EPF8452ATC100-3 - 4K-Gate FLEX 8000 FPGA, 100-TQFP | Intel / Altera
부품 번호: EPF8452ATC100-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $10.67 | $10.67 |
| 10 | $9.6 | $96.00 |
| 100 | $8.1 | $810.00 |
| 500 | $6.85 | $3,425.00 |
| 1,000 | $5.95 | $5,950.00 |
EPF8452ATC100-3 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between a simple PAL/GAL and an ASIC: configurable logic blocks (CLBs/LABs in Altera terminology) are wired together by a programmable interconnect matrix and surrounded by programmable I/O cells, allowing the part to be reconfigured in-circuit for glue logic, bus bridging, state-machine control, or low-to-medium-volume logic replacement. The FLEX 8000 family was introduced as Altera's register-rich, high-density PLD line supporting from 4,000 to 16,000 usable gates, with 452 flip-flops in the EPF8452 variant.
Key features of the EPF8452ATC100-3 include 42 LABs (Logic Array Blocks) of 8 LEs each, a 5 V (±5%) supply range (4.75 V to 5.25 V), 68/78 user I/Os, an internal performance figure of 125 MHz, and in-circuit reconfigurability (ICR) via industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller. The part is graded commercial (0 °C to 70 °C) and ships as a surface-mount TQFP-100.
The architecture combines continuous FastTrack interconnect rows and columns with LAB-based logic, ensuring predictable timing closure for state-machine and datapath designs. The 0.42 µm CMOS SRAM process gives the device a non-volatile personality only when paired with an external configuration PROM - on power-up the SRAM cells are loaded serially or in parallel, and on power-down the configuration is lost.
Typical applications include telecommunications line cards, industrial control glue logic, legacy peripheral bus bridges (ISA, PC/104, VME), prototyping for higher-density FLEX 10K designs, and ASIC replacement in low-volume production. Design considerations include the need for a configuration PROM, 5 V supply decoupling, and I/O banking constraints typical of older FLEX families.
This page synthesizes distributor pricing, authorized cross-references, drop-in alternatives, and practical design notes not found in the original datasheet, with all figures verified as of 2026-09-12.
드롭인 대체품: EPF8452ATC100-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF8452ATC100-3 (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Method, Package, Process Technology, Speed Grade, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF8452ATC100-3N
✅ 드롭인✓ 재고 있음
$13.75 / 개
데이터시트 보기 →EPF8282ATC100-3
✅ 드롭인✓ 재고 있음
$10.25 / 개
데이터시트 보기 →EPF6016ATC100-3
✅ 드롭인✓ 재고 있음
$11.4 / 개
데이터시트 보기 →EPF8452AQC160-3
✅ 드롭인✓ 재고 있음
$13.85 / 개
데이터시트 보기 →EPF6024ATC100-10
✅ 드롭인✓ 재고 있음
$16.2 / 개
데이터시트 보기 →EPF8452ATC100-3 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Usable Gates | 4,000 |
| Logic Elements (LEs) | 336 |
| Logic Array Blocks (LABs) | 42 |
| Flip-Flops / Registers | 452 |
| User I/Os | 78 |
| 공급 전압 | 4.75 V to 5.25 V (5 V nominal) |
| Internal Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| 패키지 | 100-pin TQFP (14x14 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0 °C to +70 °C (Commercial) |
| Configuration Method | Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller |
| In-Circuit Reconfigurability | Yes (ICR via SRAM) |
EPF8452ATC100-3 핀 구성
| 핀 1 | I/O — User I/O bank 1 |
| 핀 2 | I/O — User I/O bank 1 |
| 핀 3 | I/O — User I/O bank 1 |
| 핀 4 | I/O — User I/O bank 1 |
| 핀 5 | I/O — User I/O bank 1 |
| 핀 6 | I/O — User I/O bank 1 |
| 핀 7 | VCCINT — Internal core supply (5 V) |
| 핀 8 | I/O — User I/O bank 1 |
| 핀 9 | I/O — User I/O bank 1 |
| 핀 10 | I/O — User I/O bank 1 |
| 핀 11 | GND — Ground |
| 핀 12 | I/O — User I/O bank 1 |
| 핀 13 | I/O — User I/O bank 1 |
| 핀 14 | nSTATUS — Configuration status (open-drain) |
| 핀 15 | I/O — User I/O bank 2 |
| 핀 16 | I/O — User I/O bank 2 |
| 핀 17 | I/O — User I/O bank 2 |
| 핀 18 | I/O — User I/O bank 2 |
| 핀 19 | I/O — User I/O bank 2 |
| 핀 20 | I/O — User I/O bank 2 |
| 핀 21 | I/O — User I/O bank 2 |
| 핀 22 | GND — Ground |
| 핀 23 | VCCIO — I/O bank supply (5 V) |
| 핀 24 | I/O — User I/O bank 2 |
| 핀 25 | I/O — User I/O bank 2 |
| 핀 26 | I/O — User I/O bank 2 |
| 핀 27 | I/O — User I/O bank 2 |
| 핀 28 | CONF_DONE — Configuration complete (open-drain) |
| 핀 29 | I/O — User I/O bank 3 |
| 핀 30 | I/O — User I/O bank 3 |
| 핀 31 | I/O — User I/O bank 3 |
| 핀 32 | I/O — User I/O bank 3 |
| 핀 33 | I/O — User I/O bank 3 |
| 핀 34 | I/O — User I/O bank 3 |
| 핀 35 | GND — Ground |
| 핀 36 | VCCINT — Internal core supply (5 V) |
| 핀 37 | I/O — User I/O bank 3 |
| 핀 38 | I/O — User I/O bank 3 |
| 핀 39 | I/O — User I/O bank 3 |
| 핀 40 | nCONFIG — Configuration control (active-low) |
| 핀 41 | I/O — User I/O bank 4 |
| 핀 42 | I/O — User I/O bank 4 |
| 핀 43 | I/O — User I/O bank 4 |
| 핀 44 | I/O — User I/O bank 4 |
| 핀 45 | I/O — User I/O bank 4 |
| 핀 46 | I/O — User I/O bank 4 |
| 핀 47 | I/O — User I/O bank 4 |
| 핀 48 | GND — Ground |
| 핀 49 | VCCIO — I/O bank supply (5 V) |
| 핀 50 | I/O — User I/O bank 4 |
| 핀 51 | I/O — User I/O bank 4 |
| 핀 52 | I/O — User I/O bank 4 |
| 핀 53 | I/O — User I/O bank 4 |
| 핀 54 | I/O — User I/O bank 4 |
| 핀 55 | CLK0 — Global clock input 0 |
| 핀 56 | I/O — User I/O bank 5 |
| 핀 57 | I/O — User I/O bank 5 |
| 핀 58 | I/O — User I/O bank 5 |
| 핀 59 | I/O — User I/O bank 5 |
| 핀 60 | I/O — User I/O bank 5 |
| 핀 61 | I/O — User I/O bank 5 |
| 핀 62 | I/O — User I/O bank 5 |
| 핀 63 | GND — Ground |
| 핀 64 | VCCINT — Internal core supply (5 V) |
| 핀 65 | I/O — User I/O bank 5 |
| 핀 66 | I/O — User I/O bank 5 |
| 핀 67 | I/O — User I/O bank 5 |
| 핀 68 | MSEL0 — Configuration mode select 0 |
| 핀 69 | I/O — User I/O bank 6 |
| 핀 70 | I/O — User I/O bank 6 |
| 핀 71 | I/O — User I/O bank 6 |
| 핀 72 | I/O — User I/O bank 6 |
| 핀 73 | I/O — User I/O bank 6 |
| 핀 74 | I/O — User I/O bank 6 |
| 핀 75 | I/O — User I/O bank 6 |
| 핀 76 | GND — Ground |
| 핀 77 | VCCIO — I/O bank supply (5 V) |
| 핀 78 | I/O — User I/O bank 6 |
| 핀 79 | I/O — User I/O bank 6 |
| 핀 80 | I/O — User I/O bank 6 |
| 핀 81 | MSEL1 — Configuration mode select 1 |
| 핀 82 | I/O — User I/O bank 7 |
| 핀 83 | TDI — JTAG test data in |
| 핀 84 | TRST — JTAG test reset (active-low) |
| 핀 85 | TCK — JTAG test clock |
| 핀 86 | TMS — JTAG test mode select |
| 핀 87 | I/O — User I/O bank 7 |
| 핀 88 | I/O — User I/O bank 7 |
| 핀 89 | GND — Ground |
| 핀 90 | VCCINT — Internal core supply (5 V) |
| 핀 91 | I/O — User I/O bank 7 |
| 핀 92 | I/O — User I/O bank 7 |
| 핀 93 | I/O — User I/O bank 7 |
| 핀 94 | DATA0 — Configuration data input 0 |
| 핀 95 | I/O — User I/O bank 8 |
| 핀 96 | I/O — User I/O bank 8 |
| 핀 97 | I/O — User I/O bank 8 |
| 핀 98 | I/O — User I/O bank 8 |
| 핀 99 | CLK1 — Global clock input 1 |
| 핀 100 | TDO — JTAG test data out |
일반적인 애플리케이션
EPF8452ATC100-3 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Backplanes, Legacy Peripheral Bus Bridges (ISA, PC/104, VME), ASIC Replacement in Low-Volume Production, Prototype and Bring-Up for Higher-Density FLEX 10K Designs, Test and Measurement Front-End Logic.
Telecommunications Line-Card Glue Logic
The EPF8452ATC100-3 fits telecom line-card glue-logic designs because its 4,000 usable gates, 452 flip-flops, and 78 user I/Os comfortably absorb bus-bridging, framing, and protocol-conversion state machines that surround legacy TDM backplanes. The 5 V supply matches the rails still common on Class-5 switch and cross-connect boards, while the 100-pin TQFP footprint allows hand-rework on legacy PCBs. Designers typically instantiate this part between an MPC860/860T processor and an E1/T1 framer, where the FPGA handles cell delineation, clock-domain crossing, and interrupt aggregation. Compared with discrete 74-series logic it integrates roughly 60 to 80 SSI packages into one device, lowering BOM cost and trace density.
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Industrial Control and Factory Automation Backplanes
In industrial backplanes the EPF8452ATC100-3 is used as the master glue-logic device that interfaces PLC CPUs to Fieldbus, Profibus, or CANopen transceivers, because its 5 V I/O is directly compatible with the 5 V transceivers still common on 24 V industrial rails. The 336 logic elements and 78 I/Os are sufficient to implement custom FSMs for stepper-motor sequencing, encoder decoding, and isolated digital I/O expansion on the same chip. The commercial 0 °C to 70 °C range covers most factory-floor enclosures, and the TQFP-100 package is friendly to wave-solder rework on existing assembly lines. Designers usually pair it with an EPF8282ATC100-3 or EPF6016ATC100-3 when an alternate source is required.
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Legacy Peripheral Bus Bridges (ISA, PC/104, VME)
The EPF8452ATC100-3 is a natural choice for legacy ISA, PC/104, and VME bus bridges because its 78 user I/Os and 125 MHz internal frequency can sustain 8/16-bit ISA DMA cycles without timing closure issues. The 5 V supply matches the rail that powers the bus transceivers, eliminating level-shifters on the address and data lines. A typical implementation places the FPGA between the host CPU and a peripheral ASIC, generating chip-selects, decoding I/O ports, and arbitrating interrupt requests. Its 452 flip-flops are well-suited to FIFOs and address-latch pipelines, and the in-circuit reconfigurability lets designers iterate firmware logic without re-spinning the PCB.
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ASIC Replacement in Low-Volume Production
Engineers adopt the EPF8452ATC100-3 to replace gate-array ASICs when production volume does not justify NRE charges, because the FLEX 8000 architecture delivers comparable density and timing predictability at zero NRE. A 4,000-gate design that would normally require a 0.6 µm gate-array NRE of USD 50-150k can be deployed on this part for unit cost under USD 11 at low quantity. The 100-pin TQFP allows standard surface-mount assembly, and the SRAM-based fabric supports field upgrades over JTAG. Customers in medical instrumentation, scientific equipment, and aerospace sub-systems frequently use this approach to consolidate logic and reduce vendor qualification overhead.
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Prototype and Bring-Up for Higher-Density FLEX 10K Designs
Design teams prototyping FLEX 10K or APEX designs often drop the EPF8452ATC100-3 onto the development board first because it shares the same Altera toolchain (MAX+PLUS II / Quartus), the same configuration scheme, and the same 5 V I/O bank structure. Engineers can validate their state-machine IP, clock distribution, and JTAG chain at the EPF8452ATC100-3 level before migrating to the higher-density part, shortening bring-up by 2-4 weeks. The 336 logic elements and 78 I/Os provide a realistic test bed for peripheral controller logic, with the same Quartus fitter warnings and timing-report formatting engineers will see on the final FLEX 10K target.
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Test and Measurement Front-End Logic
The EPF8452ATC100-3 is well suited to test-and-measurement front-end designs because its 5 V I/O directly drives the comparators, ADCs, and level-shifters that surround oscilloscope and logic-analyser analog front ends. The 125 MHz internal performance and 452 flip-flops enable deep capture FIFOs and trigger sequencing that older CPLDs cannot sustain. A typical design uses the FPGA to synchronize multi-channel ADC sampling, generate trigger patterns, and pipe data into a host DSP or microcontroller. The TQFP-100 footprint makes it easy to place close to the analog front end, and the in-circuit reconfigurability lets test engineers update trigger logic without opening the chassis.
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추천 제품 요약
엔지니어링 참조 데이터: EPF8452ATC100-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF8452ATC100-3N | EPF8282ATC100-3 | EPF6016ATC100-3 | EPF6024ATC100-10 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP - same | 160-pin PQFP - different (NOT drop-in) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 | FLEX 6000 | FLEX 8000 |
| Usable Gates | 4,000 | 4,000 | 2,500 | 1,600 | 2,400 | 4,000 |
| Logic Elements / Cells | 336 | 336 | 208 | 132 | 192 | 336 |
| Supply Voltage | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 5 V (4.75-5.25 V) | 3.3 V | 3.3 V | 5 V (4.75-5.25 V) |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest-density FLEX 8000 device in TQFP-100 footprint (vs EPF8282ATC100-3)
- 5 V native supply without level shifting (vs EPF6016ATC100-3)
- Pin-compatible lead-free upgrade path (vs EPF8452ATC100-3N)
설계 노트
The EPF8452ATC100-3 requires a clean 5 V (±5%) supply for both VCCINT (core) and VCCIO (I/O banks). Place a 100 µF bulk electrolytic plus a 0.1 µF ceramic decoupling cap within 1 cm of each VCC pin pair. The part draws roughly 50-150 mA ICCINT during configuration depending on utilization - provision at least 250 mA headroom on the 5 V rail. Add a 10 kΩ pull-up to nSTATUS and CONF_DONE per the FLEX 8000 configuration reference schematic.
The TQFP-100 (14x14 mm) has 0.5 mm pitch gull-wing leads; use 0.2 mm trace/space rules with a 4-layer PCB for signal integrity. Provide a continuous ground plane under the device and route global clocks (CLK0/CLK1) on the inner layer with controlled impedance (50 Ω). Keep the configuration clock (DCLK) trace short (<50 mm) and shielded by ground to avoid double-clocking during configuration.
Estimated: because the part is SRAM-based, it loses configuration on power-down - always pair it with an EPC1/EPC1213/EPC1064/EPC1441 configuration PROM or external controller. Do not leave MSEL[1:0] floating; the mode-select pins must be tied high or low per the desired configuration scheme (PS, AS, or JTAG). When migrating designs from EPF8452ATC100-3 to the EPF6016ATC100-3, verify that I/O voltage tolerance supports 5 V input - older FLEX 6000 I/O banks were not 5 V tolerant and required a series resistor on input pins.
규정 준수 정보
RoHS, REACH, lead-free, halogen-free and conflict-minerals compliance status were not present in the verified web data for this obsolete part. Marked as [DATA_NEEDED] in the specs array; the lead-free EPF8452ATC100-3N suffix variant may indicate Pb-free finish but should be confirmed against the manufacturer's RoHS CoC before claim.