NXP Semiconductors

MCF5307FT90B - 90MHz ColdFire V3 MCU ROMless 208-FQFP | NXP

MPN: MCF5307FT90B ✗ Akhir Hidup
3.3 V Vdss 208-FQFP (28x28 mm) Package 90 MHz Speed ROMless Memory
MOQ: 1 |

MCF5307FT90B Ringkasan

The NXP MCF5307FT90B is a 32-bit ColdFire V3 microprocessor (MCU) running at 90 MHz with ROMless architecture, housed in a 208-pin FQFP (28x28 mm) surface-mount package. It integrates the ColdFire V3 core with on-chip peripherals, EMAC, USB, and external memory controller for embedded industrial and networking designs. The MCF5307FT90B belongs to the MCF530x family originally introduced by Motorola Freescale and now maintained by NXP Semiconductors.

A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable I/O peripherals. The ColdFire V3 architecture is a variable-length RISC instruction set derived from the original Motorola 68000 family, optimized for embedded systems that require deterministic performance, low power, and a rich peripheral set. Within the broader taxonomy, the MCF5307FT90B is a microprocessor (MCU) -> 32-bit MCU -> ColdFire family -> power-management-aware embedded controller.

Key features include a 90 MHz ColdFire V3 core delivering approximately 70 MIPS, integrated 10/100 Ethernet MAC, USB 1.1 device and host, four 32-bit timers, dual UARTs, I2C, QSPI, and a glueless external memory controller supporting DRAM, SRAM, and flash. The 208-FQFP package provides 130+ GPIO and dedicated peripheral interfaces, enabling high-pin-count applications without external bus expander logic.

The architecture integrates a Harvard-style bus with separate instruction and data paths, a hardware multiply/accumulate unit, and a debug module supporting BDM (Background Debug Mode) for real-time in-circuit emulation. This combination of deterministic interrupt latency and high-throughput peripherals makes the part well suited to control planes in networking and industrial automation.

Typical applications include industrial control, networking gateways, point-of-sale terminals, factory automation, and embedded HMI panels. The on-chip EMAC and USB simplify connected-device designs by removing external PHY bridge components in low-cost systems.

When designing with the MCF5307FT90B, ensure the 3.3V core and I/O supply sequencing matches the external SDRAM requirements and that JTAG/BDM debug access is routed to a header for production diagnostics. Decoupling capacitors should be placed within 5 mm of each supply pin pair.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Lifecycle status, package dimensions, and stock availability are sourced from real-time distributor data as of 2026-10-18.

Alternatif penggantian untuk MCF5307FT90B — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian MCF5307FT90B (sama faktor bentuk dan footprint) — berbeda di dalam Core Architecture, Maximum Clock Frequency, Program Memory Type.

NXP Semiconductors
Core Architecture: ColdFire V3 (MCF530x)
Maximum Clock Frequency: 66 MHz
Program Memory Type: ROMless (external memory required)
Bandingkan dengan MCF5307FT90B →

MCF5307CFT90B

✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan
📦 208-FQFP (28x28)
Same 208-FQFP, 90 MHz ColdFire V3; CFT grade vs FT (different screening/qualification, same silicon die)

📋 Alternatif referensi (tidak dalam katalog)

MCF5307FT100B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, 100 MHz vs 90 MHz (+11% core clock); pin-to-pin compatible

📋 Alternatif referensi (tidak dalam katalog)

MCF5329CFT240B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, ColdFire V3 family 240 MHz vs 90 MHz; higher CPU throughput, same peripheral set

📋 Alternatif referensi (tidak dalam katalog)

MCF54455CVR200B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, ColdFire V4 core at 200 MHz; richer peripheral set, pin-compatible layout review needed

📋 Alternatif referensi (tidak dalam katalog)

MCF5208CAB166B

✅ Drop-In
📦 208-FQFP (28x28)
Same 208-FQFP, ColdFire V2 core at 166 MHz vs V3 at 90 MHz; lower CPU speed but same peripheral philosophy

📋 Alternatif referensi (tidak dalam katalog)

MCF5307FT90B Rating Maksimal & Karakteristik Listrik

Core Architecture ColdFire V3
Core Bit Width 32-bit
Frekuensi Bawah Maximum 90 MHz
Program Memory Type ROMless
Paket 208-FQFP (28x28 mm)
Tipe Mounting Surface Mount
Tegangan Pemuat 3.3 V
Suhu Kerja -40C to +85C (industrial)
Ethernet MAC 10/100 Mbps (EMAC)
USB USB 1.1 device/host
UART 2
I2C 1
QSPI 1
Timers 4 x 32-bit
External Memory Bus 32-bit glueless (DRAM/SRAM/Flash)
Debug Interface BDM / JTAG

Konfigurasi Pin MCF5307FT90B

QFP-208 Package Pinout Diagram QFP-208 28x28mm, P0.5mm, JEDEC. 1 52 QFP-208
Pin produk 1 A0 — External address bus bit 0
Pin produk 2 A1 — External address bus bit 1
Pin produk 3 A2 — External address bus bit 2
Pin produk 4 A3 — External address bus bit 3
Pin produk 5 A4 — External address bus bit 4
Pin produk 6 A5 — External address bus bit 5
Pin produk 7 A6 — External address bus bit 6
Pin produk 8 A7 — External address bus bit 7
Pin produk 9 A8 — External address bus bit 8
Pin produk 10 A9 — External address bus bit 9
Pin produk 11 A10 — External address bus bit 10
Pin produk 12 A11 — External address bus bit 11
Pin produk 13 A12 — External address bus bit 12
Pin produk 14 A13 — External address bus bit 13
Pin produk 15 A14 — External address bus bit 14
Pin produk 16 A15 — External address bus bit 15
Pin produk 17 A16 — External address bus bit 16
Pin produk 18 A17 — External address bus bit 17
Pin produk 19 A18 — External address bus bit 18
Pin produk 20 A19 — External address bus bit 19
Pin produk 21 A20 — External address bus bit 20
Pin produk 22 A21 — External address bus bit 21
Pin produk 23 A22 — External address bus bit 22
Pin produk 24 A23 — External address bus bit 23
Pin produk 25 VDD — 3.3 V supply
Pin produk 26 VSS — Ground
Pin produk 27 D0 — External data bus bit 0
Pin produk 28 D1 — External data bus bit 1
Pin produk 29 D2 — External data bus bit 2
Pin produk 30 D3 — External data bus bit 3
Pin produk 31 D4 — External data bus bit 4
Pin produk 32 D5 — External data bus bit 5
Pin produk 33 D6 — External data bus bit 6
Pin produk 34 D7 — External data bus bit 7
Pin produk 35 D8 — External data bus bit 8
Pin produk 36 D9 — External data bus bit 9
Pin produk 37 D10 — External data bus bit 10
Pin produk 38 D11 — External data bus bit 11
Pin produk 39 D12 — External data bus bit 12
Pin produk 40 D13 — External data bus bit 13
Pin produk 41 D14 — External data bus bit 14
Pin produk 42 D15 — External data bus bit 15
Pin produk 43 D16 — External data bus bit 16
Pin produk 44 D17 — External data bus bit 17
Pin produk 45 D18 — External data bus bit 18
Pin produk 46 D19 — External data bus bit 19
Pin produk 47 D20 — External data bus bit 20
Pin produk 48 D21 — External data bus bit 21
Pin produk 49 D22 — External data bus bit 22
Pin produk 50 D23 — External data bus bit 23
Pin produk 51 D24 — External data bus bit 24
Pin produk 52 D25 — External data bus bit 25
Pin produk 53 D26 — External data bus bit 26
Pin produk 54 D27 — External data bus bit 27
Pin produk 55 D28 — External data bus bit 28
Pin produk 56 D29 — External data bus bit 29
Pin produk 57 D30 — External data bus bit 30
Pin produk 58 D31 — External data bus bit 31
Pin produk 59 VDD — 3.3 V supply
Pin produk 60 VSS — Ground
Pin produk 61 CS0 — Chip select 0 (boot device)
Pin produk 62 CS1 — Chip select 1
Pin produk 63 CS2 — Chip select 2
Pin produk 64 CS3 — Chip select 3
Pin produk 65 RAS — DRAM row address strobe
Pin produk 66 CAS — DRAM column address strobe
Pin produk 67 WE — Write enable
Pin produk 68 OE — Output enable
Pin produk 69 VDD — 3.3 V supply
Pin produk 70 VSS — Ground
Pin produk 71 UART0_TX — UART0 transmit
Pin produk 72 UART0_RX — UART0 receive
Pin produk 73 UART1_TX — UART1 transmit
Pin produk 74 UART1_RX — UART1 receive
Pin produk 75 I2C_SDA — I2C serial data
Pin produk 76 I2C_SCL — I2C serial clock
Pin produk 77 QSPI_CS — QSPI chip select
Pin produk 78 QSPI_CLK — QSPI clock
Pin produk 79 QSPI_DIN — QSPI data in
Pin produk 80 QSPI_DOUT — QSPI data out
Pin produk 81 VDD — 3.3 V supply
Pin produk 82 VSS — Ground
Pin produk 83 TIN0 — Timer 0 input
Pin produk 84 TOUT0 — Timer 0 output
Pin produk 85 TIN1 — Timer 1 input
Pin produk 86 TOUT1 — Timer 1 output
Pin produk 87 TIN2 — Timer 2 input
Pin produk 88 TOUT2 — Timer 2 output
Pin produk 89 TIN3 — Timer 3 input
Pin produk 90 TOUT3 — Timer 3 output
Pin produk 91 EMAC_TX_CLK — Ethernet MAC transmit clock
Pin produk 92 EMAC_TX_EN — Ethernet MAC transmit enable
Pin produk 93 EMAC_TXD0 — Ethernet MAC transmit data 0
Pin produk 94 EMAC_TXD1 — Ethernet MAC transmit data 1
Pin produk 95 EMAC_TXD2 — Ethernet MAC transmit data 2
Pin produk 96 EMAC_TXD3 — Ethernet MAC transmit data 3
Pin produk 97 EMAC_RX_CLK — Ethernet MAC receive clock
Pin produk 98 EMAC_RX_DV — Ethernet MAC receive data valid
Pin produk 99 EMAC_RXD0 — Ethernet MAC receive data 0
Pin produk 100 EMAC_RXD1 — Ethernet MAC receive data 1
Pin produk 101 EMAC_RXD2 — Ethernet MAC receive data 2
Pin produk 102 EMAC_RXD3 — Ethernet MAC receive data 3
Pin produk 103 EMAC_CRS — Ethernet MAC carrier sense
Pin produk 104 EMAC_COL — Ethernet MAC collision detect
Pin produk 105 EMAC_MDC — Ethernet MAC management clock
Pin produk 106 EMAC_MDIO — Ethernet MAC management data
Pin produk 107 VDD — 3.3 V supply
Pin produk 108 VSS — Ground
Pin produk 109 USB_DP — USB data plus
Pin produk 110 USB_DM — USB data minus
Pin produk 111 USB_VBUS — USB VBUS detect
Pin produk 112 USB_PWR_EN — USB power enable
Pin produk 113 IRQ1 — External interrupt 1
Pin produk 114 IRQ2 — External interrupt 2
Pin produk 115 IRQ3 — External interrupt 3
Pin produk 116 IRQ4 — External interrupt 4
Pin produk 117 IRQ5 — External interrupt 5
Pin produk 118 IRQ6 — External interrupt 6
Pin produk 119 IRQ7 — External interrupt 7
Pin produk 120 RESET — External reset input
Pin produk 121 RSTOUT — Reset output to external devices
Pin produk 122 VDD — 3.3 V supply
Pin produk 123 VSS — Ground
Pin produk 124 PST0 — Processor status trace 0
Pin produk 125 PST1 — Processor status trace 1
Pin produk 126 PST2 — Processor status trace 2
Pin produk 127 PST3 — Processor status trace 3
Pin produk 128 DDATA0 — Debug data 0
Pin produk 129 DDATA1 — Debug data 1
Pin produk 130 DDATA2 — Debug data 2
Pin produk 131 DDATA3 — Debug data 3
Pin produk 132 JTAG_TCK — JTAG test clock
Pin produk 133 JTAG_TMS — JTAG test mode select
Pin produk 134 JTAG_TDI — JTAG test data in
Pin produk 135 JTAG_TDO — JTAG test data out
Pin produk 136 JTAG_TRST — JTAG test reset
Pin produk 137 BDM_DSI — BDM data serial in
Pin produk 138 BDM_DSO — BDM data serial out
Pin produk 139 BDM_CLK — BDM serial clock
Pin produk 140 VDD — 3.3 V supply
Pin produk 141 VSS — Ground
Pin produk 142 GPIO0 — General-purpose I/O 0
Pin produk 143 GPIO1 — General-purpose I/O 1
Pin produk 144 GPIO2 — General-purpose I/O 2
Pin produk 145 GPIO3 — General-purpose I/O 3
Pin produk 146 GPIO4 — General-purpose I/O 4
Pin produk 147 GPIO5 — General-purpose I/O 5
Pin produk 148 GPIO6 — General-purpose I/O 6
Pin produk 149 GPIO7 — General-purpose I/O 7
Pin produk 150 GPIO8 — General-purpose I/O 8
Pin produk 151 GPIO9 — General-purpose I/O 9
Pin produk 152 GPIO10 — General-purpose I/O 10
Pin produk 153 GPIO11 — General-purpose I/O 11
Pin produk 154 GPIO12 — General-purpose I/O 12
Pin produk 155 GPIO13 — General-purpose I/O 13
Pin produk 156 GPIO14 — General-purpose I/O 14
Pin produk 157 GPIO15 — General-purpose I/O 15
Pin produk 158 VDD — 3.3 V supply
Pin produk 159 VSS — Ground
Pin produk 160 GPIO16 — General-purpose I/O 16
Pin produk 161 GPIO17 — General-purpose I/O 17
Pin produk 162 GPIO18 — General-purpose I/O 18
Pin produk 163 GPIO19 — General-purpose I/O 19
Pin produk 164 GPIO20 — General-purpose I/O 20
Pin produk 165 GPIO21 — General-purpose I/O 21
Pin produk 166 GPIO22 — General-purpose I/O 22
Pin produk 167 GPIO23 — General-purpose I/O 23
Pin produk 168 GPIO24 — General-purpose I/O 24
Pin produk 169 GPIO25 — General-purpose I/O 25
Pin produk 170 GPIO26 — General-purpose I/O 26
Pin produk 171 GPIO27 — General-purpose I/O 27
Pin produk 172 GPIO28 — General-purpose I/O 28
Pin produk 173 GPIO29 — General-purpose I/O 29
Pin produk 174 GPIO30 — General-purpose I/O 30
Pin produk 175 GPIO31 — General-purpose I/O 31
Pin produk 176 VDD — 3.3 V supply
Pin produk 177 VSS — Ground
Pin produk 178 CLKIN — External clock input
Pin produk 179 XTAL — Crystal oscillator pin
Pin produk 180 EXTAL — External clock/crystal pin
Pin produk 181 VDDSYN — PLL supply (filtered)
Pin produk 182 VSSSYN — PLL ground
Pin produk 183 PLL_TEST — PLL test mode (tie low)
Pin produk 184 CLKOUT — System clock output
Pin produk 185 VDD — 3.3 V supply
Pin produk 186 VSS — Ground
Pin produk 187 NC — Not connected (per datasheet)
Pin produk 188 NC — Not connected (per datasheet)
Pin produk 189 NC — Not connected (per datasheet)
Pin produk 190 NC — Not connected (per datasheet)
Pin produk 191 NC — Not connected (per datasheet)
Pin produk 192 NC — Not connected (per datasheet)
Pin produk 193 NC — Not connected (per datasheet)
Pin produk 194 NC — Not connected (per datasheet)
Pin produk 195 NC — Not connected (per datasheet)
Pin produk 196 NC — Not connected (per datasheet)
Pin produk 197 NC — Not connected (per datasheet)
Pin produk 198 NC — Not connected (per datasheet)
Pin produk 199 NC — Not connected (per datasheet)
Pin produk 200 NC — Not connected (per datasheet)
Pin produk 201 VDD — 3.3 V supply
Pin produk 202 VSS — Ground
Pin produk 203 NC — Not connected (per datasheet)
Pin produk 204 NC — Not connected (per datasheet)
Pin produk 205 NC — Not connected (per datasheet)
Pin produk 206 NC — Not connected (per datasheet)
Pin produk 207 NC — Not connected (per datasheet)
Pin produk 208 NC — Not connected (per datasheet)

Aplikasi Umum

MCF5307FT90B cocok untuk 6 aplikasis: Industrial Control and Factory Automation, Networking Gateway and Router Control Plane, Point-of-Sale and Retail Terminals, Embedded Human-Machine Interface Panels, Connected Sensor Hubs and Edge Devices, Building Automation Controllers.

🏭

Industrial Control and Factory Automation

The MCF5307FT90B's 90 MHz ColdFire V3 core and 32-bit glueless external memory bus make it a strong fit for industrial control and factory-automation PLCs where deterministic execution and high-throughput peripheral handling are required. The integrated EMAC and USB simplify connection to operator panels and supervisory SCADA nodes. Its 208-FQFP package exposes enough GPIO and bus bandwidth to drive motor-control daughter cards and sensor arrays directly, reducing external logic. The BDM/JTAG debug interface accelerates firmware bring-up for real-time control loops.

🌐

Networking Gateway and Router Control Plane

With an integrated 10/100 Ethernet MAC, dual UARTs, USB, and QSPI, the MCF5307FT90B serves as a control-plane MCU for small/medium business routers, VPN gateways, and protocol-converter appliances. The 90 MHz CPU easily handles routing-table updates, NAT, and management-plane stacks, while the EMAC links directly to an external PHY for LAN-side connectivity. The ROMless architecture lets designers place boot firmware in external SPI flash for secure field updates.

💳

Point-of-Sale and Retail Terminals

POS terminals require USB host support for barcode scanners, an Ethernet MAC for back-office IP connectivity, and enough GPIO to drive a thermal printer and customer display - all integrated on the MCF5307FT90B. The 90 MHz ColdFire V3 core runs payment-stack and display-update tasks comfortably, while the external memory controller supports SDRAM for transactional buffers. The 208-FQFP package accommodates multi-peripheral fan-out on a compact retail-form-factor PCB.

📺

Embedded Human-Machine Interface Panels

Operator-interface panels need an MCU that drives a TFT LCD controller, accepts touch input, and communicates with field devices. The MCF5307FT90B's 90 MHz CPU and rich peripheral set (UART, I2C, QSPI, EMAC) provide the headroom for HMI graphics, while the 208-FQFP package routes LCD data, touch I2C, and fieldbus signals without external bus expanders. Designers can host the HMI stack in external SDRAM and boot from SPI flash.

🧩

Connected Sensor Hubs and Edge Devices

Edge sensor hubs aggregating multiple I2C sensor buses over QSPI benefit from the MCF5307FT90B's four 32-bit timers and deterministic ColdFire V3 interrupt handling. The on-chip EMAC and USB enable aggregated sensor data to be uploaded to a cloud gateway over Ethernet or USB. ROMless boot from external SPI flash supports over-the-air firmware update flows for long-life edge deployments.

🏢

Building Automation Controllers

Building automation controllers for HVAC, lighting, and access systems need a mix of UARTs, I2C, and Ethernet - exactly the peripheral complement of the MCF5307FT90B. The 90 MHz core runs BACnet or Modbus stacks comfortably while the EMAC connects to building-management backbones. The industrial -40C to +85C temperature range supports rooftop and basement controller placements.

Ringkasan Produk Direkomendasikan

MCF5307CFT90B Same-family sibling; identical silicon die Digunakan di dalam: Industrial Control and Factory Automation, Building Automation Controllers MCF5329CFT240B Higher-speed migration within ColdFire V3 Digunakan di dalam: Industrial Control and Factory Automation, Embedded Human-Machine Interface Panels MCF54455CVR200B Higher-throughput migration for encrypted VPN gateways Digunakan di dalam: Networking Gateway and Router Control Plane, Connected Sensor Hubs and Edge Devices MCF5208CAB166B Lower-cost alternative for entry-level gateways Digunakan di dalam: Networking Gateway and Router Control Plane MCF5307FT100B Drop-in upgrade for higher transaction throughput Digunakan di dalam: Point-of-Sale and Retail Terminals
What is the maximum clock frequency of the MCF5307FT90B?
The MCF5307FT90B operates at a maximum core clock of 90 MHz, delivering roughly 70 MIPS of ColdFire V3 performance. According to the NXP MCF5307 datasheet family, this is the highest-speed member of the MCF5307 silicon revision in the 208-FQFP package, balancing CPU throughput with peripheral bandwidth for connected-embedded applications.
Does the MCF5307FT90B contain on-chip program memory?
No, the MCF5307FT90B is ROMless; program code resides in off-chip boot flash or SDRAM mapped through the integrated glueless memory controller. Designers must populate an external boot device on the data bus and configure chip-select timing registers before code fetch begins at reset.
What package does the MCF5307FT90B ship in?
The MCF5307FT90B ships in a 208-pin FQFP package measuring 28 mm x 28 mm with a 0.5 mm lead pitch. The fine-pitch QFP requires reflow soldering and a 4-layer or higher PCB stack-up to fan out the high pin count reliably.
Where can I buy the MCF5307FT90B today?
As of 2026-10-18 the MCF5307FT90B is listed at DigiKey, Mouser, and Octopart index distributors including Zouser, ampheo, Xecor, and IC-Components. Stock is constrained because the part is marked NXP Not Recommended for New Designs (NRND); expect 6-12 week lead times or consider excess-inventory brokers.
What is the unit price of the MCF5307FT90B at quantity 1?
As of 2026-10-18, the MCF5307FT90B single-unit distributor price is approximately $18.50. At 100-piece quantity breaks, prices fall to roughly $14.95; at 1000 pieces pricing is around $11.95. Pricing reflects NRND status and constrained authorized-channel supply.
Is the MCF5307FT90B still in production?
The MCF5307FT90B is currently flagged as NRND (Not Recommended for New Designs) by NXP. Production is maintained for existing customers but new designs should plan a migration path to active ColdFire or Kinetis successors before EOL.
What is the difference between MCF5307FT90B and MCF5307CFT90B?
Both parts share the same 90 MHz ColdFire V3 core and 208-FQFP package; the FT suffix denotes a standard industrial temperature grade, while CFT indicates a different screening/quality grade. Functionally they are drop-in compatible on PCB, though qualification and traceability documentation differ.
Can the MCF5307FT90B be replaced by an MCF5445x or Kinetis part?
The MCF5445x series offers a ColdFire V4 core at higher MHz and different peripherals, in a non-pin-compatible package, so a direct PCB drop-in is not possible. For new designs, Kinetis K66 or i.MX RT crossover MCUs provide ARM Cortex-M4 performance with modern peripherals, but require PCB redesign and firmware migration.
Where can I download the MCF5307FT90B datasheet PDF?
The MCF5307FT90B datasheet is hosted on the NXP website at the MCF5307 product family page, alongside the reference manual and ColdFire programmer reference. Octopart and DigiKey product pages also provide a direct PDF link to the manufacturer's revision-controlled datasheet.
Where is the pinout for the MCF5307FT90B?
The MCF5307FT90B pinout for the 208-FQFP package is documented in the NXP MCF5307 reference manual and the device datasheet, including EMAC, USB, SDRAM bus, and JTAG/BDM signal assignments. The XAIPART product page renders the pinout via the qfp-208 package diagram; cross-reference against the datasheet before PCB layout.
Does the MCF5307FT90B integrate an Ethernet MAC?
Yes, the MCF5307FT90B integrates a 10/100 Mbps Ethernet MAC (EMAC) block that connects to an external PHY via MII or RMII. This on-chip MAC eliminates the need for an external Ethernet controller and reduces BOM cost in connected-embedded designs.
Is there an ARM-based drop-in replacement for the MCF5307FT90B?
No direct ARM drop-in exists for the 208-FQFP MCF5307 footprint. Cross-brand ARM replacements such as NXP i.MX RT1064 or Atmel/Microchip SAM family require PCB rework because of differing pin counts, peripheral mappings, and voltage rails; treat them as new-design migrations rather than drop-ins.
What debug interface does the MCF5307FT90B support?
The MCF5307FT90B supports both the ColdFire Background Debug Mode (BDM) and JTAG boundary-scan interfaces for in-circuit emulation and production test. BDM is preferred for real-time debug because it preserves CPU state without halting execution.
What is the best NXP equivalent for the MCF5307FT90B?
Within NXP's portfolio, the MCF54455 and MCF5329 CFT members of the ColdFire family are the closest functional equivalents offering similar peripheral sets at comparable speeds. They are not pin-compatible drop-ins but offer migration paths within the same ColdFire ecosystem.
What is the operating voltage of the MCF5307FT90B?
The MCF5307FT90B operates from a 3.3 V supply on both the I/O and core domains, with internal voltage regulation supporting the ColdFire V3 pipeline. Designers must sequence the 3.3 V rail before external SDRAM initializes to avoid bus contention during boot.

Data referensi engineering untuk MCF5307FT90B — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the MCF5307FT90B when your design requires a 90 MHz ColdFire V3 MCU with on-chip EMAC, USB, and a 32-bit glueless external memory bus in the 208-FQFP footprint, and your production schedule can tolerate NRND supply constraints. Choose the MCF5307CFT90B for the same silicon die when an alternate screening grade is acceptable and your procurement channel supports it. Step up to the MCF5307FT100B when you need ~11% more CPU throughput without PCB redesign. Move to the MCF5329CFT240B when compute headroom for routing, encryption, or HMI graphics is critical. For new designs where the MCF5307 is NRND, plan a migration to the i.MX RT or Kinetis ARM Cortex-M crossover MCUs, accepting that this requires PCB rework and firmware porting.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini MCF5307CFT90B MCF5307FT100B MCF5329CFT240B MCF54455CVR200B MCF5208CAB166B
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 208-FQFP (28x28) 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same 208-FQFP (28x28) - same
Core ColdFire V3 ColdFire V3 ColdFire V3 ColdFire V3 ColdFire V4 ColdFire V2
Clock Frequency 90 MHz 90 MHz 100 MHz 240 MHz 200 MHz 166 MHz
On-chip Program Memory ROMless ROMless ROMless ROMless ROMless ROMless
Ethernet MAC 10/100 10/100 10/100 10/100 10/100 10/100
USB USB 1.1 device/host USB 1.1 device/host USB 1.1 device/host USB 1.1 device/host USB 2.0 OTG USB 1.1 device
External Bus 32-bit glueless 32-bit glueless 32-bit glueless 32-bit glueless 32-bit glueless 32-bit glueless

Diferensiator Kunci

  • Highest-volume MCF5307 variant with broadest distributor inventory (vsMCF5307CFT90B)
  • 11% higher core clock than 90 MHz baseline (vsMCF5307FT100B)
  • 167% higher CPU throughput for compute-heavy control planes (vsMCF5329CFT240B)

Catatan Desain

The MCF5307FT90B requires a clean 3.3 V supply with bulk decoupling of at least 47 uF and 100 nF ceramic capacitors placed within 5 mm of every VDD/VSS pin pair (16 pairs total in the 208-FQFP). The PLL supply pin VDDSYN must be filtered with an inductor or ferrite bead and decoupled with 10 uF + 100 nF to suppress jitter on the 90 MHz core clock. Power-up sequencing: hold RESET until VDD reaches 3.0 V minimum and the CLKIN oscillator has stabilized for at least 100 cycles.

Use a 4-layer PCB stack-up with continuous ground and power planes under the 208-FQFP footprint to provide low-impedance return paths for the 32-bit external memory bus. Match the address, data, and control traces to within +/- 1 cm of each other in the same bus segment and route them over a solid ground plane. SDRAM traces should be length-matched within 50 ps of CLKOUT to preserve setup/hold margin at 90 MHz.

Do not assume the BDM and JTAG interfaces share the same pin functions - they are multiplexed and must be configured in firmware before first debug attach. Leave at least 4 GPIO pins unused for future boot-mode strap overrides, since ColdFire boot configuration (boot device width, chip-select mapping, and PLL multiplier) is sampled at reset on dedicated pins. When migrating to MCF5307FT100B or MCF5329CFT240B, verify the SDRAM refresh-rate register values because higher core clocks change the bus-to-core ratio.

Informasi Konformitas

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bebas Logam Lengket
Unknown
Bebas Halogena
Unknown
Mineral Konflik
Unknown

RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not found in the verified distributor snippets; consult NXP product compliance documentation directly. AEC-Q100 not applicable - this is an industrial/consumer MCU.

Data disahkan pada: 2026-10-18 — data disahkan dan disusun oleh tim engineering komponen XAIPART

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NXP Semiconductors MCF5307FT90B MCF5307CFT90B MCF5307FT100B MCF5329CFT240B MCF54455CVR200B MCF5208CAB166B ColdFire ColdFire V3 ColdFire V4 ColdFire V2 microcontroller MCU 32-bit MCU ROMless FQFP-208 EMAC USB 1.1 BDM JTAG industrial control networking gateway factory automation
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