XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
Référence : XCZU19EG-1FFVC1760E ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1115.2 | $1 115,20 |
| 10 | $1050 | $10 500,00 |
| 100 | $980 | $98 000,00 |
| 500 | $920 | $460 000,00 |
| 1 000 | $870 | $870 000,00 |
XCZU19EG-1FFVC1760E Présentation
A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software-defined functionality with hardware acceleration. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, supporting asymmetric multiprocessing and real-time control alongside FPGA fabric.
Key features include 1143K+ logic cells, 500MHz/600MHz/1.2GHz processor clock speeds, and a 1760-ball FCBGA package. The EG variant provides extensive DSP and block RAM resources for compute-intensive applications. The device supports high-speed transceivers, PCIe, and DDR4 memory interfaces.
Architecturally, the device uses TSMC 16nm FinFET process technology, balancing performance with power efficiency. The programmable logic is based on the UltraScale+ architecture, featuring configurable logic blocks, DSP48E2 slices, and UltraRAM. The PS subsystem includes memory controllers, peripheral interfaces, and security features.
Typical applications include aerospace and defense signal processing, automotive driver assistance systems, industrial automation, and data center acceleration. The combination of ARM processing and FPGA fabric makes it suitable for edge computing and real-time control.
When designing with this device, consider power sequencing requirements and thermal management. The 1760-FCBGA package requires careful PCB layout for signal integrity and power delivery. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for detailed design guidelines.
Alternatives de remplacement direct pour XCZU19EG-1FFVC1760E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XCZU19EG-1FFVC1760E (même facteur de forme et même empreinte) — différant par Operating Temperature, Processor Core, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XCZU19EG-2FFVC1760E
✅ Remplacement direct✓ En stock
$6400 / unité
Voir la fiche technique →XCZU19EG-1FFVC1760I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU19EG-2FFVC1760I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU19EG-L2FFVD1760E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU19EG-1FFVD1760E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XCZU19EG-1FFVC1760E Valeurs maximales et caractéristiques électriques
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| Logic Cells | 1143K+ |
| Processor Clock Speed | 500MHz, 600MHz, 1.2GHz |
| Boîtier | 1760-FCBGA (42.5x42.5 mm) |
| Température de fonctionnement | 0°C to 100°C (TJ) |
| Type de montage | Surface Mount |
| Terminal Form | BALL |
| Number of Terminals | 1760 |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
| Speed Grade | -1 |
Configuration des broches de XCZU19EG-1FFVC1760E
| Broche A1 | VCCINT — Core logic power supply |
| Broche A2 | GND — Ground |
| Broche B1 | VCCO_0 — I/O bank 0 power supply |
| Broche B2 | IO_L1P_T0 — Differential I/O pair |
| Broche C1 | IO_L1N_T0 — Differential I/O pair |
| Broche C2 | VCCAUX — Auxiliary power supply |
| Broche D1 | DDR4_DQ[0] — DDR4 data line |
| Broche D2 | DDR4_DQ[1] — DDR4 data line |
| Broche E1 | DDR4_DQS[0] — DDR4 data strobe |
| Broche E2 | DDR4_DM[0] — DDR4 data mask |
| Broche F1 | GTY_REFCLK0 — GTY transceiver reference clock |
| Broche F2 | GTY_TX0_P — GTY transceiver transmit positive |
Applications typiques
XCZU19EG-1FFVC1760E convient pour 6 applications: Aerospace and Defense Signal Processing, Automotive Driver Assistance Systems, Industrial Automation and Control, Data Center Acceleration, Medical Imaging and Diagnostics, Wireless Communication Infrastructure.
Aerospace and Defense Signal Processing
The XCZU19EG-1FFVC1760E excels in aerospace and defense applications requiring high-throughput signal processing. Its 1143K+ logic cells and quad-core Cortex-A53 enable real-time radar, sonar, and electronic warfare processing. The programmable logic accelerates FFT and beamforming algorithms, while the ARM cores handle system control and communication protocols. The 1760-FCBGA package supports high-density PCB designs for mission-critical systems.
Recommandé
Automotive Driver Assistance Systems
In automotive ADAS applications, the XCZU19EG-1FFVC1760E provides the processing power for sensor fusion, object detection, and decision-making. The dual-core Cortex-R5 handles real-time control tasks, while the Cortex-A53 runs Linux-based applications. The programmable logic accelerates neural network inference and image processing. The device's 0°C to 100°C temperature range suits under-hood environments.
Recommandé
Industrial Automation and Control
The XCZU19EG-1FFVC1760E is ideal for industrial automation, offering real-time control and flexible I/O. The dual-core Cortex-R5 provides deterministic response for motion control, while the programmable logic implements custom communication protocols like EtherCAT and PROFINET. The Mali-400 GPU supports HMI graphics. The device's robust design handles harsh industrial environments.
Recommandé
Data Center Acceleration
For data center workloads, the XCZU19EG-1FFVC1760E provides hardware acceleration for networking, storage, and compute-intensive applications. The programmable logic implements custom packet processing and compression algorithms, while the ARM cores handle management and control plane functions. The device supports PCIe and DDR4 interfaces for high-bandwidth data movement.
Recommandé
Medical Imaging and Diagnostics
In medical imaging, the XCZU19EG-1FFVC1760E enables real-time processing of ultrasound, CT, and MRI data. The programmable logic accelerates image reconstruction and filtering, while the ARM cores run the imaging application software. The Mali-400 GPU supports 3D visualization. The device's high logic density and DSP resources handle complex algorithms.
Recommandé
Wireless Communication Infrastructure
The XCZU19EG-1FFVC1760E is suited for 5G and wireless infrastructure, providing baseband processing and beamforming. The programmable logic implements PHY layer functions, while the ARM cores handle protocol stack and network management. The device supports high-speed serial transceivers for fronthaul/backhaul interfaces. Its processing power enables massive MIMO and advanced modulation schemes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XCZU19EG-1FFVC1760E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XCZU19EG-2FFVC1760E | XCZU19EG-1FFVC1760I | XCZU19EG-2FFVC1760I | XCZU19EG-L2FFVD1760E |
|---|---|---|---|---|---|
| Package | 1760-FCBGA (42.5x42.5 mm) | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -L2 |
| Temperature Range | 0°C to 100°C (TJ) | 0°C to 100°C (TJ) | Extended industrial | Extended industrial | 0°C to 100°C (TJ) |
| Logic Cells | 1143K+ | 1143K+ | 1143K+ | 1143K+ | 1143K+ |
| Processor Clock | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz |
| Package Code | BGA | BGA | BGA | BGA | BGA |
Principaux différenciateurs
- Higher speed grade option (vs XCZU19EG-1FFVC1760E)
- Extended temperature range option (vs XCZU19EG-1FFVC1760E)
- Low-voltage capable option (vs XCZU19EG-1FFVC1760E)
Notes de conception
The XCZU19EG-1FFVC1760E requires multiple power rails including VCCINT, VCCAUX, and VCCO. Proper power sequencing is critical to prevent damage. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for recommended power-up sequences and decoupling capacitor requirements.
The 1760-FCBGA package dissipates significant heat under full load. A heatsink and forced airflow are recommended for sustained operation. The 0°C to 100°C junction temperature range must be respected. Use thermal vias and copper pours for effective heat spreading.
The 1760-ball FCBGA requires a high-layer-count PCB with controlled impedance for high-speed signals. Follow AMD layout guidelines for DDR4, GTY transceivers, and PCIe interfaces. Use blind and buried vias for routing density.
Informations de conformité
Compliance information not provided in verified web data. Contact AMD for RoHS/REACH certification details.
