC-Components. Stock is constrained because the part is marked NXP Not Recommended for New Designs (NRND); expect 6-12 week lead times or consider excess-inventory brokers.
What is the unit price of the MCF5307FT90B at quantity 1?
As of 2026-10-18, the MCF5307FT90B single-unit distributor price is approximately $18.50. At 100-piece quantity breaks, prices fall to roughly $14.95; at 1000 pieces pricing is around $11.95. Pricing reflects NRND status and constrained authorized-channel supply.
Is the MCF5307FT90B still in production?
The MCF5307FT90B is currently flagged as NRND (Not Recommended for New Designs) by NXP. Production is maintained for existing customers but new designs should plan a migration path to active ColdFire or Kinetis successors before EOL.
What is the difference between MCF5307FT90B and MCF5307CFT90B?
Both parts share the same 90 MHz ColdFire V3 core and 208-FQFP package; the FT suffix denotes a standard industrial temperature grade, while CFT indicates a different screening/quality grade. Functionally they are drop-in compatible on PCB, though qualification and traceability documentation differ.
Can the MCF5307FT90B be replaced by an MCF5445x or Kinetis part?
The MCF5445x series offers a ColdFire V4 core at higher MHz and different peripherals, in a non-pin-compatible package, so a direct PCB drop-in is not possible. For new designs, Kinetis K66 or i.MX RT crossover MCUs provide ARM Cortex-M4 performance with modern peripherals, but require PCB redesign and firmware migration.
Where can I download the MCF5307FT90B datasheet PDF?
The MCF5307FT90B datasheet is hosted on the NXP website at the MCF5307 product family page, alongside the reference manual and ColdFire programmer reference. Octopart and DigiKey product pages also provide a direct PDF link to the manufacturer's revision-controlled datasheet.
Where is the pinout for the MCF5307FT90B?
The MCF5307FT90B pinout for the 208-FQFP package is documented in the NXP MCF5307 reference manual and the device datasheet, including EMAC, USB, SDRAM bus, and JTAG/BDM signal assignments. The XAIPART product page renders the pinout via the qfp-208 package diagram; cross-reference against the datasheet before PCB layout.
Does the MCF5307FT90B integrate an Ethernet MAC?
Yes, the MCF5307FT90B integrates a 10/100 Mbps Ethernet MAC (EMAC) block that connects to an external PHY via MII or RMII. This on-chip MAC eliminates the need for an external Ethernet controller and reduces BOM cost in connected-embedded designs.
Is there an ARM-based drop-in replacement for the MCF5307FT90B?
No direct ARM drop-in exists for the 208-FQFP MCF5307 footprint. Cross-brand ARM replacements such as NXP i.MX RT1064 or Atmel/Microchip SAM family require PCB rework because of differing pin counts, peripheral mappings, and voltage rails; treat them as new-design migrations rather than drop-ins.
What debug interface does the MCF5307FT90B support?
The MCF5307FT90B supports both the ColdFire Background Debug Mode (BDM) and JTAG boundary-scan interfaces for in-circuit emulation and production test. BDM is preferred for real-time debug because it preserves CPU state without halting execution.
What is the best NXP equivalent for the MCF5307FT90B?
Within NXP's portfolio, the MCF54455 and MCF5329 CFT members of the ColdFire family are the closest functional equivalents offering similar peripheral sets at comparable speeds. They are not pin-compatible drop-ins but offer migration paths within the same ColdFire ecosystem.
What is the operating voltage of the MCF5307FT90B?
The MCF5307FT90B operates from a 3.3 V supply on both the I/O and core domains, with internal voltage regulation supporting the ColdFire V3 pipeline. Designers must sequence the 3.3 V rail before external SDRAM initializes to avoid bus contention during boot.

Dados de referência de engenharia para MCF5307FT90B — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the MCF5307FT90B when your design requires a 90 MHz ColdFire V3 MCU with on-chip EMAC, USB, and a 32-bit glueless external memory bus in the 208-FQFP footprint, and your production schedule can tolerate NRND supply constraints. Choose the MCF5307CFT90B for the same silicon die when an alternate screening grade is acceptable and your procurement channel supports it. Step up to the MCF5307FT100B when you need ~11% more CPU throughput without PCB redesign. Move to the MCF5329CFT240B when compute headroom for routing, encryption, or HMI graphics is critical. For new designs where the MCF5307 is NRND, plan a migration to the i.MX RT or Kinetis ARM Cortex-M crossover MCUs, accepting that this requires PCB rework and firmware porting.

Comparação com alternativas

Parâmetro Este produto MCF5307CFT90B MCF5307FT100B MCF5329CFT240B MCF54455CVR200B MCF5208CAB166B
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 208-FQFP (28x28) 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same
Core ColdFire V3 ColdFire V3 ColdFire V3 ColdFire V3 ColdFire V4 ColdFire V2
Clock Frequency 90 MHz 90 MHz 100 MHz 240 MHz 200 MHz 166 MHz
On-chip Program Memory ROMless ROMless ROMless ROMless ROMless ROMless
Ethernet MAC 10/100 10/100 10/100 10/100 10/100 10/100
USB USB 1.1 device/host USB 1.1 device/host USB 1.1 device/host USB 1.1 device/host USB 2.0 OTG USB 1.1 device
External Bus 32-bit glueless 32-bit glueless 32-bit glueless 32-bit glueless 32-bit glueless 32-bit glueless

Principais diferenciais

  • Highest-volume MCF5307 variant with broadest distributor inventory (vs MCF5307CFT90B)
  • 11% higher core clock than 90 MHz baseline (vs MCF5307FT100B)
  • 167% higher CPU throughput for compute-heavy control planes (vs MCF5329CFT240B)

Notas de projeto

The MCF5307FT90B requires a clean 3.3 V supply with bulk decoupling of at least 47 uF and 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pin pair (16 pairs total in the 208-FQFP). The PLL supply pin VDDSYN must be filtered with an inductor or ferrite bead and decoupled with 10 uF + 100 nF to suppress jitter on the 90 MHz core clock. Power-up sequencing: hold RESET until VDD reaches 3.0 V minimum and the CLKIN oscillator has stabilized for at least 100 cycles.

Use a 4-layer PCB stack-up with continuous ground and power planes under the 208-FQFP footprint to provide low-impedance return paths for the 32-bit external memory bus. Match the address, data, and control traces to within +/- 1 cm of each other in the same bus segment and route them over a solid ground plane. SDRAM traces should be length-matched within 50 ps of CLKOUT to preserve setup/hold margin at 90 MHz.

Do not assume the BDM and JTAG interfaces share the same pin functions - they are multiplexed and must be configured in firmware before first debug attach. Leave at least 4 GPIO pins unused for future boot-mode strap overrides, since ColdFire boot configuration (boot device width, chip-select mapping, and PLL multiplier) is sampled at reset on dedicated pins. When migrating to MCF5307FT100B or MCF5329CFT240B, verify the SDRAM refresh-rate register values because higher core clocks change the bus-to-core ratio.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not found in the verified distributor snippets; consult NXP product compliance documentation directly. AEC-Q100 not applicable - this is an industrial/consumer MCU.

Dados verificados em: 2026-10-18 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

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