K9ADGD8S0A vs K9PRGY8S7M Comparación

Comparación detallada lado a lado de K9ADGD8S0A por Samsung Electronics y K9PRGY8S7M por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Samsung Electronics
K9ADGD8S0A K9ADGD8S0A - 3D V-NAND TCAT Flash Memory Die | Samsung

K9ADGD8S0A - 3D V-NAND TCAT Flash Memory Die | Samsung

K9ADGD8S0A ✗ Fin de vida
Samsung Electronics
K9PRGY8S7M K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics

K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics

K9PRGY8S7M ✓ Activo

Comparación de especificaciones

Parámetro K9ADGD8S0A K9PRGY8S7M
Marca Samsung Electronics Samsung Electronics
Categoría EEPROM Memory ICs
Estado del ciclo de vida Fin de vida Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $0,00
Device Type 3D V-NAND flash memory bare die —
Process Technology Terabit Cell Array Transistor (TCAT) —
Architecture 3D vertical NAND (V-NAND) —
Form Factor Bare die (unpackaged) —
Found In Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages —
Known Application Samsung 850 Pro 128 GB SSD —
Memory Class Non-volatile NAND flash —
Manufacturer Samsung Electronics Samsung Electronics
Documented By TechInsights report SAR-1407-802 —
Capacity [DATA_NEEDED: die capacity] —
Tensión de alimentación [DATA_NEEDED: supply voltage] [DATA_NEEDED: supply voltage]
Interfaz [DATA_NEEDED: interface type] —
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Program/Erase Cycles [DATA_NEEDED: endurance] [DATA_NEEDED: P/E cycles]
Temperatura de funcionamiento [DATA_NEEDED: operating temperature] [DATA_NEEDED: operating temperature]
Encapsulado [DATA_NEEDED: package] —
Tipo de memoria — NAND Flash
Density — [DATA_NEEDED: density]
Organización de memoria — [DATA_NEEDED: organization]
Tipo de interfaz — [DATA_NEEDED: interface type]
Block Size — [DATA_NEEDED: block size]
Access Time — [DATA_NEEDED: access time]
Package Type — BGA (surface mount)
Package Pin/Ball Count — [DATA_NEEDED: ball count]
Tipo de montaje — Surface Mount
Estado RoHS — [DATA_NEEDED: RoHS status]
Nivel MSL — [DATA_NEEDED: MSL level]

Hojas de datos y recursos

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