EP1SGX10DF672I6N vs EP1SGX10DF672I6 对比

详细并排对比 EP1SGX10DF672I6N 出自 Intel 和 EP1SGX10DF672I6 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1SGX10DF672I6N EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N ⚠ 最后一次采购

规格对比

参数 EP1SGX10DF672I6N EP1SGX10DF672I6
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 Obsolete
库存状态 有库存 有库存
单价(USD) $85.20 $290.00
Series Stratix GX —
Family Stratix GX (EP1SGX) Stratix GX
Logic Elements 10,570 —
Logic Cells 10,570 —
CLBs (Logic Array Blocks) 1,200 LABs / 1200 CLBs —
Total RAM Bits 920,448 bits —
User I/O Pins 362 —
Package Type FBGA-672 (FineLine BGA) —
Package Code BGA, 672 balls —
Package Dimensions 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch —
安装类型 Surface Mount Surface Mount
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) 1.5 V
工作温度 0 C to 85 C (Industrial, "I" grade) 0 C to +85 C (commercial)
Logic Family CMOS —
Lead Free Status Lead Free (FBGA-672, per Ampheo listing) —
RoHS 状态 Compliant [DATA_NEEDED: RoHS Status]
Logic Elements (LEs) — 10,570
Embedded RAM — 920,448 bits
Embedded Multipliers — Yes (DSP blocks)
Transceiver Channels — 12 (3.125 Gbps)
Maximum User I/O — 362
PLLs — 4
Process Technology — 130 nm CMOS
封装 — 672-ball FC-FBGA (DF672)
Package Body Size — 33 x 33 mm, 1.0 mm pitch
MSL 等级 — [DATA_NEEDED: MSL Level]

数据手册与资源

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