A3PE1500-2FGG676 - ProASIC3E FPGA 1.5M Gates | Microchip
MPN: A3PE1500-2FGG676 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $54.32 | $54.32 |
| 10 | $49.85 | $498.50 |
| 100 | $44.1 | $4,410.00 |
| 500 | $39.2 | $19,600.00 |
| 1,000 | $33.5 | $33,500.00 |
Drop-in alternatives for A3PE1500-2FGG676 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3PE1500-2FGG676I
β Drop-Inπ Reference alternative (not in catalog)
A3PE1500-1FGG676I
β Drop-Inβ In Stock
$59.6 / Unit
View Datasheet βA3PE1500-FGG676I
β Drop-Inπ Reference alternative (not in catalog)
A3PE1500-FG676I
β Drop-Inβ In Stock
$60.2 / Unit
View Datasheet βA3PE1500-FGG676
β Drop-Inπ Reference alternative (not in catalog)
M1A3PE1500-1FGG676I
β Drop-Inπ Reference alternative (not in catalog)
M1A3PE1500-1FG676I
β Drop-Inπ Reference alternative (not in catalog)
M1A3PE1500-1FGG676
β Drop-Inπ Reference alternative (not in catalog)
A3PE1500-2FGG676 Maximum Ratings & Electrical Characteristics
| Product Family | ProASIC3E |
| System Gates | 1,500,000 |
| Logic Elements | 16KLEs |
| User I/O | 444 |
| Total RAM Bits | 276,480 |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Operating Temperature | 0Β°C to 85Β°C (TJ) |
| Speed Grade | -2 |
| System Performance | 310 MHz |
| Process Technology | 130 nm |
| Package | 676-BGA (FBGA) |
| Mounting Type | Surface Mount |
| Terminal Pitch | 1.000 mm |
| Configuration | Flash-based, reprogrammable |
| Security | AES-based design security |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
A3PE1500-2FGG676 676-bga (fbga) Pin Configuration Guide
Complete pinout information for A3PE1500-2FGG676 (676-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE1500-2FGG676.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE1500-2FGG676 is suitable for 6 applications: Communications Infrastructure, Industrial Automation, Aerospace and Defense, Medical Electronics, Data Processing and Storage, IoT Edge Computing.
Communications Infrastructure
The A3PE1500-2FGG676 fits communications line cards, routers, and Ethernet switches that require wide parallel interfaces, packet buffering, and deterministic processing. Its 444 user I/O support multiple parallel buses and control-plane bridging, while the 276,480 bits of dual-port RAM handle small frame buffers and FIFO queues. The 1.5M-gate fabric is sufficient for packet classification, CRC generation, and traffic policing logic. Flash-based instant-on is advantageous in carrier equipment that must begin forwarding shortly after power is applied. Designers can use the high I/O count to attach physical-layer transceivers, PHY devices, and memory subsystems without external CPLD glue logic.
Recommended
Industrial Automation
In industrial control, PLCs, motor drives, and vision systems benefit from the ProASIC3E's deterministic I/O and flash reprogrammability. The A3PE1500-2FGG676 can implement high-speed encoder interfaces, PWM generation, and parallel sensor acquisition with stable timing that is not subject to software jitter. Its 310 MHz system performance supports fast combinational logic, and the 1.5M gates allow multiple control loops to run in parallel hardware. The commercial temperature range suits indoor cabinets, while the industrial I variant is recommended for washdown or unheated areas. Flash configuration also enables field upgrades through JTAG without changing system boot firmware.
Recommended
Aerospace and Defense
The A3PE1500-2FGG676 is attractive for avionics data concentrators, radar preprocessing, and secure communication modules because it is a single-chip flash FPGA. Its non-volatile configuration prevents bitstream loss after power transients and provides AES-based design security to protect IP. The 676-BGA package with 444 I/O supports wide sensor busses, MIL-STD-1553 interfaces, or parallel DSP connections. For elevated temperature environments, the -2FGG676I or -1FGG676I variants are better choices. Designers should screen devices for environmental compliance and consider conformal coating because the package is a standard commercial FBGA.
Recommended
Medical Electronics
Medical imaging and patient monitoring equipment require FPGAs that provide deterministic real-time processing and long-term availability. The A3PE1500-2FGG676 can handle ultrasound beamforming data paths, optical coherence tomography engines, or parallel sensor multiplexing. Its 276,480 bits of RAM are useful for scan-line buffers, and the 444 I/O enable connection to high-speed ADCs, displays, and motor controllers. Flash-based configuration is particularly beneficial for medical devices where secure, field-reliable boot is critical. Designers should follow IEC 60601-1 EMC guidance but the device itself does not include medical certification; system-level compliance is required at the equipment level.
Recommended
Data Processing and Storage
The A3PE1500-2FGG676 is well suited to storage controllers, NVMe bridges, and data aggregation cards where wide parallel datapaths and buffering are common. Its 1.5M gates can implement DMA engines, memory-mapped register blocks, and protocol control state machines. The embedded 276,480 bits of true dual-port RAM allow asynchronous clock-domain crossing FIFOs, which are essential in mixed-clock storage designs. The 444 I/O provide enough pins for a DDR2/DDR3 bus, multiple SPI/I2C interfaces, and status LEDs. Flash-based configuration reduces boot code complexity and improves system reliability in always-on storage appliances.
Recommended
IoT Edge Computing
IoT gateways and edge processors need energy-efficient, secure logic that can bridge sensors, radios, and external hosts. The A3PE1500-2FGG676 provides enough gates to implement protocol conversion, sensor fusion, and lightweight deep-learning pre-processing in programmable hardware. Flash configuration makes the device ready instantly on power-up, which is important for low-power edge nodes. The commercial temperature range fits residential and indoor industrial IoT. With 444 I/O, the FPGA can interface to multiple ADC/DAC devices, displays, and radios while leaving room for future flexibility. Use the M1 variant when IP security is critical for edge inference models.
Recommended
Recommended Products Summary
Engineering reference data for A3PE1500-2FGG676 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE1500-2FGG676I | A3PE1500-1FGG676I | A3PE1500-FG676I | M1A3PE1500-1FGG676I | A3PE1500-FGG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) | 676-BGA (FBGA) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Device Family | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3E | ProASIC3E M1 (secure) | ProASIC3E |
| Speed Grade | -2 | -2 | -1 | [DATA_NEEDED] | -1 | [DATA_NEEDED] |
| Operating Temperature | 0Β°C to 85Β°C (TJ) | -40Β°C to 100Β°C (TJ) | -40Β°C to 100Β°C (TJ) | -40Β°C to 100Β°C (TJ) | -40Β°C to 100Β°C (TJ) | -40Β°C to 100Β°C (TJ) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Total RAM Bits | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 |
| User I/O | 444 | 444 | 444 | 444 | 444 | 444 |
| Core Supply Voltage | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V | 1.425V to 1.575V |
Key Differentiators
- Lower-cost commercial temperature option (vs A3PE1500-2FGG676I)
- Higher speed grade for demanding datapaths (vs A3PE1500-1FGG676I)
- Standard security without M1 premium (vs M1A3PE1500-1FGG676I)
Design Notes
The A3PE1500-2FGG676 core supply must be maintained between 1.425V and 1.575V. Use a dedicated 1.5V regulator capable of the FPGA's estimated current demand, and place at least one 0.1uF ceramic capacitor near every VCC and VCCPLL ball. A 4.7uF bulk capacitor per power ball group is recommended. Monitor the core voltage with a sense trace and avoid sharing the 1.5V rail with high-current switching loads. Estimated: total core current can approach several amperes in a fully utilized 1.5M-gate design, so size the regulator accordingly.
The 676-ball FBGA has 1.0mm ball pitch. Use microvias or via-in-pad to escape inner balls when routing to inner layers. For power and ground balls, connect directly to the internal plane with a low-impedance via. The exposed center pad should be connected to the ground plane for mechanical reliability, though this package is primarily a ball-attach part. Follow Microchip's layout guidelines for PLL pins, keeping VCCPLL traces short and shielded by ground pour.
Do not leave I/O pins floating in production designs; assign pull-ups or drive them from logic. Because the ProASIC3E is flash-based, remember that the device is secure by default; if you need to read back or update configuration, understand the JTAG security lock options and fuse behavior. Always program the device through Libero SoC and verify the checksum. Also ensure the correct bank voltage is applied before configuring I/O standards - applying 3.3V to a bank set to 2.5V can damage the output drivers.
Compliance Information
Digchip cross-reference listing states Lead Free Status: Lead Free and RoHS Status: RoHS Compliant. AEC-Q100 is not applicable to this FPGA product family. Additional REACH/halogen/conflict mineral information was not present in the verified web data.
