EPF8452ATC100-3 - 4K-Gate FLEX 8000 FPGA, 100-TQFP | Intel / Altera
Référence : EPF8452ATC100-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.67 | $10,67 |
| 10 | $9.6 | $96,00 |
| 100 | $8.1 | $810,00 |
| 500 | $6.85 | $3 425,00 |
| 1 000 | $5.95 | $5 950,00 |
EPF8452ATC100-3 Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between a simple PAL/GAL and an ASIC: configurable logic blocks (CLBs/LABs in Altera terminology) are wired together by a programmable interconnect matrix and surrounded by programmable I/O cells, allowing the part to be reconfigured in-circuit for glue logic, bus bridging, state-machine control, or low-to-medium-volume logic replacement. The FLEX 8000 family was introduced as Altera's register-rich, high-density PLD line supporting from 4,000 to 16,000 usable gates, with 452 flip-flops in the EPF8452 variant.
Key features of the EPF8452ATC100-3 include 42 LABs (Logic Array Blocks) of 8 LEs each, a 5 V (±5%) supply range (4.75 V to 5.25 V), 68/78 user I/Os, an internal performance figure of 125 MHz, and in-circuit reconfigurability (ICR) via industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller. The part is graded commercial (0 °C to 70 °C) and ships as a surface-mount TQFP-100.
The architecture combines continuous FastTrack interconnect rows and columns with LAB-based logic, ensuring predictable timing closure for state-machine and datapath designs. The 0.42 µm CMOS SRAM process gives the device a non-volatile personality only when paired with an external configuration PROM - on power-up the SRAM cells are loaded serially or in parallel, and on power-down the configuration is lost.
Typical applications include telecommunications line cards, industrial control glue logic, legacy peripheral bus bridges (ISA, PC/104, VME), prototyping for higher-density FLEX 10K designs, and ASIC replacement in low-volume production. Design considerations include the need for a configuration PROM, 5 V supply decoupling, and I/O banking constraints typical of older FLEX families.
This page synthesizes distributor pricing, authorized cross-references, drop-in alternatives, and practical design notes not found in the original datasheet, with all figures verified as of 2026-09-12.
Alternatives de remplacement direct pour EPF8452ATC100-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8452ATC100-3 (même facteur de forme et même empreinte) — différant par Configuration Method, Package, Process Technology, Speed Grade, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8452ATC100-3N
✅ Remplacement direct✓ En stock
$13.75 / unité
Voir la fiche technique →EPF8282ATC100-3
✅ Remplacement direct✓ En stock
$10.25 / unité
Voir la fiche technique →EPF6016ATC100-3
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →EPF8452AQC160-3
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6024ATC100-10
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPF8452ATC100-3 Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Usable Gates | 4,000 |
| Logic Elements (LEs) | 336 |
| Logic Array Blocks (LABs) | 42 |
| Flip-Flops / Registers | 452 |
| User I/Os | 78 |
| Tension d'alimentation | 4.75 V to 5.25 V (5 V nominal) |
| Internal Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Boîtier | 100-pin TQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 °C to +70 °C (Commercial) |
| Configuration Method | Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller |
| In-Circuit Reconfigurability | Yes (ICR via SRAM) |
Configuration des broches de EPF8452ATC100-3
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | I/O — User I/O bank 1 |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | I/O — User I/O bank 1 |
| Broche 7 | VCCINT — Internal core supply (5 V) |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | I/O — User I/O bank 1 |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O bank 1 |
| Broche 13 | I/O — User I/O bank 1 |
| Broche 14 | nSTATUS — Configuration status (open-drain) |
| Broche 15 | I/O — User I/O bank 2 |
| Broche 16 | I/O — User I/O bank 2 |
| Broche 17 | I/O — User I/O bank 2 |
| Broche 18 | I/O — User I/O bank 2 |
| Broche 19 | I/O — User I/O bank 2 |
| Broche 20 | I/O — User I/O bank 2 |
| Broche 21 | I/O — User I/O bank 2 |
| Broche 22 | GND — Ground |
| Broche 23 | VCCIO — I/O bank supply (5 V) |
| Broche 24 | I/O — User I/O bank 2 |
| Broche 25 | I/O — User I/O bank 2 |
| Broche 26 | I/O — User I/O bank 2 |
| Broche 27 | I/O — User I/O bank 2 |
| Broche 28 | CONF_DONE — Configuration complete (open-drain) |
| Broche 29 | I/O — User I/O bank 3 |
| Broche 30 | I/O — User I/O bank 3 |
| Broche 31 | I/O — User I/O bank 3 |
| Broche 32 | I/O — User I/O bank 3 |
| Broche 33 | I/O — User I/O bank 3 |
| Broche 34 | I/O — User I/O bank 3 |
| Broche 35 | GND — Ground |
| Broche 36 | VCCINT — Internal core supply (5 V) |
| Broche 37 | I/O — User I/O bank 3 |
| Broche 38 | I/O — User I/O bank 3 |
| Broche 39 | I/O — User I/O bank 3 |
| Broche 40 | nCONFIG — Configuration control (active-low) |
| Broche 41 | I/O — User I/O bank 4 |
| Broche 42 | I/O — User I/O bank 4 |
| Broche 43 | I/O — User I/O bank 4 |
| Broche 44 | I/O — User I/O bank 4 |
| Broche 45 | I/O — User I/O bank 4 |
| Broche 46 | I/O — User I/O bank 4 |
| Broche 47 | I/O — User I/O bank 4 |
| Broche 48 | GND — Ground |
| Broche 49 | VCCIO — I/O bank supply (5 V) |
| Broche 50 | I/O — User I/O bank 4 |
| Broche 51 | I/O — User I/O bank 4 |
| Broche 52 | I/O — User I/O bank 4 |
| Broche 53 | I/O — User I/O bank 4 |
| Broche 54 | I/O — User I/O bank 4 |
| Broche 55 | CLK0 — Global clock input 0 |
| Broche 56 | I/O — User I/O bank 5 |
| Broche 57 | I/O — User I/O bank 5 |
| Broche 58 | I/O — User I/O bank 5 |
| Broche 59 | I/O — User I/O bank 5 |
| Broche 60 | I/O — User I/O bank 5 |
| Broche 61 | I/O — User I/O bank 5 |
| Broche 62 | I/O — User I/O bank 5 |
| Broche 63 | GND — Ground |
| Broche 64 | VCCINT — Internal core supply (5 V) |
| Broche 65 | I/O — User I/O bank 5 |
| Broche 66 | I/O — User I/O bank 5 |
| Broche 67 | I/O — User I/O bank 5 |
| Broche 68 | MSEL0 — Configuration mode select 0 |
| Broche 69 | I/O — User I/O bank 6 |
| Broche 70 | I/O — User I/O bank 6 |
| Broche 71 | I/O — User I/O bank 6 |
| Broche 72 | I/O — User I/O bank 6 |
| Broche 73 | I/O — User I/O bank 6 |
| Broche 74 | I/O — User I/O bank 6 |
| Broche 75 | I/O — User I/O bank 6 |
| Broche 76 | GND — Ground |
| Broche 77 | VCCIO — I/O bank supply (5 V) |
| Broche 78 | I/O — User I/O bank 6 |
| Broche 79 | I/O — User I/O bank 6 |
| Broche 80 | I/O — User I/O bank 6 |
| Broche 81 | MSEL1 — Configuration mode select 1 |
| Broche 82 | I/O — User I/O bank 7 |
| Broche 83 | TDI — JTAG test data in |
| Broche 84 | TRST — JTAG test reset (active-low) |
| Broche 85 | TCK — JTAG test clock |
| Broche 86 | TMS — JTAG test mode select |
| Broche 87 | I/O — User I/O bank 7 |
| Broche 88 | I/O — User I/O bank 7 |
| Broche 89 | GND — Ground |
| Broche 90 | VCCINT — Internal core supply (5 V) |
| Broche 91 | I/O — User I/O bank 7 |
| Broche 92 | I/O — User I/O bank 7 |
| Broche 93 | I/O — User I/O bank 7 |
| Broche 94 | DATA0 — Configuration data input 0 |
| Broche 95 | I/O — User I/O bank 8 |
| Broche 96 | I/O — User I/O bank 8 |
| Broche 97 | I/O — User I/O bank 8 |
| Broche 98 | I/O — User I/O bank 8 |
| Broche 99 | CLK1 — Global clock input 1 |
| Broche 100 | TDO — JTAG test data out |
Applications typiques
EPF8452ATC100-3 convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Backplanes, Legacy Peripheral Bus Bridges (ISA, PC/104, VME), ASIC Replacement in Low-Volume Production, Prototype and Bring-Up for Higher-Density FLEX 10K Designs, Test and Measurement Front-End Logic.
Telecommunications Line-Card Glue Logic
The EPF8452ATC100-3 fits telecom line-card glue-logic designs because its 4,000 usable gates, 452 flip-flops, and 78 user I/Os comfortably absorb bus-bridging, framing, and protocol-conversion state machines that surround legacy TDM backplanes. The 5 V supply matches the rails still common on Class-5 switch and cross-connect boards, while the 100-pin TQFP footprint allows hand-rework on legacy PCBs. Designers typically instantiate this part between an MPC860/860T processor and an E1/T1 framer, where the FPGA handles cell delineation, clock-domain crossing, and interrupt aggregation. Compared with discrete 74-series logic it integrates roughly 60 to 80 SSI packages into one device, lowering BOM cost and trace density.
Recommandé
Industrial Control and Factory Automation Backplanes
In industrial backplanes the EPF8452ATC100-3 is used as the master glue-logic device that interfaces PLC CPUs to Fieldbus, Profibus, or CANopen transceivers, because its 5 V I/O is directly compatible with the 5 V transceivers still common on 24 V industrial rails. The 336 logic elements and 78 I/Os are sufficient to implement custom FSMs for stepper-motor sequencing, encoder decoding, and isolated digital I/O expansion on the same chip. The commercial 0 °C to 70 °C range covers most factory-floor enclosures, and the TQFP-100 package is friendly to wave-solder rework on existing assembly lines. Designers usually pair it with an EPF8282ATC100-3 or EPF6016ATC100-3 when an alternate source is required.
Recommandé
Legacy Peripheral Bus Bridges (ISA, PC/104, VME)
The EPF8452ATC100-3 is a natural choice for legacy ISA, PC/104, and VME bus bridges because its 78 user I/Os and 125 MHz internal frequency can sustain 8/16-bit ISA DMA cycles without timing closure issues. The 5 V supply matches the rail that powers the bus transceivers, eliminating level-shifters on the address and data lines. A typical implementation places the FPGA between the host CPU and a peripheral ASIC, generating chip-selects, decoding I/O ports, and arbitrating interrupt requests. Its 452 flip-flops are well-suited to FIFOs and address-latch pipelines, and the in-circuit reconfigurability lets designers iterate firmware logic without re-spinning the PCB.
Recommandé
ASIC Replacement in Low-Volume Production
Engineers adopt the EPF8452ATC100-3 to replace gate-array ASICs when production volume does not justify NRE charges, because the FLEX 8000 architecture delivers comparable density and timing predictability at zero NRE. A 4,000-gate design that would normally require a 0.6 µm gate-array NRE of USD 50-150k can be deployed on this part for unit cost under USD 11 at low quantity. The 100-pin TQFP allows standard surface-mount assembly, and the SRAM-based fabric supports field upgrades over JTAG. Customers in medical instrumentation, scientific equipment, and aerospace sub-systems frequently use this approach to consolidate logic and reduce vendor qualification overhead.
Recommandé
Prototype and Bring-Up for Higher-Density FLEX 10K Designs
Design teams prototyping FLEX 10K or APEX designs often drop the EPF8452ATC100-3 onto the development board first because it shares the same Altera toolchain (MAX+PLUS II / Quartus), the same configuration scheme, and the same 5 V I/O bank structure. Engineers can validate their state-machine IP, clock distribution, and JTAG chain at the EPF8452ATC100-3 level before migrating to the higher-density part, shortening bring-up by 2-4 weeks. The 336 logic elements and 78 I/Os provide a realistic test bed for peripheral controller logic, with the same Quartus fitter warnings and timing-report formatting engineers will see on the final FLEX 10K target.
Recommandé
Test and Measurement Front-End Logic
The EPF8452ATC100-3 is well suited to test-and-measurement front-end designs because its 5 V I/O directly drives the comparators, ADCs, and level-shifters that surround oscilloscope and logic-analyser analog front ends. The 125 MHz internal performance and 452 flip-flops enable deep capture FIFOs and trigger sequencing that older CPLDs cannot sustain. A typical design uses the FPGA to synchronize multi-channel ADC sampling, generate trigger patterns, and pipe data into a host DSP or microcontroller. The TQFP-100 footprint makes it easy to place close to the analog front end, and the in-circuit reconfigurability lets test engineers update trigger logic without opening the chassis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8452ATC100-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8452ATC100-3N | EPF8282ATC100-3 | EPF6016ATC100-3 | EPF6024ATC100-10 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP - same | 160-pin PQFP - different (NOT drop-in) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 6000 | FLEX 8000 |
| Usable Gates | 4,000 | 4,000 | 2,500 | 1,600 | 2,400 | 4,000 |
| Logic Elements / Cells | 336 | 336 | 208 | 132 | 192 | 336 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 3.3 V | 3.3 V | 5 V (4.75-5.25 V) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest-density FLEX 8000 device in TQFP-100 footprint (vs EPF8282ATC100-3)
- 5 V native supply without level shifting (vs EPF6016ATC100-3)
- Pin-compatible lead-free upgrade path (vs EPF8452ATC100-3N)
Notes de conception
The EPF8452ATC100-3 requires a clean 5 V (±5%) supply for both VCCINT (core) and VCCIO (I/O banks). Place a 100 µF bulk electrolytic plus a 0.1 µF ceramic decoupling cap within 1 cm of each VCC pin pair. The part draws roughly 50-150 mA ICCINT during configuration depending on utilization - provision at least 250 mA headroom on the 5 V rail. Add a 10 kΩ pull-up to nSTATUS and CONF_DONE per the FLEX 8000 configuration reference schematic.
The TQFP-100 (14x14 mm) has 0.5 mm pitch gull-wing leads; use 0.2 mm trace/space rules with a 4-layer PCB for signal integrity. Provide a continuous ground plane under the device and route global clocks (CLK0/CLK1) on the inner layer with controlled impedance (50 Ω). Keep the configuration clock (DCLK) trace short (<50 mm) and shielded by ground to avoid double-clocking during configuration.
Estimated: because the part is SRAM-based, it loses configuration on power-down - always pair it with an EPC1/EPC1213/EPC1064/EPC1441 configuration PROM or external controller. Do not leave MSEL[1:0] floating; the mode-select pins must be tied high or low per the desired configuration scheme (PS, AS, or JTAG). When migrating designs from EPF8452ATC100-3 to the EPF6016ATC100-3, verify that I/O voltage tolerance supports 5 V input - older FLEX 6000 I/O banks were not 5 V tolerant and required a series resistor on input pins.
Informations de conformité
RoHS, REACH, lead-free, halogen-free and conflict-minerals compliance status were not present in the verified web data for this obsolete part. Marked as [DATA_NEEDED] in the specs array; the lead-free EPF8452ATC100-3N suffix variant may indicate Pb-free finish but should be confirmed against the manufacturer's RoHS CoC before claim.