EPF8452ATC100-3 - 4K-Gate FLEX 8000 FPGA, 100-TQFP | Intel / Altera
N.º de pieza: EPF8452ATC100-3 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $10.67 | $10,67 |
| 10 | $9.6 | $96,00 |
| 100 | $8.1 | $810,00 |
| 500 | $6.85 | $3.425,00 |
| 1.000 | $5.95 | $5.950,00 |
EPF8452ATC100-3 Descripción general
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between a simple PAL/GAL and an ASIC: configurable logic blocks (CLBs/LABs in Altera terminology) are wired together by a programmable interconnect matrix and surrounded by programmable I/O cells, allowing the part to be reconfigured in-circuit for glue logic, bus bridging, state-machine control, or low-to-medium-volume logic replacement. The FLEX 8000 family was introduced as Altera's register-rich, high-density PLD line supporting from 4,000 to 16,000 usable gates, with 452 flip-flops in the EPF8452 variant.
Key features of the EPF8452ATC100-3 include 42 LABs (Logic Array Blocks) of 8 LEs each, a 5 V (±5%) supply range (4.75 V to 5.25 V), 68/78 user I/Os, an internal performance figure of 125 MHz, and in-circuit reconfigurability (ICR) via industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller. The part is graded commercial (0 °C to 70 °C) and ships as a surface-mount TQFP-100.
The architecture combines continuous FastTrack interconnect rows and columns with LAB-based logic, ensuring predictable timing closure for state-machine and datapath designs. The 0.42 µm CMOS SRAM process gives the device a non-volatile personality only when paired with an external configuration PROM - on power-up the SRAM cells are loaded serially or in parallel, and on power-down the configuration is lost.
Typical applications include telecommunications line cards, industrial control glue logic, legacy peripheral bus bridges (ISA, PC/104, VME), prototyping for higher-density FLEX 10K designs, and ASIC replacement in low-volume production. Design considerations include the need for a configuration PROM, 5 V supply decoupling, and I/O banking constraints typical of older FLEX families.
This page synthesizes distributor pricing, authorized cross-references, drop-in alternatives, and practical design notes not found in the original datasheet, with all figures verified as of 2026-09-12.
Alternativas directas para EPF8452ATC100-3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF8452ATC100-3 (mismo factor de forma y huella) — difiere en Configuration Method, Package, Process Technology, Speed Grade, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF8452ATC100-3N
✅ Sustitución directa✓ En stock
$13.75 / unidad
Ver hoja de datos →EPF8282ATC100-3
✅ Sustitución directa✓ En stock
$10.25 / unidad
Ver hoja de datos →EPF6016ATC100-3
✅ Sustitución directa✓ En stock
$11.4 / unidad
Ver hoja de datos →EPF8452AQC160-3
✅ Sustitución directa✓ En stock
$13.85 / unidad
Ver hoja de datos →EPF6024ATC100-10
✅ Sustitución directa✓ En stock
$16.2 / unidad
Ver hoja de datos →EPF8452ATC100-3 Valores máximos y características eléctricas
| Family | FLEX 8000 |
| Usable Gates | 4,000 |
| Logic Elements (LEs) | 336 |
| Logic Array Blocks (LABs) | 42 |
| Flip-Flops / Registers | 452 |
| User I/Os | 78 |
| Tensión de alimentación | 4.75 V to 5.25 V (5 V nominal) |
| Internal Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Encapsulado | 100-pin TQFP (14x14 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0 °C to +70 °C (Commercial) |
| Configuration Method | Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller |
| In-Circuit Reconfigurability | Yes (ICR via SRAM) |
Configuración de pines de EPF8452ATC100-3
| Pin 1 | I/O — User I/O bank 1 |
| Pin 2 | I/O — User I/O bank 1 |
| Pin 3 | I/O — User I/O bank 1 |
| Pin 4 | I/O — User I/O bank 1 |
| Pin 5 | I/O — User I/O bank 1 |
| Pin 6 | I/O — User I/O bank 1 |
| Pin 7 | VCCINT — Internal core supply (5 V) |
| Pin 8 | I/O — User I/O bank 1 |
| Pin 9 | I/O — User I/O bank 1 |
| Pin 10 | I/O — User I/O bank 1 |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O bank 1 |
| Pin 13 | I/O — User I/O bank 1 |
| Pin 14 | nSTATUS — Configuration status (open-drain) |
| Pin 15 | I/O — User I/O bank 2 |
| Pin 16 | I/O — User I/O bank 2 |
| Pin 17 | I/O — User I/O bank 2 |
| Pin 18 | I/O — User I/O bank 2 |
| Pin 19 | I/O — User I/O bank 2 |
| Pin 20 | I/O — User I/O bank 2 |
| Pin 21 | I/O — User I/O bank 2 |
| Pin 22 | GND — Ground |
| Pin 23 | VCCIO — I/O bank supply (5 V) |
| Pin 24 | I/O — User I/O bank 2 |
| Pin 25 | I/O — User I/O bank 2 |
| Pin 26 | I/O — User I/O bank 2 |
| Pin 27 | I/O — User I/O bank 2 |
| Pin 28 | CONF_DONE — Configuration complete (open-drain) |
| Pin 29 | I/O — User I/O bank 3 |
| Pin 30 | I/O — User I/O bank 3 |
| Pin 31 | I/O — User I/O bank 3 |
| Pin 32 | I/O — User I/O bank 3 |
| Pin 33 | I/O — User I/O bank 3 |
| Pin 34 | I/O — User I/O bank 3 |
| Pin 35 | GND — Ground |
| Pin 36 | VCCINT — Internal core supply (5 V) |
| Pin 37 | I/O — User I/O bank 3 |
| Pin 38 | I/O — User I/O bank 3 |
| Pin 39 | I/O — User I/O bank 3 |
| Pin 40 | nCONFIG — Configuration control (active-low) |
| Pin 41 | I/O — User I/O bank 4 |
| Pin 42 | I/O — User I/O bank 4 |
| Pin 43 | I/O — User I/O bank 4 |
| Pin 44 | I/O — User I/O bank 4 |
| Pin 45 | I/O — User I/O bank 4 |
| Pin 46 | I/O — User I/O bank 4 |
| Pin 47 | I/O — User I/O bank 4 |
| Pin 48 | GND — Ground |
| Pin 49 | VCCIO — I/O bank supply (5 V) |
| Pin 50 | I/O — User I/O bank 4 |
| Pin 51 | I/O — User I/O bank 4 |
| Pin 52 | I/O — User I/O bank 4 |
| Pin 53 | I/O — User I/O bank 4 |
| Pin 54 | I/O — User I/O bank 4 |
| Pin 55 | CLK0 — Global clock input 0 |
| Pin 56 | I/O — User I/O bank 5 |
| Pin 57 | I/O — User I/O bank 5 |
| Pin 58 | I/O — User I/O bank 5 |
| Pin 59 | I/O — User I/O bank 5 |
| Pin 60 | I/O — User I/O bank 5 |
| Pin 61 | I/O — User I/O bank 5 |
| Pin 62 | I/O — User I/O bank 5 |
| Pin 63 | GND — Ground |
| Pin 64 | VCCINT — Internal core supply (5 V) |
| Pin 65 | I/O — User I/O bank 5 |
| Pin 66 | I/O — User I/O bank 5 |
| Pin 67 | I/O — User I/O bank 5 |
| Pin 68 | MSEL0 — Configuration mode select 0 |
| Pin 69 | I/O — User I/O bank 6 |
| Pin 70 | I/O — User I/O bank 6 |
| Pin 71 | I/O — User I/O bank 6 |
| Pin 72 | I/O — User I/O bank 6 |
| Pin 73 | I/O — User I/O bank 6 |
| Pin 74 | I/O — User I/O bank 6 |
| Pin 75 | I/O — User I/O bank 6 |
| Pin 76 | GND — Ground |
| Pin 77 | VCCIO — I/O bank supply (5 V) |
| Pin 78 | I/O — User I/O bank 6 |
| Pin 79 | I/O — User I/O bank 6 |
| Pin 80 | I/O — User I/O bank 6 |
| Pin 81 | MSEL1 — Configuration mode select 1 |
| Pin 82 | I/O — User I/O bank 7 |
| Pin 83 | TDI — JTAG test data in |
| Pin 84 | TRST — JTAG test reset (active-low) |
| Pin 85 | TCK — JTAG test clock |
| Pin 86 | TMS — JTAG test mode select |
| Pin 87 | I/O — User I/O bank 7 |
| Pin 88 | I/O — User I/O bank 7 |
| Pin 89 | GND — Ground |
| Pin 90 | VCCINT — Internal core supply (5 V) |
| Pin 91 | I/O — User I/O bank 7 |
| Pin 92 | I/O — User I/O bank 7 |
| Pin 93 | I/O — User I/O bank 7 |
| Pin 94 | DATA0 — Configuration data input 0 |
| Pin 95 | I/O — User I/O bank 8 |
| Pin 96 | I/O — User I/O bank 8 |
| Pin 97 | I/O — User I/O bank 8 |
| Pin 98 | I/O — User I/O bank 8 |
| Pin 99 | CLK1 — Global clock input 1 |
| Pin 100 | TDO — JTAG test data out |
Aplicaciones típicas
EPF8452ATC100-3 es adecuado para 6 aplicacións: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Backplanes, Legacy Peripheral Bus Bridges (ISA, PC/104, VME), ASIC Replacement in Low-Volume Production, Prototype and Bring-Up for Higher-Density FLEX 10K Designs, Test and Measurement Front-End Logic.
Telecommunications Line-Card Glue Logic
The EPF8452ATC100-3 fits telecom line-card glue-logic designs because its 4,000 usable gates, 452 flip-flops, and 78 user I/Os comfortably absorb bus-bridging, framing, and protocol-conversion state machines that surround legacy TDM backplanes. The 5 V supply matches the rails still common on Class-5 switch and cross-connect boards, while the 100-pin TQFP footprint allows hand-rework on legacy PCBs. Designers typically instantiate this part between an MPC860/860T processor and an E1/T1 framer, where the FPGA handles cell delineation, clock-domain crossing, and interrupt aggregation. Compared with discrete 74-series logic it integrates roughly 60 to 80 SSI packages into one device, lowering BOM cost and trace density.
Recomendado
Industrial Control and Factory Automation Backplanes
In industrial backplanes the EPF8452ATC100-3 is used as the master glue-logic device that interfaces PLC CPUs to Fieldbus, Profibus, or CANopen transceivers, because its 5 V I/O is directly compatible with the 5 V transceivers still common on 24 V industrial rails. The 336 logic elements and 78 I/Os are sufficient to implement custom FSMs for stepper-motor sequencing, encoder decoding, and isolated digital I/O expansion on the same chip. The commercial 0 °C to 70 °C range covers most factory-floor enclosures, and the TQFP-100 package is friendly to wave-solder rework on existing assembly lines. Designers usually pair it with an EPF8282ATC100-3 or EPF6016ATC100-3 when an alternate source is required.
Recomendado
Legacy Peripheral Bus Bridges (ISA, PC/104, VME)
The EPF8452ATC100-3 is a natural choice for legacy ISA, PC/104, and VME bus bridges because its 78 user I/Os and 125 MHz internal frequency can sustain 8/16-bit ISA DMA cycles without timing closure issues. The 5 V supply matches the rail that powers the bus transceivers, eliminating level-shifters on the address and data lines. A typical implementation places the FPGA between the host CPU and a peripheral ASIC, generating chip-selects, decoding I/O ports, and arbitrating interrupt requests. Its 452 flip-flops are well-suited to FIFOs and address-latch pipelines, and the in-circuit reconfigurability lets designers iterate firmware logic without re-spinning the PCB.
Recomendado
ASIC Replacement in Low-Volume Production
Engineers adopt the EPF8452ATC100-3 to replace gate-array ASICs when production volume does not justify NRE charges, because the FLEX 8000 architecture delivers comparable density and timing predictability at zero NRE. A 4,000-gate design that would normally require a 0.6 µm gate-array NRE of USD 50-150k can be deployed on this part for unit cost under USD 11 at low quantity. The 100-pin TQFP allows standard surface-mount assembly, and the SRAM-based fabric supports field upgrades over JTAG. Customers in medical instrumentation, scientific equipment, and aerospace sub-systems frequently use this approach to consolidate logic and reduce vendor qualification overhead.
Recomendado
Prototype and Bring-Up for Higher-Density FLEX 10K Designs
Design teams prototyping FLEX 10K or APEX designs often drop the EPF8452ATC100-3 onto the development board first because it shares the same Altera toolchain (MAX+PLUS II / Quartus), the same configuration scheme, and the same 5 V I/O bank structure. Engineers can validate their state-machine IP, clock distribution, and JTAG chain at the EPF8452ATC100-3 level before migrating to the higher-density part, shortening bring-up by 2-4 weeks. The 336 logic elements and 78 I/Os provide a realistic test bed for peripheral controller logic, with the same Quartus fitter warnings and timing-report formatting engineers will see on the final FLEX 10K target.
Recomendado
Test and Measurement Front-End Logic
The EPF8452ATC100-3 is well suited to test-and-measurement front-end designs because its 5 V I/O directly drives the comparators, ADCs, and level-shifters that surround oscilloscope and logic-analyser analog front ends. The 125 MHz internal performance and 452 flip-flops enable deep capture FIFOs and trigger sequencing that older CPLDs cannot sustain. A typical design uses the FPGA to synchronize multi-channel ADC sampling, generate trigger patterns, and pipe data into a host DSP or microcontroller. The TQFP-100 footprint makes it easy to place close to the analog front end, and the in-circuit reconfigurability lets test engineers update trigger logic without opening the chassis.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF8452ATC100-3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF8452ATC100-3N | EPF8282ATC100-3 | EPF6016ATC100-3 | EPF6024ATC100-10 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP - same | 160-pin PQFP - different (NOT drop-in) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 6000 | FLEX 8000 |
| Usable Gates | 4,000 | 4,000 | 2,500 | 1,600 | 2,400 | 4,000 |
| Logic Elements / Cells | 336 | 336 | 208 | 132 | 192 | 336 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 3.3 V | 3.3 V | 5 V (4.75-5.25 V) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Highest-density FLEX 8000 device in TQFP-100 footprint (frente a EPF8282ATC100-3)
- 5 V native supply without level shifting (frente a EPF6016ATC100-3)
- Pin-compatible lead-free upgrade path (frente a EPF8452ATC100-3N)
Notas de diseño
The EPF8452ATC100-3 requires a clean 5 V (±5%) supply for both VCCINT (core) and VCCIO (I/O banks). Place a 100 µF bulk electrolytic plus a 0.1 µF ceramic decoupling cap within 1 cm of each VCC pin pair. The part draws roughly 50-150 mA ICCINT during configuration depending on utilization - provision at least 250 mA headroom on the 5 V rail. Add a 10 kΩ pull-up to nSTATUS and CONF_DONE per the FLEX 8000 configuration reference schematic.
The TQFP-100 (14x14 mm) has 0.5 mm pitch gull-wing leads; use 0.2 mm trace/space rules with a 4-layer PCB for signal integrity. Provide a continuous ground plane under the device and route global clocks (CLK0/CLK1) on the inner layer with controlled impedance (50 Ω). Keep the configuration clock (DCLK) trace short (<50 mm) and shielded by ground to avoid double-clocking during configuration.
Estimated: because the part is SRAM-based, it loses configuration on power-down - always pair it with an EPC1/EPC1213/EPC1064/EPC1441 configuration PROM or external controller. Do not leave MSEL[1:0] floating; the mode-select pins must be tied high or low per the desired configuration scheme (PS, AS, or JTAG). When migrating designs from EPF8452ATC100-3 to the EPF6016ATC100-3, verify that I/O voltage tolerance supports 5 V input - older FLEX 6000 I/O banks were not 5 V tolerant and required a series resistor on input pins.
Información de cumplimiento
RoHS, REACH, lead-free, halogen-free and conflict-minerals compliance status were not present in the verified web data for this obsolete part. Marked as [DATA_NEEDED] in the specs array; the lead-free EPF8452ATC100-3N suffix variant may indicate Pb-free finish but should be confirmed against the manufacturer's RoHS CoC before claim.