A3PE1500-1FGG676I - ProASIC3E FPGA, 1.5M Gates | Microchip
MPN: A3PE1500-1FGG676I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.6 | $59,600.00 |
Drop-in alternatives for A3PE1500-1FGG676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE1500-FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-2FGG676
✅ Drop-In✓ In Stock
$33.5 / Unit
View Datasheet →A3PE1500-1FG676I
✅ Drop-In✓ In Stock
$65.89 / Unit
View Datasheet →M1A3PE1500-1FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-2FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-1FGG676I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| Equivalent System Gates | 1,500,000 |
| Logic Elements | 38400 |
| RAM Bits | 276480 |
| Number of I/Os | 444 |
| Operating Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 231 MHz |
| Package / Case | FBGA-676 |
| Mounting Style | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Packaging | Tray |
| Lead Free | Yes |
| RoHS | Compliant |
| Process Technology | 130nm 7-layer metal flash CMOS |
A3PE1500-1FGG676I fbga-676 Pin Configuration Guide
Complete pinout information for A3PE1500-1FGG676I (fbga-676 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE1500-1FGG676I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE1500-1FGG676I is suitable for 6 applications: Communications Infrastructure, Industrial Automation, Avionics and Defense, Consumer Electronics, Medical Electronics, Automotive Electronics.
Communications Infrastructure
The A3PE1500-1FGG676I is ideal for communications infrastructure such as network routers, switches, and base stations. Its 444 I/Os and 1.5M gates enable protocol bridging, packet processing, and interface conversion. The flash-based architecture provides instant-on and high reliability, critical for always-on network equipment. With 231 MHz performance, it can handle high-speed data paths while maintaining low power consumption. The device supports various I/O standards including LVDS and PCI, making it versatile for backplane and line-card interfaces. Its reprogrammability allows in-field updates for evolving protocols, reducing downtime and extending product life.
Recommended
Industrial Automation
In industrial automation, the A3PE1500-1FGG676I excels in motor control, PLCs, and sensor interfacing. Its 444 I/Os allow direct connection to multiple sensors and actuators, while the 1.5M gates provide ample logic for implementing control algorithms. The -40°C to +85°C temperature range ensures operation in harsh factory environments. The flash-based FPGA offers instant-on, eliminating boot delays in safety-critical systems. Its low power consumption reduces heat generation in sealed enclosures. The device's reprogrammability enables firmware updates for changing production requirements without hardware redesign, making it a cost-effective solution for evolving industrial systems.
Recommended
Avionics and Defense
The A3PE1500-1FGG676I is well-suited for avionics and defense applications due to its flash-based security and reliability. The non-volatile configuration prevents bitstream tampering and ensures instant-on, critical for mission-critical systems. Its 1.5M gates and 444 I/Os support complex signal processing, radar, and communication systems. The industrial temperature range and lead-free packaging meet stringent environmental requirements. The device's reprogrammability allows for secure in-field updates, reducing maintenance costs. With 231 MHz performance, it can handle real-time data processing while maintaining deterministic behavior, essential for safety-critical avionics.
Recommended
Consumer Electronics
In consumer electronics, the A3PE1500-1FGG676I enables features like video processing, display control, and smart home interfaces. Its 444 I/Os connect to various peripherals, while 1.5M gates handle image scaling, color space conversion, and UI rendering. The 1.5V core reduces power consumption, extending battery life in portable devices. The flash-based architecture allows instant-on for immediate user response. Its small FBGA package fits compact designs. The device's reprogrammability supports firmware updates for adding new features or fixing bugs post-launch, enhancing product longevity and user satisfaction.
Recommended
Medical Electronics
The A3PE1500-1FGG676I is used in medical electronics such as patient monitors, imaging systems, and diagnostic equipment. Its 444 I/Os interface with sensors, ADCs, and displays, while 1.5M gates implement signal processing and control logic. The industrial temperature range ensures reliable operation in clinical environments. The flash-based architecture provides high reliability and instant-on, critical for life-supporting devices. Its low power consumption reduces heat, important for compact medical devices. The device's reprogrammability allows for software updates to improve algorithms or add new diagnostic features without hardware changes, extending device lifespan.
Recommended
Automotive Electronics
In automotive electronics, the A3PE1500-1FGG676I supports applications like infotainment, ADAS, and body control modules. Its 444 I/Os connect to cameras, sensors, and displays, while 1.5M gates handle video processing, sensor fusion, and control algorithms. The -40°C to +85°C range covers automotive temperature requirements. The flash-based architecture provides instant-on for immediate system response and high reliability in vibration-prone environments. Its low power consumption reduces load on the vehicle's electrical system. The device's reprogrammability enables over-the-air updates for feature enhancements and security patches, keeping vehicles up-to-date.
Recommended
Recommended Products Summary
Engineering reference data for A3PE1500-1FGG676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE1500-FGG676I | A3PE1500-2FGG676 | A3PE1500-1FG676I | M1A3PE1500-1FGG676I |
|---|---|---|---|---|---|
| Package | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-676 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 (231 MHz) | Standard (350 MHz) | -2 (higher) | -1 (231 MHz) | -1 (231 MHz) |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) | Military (-55 to +125 C) |
| Lead-Free | Yes | Yes | Yes | No | Yes |
| Number of I/Os | 444 | 444 | 444 | 444 | 444 |
| RAM Bits | 276480 | 276480 | 276480 | 276480 | 276480 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Flash-based architecture provides instant-on and security (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature range (-40 to +85 C) (vs A3PE1500-2FGG676 (commercial only))
- Lead-free and RoHS compliant (vs A3PE1500-1FG676I (non-lead-free))
Design Notes
The A3PE1500-1FGG676I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each power pin with a 0.1uF ceramic capacitor and add bulk capacitance (10uF) near the FPGA. Estimated: For a typical design with 50% logic utilization and 100 MHz clock, core power dissipation is approximately 0.5W, based on Microchip's power calculator. Ensure the power supply can handle peak current during configuration.
The 676-pin FBGA package requires a multi-layer PCB with at least 6 layers for proper routing and power distribution. Follow Microchip's layout guidelines: use 0.1uF decoupling capacitors on each power pin, place them as close as possible to the balls, and use a solid ground plane. For high-speed I/Os, control impedance and use series termination resistors. The ball pitch is 1mm, so use vias with a drill size of 0.2mm or smaller for routing.
The A3PE1500-1FGG676I in FBGA-676 package has a thermal resistance (theta_JA) of approximately 15 C/W, depending on airflow and PCB design. Estimated: For 1W power dissipation, the junction temperature rise is 15C above ambient. At 85C ambient, the junction would be 100C, within the maximum rating. For higher power designs, add thermal vias under the package and consider a heatsink or forced airflow. Monitor junction temperature in high-reliability applications.
Compliance Information
Lead-free and RoHS compliant per part number suffix 'GG'. REACH and conflict minerals status not specified in provided data.
