IDL04G65C5XUMA2 vs IGLT65R035D2ATMA1 Comparación
Comparación detallada lado a lado de IDL04G65C5XUMA2 por Infineon y IGLT65R035D2ATMA1 por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | IDL04G65C5XUMA2 | IGLT65R035D2ATMA1 |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoría | Diodes | MOSFETs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,92 | $5,10 |
| Manufacturer | Infineon Technologies | Infineon Technologies |
| Product Family | CoolSiC™ Schottky Diode Generation 5 | CoolGaN™ G5 TOLT |
| Diode Type | Silicon Carbide (SiC) Schottky | — |
| Repetitive Peak Reverse Voltage (V_RRM) | 650 V | — |
| Continuous Forward Current (I_F(AV)) | 4 A | — |
| Total Capacitive Charge (Q_C) | 7 nC (typical) | — |
| Forward Voltage (V_F) | 1.7 V at 4 A (typical, per datasheet) | — |
| Reverse Leakage Current (I_R) | 70 µA at 650 V | — |
| Junction Capacitance (C_J) | 130 pF at 1 V, 1 MHz | — |
| Reverse Recovery Time (t_rr) | 0 ns (Schottky, no minority-carrier storage) | — |
| Temperatura de unión de funcionamiento | -55°C to +175°C | — |
| Encapsulado | PG-VSON-4 (DPAK real2pin) Surface Mount | PG-HDSOP-16-8 (top-side cooled) |
| Tipo de montaje | Surface Mount, Tape & Reel | Surface Mount |
| Recuento de pines | 4 (with exposed thermal pad) | — |
| RoHS / REACH | RoHS Compliant (per Infineon product page) | — |
| Tipo de transistor | — | N-Channel enhancement-mode GaN HEMT |
| Drain-Source Voltage (Vdss) | — | 650 V |
| Continuous Drain Current (Id) at Tc | — | 47 A |
| Maximum Power Dissipation (Pd) at Tc | — | 154 W |
| On-Resistance (Rds(on)) | — | [DATA_NEEDED: typical Rds(on) in mohm] |
| Gate Threshold Voltage (Vgs(th)) | — | [DATA_NEEDED: typical Vgs(th)] |
| Input Capacitance (Ciss) at Vds=400V | — | 540 pF |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: Tj min/max] |
| Cooling Configuration | — | Top-side cooled (TOLT) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Estado RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Production Wafer Size | — | 200 mm (8 inch) |