EP1SGX10DF672I6N vs EP1SGX10DF672I6 Comparación
Comparación detallada lado a lado de EP1SGX10DF672I6N por Intel y EP1SGX10DF672I6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX10DF672I6N | EP1SGX10DF672I6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $85,20 | $290,00 |
| Series | Stratix GX | — |
| Family | Stratix GX (EP1SGX) | Stratix GX |
| Logic Elements | 10,570 | — |
| Logic Cells | 10,570 | — |
| CLBs (Logic Array Blocks) | 1,200 LABs / 1200 CLBs | — |
| Total RAM Bits | 920,448 bits | — |
| User I/O Pins | 362 | — |
| Package Type | FBGA-672 (FineLine BGA) | — |
| Package Code | BGA, 672 balls | — |
| Package Dimensions | 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Temperatura de funcionamiento | 0 C to 85 C (Industrial, "I" grade) | 0 C to +85 C (commercial) |
| Logic Family | CMOS | — |
| Lead Free Status | Lead Free (FBGA-672, per Ampheo listing) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS Status] |
| Logic Elements (LEs) | — | 10,570 |
| Embedded RAM | — | 920,448 bits |
| Embedded Multipliers | — | Yes (DSP blocks) |
| Transceiver Channels | — | 12 (3.125 Gbps) |
| Maximum User I/O | — | 362 |
| PLLs | — | 4 |
| Process Technology | — | 130 nm CMOS |
| Encapsulado | — | 672-ball FC-FBGA (DF672) |
| Package Body Size | — | 33 x 33 mm, 1.0 mm pitch |
| Nivel MSL | — | [DATA_NEEDED: MSL Level] |