RTAX2000D-CQ352B - 2M-Gate Rad-Tolerant FPGA, CQFP-352 | Microchip
Teilenummer: RTAX2000D-CQ352B ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4200 | $4.200,00 |
| 10 | $3980 | $39.800,00 |
| 100 | $3650 | $365.000,00 |
| 500 | $3350 | $1.675.000,00 |
| 1.000 | $3100 | $3.100.000,00 |
RTAX2000D-CQ352B Übersicht
A radiation-tolerant FPGA is a programmable logic device qualified for space-flight environments where total ionizing dose (TID) and single-event effects threaten conventional SRAM FPGAs. Within the power-management hierarchy of space avionics, the RTAX family sits in the on-board data processing tier, providing single-chip glueless logic that is live at power-up because its antifuse configuration is permanently programmed.
Key features include antifuse one-time-programmable interconnect immune to configuration upsets, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry logic for arithmetic chains. The D-suffix die is screened with tighter ICCA current limits at 125C final electrical test compared to the standard RTAX2000S, supporting high-reliability programs.
Architecturally, the RTAX2000D derives from the commercial Axcelerator family, using a 0.15-micron CMOS process with metal-to-metal antifuse elements. This yields low static power, no configuration PROM requirement, and no SEE-sensitive configuration memory, a decisive advantage over SRAM-based FPGAs in orbit.
Typical applications include satellite payload data processing, spacecraft bus command and telemetry controllers, sensor interface and formatting logic, and radiation-hardened reconfigurable computing modules.
Design-wise, plan the migration path: prototype against Axcelerator commercial parts using the footprint-compatible adaptor board and EDIF netlist/pinout conversion methodology described in the manufacturer datasheet before committing to the one-time-programmable RTAX device.
This page synthesizes distributor availability, drop-in family alternatives, and design guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für RTAX2000D-CQ352B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit RTAX2000D-CQ352B (gleiche Bauform und Footprint) – abweichend in Package, Configuration, Technology, Family, Logic Cells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTAX2000D-CQ352E
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX2000D-CQ352V
✅ Drop-In✓ Auf Lager
$2560 / Stück
Datenblatt ansehen →RTAX2000D-1CQ352V
✅ Drop-In✓ Auf Lager
$3950 / Stück
Datenblatt ansehen →RTAX2000DL-CQ352B
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX2000DL-1CQ352E
✅ Drop-In✓ Auf Lager
$2300 / Stück
Datenblatt ansehen →RTAX4000D-CQ352B
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX2000D-CQ352B Grenzwerte & elektrische Eigenschaften
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Equivalent System Gates | 2000000 |
| Logic Cells | 29568 |
| CLBs | 19712 |
| Core Supply Voltage | 1.5 V nominal (1.425 V to 1.575 V) |
| Process Technology | CMOS antifuse |
| Configuration Type | One-time programmable antifuse, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking Features | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Carry logic |
| Gehäuse | CQFP-352 ceramic quad flat pack |
| Screening / Speed Grade | B (burn-in screening); D suffix = tighter ICCA limits at 125C final test |
| Montageart | Surface Mount |
| Application Domain | Space-flight systems |
| Radiation Tolerance | Radiation-tolerant (TID/SEE per family datasheet) |
RTAX2000D-CQ352B cqfp-352 ceramic quad flat pack Pinbelegungsleitfaden
Pinbelegung für RTAX2000D-CQ352B (cqfp-352 ceramic quad flat pack-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RTAX2000D-CQ352B.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTAX2000D-CQ352B ist geeignet für 6 Anwendungs: Satellite Payload Data Processing, Spacecraft Bus Command and Telemetry, Radiation-Hardened Reconfigurable Computing Modules, Star Tracker and Imager Interface Logic, Launcher and Avionics Interface Bridging, Prototype-to-Flight Migration Flow.
Satellite Payload Data Processing
The RTAX2000D-CQ352B fits satellite payload processing because its 2,000,000 equivalent gates and 29,568 logic cells absorb sensor formatting, packetization, and front-end compression logic in a single live-at-power-up device. The antifuse fabric has no configuration memory to upset under heavy-ion flux, eliminating the SEE-driven reconfiguration loops that burden SRAM FPGAs, while embedded SRAM blocks with FIFO control handle burst buffering between high-rate detectors and downlink encoders. In a typical chain the FPGA sits between the payload sensor and a spaceWire or LVDS formatter, with 1.5V core and banked I/O rails; the one-time-programmable fabric adds no switching-configuration overhead, but designers must budget the fixed logic partition carefully since the antifuse cannot be rewritten after flight-unit programming.
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Spacecraft Bus Command and Telemetry
Spacecraft bus controllers benefit from the RTAX2000D-CQ352B because its D-level die screening (tighter ICCA limits at 125C final electrical test) and B burn-in screening satisfy mission assurance requirements for the highest-reliability bus electronics. With 19,712 CLBs the device integrates telemetry acquisition, command decoding, and housekeeping state machines that would otherwise require several rad-hard ASICs, and its segmentable clock tree supports independent timing domains for the processor interface and low-rate telemetry peripherals. Placed between an on-board computer and MIL-STD-1553 or SpaceWire interfaces, it delivers deterministic, single-chip operation; the trade-off is one-time programmability, so flight software-controlled flexibility must live outside the FPGA.
Empfohlen
Radiation-Hardened Reconfigurable Computing Modules
For onboard science data reduction, the RTAX2000D-CQ352B provides 2,000,000 gates of antifuse logic whose interconnect is immune to configuration single-event upsets, a decisive property for compute modules that must run unattended for years. Carry logic accelerates fixed-point FFT, convolution, and error-correction chains, while chip-wide highway routing distributes wide data paths across the 29,568-cell fabric with predictable timing. The device is mounted on a heritage avionics board between an ADC front end and memory controllers, with the 1.5V core fed from a rad-tolerant point-of-load regulator; because the antifuse is programmed once, algorithm updates are handled at the system level via multiple programmed flight spares rather than in-orbit reconfiguration.
Empfohlen
Star Tracker and Imager Interface Logic
Star trackers and scientific imagers require deterministic, low-noise timing and high-bandwidth readout channels, which the RTAX2000D-CQ352B supplies with its segmentable clocks and 2,000,000-gate capacity for CCD/CMOS sequencer, correlated double sampling support, and centroid computation logic. The antifuse architecture introduces no configuration-cell switching noise, helpful for the sensitive analog front ends adjacent to the digital core, and the CQFP-352 ceramic package supports the thermal and outgassing requirements of optical payloads. The FPGA typically clocks the sensor, sequences exposure, and pre-processes star centroids before handing coordinates to the attitude computer; designers should partition timing-critical centroid paths early since the one-time-programmable fabric does not permit later timing closure iterations on flight hardware.
Empfohlen
Launcher and Avionics Interface Bridging
Launch-vehicle avionics frequently mix legacy bus standards with modern processors, and the RTAX2000D-CQ352B bridges them with 19,712 CLBs of glue logic, embedded SRAM FIFOs for rate decoupling, and I/O banks configurable to the required interface voltages. Its D-suffix screening and B burn-in align with launcher mission assurance flow, and the live-at-power-up antifuse configuration means interface logic is functional the instant units are energized during Range safety checks, with no configuration load time. The device typically sits between a flight computer and 1553, ARINC, or discretes interfaces; because antifuse devices cannot be reprogrammed after screening, teams maintain programmed flight spares and verify netlist parity through Microchip Libero SoC release control.
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Prototype-to-Flight Migration Flow
The RTAX2000D-CQ352B is designed for a low-risk prototype-to-flight methodology: because the RTAX architecture derives from the commercial Axcelerator family, engineers validate RTL on reprogrammable Axcelerator devices using a footprint-compatible adaptor board plus an EDIF netlist and pinout converter, exactly as described in the RTAX-S/SL datasheet and the application note Prototyping for RTAX-S and RTAX-SL Devices. Only after timing closure and functional sign-off is the one-time-programmable antifuse flight device programmed, eliminating expensive burn errors. This page lists drop-in CQFP-352 family members (RTAX2000D E/V grades, DL low-power variants, and RTAX4000D density upgrades) so the final die choice can be deferred until after prototype results, keeping a single PCB layout across all options.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTAX2000D-CQ352B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTAX2000D-CQ352E | RTAX2000DL-CQ352B | RTAX4000D-CQ352B |
|---|---|---|---|---|
| Package | CQFP-352 | CQFP-352 - same | CQFP-352 - same | CQFP-352 - same |
| Brand | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) |
| Equivalent System Gates | 2,000,000 | 2,000,000 | 2,000,000 | 4,000,000 |
| Core Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Screening / Suffix | D, B burn-in | D, E grade | DL, B burn-in | D, B burn-in |
| Configuration | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up | Antifuse OTP, live at power-up |
| Relative Static Power | Standard D die | Same as this product | Lower (L low-power variant) | Higher (larger die) |
Wichtigste Unterscheidungsmerkmale
- Highest-reliability screening in the 2M-gate family (vs. RTAX2000D-CQ352E)
- Lower static power than the density upgrade (vs. RTAX4000D-CQ352B)
- Full-speed die versus speed grade 1 (vs. RTAX2000D-1CQ352V)
Designhinweise
The RTAX2000D-CQ352B is one-time programmable: once antifuses are burned, the configuration can never be changed. Complete full timing closure and functional verification in Libero SoC, and validate on a commercial Axcelerator prototype using the footprint-compatible adaptor board and EDIF netlist/pinout converter flow per the manufacturer datasheet, before programming any flight device. Maintain configuration-file version control and programmed flight spares for every mission lot.
Design the 1.5V core rail to hold 1.425V to 1.575V under all load and radiation-related degradation conditions. The D-suffix die is screened to tighter ICCA limits at 125C, which improves standby-current predictability, but transient core current during carry-chain switching still requires adequate decoupling on all VCC pins of the CQFP-352. Verify I/O bank voltages against the datasheet bank tables; mixed-voltage banks must be assigned before pin lock since antifuse programming fixes them permanently.
The CQFP-352 ceramic package has leads on all four sides; use a land pattern per the mechanical drawing in the family datasheet and support the leads with solder columns where thermal cycling life is a concern, as recommended for RTAX ceramic packages. Provide a solid ground plane under the device, place 0.1uF decoupling at each supply pin group, and keep high-speed LVDS or SpaceWire pairs length-matched from the CQFP through the board connector to preserve signal integrity.
Compliance-Informationen
Aerospace ceramic CQFP package; environmental compliance data not stated in provided web data. Consult Microchip product page for RoHS/REACH declarations.