A3PE1500-1FG676I - ProASIC3E FPGA 1.5M Gates | Microchip
부품 번호: A3PE1500-1FG676I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95.44 | $95.44 |
| 10 | $86.32 | $863.20 |
| 100 | $78.1 | $7,810.00 |
| 500 | $71.55 | $35,775.00 |
| 1,000 | $65.89 | $65,890.00 |
A3PE1500-1FG676I 개요
What is an FPGA? A Field Programmable Gate Array is an integrated circuit that can be configured by the designer after manufacturing to implement arbitrary digital logic. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks, configurable I/O, and routing resources; they are used for rapid prototyping, custom digital control, signal processing, and protocol bridging. The ProASIC3E family is built on a 130nm flash-based CMOS process, which means configuration is stored in non-volatile flash cells rather than external SRAM/EEPROM.
Key features include 1.5M system gates, 38,400 logic elements, 444 user I/Os, 276,480 bits of true dual-port SRAM, and up to 272MHz system performance. The flash fabric is live-at-power-up, eliminating the boot time and external configuration memory of SRAM FPGAs. In-system programming (ISP) is supported through JTAG, and the single-chip design reduces board area and bill-of-materials cost.
Technical depth: The device is manufactured in 130nm, seven-layer metal (six copper) flash-based CMOS. The non-volatile architecture provides instant-on operation and inherent design security because configuration bitstreams are not exposed on external memory buses. The FPGA supports a wide range of I/O standards through configurable I/O banks—though the exact I/O voltage list should be confirmed in the ProASIC3E datasheet—and includes dedicated clock conditioning circuitry.
Typical applications include communications infrastructure, industrial automation, medical electronics, aerospace and defense systems, automotive connectivity, and IoT edge processing. The 444 I/Os allow parallel bus interfaces, while the 1.5M gates are sufficient for soft-core processors, DSP datapaths, and protocol controllers.
Design consideration: The 1.5V core supply must be clean and adequately decoupled. Use a 0.1uF ceramic capacitor on each VCC/BGx pin and a 10uF bulk capacitor near the FPGA, with a solid ground plane; verify power sequencing if multiple I/O supplies are used. The FBGA-676 package has a 27 mm x 27 mm body with 1 mm ball pitch, requiring careful PCB fanout.
This page synthesizes distributor availability, pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a pre-engineering advantage for the A3PE1500-1FG676I.
드롭인 대체품: A3PE1500-1FG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE1500-1FG676I (동일 폼 팩터 및 풋프린트) — 차이점: Core Supply Voltage, System Gates, Configuration, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE1500-1FGG676I
✅ 드롭인✓ 재고 있음
$59.6 / 개
데이터시트 보기 →A3PE1500-FG676I
✅ 드롭인✓ 재고 있음
$60.2 / 개
데이터시트 보기 →A3PE1500-1FG676
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE1500-2FGG676
✅ 드롭인✓ 재고 있음
$33.5 / 개
데이터시트 보기 →M1A3PE1500-1FG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3PE1500-1FG676I 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| System Gates | 1.5M |
| Logic Elements (CLBs) | 38400 |
| User I/Os | 444 |
| Total RAM Bits | 276480 |
| Max System Performance | 272MHz |
| Core Supply Voltage | 1.5V |
| Process Technology | 130nm, 7-layer metal (6 copper), Flash-based CMOS |
| Package Type | FBGA-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | 0°C to 70°C (per DigChip listing) |
| Configuration | Non-volatile Flash (single-chip, live at power-up) |
| Programming | In-system programmable (ISP) via JTAG |
| RoHS 상태 | RoHS non-compliant (per DigChip listing) |
| Lead-Free Status | Contains lead (per DigChip listing) |
A3PE1500-1FG676I fbga-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) 핀 구성 가이드
A3PE1500-1FG676I(fbga-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE1500-1FG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE1500-1FG676I 적합 용도: 6 애플리케이션s: Communications Infrastructure & Networking, Industrial Automation & Motor Control, Medical Electronics & Diagnostic Devices, Aerospace & Defense / Secure Systems, Automotive Connectivity & Infotainment, IoT & Edge Computing.
Communications Infrastructure & Networking
The A3PE1500-1FG676I suits communications line cards, Ethernet switches, and small-cell baseband processing. Its 444 user I/Os connect to parallel DDR SRAM, network processors, and PHY devices. The flash-based fabric provides instant-on configuration, reducing system startup time for carrier equipment; 1.5M gates are enough for packet parsing, queue management, and custom MAC logic. The 276,480 bits of true dual-port SRAM support FIFOs and header buffers without external memory. Its 272MHz system performance meets typical 100M/1G Ethernet control-plane tasks. In-system programming permits field updates via JTAG. Recommended companion ProASIC3E parts include lower-density A3P600-1FGG256 for I/O expansion and higher-density A3PE3000-2FG484 for aggregate switching logic.
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Industrial Automation & Motor Control
In industrial PLCs, servo drives, and robot controllers, the A3PE1500-1FG676I implements high-speed encoder interfaces, PWM generation, and safety logic. The 1.5V core and 130nm flash process keep dynamic power moderate, while 444 I/Os allow parallel connection to ADCs, DACs, and fieldbus ASICs. The live-at-power-up feature is valuable on factory floors where a delayed boot from external configuration memory is unacceptable. The 1.5M-gate capacity can host a soft-core MCU and custom motion-control peripherals. Designers should confirm the temperature grade with the datasheet because the I-suffix is intended for industrial use. Recommended companion parts include A3P600-1FGG256 for slave I/O boards and M1AFS1500-1FG676 for systems needing an integrated analog front end.
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Medical Electronics & Diagnostic Devices
For diagnostic imaging, patient monitors, and portable medical instruments, the A3PE1500-1FG676I offers determinism and security. Flash configuration prevents accidental bitstream exposure, aiding intellectual-property protection. The 444 I/Os interface with medical ADCs, displays, and communication bridges; the 1.5M gates handle imaging pipelines and control logic. Its instant-on behavior supports safety-critical power-up sequences. Although not AEC-Q100 (not applicable), the device can be qualified by the medical OEM. Use the industrial temperature grade option when needed. Recommended companion FPGAs include A3P250-1VQG100T for low-power sensor front ends and A3P400-1PQG208I for handheld control modules.
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Aerospace & Defense / Secure Systems
In avionics, UAVs, and secure communication systems, the A3PE1500-1FG676I's non-volatile flash fabric supports secure boot and tamper-resistant designs. M1 variants provide enhanced screening for defense programs. 444 user I/Os connect to sensors, serializers, and encrypted data links; 1.5M gates are ample for crypto-cores, telemetry, and interface bridging. The 272MHz -1 speed grade balances performance and power. The 676-ball FBGA with 1mm pitch suits rugged boards with adequate thermal vias. Designers should evaluate the M1A3PE1500-1FG676I for military temperature ranges. Recommended companion devices include M1AFS1500-2FGG676 for mixed-signal SoC tasks and A3PE3000-1FGG484I for higher gate-count processing.
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Automotive Connectivity & Infotainment
The A3PE1500-1FG676I can be used in automotive gateway, telematics, and infotainment systems that need fast logic and flexible I/O without ASIC NRE. The flash FPGA is live at power-up, helping cameras and displays initialize quickly. Its 444 I/Os support LVDS, MIPI (with external SerDes), and parallel RGB interfaces; 1.5M gates host video scaling, protocol conversion, and gateway routing logic. Although the base part is not AEC-Q100 qualified, for harsh environments designers should select qualified or screened variants based on the datasheet. The 1.5V core reduces switching noise in dense boards. Recommended companion FPGAs include A3P250-2FGG144I for sensor fusion and A3P400-2FGG144 for display bridging.
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IoT & Edge Computing
For smart-home hubs, industrial IoT gateways, and edge AI pre-processing, the A3PE1500-1FG676I provides reconfigurable logic with minimal power overhead. The non-volatile flash configuration eliminates boot flash and reduces BOM. 1.5M gates can implement multiple protocol interfaces (Ethernet, CAN, UART, SPI), sensor aggregation, and lightweight machine-learning inference preprocessing. 276,480 bits of true dual-port SRAM buffer streaming data. Live-at-power-up enables sub-millisecond wakeup and deterministic I/O state. When power is critical, the 1.5V core and 130nm process help. Recommended companion parts include A3P060-1VQ100T for simple sensor nodes and A3P250-2VQG100 for edge gateway glue logic.
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추천 제품 요약
엔지니어링 참조 데이터: A3PE1500-1FG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE1500-1FGG676I | A3PE1500-FG676I | A3PE1500-1FG676 | A3PE1500-2FGG676 | M1A3PE1500-1FG676I |
|---|---|---|---|---|---|---|
| Package | FBGA-676 | FBGA-676 (same) | FBGA-676 (same) | FBGA-676 (same) | FBGA-676 (same) | FBGA-676 (same) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5M | 1.5M | 1.5M | 1.5M | 1.5M | 1.5M |
| User I/O Count | 444 | 444 | 444 | 444 | 444 | 444 |
| Total RAM Bits | 276480 | 276480 | 276480 | 276480 | 276480 | 276480 |
| Max System Performance | 272MHz | 272MHz | 231MHz | 272MHz | 350MHz | 272MHz |
| Temperature Grade | Industrial (I-suffix; one listing 0-70C) | Industrial (I-suffix) | Industrial (I-suffix) | Commercial | Commercial | Military/Defense screening |
| RoHS Compliance | Non-compliant (contains lead) | Compliant (green package) | Non-compliant | Non-compliant | Compliant (green package) | Unknown |
주요 차별점
- Higher -1 speed grade than base ProASIC3E parts (vs A3PE1500-FG676I)
- Industrial I-suffix option not available on all variants (vs A3PE1500-1FG676)
- Non-green FG package for cost-sensitive legacy designs (vs A3PE1500-1FGG676I)
설계 노트
The A3PE1500-1FG676I operates from a 1.5V core supply with multiple VCC and ground balls. Decouple each VCC/BGx ball with a 0.1uF ceramic capacitor placed as close as possible to the ball, and add a 10uF bulk capacitor near one corner of the FPGA. If multiple I/O supply voltages are used, confirm sequencing requirements in the ProASIC3E datasheet to avoid latch-up or excessive current.
Estimated: for an FPGA dissipating 1.5W in the FBGA-676 package, the junction rise above ambient is theta_JA multiplied by power. Typical 27x27mm BGA theta_JA values range from 10-20C/W with airflow, so junction temperature could rise 15-30C. Add thermal vias under the exposed pad, use a solid ground plane, and provide airflow or a heatsink for high-utilization designs.
The 676-ball FBGA has 1mm ball pitch, requiring careful fanout. Use a 4-layer or 6-layer stackup with blind/buried vias if needed for dense routing. Keep high-speed I/O traces length-matched and impedance-controlled, and place decoupling capacitors on the bottom side directly opposite the FPGA's power balls when possible.
Because this is a flash-based FPGA, no external configuration memory is required. Do not leave the JTAG/ISP pins unconnected if field programming is expected; bring out TCK, TMS, TDI, TDO, and TRST to a header. Also, verify the temperature grade with the final Microchip datasheet—the I-suffix is normally industrial, but at least one distributor listing shows 0-70C for this part.
규정 준수 정보
Per DigChip listing, A3PE1500-1FG676I contains lead and is RoHS non-compliant. The FGG676 variants are green/RoHS-compliant. AEC-Q100 not applicable for this FPGA family.
