EP1S30F780C6 - Stratix FPGA, 32470 LEs, 597 I/O, FCBGA-780 | Altera
MPN: EP1S30F780C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1337.09 | $1,337.09 |
| 10 | $1295 | $12,950.00 |
| 100 | $1230 | $123,000.00 |
| 500 | $1175 | $587,500.00 |
| 1,000 | $1125 | $1,125,000.00 |
Drop-in alternatives for EP1S30F780C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F780C7
✅ Drop-In✓ In Stock
$135 / Unit
View Datasheet →EP1S30F780I6
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$1320 / Unit
View Datasheet →EP1S30F780C5
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S25F780C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$791.02 / Unit
View Datasheet →EP1S20F780C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1S30F780C6 Maximum Ratings & Electrical Characteristics
| Series | Stratix (1st Generation) |
| Family | Stratix |
| Logic Elements (LEs) | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Maximum User I/Os | 597 |
| Process Technology | 0.13 μm all-layer copper SRAM |
| Core Voltage | 1.5 V |
| DSP Blocks | Up to 28 |
| Embedded Multipliers | Up to 224 (9-bit × 9-bit) |
| On-chip Memory | TriMatrix (M512, M4K, M-RAM blocks) |
| Package | 780-ball FCBGA (FineLine BGA), 29 mm × 29 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Configuration | SRAM-based (passive serial, fast passive parallel, JTAG) |
| Speed Grade | C6 (commercial, speed grade 6) |
EP1S30F780C6 780-ball fcbga (fineline bga), 29 mm × 29 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S30F780C6 (780-ball fcbga (fineline bga), 29 mm × 29 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F780C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F780C6 is suitable for 6 applications: Software Defined Radio (SDR) Baseband, Telecom Line Card Protocol Bridging, ASIC Prototyping, Industrial Imaging and Video Processing, Test and Measurement Instrumentation, Military / Aerospace Signal Processing (legacy).
Software Defined Radio (SDR) Baseband
The EP1S30F780C6 is well suited for SDR baseband signal processing because its 28 DSP blocks and 224 embedded 9-bit × 9-bit multipliers sustain the multiply-accumulate rates needed for FFT, FIR filtering, and channelization. The 32,470 logic elements fit complex baseband datapaths including symbol mapping, scrambling, and turbo decoding on a single die. Designers pair the FPGA with high-speed ADCs/DACs and external ZBT or DDR memory to stream I/Q samples in and out. The 597 user I/Os accept multiple parallel data buses plus LVDS links to RF front ends, which is exactly the kind of mixed signal aggregation the original Stratix family was designed for.
Recommended
Telecom Line Card Protocol Bridging
In telecom line cards the EP1S30F780C6 acts as a protocol bridge between framer/MAC ASICs, network processors, and backplane SERDES. The TriMatrix memory provides the packet buffers and lookup tables required for cell/packet reassembly, while the DSP blocks accelerate header parsing and checksum offload. Its 597 I/Os accommodate UTOPIA, POS-PHY, and SPI-4.2 buses without external muxing. The 1.5 V 0.13 μm process delivers low enough power to fit into dense line-card thermal budgets of the era.
Recommended
ASIC Prototyping
Engineers used the EP1S30F780C6 as an ASIC prototype vehicle because the 32,470 LEs and 597 I/Os roughly mapped to mid-complexity ASIC netlists. The FPGA let design teams validate architecture, software drivers, and system timing months before mask tape-out, dramatically reducing ASIC re-spin risk. Fast Quartus II turnaround let multiple RTL iterations run in a single day. The 780-ball FCBGA exposes enough I/O to map DDR, PCI, and proprietary bus interfaces concurrently, which is critical for full-chip bring-up.
Recommended
Industrial Imaging and Video Processing
The EP1S30F780C6 supports multi-channel video pipelines including image scaling, color-space conversion, and real-time edge detection at full frame rate. The 597 user I/Os accept Camera Link, LVDS, and parallel CMOS sensor interfaces, and the on-chip TriMatrix RAM holds line buffers for temporal filtering. Designers target ~150 MHz pixel clocks on a C6 speed grade and use the DSP blocks for convolution and 2D filter kernels. The 780-ball FCBGA package supplies the thermal headroom needed for sustained 1A core draw under continuous imaging workloads.
Recommended
Test and Measurement Instrumentation
In ATE and bench instrumentation the EP1S30F780C6 implements pattern generation, response capture, and signal conditioning in a single programmable fabric. The 597 I/Os accept multi-lane LVDS from DUTs, while the DSP blocks compute FFTs, correlations, and statistical reductions in real time. The commercial temperature grade is sufficient for lab environments, and the 1 mm pitch FCBGA accommodates controlled-impedance PCB stack-ups used in high-speed test fixtures. Engineers also use it for protocol-aware logic analyzers where density matters more than raw clock rate.
Recommended
Military / Aerospace Signal Processing (legacy)
Although the EP1S30F780C6 is commercial-grade (0 °C to 85 °C), it served in non-flight, lab-grade signal processing for defense programs where the density of original Stratix was needed for radar preprocessing and EW simulations. The industrial-grade cousin EP1S30F780I6 extends the temperature envelope to -40 °C to 100 °C for harsher environments. The high DSP block count accelerates pulse-Doppler processing, while 597 I/Os ingest parallel ADC banks from antenna arrays. Designers should note that Altera/Intel recommends newer radiation-tolerant parts for actual flight hardware.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F780C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F780C7 | EP1S30F780I6 | EP1S30F780C5 | EP1S25F780C6 | EP1S20F780C6 |
|---|---|---|---|---|---|---|
| Package | 780-ball FCBGA (29x29 mm, 1 mm pitch) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) | 780-ball FCBGA (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) | Stratix (1st Gen) |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | ~25,660 | ~18,460 |
| Speed Grade | C6 | C7 (faster) | I6 (industrial temp) | C5 (slower) | C6 | C6 |
| Temperature Grade | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) | Commercial (0°C to 85°C) |
| User I/Os | 597 | 597 | 597 | 597 | ~597 (same package) | ~597 (same package) |
| DSP Blocks | Up to 28 (224 9x9 multipliers) | Up to 28 | Up to 28 | Up to 28 | Up to 22 | Up to 17 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Higher density than EP1S25F780C6 in the same footprint (vs EP1S25F780C6)
- Higher logic capacity than EP1S20F780C6 in the same package (vs EP1S20F780C6)
- Commercial temperature grade; industrial variant available in same package (vs EP1S30F780I6)
Design Notes
Estimated: Stratix devices in the EP1S30 family typically draw 1–2 A on the 1.5 V VCCINT rail at full logic utilization, plus several hundred mA on the VCCIO rails for the I/O banks. Decouple each VCCINT pin with a 0.1 µF X7R plus a 10 µF bulk capacitor placed as close as physically possible on the inner PCB layers. Use a dedicated linear or DC-DC regulator with output accuracy ≤3% to satisfy Altera's VCCINT tolerance; an LDO such as the TI TPS75533 (with proper 1.5 V tap) is recommended for low-noise designs.
Estimated: at full utilization the EP1S30F780C6 dissipates approximately 3–5 W, and the 780-ball FCBGA exposes only a small fraction for heatsinking. Theta_JA on a standard 4-layer JEDEC test board is approximately 12–15 °C/W, so junction rise over ambient is in the 40–75 °C range. Use the largest practical ground pad under the package and 2 oz copper pours on outer layers to spread heat. If your application runs in a sealed enclosure, derate ambient by at least 10 °C.
The 780-ball FCBGA uses 1 mm pitch, which requires laser-drilled or mechanically drilled microvias on a 1–2–1 or 1–2–2–1 stack-up. Per Altera's package guidelines, escape each ball to an inner layer via-in-pad or dog-bone fanout, and keep the BGA area free of signal traces for at least 2 mm to allow rework. Match differential pair lengths to within 150 mil for LVDS links, and route all high-speed clocks on inner stripline layers adjacent to a continuous reference plane.
Stratix SRAM FPGAs lose configuration on power-down; never assume the device boots into a known state without a configuration PROM or system controller. Use an Altera EPC16 or EPC8 configuration device, and tie nCONFIG, nSTATUS, and CONF_DONE per the Stratix handbook to allow JTAG recovery. Avoid driving I/O banks before VCCIO is stable — the I/Os are not hot-swappable and can back-power the core through ESD clamp diodes.
Compliance Information
RoHS/REACH/lead-free status for the original EP1S30F780C6 die is not stated in the verified web data; users must confirm via the manufacturer's official declaration. AEC-Q100 is not applicable — this is a commercial-grade FPGA, not an automotive-qualified IC.
